CN109631202A - A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner - Google Patents
A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner Download PDFInfo
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- CN109631202A CN109631202A CN201811485265.XA CN201811485265A CN109631202A CN 109631202 A CN109631202 A CN 109631202A CN 201811485265 A CN201811485265 A CN 201811485265A CN 109631202 A CN109631202 A CN 109631202A
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- heat
- heat exchange
- unit
- semiconductor
- exchange unit
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0042—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater characterised by the application of thermo-electric units or the Peltier effect
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/62—Control or safety arrangements characterised by the type of control or by internal processing, e.g. using fuzzy logic, adaptive control or estimation of values
- F24F11/63—Electronic processing
- F24F11/65—Electronic processing for selecting an operating mode
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F11/00—Control or safety arrangements
- F24F11/89—Arrangement or mounting of control or safety devices
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/30—Arrangement or mounting of heat-exchangers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F5/00—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater
- F24F5/0007—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning
- F24F5/0017—Air-conditioning systems or apparatus not covered by F24F1/00 or F24F3/00, e.g. using solar heat or combined with household units such as an oven or water heater cooling apparatus specially adapted for use in air-conditioning using cold storage bodies, e.g. ice
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/14—Thermal energy storage
Abstract
A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner, belongs to semiconductor air conditioner field.The device includes semiconductor refrigerating unit, heat exchange unit, exhaust fan and power-supply controller of electric.Heating/refrigerating core is divided into the identical upper layer and lower layer of structure, air inlet is constituted between each heat exchanger fin of the first heat exchange unit of lower layer, air outlet is constituted between each heat exchanger fin of the first heat exchange unit of upper layer, exhaust fan is set at air outlet, air is entered by air inlet through backflash, is discharged from air outlet by exhaust fan.The air-conditioning device absorbs the cooling capacity or heat of semiconductor refrigerating unit by heat exchange unit and storage adiabator, when environment needs to freeze, the heat of semiconductor refrigerating unit release is absorbed by storage adiabator, and when environment needs to heat, the cooling capacity of semiconductor refrigerating unit release is absorbed by storage adiabator.Semiconductor refrigerating unit realizes the switching of refrigeration, heating by conversion direct current supply positive and negative electrode.Backflash effectively increases heat exchange area and heat-exchange time, promotes refrigeration or heating efficiency.
Description
Technical field
The present invention relates to a kind of accumulation of heat/cold storage double-flow style semiconductor air conditioners, belong to semiconductor air conditioner field.
Background technique
Hot summer room temperature is higher, has seriously affected the working efficiency and quality of life of people.It is easypro in order to obtain
Suitable environment generallys use compressed air conditioner and freezes.However compressed air conditioner volume is larger, building block is more, cost
It is higher, portability is poor, these factors limit the application of compressed air conditioner on various occasions.In some office blocks, classroom is learned
In raw dormitory or even residential house, air-conditioning equipment is popularized far away.In the same manner, in cold winter, especially southern region of China,
Due to a lack of central heating, cause room temperature lower, in the place that compressed air conditioner is not popularized and region, lacks safely and fast
Heating mode.Semiconductor air conditioner has low in cost, refrigeration (or heating) speed because being freezed using paltie effect or being heated
It spends fast, no-rotary part, attract attention without refrigerant and environmental-friendly feature.However since its coefficient of performance is lower, making
While cold (or heating), a large amount of heat (cooling capacity) is also produced, if these heats (or cooling capacity) scatter and disappear indoors, not only not
It can be room temperature lowering (or heating), so that room temperature is increased (or reduction), this severely limits the extensive of semiconductor air conditioner
Using.In addition, in traditional semiconductor air-conditioning system, since the contact area of air and chill surface (or heating surface) has
Limit, which greatly limits air by fast cooling (or heating).
