CN109616449B - 柔性电子器件及其制作方法 - Google Patents
柔性电子器件及其制作方法 Download PDFInfo
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- CN109616449B CN109616449B CN201811321073.5A CN201811321073A CN109616449B CN 109616449 B CN109616449 B CN 109616449B CN 201811321073 A CN201811321073 A CN 201811321073A CN 109616449 B CN109616449 B CN 109616449B
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 2
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
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- 229910021389 graphene Inorganic materials 0.000 description 1
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- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
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- 229910052697 platinum Inorganic materials 0.000 description 1
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- 229920000915 polyvinyl chloride Polymers 0.000 description 1
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/067—Hermetically-sealed casings containing a dielectric fluid
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
Claims (11)
Priority Applications (1)
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CN201811321073.5A CN109616449B (zh) | 2018-11-07 | 2018-11-07 | 柔性电子器件及其制作方法 |
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CN201811321073.5A CN109616449B (zh) | 2018-11-07 | 2018-11-07 | 柔性电子器件及其制作方法 |
Publications (2)
Publication Number | Publication Date |
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CN109616449A CN109616449A (zh) | 2019-04-12 |
CN109616449B true CN109616449B (zh) | 2020-12-15 |
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CN201811321073.5A Active CN109616449B (zh) | 2018-11-07 | 2018-11-07 | 柔性电子器件及其制作方法 |
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Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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CN110139475B (zh) * | 2019-05-28 | 2020-06-05 | 方香玲 | 基于非牛顿流体的防止意外折叠损坏的可伸缩柔性电子板 |
CN111110233B (zh) * | 2019-12-24 | 2022-10-11 | 浙江清华柔性电子技术研究院 | 多接口的柔性电极 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105228823A (zh) * | 2013-02-27 | 2016-01-06 | 康宁股份有限公司 | 用于降低挠性玻璃基材的双轴弯曲和/或翘曲的方法和结构 |
CN108475692A (zh) * | 2015-12-28 | 2018-08-31 | 3M创新有限公司 | 具有流体腔设计的柔性电子设备 |
CN209497726U (zh) * | 2018-11-07 | 2019-10-15 | 浙江清华柔性电子技术研究院 | 柔性电子器件 |
Family Cites Families (1)
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KR101954983B1 (ko) * | 2012-08-09 | 2019-03-08 | 삼성디스플레이 주식회사 | 가요성 표시 장치 및 가요성 표시 장치의 제조 방법 |
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- 2018-11-07 CN CN201811321073.5A patent/CN109616449B/zh active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105228823A (zh) * | 2013-02-27 | 2016-01-06 | 康宁股份有限公司 | 用于降低挠性玻璃基材的双轴弯曲和/或翘曲的方法和结构 |
CN108475692A (zh) * | 2015-12-28 | 2018-08-31 | 3M创新有限公司 | 具有流体腔设计的柔性电子设备 |
CN209497726U (zh) * | 2018-11-07 | 2019-10-15 | 浙江清华柔性电子技术研究院 | 柔性电子器件 |
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