CN109637958B - Fixing carrier and fixing method for silicon wafer corrosion process - Google Patents

Fixing carrier and fixing method for silicon wafer corrosion process Download PDF

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Publication number
CN109637958B
CN109637958B CN201910051002.6A CN201910051002A CN109637958B CN 109637958 B CN109637958 B CN 109637958B CN 201910051002 A CN201910051002 A CN 201910051002A CN 109637958 B CN109637958 B CN 109637958B
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silicon wafer
piece
fixing
carrier
fixing unit
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CN109637958A (en
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伍志军
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Suzhou Saisen Electronic Technology Co ltd
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Suzhou Saisen Electronic Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The invention discloses a silicon wafer corrosion process fixing carrier, which relates to the technical field of silicon wafer corrosion and comprises a carrier main body, a first fixing unit, at least two adjusting fixing pieces and a conducting piece. The first fixing unit has a recess. The adjusting fixing piece is in the opposite direction, the opposite end face of the adjusting fixing piece faces the center of the carrier main body, the adjusting fixing piece is connected with the carrier main body and the first fixing unit, one adjusting fixing piece is provided with a positive thread, the other adjusting fixing piece is provided with a reverse thread, the adjusting fixing piece is further provided with an extending piece and a sliding piece, the extending piece is provided with a certain length, and the sliding piece is connected with the extending piece. The conducting piece is provided with a telescopic opening, the extending piece is positioned in the telescopic opening, the telescopic opening is provided with a sliding groove, and the sliding groove is connected with the sliding piece. Under the action of the positive threads and the reverse threads of the two adjusting fixing pieces, the two first fixing units clamp the silicon wafer at the same speed and with the same force. The silicon wafer is clamped, and meanwhile, the deviation between the center of the silicon wafer and the center of the carrier main body is prevented, so that the quality of a product is influenced.

Description

Fixing carrier and fixing method for silicon wafer corrosion process
Technical Field
The invention relates to the technical field of silicon wafer corrosion, in particular to a silicon wafer corrosion process fixing carrier.
Background
The silicon wafer corrosion is to corrode polysilicon by using sodium hydroxide, and aims to remove a surface damaged layer generated when the silicon wafer is sliced by a multi-wire saw, and meanwhile, the anisotropism of the silicon corrosion by using the sodium hydroxide is utilized to strive for the surface texture with lower reflectivity.
In the current silicon wafer etching process, firstly, a round silicon wafer is put into a special carrier, secondly, the special carrier is put into a constant temperature etching pool to etch for a certain time, and the etching is accelerated under the shaking of a mechanical arm, so that the silicon wafer is etched into a groove in a place without protection, and the preliminary shape of the chip is formed. In the process, as the silicon wafer carrier does not fix the silicon wafer, the silicon wafer returns to generate uncontrollable self-rotation under shaking, so that the corrosion degree of each part of the silicon wafer is inconsistent, the depth of the groove is inconsistent, and the product quality is affected.
The chinese patent publication No. CN104992917B discloses a "silicon wafer carrier", comprising: the fixing unit comprises a V-shaped groove fixing strip. In the specific implementation, the fixing unit is firstly installed, at this time, in order to facilitate the installation of the silicon wafer, the V-shaped groove fixing strip is not thoroughly fixed, and only after the installation of the silicon wafer is completed, the V-shaped groove fixing strip can be thoroughly fixed. In the process, when the V-shaped groove fixing strip is thoroughly fixed, force is inevitably applied to the silicon wafer, the silicon wafer is stressed to move, the center of the silicon wafer is deviated from the center of the carrier main body, and finally, the silicon wafer is immersed into each part of the constant-temperature corrosion pool to be different in height in the corrosion process (the silicon wafer is corroded at one end generally and then rotates to the other end to be corroded), so that each part of the silicon wafer cannot be completely corroded, and the product quality is affected. When the silicon wafer is placed in the V-shaped groove fixing strip, the center of the silicon wafer is required to be aligned with the center of the V-shaped groove fixing strip, otherwise, the center of the silicon wafer and the center of the carrier main body are deviated, and the product quality is affected.
