CN109633418A - Photon radiation microscope example seat, test method and microscopie unit - Google Patents
Photon radiation microscope example seat, test method and microscopie unit Download PDFInfo
- Publication number
- CN109633418A CN109633418A CN201811630274.3A CN201811630274A CN109633418A CN 109633418 A CN109633418 A CN 109633418A CN 201811630274 A CN201811630274 A CN 201811630274A CN 109633418 A CN109633418 A CN 109633418A
- Authority
- CN
- China
- Prior art keywords
- sample
- photon radiation
- substrate
- example seat
- radiation microscope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/302—Contactless testing
- G01R31/308—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
- G01R31/311—Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of integrated circuits
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B21/00—Microscopes
- G02B21/34—Microscope slides, e.g. mounting specimens on microscope slides
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Environmental & Geological Engineering (AREA)
- Health & Medical Sciences (AREA)
- Computer Vision & Pattern Recognition (AREA)
- Electromagnetism (AREA)
- Toxicology (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Optics & Photonics (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The invention discloses a kind of photon radiation microscope example seats, comprising: substrate is provided with the sample supporting region for carrying sample on the substrate;Vertically run through the substrate in the sample supporting region;The loading plate of light-transmitting materials is equipped in the sample supporting region;Metal electrode is arranged in the substrate and vertically runs through the substrate;Closing line, for the acupuncture treatment region of the sample to be tested to be electrically connected with the metal electrode.The present invention make it is original just/back side detection type EMMI/OBIRCH applied analysis equipment have from two sides carry out analysis application ability.Accurate positioning defective locations that can be more convenient.
Description
Technical field
The present invention relates to field of microelectronic fabrication, more particularly to a kind of microscopical specimen holder of photon radiation and test
Method.The invention further relates to a kind of photon radiation microscopie units.
Background technique
As device dimensions shrink and operating voltage reduce, chip back segment metal interconnection layer gradually increases, and sample fails are fixed
Position is all the more complicated.EMMI (photon radiation microscope) and OBIRCH (photic impedance variations microscope) is to be most commonly used for sample
Fail the equipment positioned, and EMMI mainly carries out failure positioning by the photon signal that capturing devices electric leakage generates, and OBIRCH is main
Laser signal by capturing the resistance variations generated after laser scanning chip feedback carries out failure positioning.According to chip failure mould
Formula industry mainly uses two kinds of equipment of front detection type and back side detection type EMMI/OBIRCH.It is selected for different failure modes
The success rate of chip failure positioning can be improved in suitable equipment.
Chip leading portion and lower metal problem are frequently with back side detection type EMMI/OBIRCH, because of the increasing of metal interconnection layer
The photon for the defects of will lead to element leakage and short-circuit lower metal or Laser feedback signal is added to weaken even completely by upper layer gold
Belong to masking, blocking of the upper layer metal to signal can avoid using back side detection type EMMI/OBIRCH, improve signal reception amount, from
And the success rate of failure positioning is improved, such as GOI failure, S/D electric leakage, ESD damage, lower metal short circuit failure are frequently with the back side
Detection type EMMI/OBIRCH is positioned.Equally, when chip metal interconnection layer especially upper layer metal when something goes wrong, the back side
Detection type EMMI/OBIRCH captures the Laser feedback signal of defect since the blocking of lower metal layer can be weakened or be hidden completely
It covers, therefore, often selects front detection type EMMI/OBIRCH to be positioned for such defect.
The back side normal operating process of detection type EMMI/OBIRCH is that sample is face-up placed on sample stage to (small ruler
Very little sample needs to be pasted on glass slide using hot melt adhesive), by the microscope above sample to defocused, on chip
Metal Pad is had an acupuncture treatment and applies electric signal.The detector of side starts to receive signal under the die at this time, detects from chip back
Chip failure position.Common detector has ccd detector and indium gallium arsenic detector.Laser scanning chip can also be used to induce
Resistance variations detect Laser feedback signal, to position to defective locations, as shown in Figure 1.And front detection type EMMI/
The difference of OBIRCH and back side detection type is that detector position is located above sample, as shown in Figure 2.
