CN109588016A - The cooling system of data center and data center - Google Patents
The cooling system of data center and data center Download PDFInfo
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- CN109588016A CN109588016A CN201811594444.7A CN201811594444A CN109588016A CN 109588016 A CN109588016 A CN 109588016A CN 201811594444 A CN201811594444 A CN 201811594444A CN 109588016 A CN109588016 A CN 109588016A
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- cooling system
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- cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/2079—Liquid cooling without phase change within rooms for removing heat from cabinets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20718—Forced ventilation of a gaseous coolant
- H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the invention discloses a kind of cooling system of data center and data center, the data center is arranged in computer room, and including the cabinet being in a row set side by side, each cabinet includes multiple processing chips and other hardware devices；The cooling system includes: liquid cooling system and air cooling system；The liquid cooling system is set to liquid cooling system air conditioning room, and the liquid cooling system air conditioning room is set to the side of the computer room, and the liquid cooling system is used to carry out liquid-cooling heat radiation to each processing chip in the cabinet；The air cooling system is set to air cooling system air conditioning room, and the air cooling system air conditioning room is set to the other side of the computer room, and the air cooling system is used to carry out wind-cooling heat dissipating to other hardware devices described in the computer room.Technical solution of the present invention provides a kind of cooling system deployment scheme of data center's grade, solves the problems, such as the cooling system deployment scheme at present due to not yet providing data center's grade in the lower and existing industry of industry maturity.
Description
Technical field
The present embodiments relate to data center's cooling technical field more particularly to a kind of heat dissipation systems of data center
System and data center.
Background technique
With the arrival of big data era, the scale of data center is increasing, and the calorific value of data center also increases therewith
Add, for the normal operation for ensuring data center, cooling system need to be disposed.
The cooling system of conventional data centers is to carry out modular planning, layout to refrigeration unit-precision air conditioner.But with
The deployment of high-performance treatments chip, Single Cabinet power density constantly increase, and the cooling system of above-mentioned conventional data centers is gradually not
The radiating requirements of data center are able to satisfy, liquid cooling system becomes the technological development direction of data center's infrastructure.Liquid cooling system
Data center liquid cooling is passed directly into server, realize that chip-scale is cooling, water cooler be not necessarily to, so that data center can be realized
The promotion of whole efficiency.
But since industry maturity is lower, industry does not provide the cooling system deployment scheme of data center's grade at present.
Summary of the invention
The embodiment of the present invention provides cooling system and the data center of a kind of data center, to provide a kind of data center's grade
Cooling system deployment scheme.
In a first aspect, data center's setting exists the embodiment of the invention provides a kind of cooling system of data center
In computer room, including the cabinet being in a row set side by side, each cabinet includes multiple processing chips and other hardware devices；It is described
Cooling system includes: liquid cooling system and air cooling system；
The liquid cooling system is set to liquid cooling system air conditioning room, and the liquid cooling system air conditioning room is set to the one of the computer room
Side, the liquid cooling system are used to carry out liquid-cooling heat radiation to each processing chip in the cabinet；
The air cooling system is set to air cooling system air conditioning room, and the air cooling system air conditioning room is set to the another of the computer room
Side, the air cooling system are used to carry out wind-cooling heat dissipating to other hardware devices described in the computer room.
Second aspect, the embodiment of the invention also provides a kind of data center, which is provided
The cooling system of data center radiate.
The cooling system of data center provided in an embodiment of the present invention, the cooling system by the way that data center is arranged includes liquid
Cooling system and air cooling system, and liquid cooling system is set and is set to liquid cooling system air conditioning room, liquid cooling system air conditioning room is set to computer room
Side, liquid cooling system is used to carry out liquid-cooling heat radiation to reason chip everywhere in cabinet；Air cooling system is set to air cooling system sky
Between tune, air cooling system air conditioning room is set to the other side of computer room, and air cooling system is used to carry out other hardware devices in computer room
Wind-cooling heat dissipating proposes a kind of cooling system of data center's grade as a result, solves and deposit at present since industry maturity is lower
Industry in not yet provide data center grade cooling system deployment scheme the problem of；And from entire data center's scale portion
Administration's angle is set out, and the embodiment of the present invention is located at middle part, liquid cooling system air conditioning room and air cooling system air conditioning room point by the way that computer room is arranged
It is not set to the two sides of computer room, liquid cooling system is set in liquid cooling air conditioning room, can be real during air cooling system is set between air cooling air conditioner
Existing liquid cooling system and air cooling system are arranged in independent space respectively, i.e., the two undopes, conducive to later period O&M is facilitated.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the cooling system of the data center in the embodiment of the present invention one.
Fig. 2 is the structural schematic diagram of the cooling system of the data center in the embodiment of the present invention two.