Disclosure of Invention
The invention aims to solve the problem that the center of a silicon wafer deviates from the center of a carrier main body in the prior art, and the quality of a product is affected.
The second object of the present invention is to provide a method for fixing a silicon wafer.
In order to achieve one of the above purposes, the present invention adopts the following technical scheme: a silicon wafer etching process fixing carrier, comprising: the carrier body is used for bearing the silicon wafer; the first fixing unit is provided with a notch which is used for clamping the silicon wafer; at least two adjustment mounting, adjustment mounting are in relative direction, and the relative terminal surface of adjustment mounting is towards the center of carrier main part, and adjustment mounting connects carrier main part and first fixed unit, and one of them adjustment mounting has the positive screw thread, and another adjustment mounting has the reverse screw thread, and adjustment mounting still has: an extension member having a length; a slider coupled to the extension; the conducting piece is provided with a telescopic opening, the telescopic opening is provided with a certain depth, the extending piece is positioned in the telescopic opening, the extending piece is mutually attached to the telescopic opening, the telescopic opening is provided with a sliding groove, and the sliding groove is connected with the sliding piece.
In the above technical scheme, in the embodiment of the invention, the silicon wafer is firstly put into the notch of the first fixing unit, and the silicon wafer is clamped by the notch wall.
And then screwing the adjusting fixing piece to drive the first fixing unit to clamp the silicon wafer, wherein the extending piece of the adjusting fixing piece applies force to the conducting piece, the conducting piece applies force to drive the other adjusting fixing piece, the other first fixing unit is further driven to clamp the silicon wafer, and under the action of the positive threads and the reverse threads of the two adjusting fixing pieces, the two first fixing units clamp the silicon wafer at the same speed and with the same force.
Finally, in the process of clamping the silicon wafer, if the silicon wafer and the carrier main body are not positioned at the same center point, the height of the center point of the silicon wafer is higher or lower than that of the center of the first fixing unit, and the two ends of the silicon wafer face the same direction in an arc manner, so that the silicon wafer is easy to squeeze and move, the silicon wafer is forced to move out of the first fixing unit, and the silicon wafer needs to be reinstalled; if the silicon wafer and the carrier main body are positioned at the same center point, the height of the center point of the silicon wafer is equal to the center of the first fixing unit, and the two ends of the silicon wafer face in different directions in an arc mode, the guiding effect of force is not achieved, so that the first fixing unit clamps the silicon wafer and fixes the silicon wafer.
Further, in an embodiment of the present invention, the notch is V-shaped. On one hand, the V-shaped opening is larger, and misalignment notches during silicon wafer installation are avoided. On the other hand, the V-shaped wall surface has a powerful guiding effect, moves along the V-shaped wall surface, and finally enables two ends of the silicon wafer to be mutually attached to the V-shaped wall surface, so that when the silicon wafer is installed, an unoriented force is applied to the silicon wafer, the silicon wafer and the notch generate large friction, the silicon wafer is damaged, and corrosion work cannot be performed.
Further, in an embodiment of the present invention, the recess has elasticity. On the one hand, when the notch clamps the silicon wafer, the clamping force of the notch on the silicon wafer is enhanced by the force generated by elastic compression of the notch. On the other hand, when the silicon wafer shakes in the corrosion pool, the elasticity of the notch provides buffer for the silicon wafer, and the silicon wafer is prevented from being forced to generate cracks by rigid clamping.
Further, in an embodiment of the present invention, the extension member is cylindrical.
Further, in an embodiment of the present invention, the telescoping port is cylindrical.
Further, in an embodiment of the present invention, the silicon wafer etching process fixing carrier further includes: the second fixed unit, the carrier main part is connected to the second fixed unit, and the junction of second fixed unit and carrier main part has the bearing, and the second fixed unit has: an accommodation space; the locking piece is positioned in the accommodating space and is provided with a guide surface and a positioning groove.