By the operating process of two kinds of equipment it is found that back side detection type equipment can not carry out positive detection, because of chip front side
Will lead to equipment downward can not have an acupuncture treatment and input electrical signal, and vice versa.It fails if chip failure analysis is existed simultaneously to two kinds
The demand of localization method, enterprise needs while buying two kinds of equipment (at high cost), or directly commission third-party analysis mechanism carries out
Failure analysis, (analysis cost is expensive, and usually requires principal and carry out relevant information confirmation to scene, expend many times at
This), also or on the same device realize the detection of both direction.
Fig. 3 is the existing method schematic diagram that front failure positioning is carried out by back side detection type EMMI/OBIRCH, is implemented
Process approximately as: 1., which face down sample, is fixed on the sample stage back side;2. minimum again using indium gallium arsenic detector (or CCD)
Rate treats analyzed area and focuses;3. being had an acupuncture treatment from bottom to top using specific U-shaped probe as shown in Figure 3 and applying telecommunications
Number, EMMI/OBIRCH analysis then is carried out to sample front.This method is provided with back side detection type EMMI/OBIRCH from just
Face carries out the ability of analysis application, but this method has an acupuncture treatment complicated for operation from bottom to top and is easy to damage sample and probe;U-shaped probe
Below sample, causes 100X probe that can not focus, the position Hotspot can not be accurately positioned.
Summary of the invention
Technical problems to be solved in this application are to devise a kind of photon radiation microscope example seat, make it is original just/
Back side detection type EMMI/OBIRCH applied analysis equipment has the ability that analysis application is carried out from two sides.It more accurate can position
Defective locations;It is easy to operate, improve failure analysis efficiency;The use scope for widening board has saved third-party testing cost.
In order to solve the above-mentioned technical problem, the invention discloses a kind of photon radiation microscope example seats, comprising: substrate,
The sample supporting region for carrying sample is provided on the substrate;Vertically run through the base in the sample supporting region
Plate;The loading plate of light-transmitting materials is equipped in the sample supporting region;Metal electrode is arranged in the substrate and along Vertical Square
To through the substrate;Closing line, for the region to be had an acupuncture treatment of the sample to be electrically connected with the metal electrode.
Preferably, further includes: bracket is used to support the substrate, and the bracket is flexibly connected on the substrate.
Preferably, further includes: pedestal, for carrying the bracket, the pedestal is fixedly connected on the bracket.
Preferably, the substrate is square pcb board.
Preferably, the loading plate is pure quartz glass plate.
Preferably, the metal electrode is copper electrode.
Preferably, the metal electrode is arranged in around the sample supporting region.
Preferably, the bracket is threadedly coupled with the substrate.
Preferably, the pedestal is magnetic material, for specimen holder to be fixed on board plummer.
The invention also discloses a kind of photon radiation microscope devices, comprising: probe base has specimen holder plummer, institute
It states upper surface and is used to support probe base, feeler arm is provided on the probe base, is provided with probe on the feeler arm;Equipment is held
Microscope carrier, for carrying the photon radiation microscope example seat.
Preferably, further includes: multiple optical lenses are set to below sample stage and probe station, are used for optical focus, described
There is trouble free service distance between optical lens and the sample stage, probe base, feeler arm and probe;Multiple detectors, are located at
Below the optical lens, for carrying out defect location and analysis to the metal interconnecting layer.
Preferably, further includes: viewing microscope is arranged above sample, and the viewing microscope is for observation of having an acupuncture treatment.
Preferably, further includes: multiple optical lenses, setting is used for optical focus with above sample stage and probe station, described
There is trouble free service distance between optical lens and the sample stage, probe base, feeler arm and probe;Multiple detectors, are located at
Above the optical lens, for carrying out defect location and analysis to the metal interconnecting layer.
Preferably, the detector includes indium gallium arsenic detector or confocal laser microscope.