Fig. 3 is the secondary lateral structure schematic diagram of the liquid cooling system in Fig. 2.
Fig. 4 is the primary side structural schematic diagram of the liquid cooling system in Fig. 2.
Fig. 5 is the built-in function section flow chart of the indirect evaporating-cooling unit of the air cooling system in Fig. 2.
Fig. 6 is the working principle diagram of the indirect evaporating-cooling unit cross flow heat exchanger in Fig. 5.
Fig. 7 is the structural schematic diagram of the cooling system of the data center in the embodiment of the present invention three.
Specific embodiment
The embodiment of the present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this
Locate described specific embodiment and is used only for explaining the embodiment of the present invention, rather than the restriction to the embodiment of the present invention.In addition also
It should be noted that only parts related to embodiments of the present invention are shown rather than entire infrastructure for ease of description, in attached drawing.
Embodiment one
Fig. 1 is the structural schematic diagram of the cooling system of the data center in the embodiment of the present invention one, provided in this embodiment
Cooling system can be used for for data center's heat dissipation.Referring to Fig.1, which is arranged in computer room 00, which includes
The cabinet 10 being in a row set side by side, each cabinet 10 include multiple processing chip (not shown in figure 1)s and other hardware devices；It should
The cooling system 20 of data center includes: liquid cooling system 201 and air cooling system 202；Liquid cooling system 201 is set to liquid cooling system sky
01 between tune, liquid cooling system air conditioning room 01 is set to the side of computer room 00, and liquid cooling system 201 is used for managing core everywhere in cabinet 10
Piece 101 carries out liquid-cooling heat radiation；Air cooling system 202 is set to air cooling system air conditioning room 02, and air cooling system air conditioning room 02 is set to machine
The other side in room 00, air cooling system 202 are used to carry out wind-cooling heat dissipating to other hardware devices in computer room 00.
Wherein, processing chip can be central processing unit (Central Processing Unit, CPU) or graphics processor
(Graphics Processing Unit, GPU), other hardware devices in cabinet 10 may include hard disk, memory, on mainboard
South bridge (Platform Controller Hub, PCH) on north bridge, mainboard and skilled person will appreciate that other yuan
Device.
Wherein, liquid-cooling heat radiation refers to that logical supercooled liquid circulation takes away heat, and wind-cooling heat dissipating, which refers to, takes away heat by air circulation
Amount.In the present embodiment, liquid-cooling heat radiation is carried out by each processing chip higher to the calorific value in cabinet 10 of liquid cooling system 201,
Other hardware devices lower to the calorific value in cabinet 10 of air cooling system 202 carry out wind-cooling heat dissipating, are ensuring the data center
Cooling system 20 to processing chip and other hardware devices all have preferable heat dissipation effect while, advantageously reduce this
The lower deployment cost and operating cost of the cooling system 20 of data center.
Wherein, multiple cabinets 10 in computer room 00 are in a row set side by side.Illustratively, 8 rows are shown in Fig. 1 to be set side by side
Cabinet 10, every row's cabinet 10 includes 20 cabinets, but this does not constitute the restriction to the present embodiment.In other embodiments
In, the number of the cabinet 10 in computer room 00 can be set according to the actual demand of the cooling system 20 of data center and data center
The arrangement mode of amount and cabinet 10, the present embodiment are not construed as limiting this.
Illustratively, shown in Fig. 1 for orientation, liquid cooling system air conditioning room 01 is set to the left side of computer room 00, wind
Cooling system air conditioning room 02 is set to the right side of computer room 00, is only for a kind of set-up mode of the cooling system 20 of data center, and
The restriction to the present embodiment is not constituted.It in other embodiments, can also be according to the practical need of the cooling system 20 of data center
It asks, other sides that setting liquid cooling system air conditioning room 01 is located at computer room 00 with air cooling system air conditioning room 02 (meet the two and are located at machine
The not ipsilateral in room 00), the present embodiment is not construed as limiting this.
The cooling system deployment scheme for present embodiments providing a kind of data center's grade, specifically, from data center's scale
Deployment angle is set out, and is located at middle part by the way that computer room 00 is arranged, liquid cooling system air conditioning room 01 and air cooling system air conditioning room 02 distinguish position
In the two sides of computer room 00, liquid cooling system air conditioning room 01 and air cooling system air conditioning room 02 can be separately provided, since liquid cooling system is set
It is placed in liquid cooling system air conditioning room 01, air cooling system is set in air cooling system air conditioning room 02, so as to make liquid cooling system and wind
Cooling system is respectively arranged in independent air conditioning room, i.e., two systems undope, and is convenient for later period O&M.