Summary of the invention
In order to overcome problems of the prior art, it is empty that the present invention provides a kind of accumulation of heat/cold storage double-flow semiconductor
Device is adjusted, which absorbs the cooling capacity or heat of semiconductor refrigerating unit by heat exchange unit and storage adiabator, in environment
When needing to freeze, the heat of semiconductor refrigerating unit release is absorbed and closed by thermal insulation board by storage adiabator, needs to make in environment
When hot, the cooling capacity of semiconductor refrigerating unit release is absorbed and closed by thermal insulation board by storage adiabator.
The technical solution adopted by the present invention is that: a kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner, it includes partly leading
Body refrigeration unit, heat exchange unit, exhaust fan and power-supply controller of electric, the semiconductor refrigerating unit and the heating of heat exchange unit composition/
Refrigerating core, heating/refrigerating core are divided into the identical upper layer and lower layer of structure, every layer of heating/refrigerating core middle position setting
A semiconductor refrigerating is respectively arranged in the heat transfer plate outside of the first opposite heat exchange unit of two heat exchanger fins, two the first heat exchange units
Unit, the outside of two semiconductor refrigerating units are respectively arranged second heat exchange unit, the refrigeration side of semiconductor refrigerating unit with
The heat-transfer area of first heat exchange unit abuts, and the heating side of semiconductor refrigerating unit and the heat-transfer area of the second heat exchange unit abut；Institute
It states to be equipped between two heat exchanger fins of the second heat exchange unit and stores adiabator；After upper layer and lower layer heating/refrigerating core superposition, heating/
It is wrapped up using thermal insulation board on the periphery of refrigerating core；The channel constituted between each heat exchanger fin of the first heat exchange unit of lower layer is air inlet
Mouthful, the channel constituted between each heat exchanger fin of the first heat exchange unit of upper layer is air outlet, exhaust fan is set at air outlet, air by
Air inlet, which passes into, to be arranged in the subsequent backflash of the first heat exchange unit, is discharged from air outlet by exhaust fan；The semiconductor
Refrigeration unit, exhaust fan are electrically connected with the power-supply controller of electric being located on panel.
The cross sectional shape of first heat exchange unit uses the structure of the first comb teeth and the first comb teeth slot.
The cross sectional shape of second heat exchange unit uses the structure of the second comb teeth and the second comb teeth slot.
Heating/refrigerating core top surface, bottom surface, the left side, the right side, the back side and positive two sides are arranged in the thermal insulation board.
The power-supply controller of electric is using the direct current supply positive and negative electrode for converting semiconductor refrigerating unit, to control semiconductor system
Cold unit is the conversion of refrigeration or heating.
The beneficial effects of the present invention are: this accumulation of heat/cold storage double-flow style semiconductor air conditioner includes semiconductor refrigerating
Unit, heat exchange unit, exhaust fan and power-supply controller of electric.Semiconductor refrigerating unit and heat exchange unit constitute heating/refrigerating core, system
Heat/refrigerating core is divided into the identical upper layer and lower layer of structure.The channel constituted between each heat exchanger fin of the first heat exchange unit of lower layer is
Air inlet, the channel constituted between each heat exchanger fin of the first heat exchange unit of upper layer are air outlet, and exhaust fan is arranged at air outlet, empty
Gas is passed by air inlet to be arranged in the subsequent backflash of the first heat exchange unit, is discharged from air outlet by exhaust fan.The air-conditioning
Device absorbs the cooling capacity or heat of semiconductor refrigerating unit, when environment needs to freeze, half by heat exchange unit and storage adiabator
The heat of conductor refrigeration unit release is absorbed and closed by thermal insulation board by storage adiabator, when environment needs to heat, semiconductor system
The cooling capacity of cold unit release is absorbed and closed by thermal insulation board by storage adiabator.By the direct current supply for converting semiconductor refrigerating unit
The switching of refrigeration, heating may be implemented in positive and negative electrode；It is designed by backflash, effectively increases the contact area of air and heat exchanger fin
And time of contact, promote refrigeration or heating efficiency.
Detailed description of the invention
Fig. 1 is a kind of structure chart of accumulation of heat/cold storage double-flow style semiconductor air conditioner.