The invention also discloses a kind of test methods using photon radiation microscope example seat, comprising the following steps: step
Rapid one, sample back side silicon base is fixed on specimen holder loading plate lower surface;Step 2 removes specimen holder bottom bracket, will
The region to be tested for needing to have an acupuncture treatment with the copper electrode of closing line and surrounding by being electrically connected, then mounting bracket;Step 3,
It has an acupuncture treatment the corresponding copper electrode upper surface that test sample is connected;Step 4, using indium gallium arsenic detector or it is confocal swash
Light microscope minimum multiplying power treats analyzed area and focuses, input electrical signal, carries out the front EMMI/OBIRCH point to sample
Analysis.
Preferably, in step 1, sample back side silicon base is fixed on loading plate lower surface by thermosol.
Photon radiation microscope example seat and photon radiation microscope device of the invention, make it is original just/back side detection
Formula EMMI/OBIRCH applied analysis equipment has the ability that analysis application is carried out from two sides.It can more accurate positioning defective locations;
It is easy to operate, improve failure analysis efficiency;The use scope for widening board has saved third-party testing cost.
Detailed description of the invention
Fig. 1 is back side detection type EMMI/OBIRCH routine test schematic diagram in the prior art.
Fig. 2 is front detection type EMMI/OBIRCH routine test schematic diagram in the prior art.
Fig. 3 is the existing positive surface detecting method schematic diagram of back side detection type EMMI/OBIRCH.
Fig. 4-8 is photon radiation microscope example seat schematic diagram of the present invention.
Fig. 9 is that photon radiation microscope example seat of the invention is detected applied to the front back side detection type EMMI/OBIRCH
Schematic diagram.
Photon radiation microscope example seat Figure 10 of the invention is applied to the detection of the back side front detection type EMMI/OBIRCH and shows
It is intended to.
Description of symbols
10 photon radiation microscope example seat, 11 substrate
12 loading plate, 13 metal electrode
14 closing line, 15 bracket
16 pedestal, 20 probe base
21 feeler arm, 22 probe
30 equipment plummer, 40 optical lens
50 detector, 51 indium gallium arsenic detector
52 confocal laser microscope, 60 viewing microscope
61 thermosols
Specific embodiment
Specific embodiments of the present invention are described in detail with reference to the accompanying drawing.It is to be appreciated that the present invention is not
It is confined to above-mentioned particular implementation, devices and structures not described in detail herein should be understood as with common in this field
Mode is practiced;Anyone skilled in the art without departing from the scope of the technical proposal of the invention all can benefit
Many possible changes and modifications are made to technical solution of the present invention with the methods and technical content of the disclosure above, or are revised as
With the equivalent embodiment of variation, this is not affected the essence of the present invention.
Embodiment a sample seat
As shown in Figure 4-8, photon radiation microscope example seat 10 of the invention, comprising: substrate 11, metal electrode 13, branch
Frame 15, pedestal 16, closing line 14.
The substrate 11 is preferably square pcb board, it is preferable that substrate 11 the side length 50~80mm, high 5mm.It is described
The sample supporting region for carrying sample is provided on substrate;Vertically run through the substrate in the sample supporting region;
The loading plate 12 of light-transmitting materials is equipped in the sample supporting region;Preferably, the loading plate 12 is quartz glass plate.This implementation
In example, which is arranged in the center of the substrate, and the side length of the quartz glass plate is 25~50mm, is highly
3mm。
Metal electrode 13 is arranged in the substrate and vertically runs through the substrate and be looped around around carrying
11;Metal electrode described in the present embodiment is copper electrode.The metal electrode 13 is arranged in around the sample supporting region, according to
Old different test zone Pad demand, quantity are 2~100.
The metal layer of the sample and the metal electrode 13 are electrically connected by the closing line 14 with re-bonding mode
It connects.
The bracket 15 is used to support the substrate 11, and the bracket 15 is movably connected on the substrate 11.Preferably,
The bracket is four, is threadedly coupled with the substrate.Preferably, screw outer diameter 5mm, internal diameter 3mm, the high 5mm of bracket.