Embodiment two
On the basis of the above embodiment 1, the present embodiment illustratively shows the specific of liquid cooling system and air cooling system
Set-up mode.Fig. 2 is the structural schematic diagram of the cooling system of the data center in the embodiment of the present invention two, and Fig. 3 is the liquid in Fig. 2
The secondary lateral structure schematic diagram of cooling system, Fig. 4 are the primary side structural schematic diagrams of the liquid cooling system in Fig. 2.In conjunction with Fig. 2-Fig. 4,
In the cooling system 20 of the data center, liquid cooling system 201 includes: cold plate 2011, cooling liquid tube road 2012, cold liquid allocation unit
2013 and dry and cold device 2014；Cooling liquid tube road 2012 and cold liquid allocation unit 2013 are set in liquid cooling system air conditioning room 01, dry and cold
Device 2014 is set to the outdoor of liquid cooling system air conditioning room 01；Cold plate 2011 is attached at the surface of processing chip, and cold plate 2011 is used for
Absorb the heat of attached processing chip；Cooling liquid tube road 2012 is separately connected with each cold plate 2011, and cooling liquid tube road 2012 is used for
Liquid in cold plate 2011 is recycled；Cold liquid allocation unit 2013 is connect with cooling liquid tube road 2012, cold liquid allocation unit
2013 for passing through liquid of 2012 distribution circulation of cooling liquid tube road into cold plate 2011；Dry and cold device 2014 and cold liquid allocation unit
Piping connection in 2013, dry and cold device 2014 are used to cool down by liquid of the outdoor environment to channel interior, then will cooling
Liquid circulation afterwards is into the pipeline of liquid cooling allocation unit 2013.
Wherein, cold plate 2012 is closely attached with processing chip, for that will be handled by the liquid circulation in its internal duct
The heat generated when chip operation is taken away.Illustratively, cold plate 2012 can be attached at upper surface, lower surface or the side of processing chip
At at least the one of face, the present embodiment is not construed as limiting this.
Wherein, cooling liquid tube road 2012 is used to take away the high-temp liquid in cold plate 2011 by way of liquid circulation, and
It is supplemented in cryogenic liquid, to sustainably take away the heat that processing chip generates.
It should be noted that the material and caliber of liquid cooling pipeline 2012 can be according to the realities of the cooling system 20 of data center
The setting of border demand, the present embodiment are not construed as limiting this.
Wherein, cold liquid allocation unit (i.e. cold source allocation unit, Coolant Distribution Unit, CDU) 2013 can
The flow and flow rate of the liquid entered in each cold plate 2011 is adjusted, to be conducive to according to the processing core in cabinet 10
The practical operation situation of piece, control loop everywhither manage the liquid of chip, to realize spirit of the liquid between each cold plate 2011
Distribution living.During being somebody's turn to do, the heat exchange between cold plate 2011 and cold liquid allocation unit 2013 is equivalent to primary side heat exchange.
Illustratively, when reason chip works everywhere in cabinet 10, cold liquid allocation unit 2013 can be each cold to entering
The liquid of plate 2011 is shunted, and is conducive to realize the uniform liquid separation of each cold plate 2011, so that it is equal to be advantageously implemented each processing chip
Even heat dissipation.
Wherein, dry and cold device 2014 is dry cooler, and it is by walking liquid in pipeline that the course of work, which does not have the consumption of water,
Body, the mode that pipeline walks circulated air outside carrys out the liquid in cooling line, so that the temperature of liquid in pipeline is reduced, to reach cold
But purpose.During being somebody's turn to do, the heat exchange between dry and cold device 2014 and cold liquid allocation unit 2013 is equivalent to secondary side heat exchange.
The above-mentioned liquid cooling system of the present embodiment uses no water cooler design, can avoid causing using water cooler
Heat sink conception is complicated and the problem of energy-saving effect difference, to be conducive to the deployment side of the cooling system 20 of simplified data center
Case, while energy consumption is advantageously reduced, to be conducive to optimize always possessing into for the cooling system of data center and data center
This (total cost of ownership, TCO) is extremely ultimate attainment.
Optionally, with continued reference to Fig. 2 and Fig. 3, cooling liquid tube road 2012 includes water inlet pipe road 20121 and outlet pipeline 20122；
In computer room 00, the first water collector 1021 and the second water collector 1022, the first water collector are additionally provided with outside each cabinet 10
1021 include multiple first valve ports, and the second water collector 1022 includes multiple second valve ports；Water inlet pipe road 20121 passes through the first valve port
It is connect with the water inlet of cold plate 2011；Outlet pipeline 20122 is connect by the second valve port with the water outlet of cold plate 2011.