Further, in an embodiment of the present invention, the carrier body further includes: the rotating piece is connected with the first fixing unit; the convex piece is connected with the rotating piece.
Still further, in an embodiment of the present invention, the second fixing unit further has: a button; an elastic member connected to the button; one end of the pull rope is connected with the button, and the other end of the pull rope is connected with the lock piece.
Further, in an embodiment of the present invention, the second fixing unit further has a rotation shaft. On one hand, a fixed point is provided for the pull rope, so that the pull rope is convenient to steer, and on the other hand, when the pull rope moves, the rotating shaft can move along the movement direction of the pull rope, so that the pull rope is prevented from being worn.
Further, in an embodiment of the present invention, the lock member further has a locking port.
In an embodiment of the present invention, the second fixing unit further has a clamping member movably connected to the second fixing unit, a connection portion between the clamping member and the second fixing unit has a biasing spring member, one end of the clamping member is located in the accommodating space, and the other end of the clamping member is a force application portion.
Further, in the embodiment of the invention, one end of the clip located in the accommodating space is arc-shaped.
The beneficial effects of the invention are as follows:
firstly, under the action of the positive threads and the reverse threads of the two adjusting fixing pieces, the two first fixing units clamp the silicon wafer at the same speed and with the same force. The silicon wafer is clamped, and meanwhile, the deviation between the center of the silicon wafer and the center of the carrier main body is prevented, so that the quality of a product is influenced.
Secondly, when the silicon wafer and the carrier main body are not at the same center point, the two ends of the silicon wafer clamped by the two first fixing units face the same direction in an arc shape, so that the silicon wafer is forced to move out of the first fixing units, and the deviation between the center of the silicon wafer and the center of the carrier main body is prevented, and the product quality is prevented from being influenced.
In order to achieve the second purpose, the invention adopts the following technical scheme: a method of fixing a silicon wafer comprising the steps of:
clamping, namely placing the silicon wafer into a notch of a first fixing unit, and clamping the silicon wafer by using the wall of the notch;
the adjusting fixing piece is screwed to drive the first fixing unit to clamp the silicon wafer, wherein the extending piece of the adjusting fixing piece applies force to the conducting piece, the conducting piece applies force to drive the other adjusting fixing piece to further drive the other first fixing unit to clamp the silicon wafer, and under the action of the positive threads and the reverse threads of the two adjusting fixing pieces, the two first fixing units clamp the silicon wafer at the same speed and with the same force;
judging the center point, when the two first fixing units clamp the silicon wafer at the same speed and with the same force, if the silicon wafer and the carrier main body are not positioned at the same center point, the height of the center point of the silicon wafer is higher or lower than that of the center of the first fixing units, and the two ends of the silicon wafer are in the same direction in an arc shape, so that the silicon wafer is easy to extrude and move, the silicon wafer is forced to move out of the first fixing units, and the silicon wafer needs to be reinstalled; if the silicon wafer and the carrier main body are positioned at the same center point, the height of the center point of the silicon wafer is equal to the center of the first fixing unit, and the two ends of the silicon wafer face in different directions in an arc manner, so that the first fixing unit clamps the silicon wafer without the guiding function of force;
and (3) fixing, namely after the first fixing unit clamps the silicon wafer, sending the adjusting fixing piece to finish the fixing work of the silicon wafer.
Further, in the embodiment of the invention, after the fixing step is completed, the carrier body is put into the etching tank for etching.
Further, in the embodiment of the invention, in the clamping step, the elasticity of the notch applies force to the silicon wafer wall surface, so that the clamping force of the silicon wafer is further enhanced.
Further, in the embodiment of the invention, in the etching step, after a part of the silicon wafer is etched for a certain time, the carrier body is rotated for a certain angle according to the requirement of the non-etched part of the silicon wafer, the rotating member of the carrier body is forced to rotate, the convex member on the rotating member slides along the guiding surface of the locking member to jack up the locking member, and when the convex member moves to the positioning groove of the locking member, the positioning groove is clamped with the convex member to lock the carrier body.