For carrying the bracket 15, the pedestal 16 is fixedly connected on the bracket 15 pedestal 16.The bottom
Seat is preferably magnetic material, adsorbable on equipment plummer.The diameter of pedestal is 10mm in the present embodiment.
Two back side detection type photon radiation microscope device of embodiment and detection method
As shown in figure 9, the photon radiation microscope device of a preferred embodiment of the invention, is back side detection type photon
Radiate microscope device comprising: probe base 20, equipment plummer 30, optical lens 40, detector 50, viewing microscope 60.
The probe base 20 has upper surface, and the upper surface is used to support probe base 20, is arranged on the probe base 20
There is feeler arm 21, is provided with probe 22 on the feeler arm 21.
The equipment plummer 30 is for carrying the photon radiation microscope example seat.
The optical lens 40, setting with below sample stage and probe station, be used for optical focus, the optical lens 40 with
There is trouble free service distance, described in the present embodiment between the equipment plummer 30, probe base 20, feeler arm 21 and probe 22
Optical lens is 3.
The detector 50 is located at 40 lower section of the optical lens, for the metal interconnecting layer carry out defect location and
Analysis.Detector 50 described in the present embodiment includes indium gallium arsenic detector 51 or confocal laser microscope 52.
The viewing microscope 60 is arranged above sample, and viewing microscope is for observation of having an acupuncture treatment.
The back side detection type photon radiation microscope device operating procedure of the present embodiment is as follows:
Sample back side silicon base is fixed on sample stage center quartz glass lower surface by hot melt adhesive 61, heat by step 1
Melten gel is uniformly smeared, and avoids generating bubble.
Step 2 removes specimen holder bottom bracket, will need the pad that has an acupuncture treatment by re-bonding mode by itself and week
The copper electrode enclosed is attached, then mounting bracket.
The viewing microscope above sample stage can be used to be focused, needle point is found in the visual field, then to test Pad
It has an acupuncture treatment corresponding copper electrode upper surface.
Step 3 is treated analyzed area and is focused using indium gallium arsenic detector or confocal laser microscope minimum multiplying power,
Input electrical signal carries out the positive surface analysis of EMMI/OBIRCH to sample.
Three front detection type photon radiation microscope device of embodiment and detection method
As shown in Figure 10, the photon radiation microscope device of a preferred embodiment of the invention is front detection type light
Son radiation microscope device comprising: probe base 20, equipment plummer 30, optical lens 40, detector 50.
The probe base 20 has upper surface, and the upper surface is used to support probe base 20, is arranged on the probe base 20
There is feeler arm 21, is provided with probe 22 on the feeler arm 21.
The equipment plummer 30 is for carrying the photon radiation microscope example seat.
The optical lens 40, setting with above sample stage and probe station, be used for optical focus, the optical lens 40 with
There is trouble free service distance, described in the present embodiment between the equipment plummer 30, probe base 20, feeler arm 21 and probe 22
Optical lens is 3.
The detector 50 is located at 40 top of the optical lens, for the metal interconnecting layer carry out defect location and
Analysis.Detector 50 described in the present embodiment includes indium gallium arsenic detector 51 or confocal laser microscope 52.
The front detection type photon radiation microscope device operating procedure of the present embodiment is as follows:
Sample back side silicon base is fixed on sample stage center quartz glass lower surface by hot melt adhesive 61, heat by step 1
Melten gel is uniformly smeared, and avoids generating bubble.
Step 2 removes specimen holder bottom bracket, will need the pad that has an acupuncture treatment by re-bonding mode by itself and week
The copper electrode enclosed is attached, then mounting bracket.
Step 3 is treated analyzed area and is focused using indium gallium arsenic detector or confocal laser microscope minimum multiplying power,
Input electrical signal carries out the positive surface analysis of EMMI/OBIRCH to sample.
Photon radiation microscope example seat and photon radiation microscope device of the invention, make it is original just/back side detection
Formula EMMI/OBIRCH applied analysis equipment has the ability that analysis application is carried out from two sides.It can more accurate positioning defective locations;
It is easy to operate, improve failure analysis efficiency;The use scope for widening board has saved third-party testing cost.