Fig. 2 is the internal structure chart of double-flow style semiconductor air conditioner.
Fig. 3 is the A-A cross-sectional view (air flow figure) in Fig. 2.
Fig. 4 is the schematic diagram of semiconductor refrigerating unit.
Fig. 5 is the structure chart of the first heat exchange unit.
Fig. 6 is the structure chart of the second heat exchange unit.
Fig. 7 is the power controller circuit figure of style semiconductor air conditioner.
In figure: 1, semiconductor refrigerating unit, 1a, heating side, 1b, refrigeration side, the 2, first heat exchange unit, 2a, the first pectination
Tooth, 2b, the first comb teeth slot, the 3, second heat exchange unit, 3a, the second comb teeth, 3b, the second comb teeth slot, 4, storage adiabator, 5, air draft
Fan, 6, air outlet, 7, air inlet, 8, backflash, 9, thermal insulation board, 10, power-supply controller of electric, DC1, refrigeration mode control route connect
Mouthful, DC2, heating mode control line interface.
Specific embodiment
Below in conjunction with the drawings and the specific embodiments, the present invention will be described:
Fig. 1,2,3,4,5 show a kind of structure chart of accumulation of heat/cold storage double-flow style semiconductor air conditioner.This accumulation of heat/storage
Cold type double-flow style semiconductor air conditioner includes semiconductor refrigerating unit 1, heat exchange unit, exhaust fan 5 and power-supply controller of electric 10.Half
Conductor refrigeration unit 1 and heat exchange unit constitute heating/refrigerating core, and heating/refrigerating core is divided into the identical upper layer and lower layer of structure,
The first opposite heat exchange unit 2 of two heat exchanger fins, two the first heat exchange units are arranged in every layer of heating/refrigerating core middle position
Each one semiconductor refrigerating unit 1 of setting on the outside of 2 heat transfer plate, the outside of two semiconductor refrigerating units 1 are respectively arranged one the
Two heat exchange units 3, refrigeration side 1b(Fig. 4 of semiconductor refrigerating unit 1) it is abutted with the heat-transfer area of the first heat exchange unit 2, semiconductor
Heating side 1a(Fig. 4 of refrigeration unit 1) it is abutted with the heat-transfer area of the second heat exchange unit 3, two heat exchanger fins of the second heat exchange unit 3
Between be equipped with store adiabator 4.After upper layer and lower layer heating/refrigerating core superposition, heating/refrigerating core periphery uses thermal insulation board 9
Heating/refrigerating core top surface, bottom surface, the left side, the right side, the back side and positive two sides are arranged in package, thermal insulation board 9.In lower layer
The channel constituted between each heat exchanger fin of one heat exchange unit 2 is air inlet 7(Fig. 3,5), each heat exchanger fin of the first heat exchange unit of upper layer 2
Between the channel that constitutes be air outlet 6(Fig. 3,5), exhaust fan 5 is set at air outlet 6, and air passes into setting by air inlet 7
In the subsequent backflash 8 of the first heat exchange unit 2, it is discharged from air outlet 6 by exhaust fan 5.Semiconductor refrigerating unit 1, exhaust fan 5 with
Power-supply controller of electric 10 on panel is electrically connected.The cross sectional shape of first heat exchange unit 2 uses the first comb teeth 2a and first
The structure of comb teeth slot 2b.
Fig. 6 shows the structure chart of the second heat exchange unit.The cross sectional shape of second heat exchange unit 3 uses the second comb teeth 3a
With the structure of the second comb teeth slot 3b.
Fig. 7 shows the power controller circuit figure of style semiconductor air conditioner.Alternating current passes through after full-wave rectification to semiconductor
Refrigeration unit 1 supplies direct current, and power-supply controller of electric 10 is using the direct current supply positive and negative electrode for converting semiconductor refrigerating unit 1, to control
Semiconductor refrigerating unit 1 processed is the conversion of refrigeration or heating.