Further, in the embodiment of the invention, in the etching step, after the silicon wafer part in the etching tank is etched for a certain time, according to the requirement of the non-etched part of the silicon wafer, the button is pressed down to move, the lock piece is pulled by the pull rope, so that the positioning groove is separated from the convex piece, meanwhile, the locking opening of the lock piece is clamped with the clamping piece, the carrier body is rotated by a certain angle, the rotating piece is forced to rotate, the convex piece is propped against the force application part of the clamping piece, the clamping piece is driven to rotate, so that the clamping piece is separated from the locking opening, the lock piece is reset, and the carrier body is conveniently locked later.
Drawings
FIG. 1 is a detailed three-dimensional schematic diagram of a silicon wafer etching process fixing carrier according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of a mechanism of a carrier body according to an embodiment of the invention.
Fig. 3 is a three-dimensional schematic diagram of a driving member and an extending member according to an embodiment of the present invention.
FIG. 4 is a three-dimensional schematic diagram of a silicon wafer etching process fixing carrier according to an embodiment of the invention.
FIG. 5 is a three-dimensional schematic view of another detail of a silicon wafer etching process fixture carrier according to an embodiment of the present invention.
Fig. 6 is a schematic structural diagram of a second fixing unit according to an embodiment of the invention.
Fig. 7 is a partial enlarged view of fig. 4 a.
Fig. 8 is a schematic diagram illustrating the movement of the second fixing unit according to the embodiment of the present invention.
Fig. 9 is a partial enlarged view of B of fig. 6.
Fig. 10 is another motion diagram of the second fixing unit according to the embodiment of the present invention.
In the accompanying drawings
1. Carrier body 2, adjustment fixture 21, extension
22. Slider 3, first fixing unit 31, recess
4. Rotation piece 41, convex piece 5, second fixing unit
6. Button 7, elastic member 8, pull cord
9. Spindle 10, locking element 101, locking opening
102. Positioning groove 103, guide surface 11 and clamping piece
12. Force application portion 13, conductive member 131, and expansion port
132. Sliding chute
Detailed Description
In order to make the objects, technical solutions, and advantages of the present invention more apparent, the embodiments of the present invention will be further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are some, but not all, embodiments of the present invention, are intended to be illustrative only and not limiting of the embodiments of the present invention, and that all other embodiments obtained by persons of ordinary skill in the art without making any inventive effort are within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," "horizontal," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Furthermore, the terms "a," an, "" the first, "" the second, "" the third, "" the fourth, "" the fifth, "and the sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
For purposes of brevity and description, the principles of the embodiments are described primarily by reference to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. However, it is apparent that. It will be apparent to one of ordinary skill in the art that the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.
Embodiment one:
as shown in fig. 1-3, a silicon wafer etching process fixing carrier includes: the carrier comprises a carrier body 1, a first fixing unit 3, at least two adjusting fixing pieces 2 and a conducting piece 13. The carrier body 1 is used for carrying silicon wafers. The first fixing unit 3 has a recess 31, and the recess 31 is used for clamping the silicon wafer. The adjusting and fixing parts 2 are in opposite directions, opposite end faces of the adjusting and fixing parts 2 face the center of the carrier main body 1, the adjusting and fixing parts 2 are connected with the carrier main body 1 and the first fixing unit 3, one adjusting and fixing part 2 is provided with positive threads, the other adjusting and fixing part 2 is provided with reverse threads, the adjusting and fixing part 2 is also provided with an extending part 21 and a sliding part 22, the extending part 21 is provided with a certain length, and the sliding part 22 is connected with the extending part 21. The conductive member 13 has a telescopic opening 131, the telescopic opening 131 has a certain depth, the extension member 21 is located in the telescopic opening 131, the extension member 21 and the telescopic opening 131 are mutually attached, the telescopic opening 131 has a sliding groove 132, and the sliding groove 132 is connected with the sliding member 22.