Presently preferred embodiments of the present invention is described above, anything that does not depart from the technical scheme of the invention, according to
According to technical spirit any simple modifications, equivalents, and modifications made to the above embodiment of the invention, this hair is still fallen within
In the range of bright technical solution protection.
Claims (16)
1. a kind of photon radiation microscope example seat characterized by comprising
Substrate is provided with the sample supporting region for carrying sample on the substrate;In the sample supporting region vertically
Through the substrate;The loading plate of light-transmitting materials is equipped in the sample supporting region;
Metal electrode is arranged in the substrate and vertically runs through the substrate;
Closing line, for the acupuncture treatment region of the sample to be electrically connected with the metal electrode.
2. photon radiation microscope example seat as described in claim 1, which is characterized in that further include: bracket is used to support institute
Substrate is stated, the bracket is flexibly connected on the substrate.
3. photon radiation microscope example seat as described in claim 1, which is characterized in that further include: pedestal, for carrying
Bracket is stated, the pedestal is fixedly connected on the bracket.
4. photon radiation microscope example seat as described in claim 1, which is characterized in that the substrate is square pcb board.
5. photon radiation microscope example seat as described in claim 1, which is characterized in that the loading plate is high purity quartz glass
Glass plate.
6. photon radiation microscope example seat as described in claim 1, which is characterized in that the metal electrode is copper electrode.
7. photon radiation microscope example seat as described in claim 1, which is characterized in that the metal electrode is arranged described
Around sample supporting region.
8. photon radiation microscope example seat as claimed in claim 2, which is characterized in that the bracket and the substrate screw thread
Connection.
9. photon radiation microscope example seat as claimed in claim 3, which is characterized in that the pedestal is magnetic material, is used
In specimen holder is fixed on board plummer.
10. a kind of photon radiation microscope using the photon radiation microscope example seat as described in one of claim 1-9
Equipment characterized by comprising
Probe base has upper surface, and the upper surface is used to support probe base, feeler arm is provided on the probe base, described
Probe is provided on feeler arm;
Equipment plummer, for carrying the photon radiation microscope example seat.
11. photon radiation microscope device as claimed in claim 10, which is characterized in that further include:
Multiple optical lenses, setting are used for optical focus, the optical lens and the sample with below sample stage and probe station
There is trouble free service distance between platform, probe base, feeler arm and probe;
Multiple detectors are located at below the optical lens, for carrying out defect location and analysis to the metal interconnecting layer.
12. photon radiation microscope device as claimed in claim 11, which is characterized in that further include:
Viewing microscope is arranged above sample, and the viewing microscope is for observation of having an acupuncture treatment.
13. photon radiation microscope device as claimed in claim 10, which is characterized in that further include:
Multiple optical lenses, setting are used for optical focus, the optical lens and the sample with above sample stage and probe station
There is trouble free service distance between platform, probe base, feeler arm and probe;
Multiple detectors are located above the optical lens, for carrying out defect location and analysis to the metal interconnecting layer.
14. the photon radiation microscope device as described in one of claim 11-13, which is characterized in that the detector packet
Include indium gallium arsenic detector or confocal laser microscope.
15. a kind of test method using the photon radiation microscope example seat as described in one of claim 1-9, feature
It is, comprising the following steps:
Sample back side silicon base is fixed on specimen holder loading plate lower surface by step 1,
Step 2 removes specimen holder bottom bracket, and the region to be tested for needing to have an acupuncture treatment is passed through closing line and the copper of surrounding electricity
Pole is electrically connected, then mounting bracket;
Step 3 has an acupuncture treatment from top to bottom to the corresponding copper electrode upper surface of test sample;
Step 4 is treated analyzed area and is focused using indium gallium arsenic detector or confocal laser microscope minimum multiplying power, input
Electric signal carries out the positive surface analysis of EMMI/OBIRCH to sample.