Using above-mentioned technical method, after power-supply controller of electric connects DC1, air-conditioning device is in refrigeration mode: controller will
AC power source is converted into direct current and is supplied to semiconductor refrigerating unit, and semiconductor refrigerating unit is started to work, inside refrigeration, outside
Heating, because the inside of semiconductor refrigerating unit is close to the first heat exchange unit, the temperature of the first heat exchange unit is reduced, and exhaust fan will
Air is sucked by air inlet and is flowed through backflash, is back to air outlet discharge, flows through in circuit and cooled down in air；Because partly leading
The outside of body refrigeration unit is close to the second heat exchange unit, and the heat generated is conducted by the second heat exchange unit to accumulation of heat material
Material, heat-storing material is by heat storage, and under the action of thermal insulation board, the heat being stored into heat-storing material will not be discharged into environment and work as
In.
After power-supply controller of electric connects DC2, air-conditioning device is in heating mode: AC power source is converted into direct current by controller
It is supplied to semiconductor refrigerating unit, semiconductor refrigerating unit is started to work, inside heating, outside refrigeration, because of semiconductor refrigerating list
The inside of member is close to the first heat exchange unit, and the temperature of the first heat exchange unit increases, and exhaust fan is sucked air simultaneously by air inlet
Backflash is flowed through, air outlet discharge is back to, flows through in circuit and heated up in air；Because semiconductor refrigerating unit outside with
Second heat exchange unit is close to, and the cooling capacity generated is conducted by the second heat exchange unit to heat-storing material, and heat-storing material stores up cooling capacity
It deposits, under the action of thermal insulation board, the cooling capacity being stored into heat-storing material will not be discharged into environment.
Claims (5)
1. a kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner, it includes semiconductor refrigerating unit (1), heat exchange unit, row
Fan (5) and power-supply controller of electric (10), it is characterized in that: the semiconductor refrigerating unit (1) and heat exchange unit constitute heating/refrigeration
Machine core, heating/refrigerating core are divided into the identical upper layer and lower layer of structure, and every layer of heating/refrigerating core middle position is arranged two
A semiconductor system is respectively arranged in the heat transfer plate outside of opposite the first heat exchange unit (2) of heat exchanger fin, two the first heat exchange units (2)
Second heat exchange unit (3), semiconductor refrigerating unit is respectively arranged in cold unit (1), the outside of two semiconductor refrigerating units (1)
(1) heat-transfer area of refrigeration side (1b) and the first heat exchange unit (2) abuts, the heating side (1a) of semiconductor refrigerating unit (1) with
The heat-transfer area of second heat exchange unit (3) abuts；It is equipped between two heat exchanger fins of second heat exchange unit (3) and stores adiabator (4)；
After upper layer and lower layer heating/refrigerating core superposition, heating/refrigerating core periphery is wrapped up using thermal insulation board (9)；In lower layer first
The channel constituted between each heat exchanger fin of heat exchange unit (2) is air inlet (7), between each heat exchanger fin of the first heat exchange unit of upper layer (2)
The channel of composition is air outlet (6), and exhaust fan (5) are arranged at air outlet (6), and air passes into setting by air inlet (7)
In the first heat exchange unit (2) subsequent backflash (8), it is discharged from air outlet (6) by exhaust fan (5)；The semiconductor refrigerating list
First (1), exhaust fan (5) are electrically connected with the power-supply controller of electric (10) being located on panel.
2. a kind of accumulation of heat according to claim 1/cold storage double-flow style semiconductor air conditioner, it is characterized in that: described
The cross sectional shape of one heat exchange unit (2) uses the structure of the first comb teeth (2a) and the first comb teeth slot (2b).
3. a kind of accumulation of heat according to claim 1/cold storage double-flow style semiconductor air conditioner, it is characterized in that: described
The cross sectional shape of two heat exchange units (3) uses the structure of the second comb teeth (3a) and the second comb teeth slot (3b).