The working steps are as follows:
first, a silicon wafer is put into the recess 31 of the first fixing unit 3, and the silicon wafer is held by the wall of the recess 31.
Then, the adjusting fixing piece 2 is screwed to drive the first fixing unit 3 to clamp the silicon wafer, wherein the extending piece 21 of the adjusting fixing piece 2 applies force to the conducting piece 13, the conducting piece 13 applies force to drive the other adjusting fixing piece 2, the other first fixing unit 3 is further driven to clamp the silicon wafer, and under the action of the positive threads and the reverse threads of the two adjusting fixing pieces 2, the two first fixing units 3 clamp the silicon wafer at the same speed and with the same force.
Finally, in the process of clamping the silicon wafer, if the silicon wafer and the carrier main body 1 are not located at the same center point, the height of the center point of the silicon wafer is higher than or lower than the center of the first fixing unit 3, the two ends of the silicon wafer face in the same direction in an arc manner, so that the silicon wafer is easy to squeeze and move, the silicon wafer is forced to move out of the first fixing unit 3, and the silicon wafer needs to be reinstalled. If the silicon wafer and the carrier main body 1 are positioned at the same center point, the height of the center point of the silicon wafer is equal to the center of the first fixing unit 3, and the two ends of the silicon wafer face different directions in an arc mode, the guiding effect of force is not provided, so that the first fixing unit 3 clamps the silicon wafer and fixes the silicon wafer.
Specifically, the recess 31 is V-shaped. The recess 31 has elasticity. The V-shaped opening of the first aspect is larger to avoid misalignment of the notch 31 when mounting the wafer. The V-shaped wall surface of the second aspect has a powerful guiding effect, moves along the V-shaped wall surface, and finally makes two ends of the silicon wafer mutually fit with the V-shaped wall surface, so that when the silicon wafer is prevented from being installed, an unoriented force is applied to the silicon wafer, and large friction is generated between the silicon wafer and the notch 31, so that the silicon wafer is damaged, and corrosion work cannot be performed. When the notch 31 of the third aspect clamps the silicon wafer, the clamping force of the silicon wafer is enhanced by the force generated by the elastic compression of the notch 31. The elasticity of the notch 31 provides a cushion for the wafer as it is dithered in the etching bath, preventing the rigid grip from forcing the wafer into cracks.
Specifically, as shown in fig. 3, the extension 21 is cylindrical. The expansion port 131 is cylindrical. The cylindrical extension 21 is fitted to the cylindrical expansion port 131. The extending piece 21 has a limiting function in all directions of the whole body, when the carrier main body 1 is prevented from shaking, the extending piece 21 shakes out of the telescopic opening 131, so that the extending piece 21 cannot transmit the rotating force to the conducting piece 13, and the two adjusting and fixing pieces 2 cannot be matched.
Specifically, as shown in fig. 4-7, the silicon wafer etching process fixing carrier further comprises a second fixing unit 5, the second fixing unit 5 is connected with the carrier main body 1, a bearing is arranged at the joint of the second fixing unit 5 and the carrier main body 1, and the second fixing unit 5 is provided with an accommodating space and a locking piece 10. The lock 10 is located in the accommodating space, and the lock 10 has a guide surface 103 and a positioning groove 102. The carrier body 1 further comprises a rotor 4, a boss 41. The rotating member 4 is connected to the first fixing unit 3, and the protruding member 41 is connected to the rotating member 4. When a silicon wafer is put into a corrosion pool to be corroded for a certain time, the carrier body 1 is rotated for a certain angle according to the requirement of the non-corroded part of the silicon wafer, the rotating piece 4 of the carrier body 1 is forced to rotate, the convex piece 41 on the rotating piece 4 slides along the guide surface 103 of the locking piece 10 to jack up the locking piece 10, and when the convex piece 41 moves to the positioning groove 102 of the locking piece 10, the positioning groove 102 is clamped with the convex piece 41 to lock the carrier body 1 to fix the silicon wafer. The invention has self-locking function when converting the direction of the silicon wafer, does not need to manually lock and fix, greatly quickens the conversion time of the silicon wafer and saves the corrosion time of the silicon wafer.