16. the test method of photon radiation microscope example seat as claimed in claim 14, which is characterized in that in step 1,
Sample back side silicon base is fixed on loading plate lower surface by thermosol.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811630274.3A CN109633418A (en) | 2018-12-29 | 2018-12-29 | Photon radiation microscope example seat, test method and microscopie unit |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811630274.3A CN109633418A (en) | 2018-12-29 | 2018-12-29 | Photon radiation microscope example seat, test method and microscopie unit |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109633418A true CN109633418A (en) | 2019-04-16 |
Family
ID=66079224
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811630274.3A Pending CN109633418A (en) | 2018-12-29 | 2018-12-29 | Photon radiation microscope example seat, test method and microscopie unit |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109633418A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110579699A (en) * | 2019-09-20 | 2019-12-17 | 武汉电信器件有限公司 | Chip testing device |
CN111913091A (en) * | 2020-07-31 | 2020-11-10 | 上海华力集成电路制造有限公司 | Sample fixing device |
CN112198651A (en) * | 2020-12-03 | 2021-01-08 | 深圳市众凌泰科技有限公司 | Slide water cooling system and method |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101063625A (en) * | 2006-04-30 | 2007-10-31 | 中芯国际集成电路制造(上海)有限公司 | BGA packaging retainer apparatus and method for testing BGA packaging |
CN101206179A (en) * | 2006-12-22 | 2008-06-25 | 中芯国际集成电路制造(上海)有限公司 | Light emission microscope sample |
CN101527275A (en) * | 2008-03-06 | 2009-09-09 | 和舰科技(苏州)有限公司 | Wafer back positioning system |
CN102074543A (en) * | 2009-11-20 | 2011-05-25 | 中芯国际集成电路制造(上海)有限公司 | Packaging pedestal for semiconductor |
JP2012256648A (en) * | 2011-06-07 | 2012-12-27 | Fujifilm Corp | Kit for forming metal electrode protection film, metal electrode protection film and formation method therefor, and semiconductor light-emitting device and manufacturing method therefor |
US20130170022A1 (en) * | 2011-12-29 | 2013-07-04 | Elwha LLC, a limited liability company of the State of Delaware | Adjustable optics for ongoing viewing correction |
CN103389307A (en) * | 2012-05-11 | 2013-11-13 | 上海华虹Nec电子有限公司 | Apparatus for backside EMMI failure analysis and failure analysis method thereof |
CN103487744A (en) * | 2013-05-07 | 2014-01-01 | 上海华力微电子有限公司 | Dynamic EMMI system, implementing method of dynamic EMMI system and application method of dynamic EMMI system |
CN104316856A (en) * | 2014-10-29 | 2015-01-28 | 上海华力微电子有限公司 | Back face detection type photon radiation microscope device and testing method thereof |
CN105092909A (en) * | 2015-08-11 | 2015-11-25 | 上海华力微电子有限公司 | Bent probe and jig thereof |
CN106908943A (en) * | 2017-03-20 | 2017-06-30 | 北京航空航天大学 | A kind of high-accuracy microscope example real-time range and apparatus for measuring degree of inclination |
-
2018
- 2018-12-29 CN CN201811630274.3A patent/CN109633418A/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101063625A (en) * | 2006-04-30 | 2007-10-31 | 中芯国际集成电路制造(上海)有限公司 | BGA packaging retainer apparatus and method for testing BGA packaging |
CN101206179A (en) * | 2006-12-22 | 2008-06-25 | 中芯国际集成电路制造(上海)有限公司 | Light emission microscope sample |
CN101527275A (en) * | 2008-03-06 | 2009-09-09 | 和舰科技(苏州)有限公司 | Wafer back positioning system |
CN102074543A (en) * | 2009-11-20 | 2011-05-25 | 中芯国际集成电路制造(上海)有限公司 | Packaging pedestal for semiconductor |
JP2012256648A (en) * | 2011-06-07 | 2012-12-27 | Fujifilm Corp | Kit for forming metal electrode protection film, metal electrode protection film and formation method therefor, and semiconductor light-emitting device and manufacturing method therefor |