4. a kind of accumulation of heat according to claim 1/cold storage double-flow style semiconductor air conditioner, it is characterized in that: it is described every
Heating/refrigerating core top surface, bottom surface, the left side, the right side, the back side and positive two sides are arranged in hot plate (9).
5. a kind of accumulation of heat according to claim 1/cold storage double-flow style semiconductor air conditioner, it is characterized in that: the electricity
Source controller (10) is using the direct current supply positive and negative electrode for converting semiconductor refrigerating unit (1), to control semiconductor refrigerating unit
(1) conversion for being refrigeration or heating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811485265.XA CN109631202A (en) | 2018-12-06 | 2018-12-06 | A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811485265.XA CN109631202A (en) | 2018-12-06 | 2018-12-06 | A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109631202A true CN109631202A (en) | 2019-04-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811485265.XA Pending CN109631202A (en) | 2018-12-06 | 2018-12-06 | A kind of accumulation of heat/cold storage double-flow style semiconductor air conditioner |
Country Status (1)
| Country | Link |
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| CN (1) | CN109631202A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110645689A (en) * | 2019-10-23 | 2020-01-03 | 珠海格力电器股份有限公司 | Heat collecting and utilizing device and method for improving energy utilization rate and semiconductor air conditioner |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2054882U (en) * | 1989-06-20 | 1990-03-21 | 施巨英 | Semiconductor-cooling/heating fan |
| CN101298925A (en) * | 2008-06-05 | 2008-11-05 | 湖南大学 | Method and device for heating by heat electric heating pump phase-change thermal storage |
| US20100005730A1 (en) * | 2008-07-11 | 2010-01-14 | Kuo Liang Weng | Building energy storage and conversion apparatus |
| CN102997353A (en) * | 2012-09-24 | 2013-03-27 | 陈志明 | Solar electronic air conditioner and manufacture method thereof |
| JP5714154B1 (en) * | 2014-04-14 | 2015-05-07 | 日本デジタルソフト株式会社 | Building wall, floor or ceiling structure |
| CN205481472U (en) * | 2015-12-30 | 2016-08-17 | 合肥华凌股份有限公司 | Air -conditioning fan |
| CN205690582U (en) * | 2016-06-21 | 2016-11-16 | 丁文凯 | Semiconductor air conditioner is fanned |
| CN107270451A (en) * | 2017-07-10 | 2017-10-20 | 湖南大学 | A kind of air ventilating fan that function is reclaimed with electrostatic precipitation and thermoelectricity |
-
2018
- 2018-12-06 CN CN201811485265.XA patent/CN109631202A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2054882U (en) * | 1989-06-20 | 1990-03-21 | 施巨英 | Semiconductor-cooling/heating fan |
| CN101298925A (en) * | 2008-06-05 | 2008-11-05 | 湖南大学 | Method and device for heating by heat electric heating pump phase-change thermal storage |
| US20100005730A1 (en) * | 2008-07-11 | 2010-01-14 | Kuo Liang Weng | Building energy storage and conversion apparatus |
| CN102997353A (en) * | 2012-09-24 | 2013-03-27 | 陈志明 | Solar electronic air conditioner and manufacture method thereof |
| JP5714154B1 (en) * | 2014-04-14 | 2015-05-07 | 日本デジタルソフト株式会社 | Building wall, floor or ceiling structure |
| CN205481472U (en) * | 2015-12-30 | 2016-08-17 | 合肥华凌股份有限公司 | Air -conditioning fan |
| CN205690582U (en) * | 2016-06-21 | 2016-11-16 | 丁文凯 | Semiconductor air conditioner is fanned |
| CN107270451A (en) * | 2017-07-10 | 2017-10-20 | 湖南大学 | A kind of air ventilating fan that function is reclaimed with electrostatic precipitation and thermoelectricity |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110645689A (en) * | 2019-10-23 | 2020-01-03 | 珠海格力电器股份有限公司 | Heat collecting and utilizing device and method for improving energy utilization rate and semiconductor air conditioner |
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