More specifically, as shown in fig. 6 to 9, the second fixing unit 5 further has a button 6, an elastic member 7, and a pull cord 8. The elastic member 7 is connected to the button 6. One end of the pull rope 8 is connected with the button 6, and the other end of the pull rope 8 is connected with the lock piece 10. When the carrier body 1 needs to be rotated, the push button 6 is pressed to pull the pull rope 8 to move, and the pull rope 8 further pulls the lock member 10 to move, so that the positioning groove 102 is separated from the convex member 41, and unlocking is completed.
More specifically, the second fixing unit 5 also has a rotation shaft 9. Is stretched and put on the rotating shaft 9. On the one hand, a fixed point is provided for the pull rope 8, so that the pull rope 8 is convenient to steer, and on the other hand, when the pull rope 8 moves, the rotating shaft 9 can move along the movement direction of the pull rope 8, so that the pull rope 8 is prevented from being worn.
More specifically, as shown in fig. 6-9, the lock 10 also has a locking port 101. The second fixing unit 5 is further provided with a clamping piece 11, the clamping piece 11 is movably connected in the second fixing unit 5, a biasing spring piece is arranged at the joint of the clamping piece 11 and the second fixing unit 5, one end of the clamping piece 11 is located in the accommodating space, and the other end of the clamping piece 11 is provided with a force application part 12. When the pull rope 8 pulls the lock 10 to move, the locking opening 101 of the lock 10 is clamped with the clamping piece 11, and at this time, the button 6 is released, so that on one hand, the button 6 is not required to be pressed for a long time, a period of labor force is saved, and on the other hand, whether the convex piece 41 has missed the positioning groove 102 or not when the carrier body 1 is rotated is not required to be judged, and the locking at the same position is prevented. As shown in fig. 10, after the locking opening 101 engages the clamping member 11, the carrier body 1 is rotated, and the convex member 41 of the rotating member 4 abuts against the force application portion 12 of the clamping member 11 in the rotating process, so as to urge the clamping member 11 to rotate, so that the clamping member 11 is separated from the locking opening 101, and the locking member 10 is reset, so that the carrier body 1 is conveniently locked.
More specifically, the end of the clip 11 located in the accommodation space is arc-shaped. The arc-shaped clamping piece 11 has a guiding function, so that the clamping piece 11 is prevented from being separated from the accommodating space.
The beneficial effects of the invention are as follows:
firstly, under the action of the positive threads and the reverse threads of the two adjusting fixing pieces 2, the two first fixing units 3 clamp the silicon wafer at the same speed and with the same force. The silicon wafer is clamped, and the deviation between the center of the silicon wafer and the center of the carrier main body 1 is prevented, so that the quality of a product is influenced.
Secondly, when the silicon wafer and the carrier main body 1 are not at the same center point, the two ends of the silicon wafer clamped by the two first fixing units 3 face the same direction in an arc shape, so that the silicon wafer is forced to move out of the first fixing units 3, and the deviation between the center of the silicon wafer and the center of the carrier main body 1 is prevented, and the product quality is prevented from being influenced.
A method of fixing a silicon wafer comprising the steps of:
and clamping, namely placing the silicon wafer into the notch 31 of the first fixing unit 3, and clamping the silicon wafer by using the wall of the notch 31.
The adjusting fixing piece 2 is screwed to drive the first fixing unit 3 to clamp the silicon wafer, wherein the extending piece 21 of the adjusting fixing piece 2 applies force to the conducting piece 13, the conducting piece 13 applies force to drive the other adjusting fixing piece 2, the other first fixing unit 3 is further driven to clamp the silicon wafer, and under the action of the positive threads and the reverse threads of the two adjusting fixing pieces 2, the two first fixing units 3 clamp the silicon wafer at the same speed and with the same force.