US20130170022A1 (en) * | 2011-12-29 | 2013-07-04 | Elwha LLC, a limited liability company of the State of Delaware | Adjustable optics for ongoing viewing correction |
CN103389307A (en) * | 2012-05-11 | 2013-11-13 | 上海华虹Nec电子有限公司 | Apparatus for backside EMMI failure analysis and failure analysis method thereof |
CN103487744A (en) * | 2013-05-07 | 2014-01-01 | 上海华力微电子有限公司 | Dynamic EMMI system, implementing method of dynamic EMMI system and application method of dynamic EMMI system |
CN104316856A (en) * | 2014-10-29 | 2015-01-28 | 上海华力微电子有限公司 | Back face detection type photon radiation microscope device and testing method thereof |
CN105092909A (en) * | 2015-08-11 | 2015-11-25 | 上海华力微电子有限公司 | Bent probe and jig thereof |
CN106908943A (en) * | 2017-03-20 | 2017-06-30 | 北京航空航天大学 | A kind of high-accuracy microscope example real-time range and apparatus for measuring degree of inclination |
Non-Patent Citations (3)
Title |
---|
LI TIAN: "Application study of simply and low cost numerical aperture increasing lens (NAIL) system for OBIRCH and EMMI in backside failure analysis", 《2015 IEEE 22ND INTERNATIONAL SYMPOSIUM ON THE PHYSICAL AND FAILURE ANALYSIS OF INTEGRATED CIRCUITS》 * |
M.BOOSTANDOOST: "Circuit simulation assisting Physical Fault Isolation for effective root cause analysis", 《MICROELECTRONICS RELIABILITY》 * |
刘迪: "基于SIFT技术的集成电路失效缺陷分析", 《固体电子学研究与进展》 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110579699A (en) * | 2019-09-20 | 2019-12-17 | 武汉电信器件有限公司 | Chip testing device |
CN111913091A (en) * | 2020-07-31 | 2020-11-10 | 上海华力集成电路制造有限公司 | Sample fixing device |
CN111913091B (en) * | 2020-07-31 | 2023-06-13 | 上海华力集成电路制造有限公司 | Sample fixing device |
CN112198651A (en) * | 2020-12-03 | 2021-01-08 | 深圳市众凌泰科技有限公司 | Slide water cooling system and method |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109633418A (en) | Photon radiation microscope example seat, test method and microscopie unit | |
US7053639B1 (en) | Probing fixture for semiconductor wafer | |
US6515494B1 (en) | Silicon wafer probe station using back-side imaging | |
CN107505341B (en) | X-ray-based LED chip defect automatic detection equipment and method | |
TW200822263A (en) | Test method for yielding a known good die | |
US6395580B1 (en) | Backside failure analysis for BGA package | |
US6339337B1 (en) | Method for inspecting semiconductor chip bonding pads using infrared rays | |
CN111123075B (en) | Failure analysis method of packaged device | |
CN108318800A (en) | A kind of GaN base semiconductor laser chip detection device and method | |
JP2737744B2 (en) | Wafer probing equipment | |
CN102403242B (en) | Method for protecting chip to be detected from damage during re-bonding | |
US5783835A (en) | Probing with backside emission microscopy | |
US6405359B1 (en) | Method for backside failure analysis requiring simple bias conditions | |
TW202132780A (en) | Stage and inspection apparatus | |
CN104316856B (en) | Back side detection type photon radiation microscopie unit and method of testing | |
CN107389987A (en) | A kind of simple electro-migration testing system | |
US8268669B2 (en) | Laser optical path detection | |
JPS61263235A (en) | Inspecting device | |
CN114324390A (en) | Integrated circuit failure positioning system and method based on continuous laser source | |
CN111913091B (en) | Sample fixing device | |
CN220272429U (en) | Semiconductor test apparatus | |
CN113341297B (en) | Grab point testing system and method | |
JP3012939B2 (en) | Solder bridge inspection method and apparatus for implementing the method | |
TW202318004A (en) | Electrical testing apparatus | |
CN216594812U (en) | Testing mechanism of body micro-defect detector |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |
|
RJ01 | Rejection of invention patent application after publication |