When the two first fixing units 3 clamp the silicon wafer at the same speed and with the same force, if the silicon wafer and the carrier main body 1 are not positioned at the same center point, the height of the center point of the silicon wafer is higher or lower than that of the center of the first fixing units 3, and the two ends of the silicon wafer are in the same direction in an arc shape, so that the silicon wafer is easily extruded and moved under the guiding action of the force, the silicon wafer is forced to move out of the first fixing units 3, and the silicon wafer needs to be reinstalled. If the silicon wafer and the carrier main body 1 are at the same center point, the height of the silicon wafer center point is equal to the center of the first fixing unit 3, and the two ends of the silicon wafer are in different directions in an arc shape, the guiding function of force is not provided, so that the first fixing unit 3 clamps the silicon wafer.
After the first fixing unit 3 clamps the silicon wafer, the adjusting fixing piece 2 is sent to finish the fixing work of the silicon wafer.
Specifically, after the fixing step is completed, the carrier body 1 is put into an etching bath to perform etching work.
Specifically, in the clamping step, the elasticity of the notch 31 applies force to the silicon wafer wall surface, so that the clamping force of the silicon wafer is further enhanced.
More specifically, in the etching step, after a part of the silicon wafer is etched for a certain period of time, the carrier body 1 is rotated by a certain angle according to the requirement of the non-etched part of the silicon wafer, the rotating member 4 of the carrier body 1 is forced to rotate, the protruding member 41 on the rotating member 4 slides along the guiding surface 103 of the locking member 10 to jack up the locking member 10, and when the protruding member 41 moves to the positioning groove 102 of the locking member 10, the positioning groove 102 is clamped with the protruding member 41 to lock the carrier body 1.
More specifically, in the etching step, after the silicon wafer in the etching tank is partially etched for a certain time, according to the requirement of the non-etched part of the silicon wafer, the button 6 is pressed down, the button 6 moves, the lock 10 is pulled by the pull rope 8, so that the positioning groove 102 is separated from the convex part 41, meanwhile, the locking opening 101 of the lock 10 is clamped with the clamping part 11, the carrier body 1 is rotated for a certain angle, the rotating part 4 is forced to rotate, the convex part 41 is abutted against the force application part 12 of the clamping part 11, the clamping part 11 is driven to rotate, the clamping part 11 is separated from the locking opening 101, the lock 10 is reset, and the carrier body 1 is conveniently locked later.
While the foregoing describes the illustrative embodiments of the present invention so that those skilled in the art may understand the present invention, the present invention is not limited to the specific embodiments, and all inventive innovations utilizing the inventive concepts are herein within the scope of the present invention as defined and defined by the appended claims, as long as the various changes are within the spirit and scope of the present invention.

Claims (9)

1. A silicon wafer etching process fixing carrier, comprising:
a carrier body;
a first fixing unit having a recess;
the device comprises a carrier main body, at least two adjusting fixing pieces, wherein the adjusting fixing pieces are in opposite directions, opposite end faces of the adjusting fixing pieces face to the center of the carrier main body, the adjusting fixing pieces are connected with the carrier main body and the first fixing unit, one adjusting fixing piece is provided with a positive thread, the other adjusting fixing piece is provided with a reverse thread, and the adjusting fixing pieces are further provided with:
an extension member;
a slider coupled to the extension;
a conductive member, the conductive member having:
the extension piece is positioned in the extension opening, the extension opening is provided with a sliding groove, and the sliding groove is connected with the sliding piece;
the silicon wafer corrosion process fixing carrier further comprises a second fixing unit, the second fixing unit is connected with the carrier main body, a bearing is arranged at the joint of the second fixing unit and the carrier main body, the second fixing unit is provided with an accommodating space and a locking piece, the locking piece is positioned in the accommodating space, and the locking piece is provided with a guide surface and a positioning groove;
the second fixing unit further has: the device comprises a button, an elastic piece and a pull rope, wherein the elastic piece is connected with the button, one end of the pull rope is connected with the button, and the other end of the pull rope is connected with the lock piece;
the second fixing unit is also provided with a rotating shaft;
the locking piece is also provided with a locking opening;
the second fixing unit is also provided with a clamping piece, the clamping piece is movably connected in the second fixing unit, a connection part of the clamping piece and the second fixing unit is provided with a biasing spring piece, one end of the clamping piece is positioned in the accommodating space, and the other end of the clamping piece is a force application part;
the carrier body further includes:
the rotating piece is connected with the first fixing unit;
and the convex piece is connected with the rotating piece.
2. The silicon wafer etching process fixing carrier of claim 1, wherein the notch is V-shaped.
3. The silicon wafer etching process mounting carrier of claim 1, wherein the notch is resilient.
4. The silicon wafer etching process fixing carrier of claim 1, wherein the extension is cylindrical.
5. The silicon wafer etching process fixing carrier of claim 1, wherein the telescopic opening is cylindrical.
6. The silicon wafer etching process fixing carrier according to claim 1, wherein one end of the clamping piece located in the accommodating space is arc-shaped.
7. A method for fixing a silicon wafer, wherein the method for fixing a silicon wafer is based on the silicon wafer etching process fixing carrier of claim 1, and the method for fixing a silicon wafer comprises the following steps:
clamping, namely placing the silicon wafer into a notch of a first fixing unit, and clamping the silicon wafer by using the wall of the notch;
the method comprises the steps of relatively moving, screwing an adjusting fixing piece to drive the first fixing unit to clamp a silicon wafer, wherein an extending piece of the adjusting fixing piece applies force to a conducting piece, the conducting piece applies force to drive the other adjusting fixing piece to further drive the other first fixing unit to clamp the silicon wafer, and under the action of positive threads and reverse threads of the two adjusting fixing pieces, the two first fixing units clamp the silicon wafer at the same speed and with the same force;
judging a central point, when two first fixing units clamp a silicon wafer at the same speed and with the same force, if the silicon wafer and a carrier main body are not positioned at the same central point, the height of the central point of the silicon wafer is higher or lower than that of the center of the first fixing units, and the two ends of the silicon wafer are in arc directions in the same direction, so that the silicon wafer is easy to extrude and move, the silicon wafer is forced to move out of the first fixing units, and the silicon wafer needs to be reinstalled; if the silicon wafer and the carrier main body are positioned at the same center point, the height of the center point of the silicon wafer is equal to the center of the first fixing unit, and the two ends of the silicon wafer are in arc directions, so that the silicon wafer is clamped by the first fixing unit without the guiding function of force;
after the first fixing unit clamps the silicon wafer, loosening the adjusting fixing piece to finish the fixing work of the silicon wafer;
in the etching step, after a part of a silicon wafer is etched for a certain time, rotating the carrier main body by a certain angle according to the requirement of an unetched part of the silicon wafer, and enabling a rotating piece of the carrier main body to rotate under the force of the rotating piece, wherein a convex piece on the rotating piece slides along a guide surface of a locking piece to jack up the locking piece, and when the convex piece moves to a positioning groove of the locking piece, the positioning groove is clamped with the convex piece to lock the carrier main body;
in the corrosion step, after the silicon wafer part in the corrosion pool is corroded for a certain time, according to the requirement of the non-corroded part of the silicon wafer, a button is pressed down, the button moves, a locking piece is pulled through a pull rope, a positioning groove is separated from a convex piece, meanwhile, a locking opening of the locking piece is clamped with a clamping piece, the carrier main body is rotated for a certain angle, the rotating piece is stressed to rotate, the convex piece props against a force application part of the clamping piece, the clamping piece is driven to rotate, the clamping piece is separated from the locking opening, the locking piece resets, and the carrier main body is conveniently locked later.
8. The method of securing a silicon wafer according to claim 7, wherein after the securing step is completed, the carrier body is placed into an etching bath for etching.
9. The method of fixing a silicon wafer according to claim 7, wherein the elasticity of the notch applies a force to the silicon wafer wall surface during the clamping step, further enhancing the clamping force of the silicon wafer.
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