So set, the liquid in cold plate 2011 can be made to pass sequentially through the second valve port, the second water collector 1022 and outlet pipe
Road 20122 is expelled to cold liquid allocation unit 2013；Meanwhile through cold liquid allocation unit 2013 distribution after liquid can successively by into
Water lines 20121, the first water collector 1021 and the first valve port enter in cold plate 2011, hereby it is achieved that liquid in cold plate 2011
Circulation, to realize the liquid-cooling heat radiation of processing chip.In addition, 201 pipeline complexity of entire liquid cooling system is lower, to run
It is lower with maintenance difficulties, advantageously reduce O&M cost.
Illustratively, butterfly valve 302, ball valve 303, screw thread be may each comprise and connected with continued reference to Fig. 3, the first valve port and the second valve port
304 and quick coupling 305 are connect, is manually-operated gate；Wherein, by the design of each valve, be conducive to entire liquid cooling system
Modularization of uniting setting, is on the one hand conducive to the modularization rapid deployment of the cooling system 20 of the data center, reduces the construction period
And construction cost；On the other hand, during later maintenance, problem investigation and maintenance can be carried out for different modules, after being convenient for
Phase maintenance, to advantageously reduce O&M cost.In addition, the first water collector 1021 and the second water collector 1022 also row of may each comprise
Air valve 301 or skilled person will appreciate that other structures, the present embodiment is not construed as limiting this.
Illustratively, with continued reference to Fig. 2 and Fig. 4, the pipeline in cold liquid allocation unit 2013 may also comprise allocation unit into
Water lines 20131 and allocation unit outlet pipeline 20132, wherein allocation unit inlet pipeline 20131 is used to flow to cold plate 2011
Enter liquid, allocation unit outlet pipeline 20132 is used for from 2011 trickle of cold plate.It is single for dry and cold device 2014 and the distribution of cold liquid
The connection between pipeline in member 2013 can also carry out modular design by multiple valves.It should be noted that valve
Type (or specification) can be skilled person will appreciate that any one or more specifications, the present embodiment is not construed as limiting this.When
So, other than multiple valves for modularized design, on the pipeline between dry and cold device 2014 and cold liquid allocation unit 2013
Also settable pipeline non-return valve, electric butterfly valve, y-type filter or skilled person will appreciate that other structures, the present embodiment
This is not construed as limiting.
It should be noted that (" each structure " here may include each to each structure shown in above-mentioned Fig. 3 and Fig. 4
Valve and y-type filter) specification and effect can be skilled person will appreciate that specification and effect, the embodiment of the present invention
This is repeated no more, is also not construed as limiting.
Optionally, it is contemplated that the economy and reliability of the cooling system 20 of data center and data center, cold liquid point
Quantity with unit 2013 is at least two (illustrative, 2 cold liquid allocation units 2013 are shown in Fig. 3), dry and cold device
2014 quantity is at least four (illustrative, 4 dry and cold devices 2014 are shown in Fig. 4).
Wherein, at least one spare cold liquid allocation unit, multiple dry and cold devices are equipped in multiple cold liquid allocation units 2013
At least one spare dry and cold device is provided in 2014.
Wherein, spare cold liquid allocation unit and spare dry and cold device are enabled when the quantity of heat production of data center is larger, thus
The cooling system 20 of the data center can be made to be suitable for the data center of different scales, the cooling system of Ye Keshigai data center
20 are flexibly applied to the different working condition of same data center, thus under the premise of meeting the radiating requirements of data center,
The flexible Application of the cooling system 20 of the data center can be achieved.
Illustratively, individual module " 1+1 " design, i.e. 2 cold liquid allocation units can be used in cold liquid allocation unit 2013
1 spare cold liquid allocation unit is set in 2013；Dry and cold device 2014 can be used concentration " 3+1 " and design, i.e. in 4 dry and cold devices 2014
1 spare dry and cold device is set.
It should be noted that this is only the illustrative explanation to the cooling system 20 of the data center, but do not constitute
Restriction to the cooling system 20 of the data center in the present embodiment.It in other embodiments, can dissipating according to data center
The actual demand of hot systems 20 is arranged the quantity and design method of cold liquid allocation unit 2013, and dry and cold device 2014 is arranged
Quantity and design method, the present embodiment are not construed as limiting this.
Optionally, with continued reference to Fig. 2, vent passages 001 are additionally provided in computer room 00；Air cooling system 202 is used for by logical
Wind channel 001 carries out wind-cooling heat dissipating to other hardware devices in computer room 00.
Wherein, vent passages 001 can take away the hot-air in computer room 00, while be supplemented in cold air, thus realization pair
Other hardware devices contacted in computer room 00 with air carry out the process of wind-cooling heat dissipating.
In the following, including indirect evaporating-cooling unit as example using air cooling system 202, wind-cooling heat dissipating process and principle are carried out
Exemplary illustration.
Optionally, with continued reference to Fig. 2, air cooling system 202 includes indirect evaporating-cooling unit；Indirect evaporating-cooling unit is set
It is placed in air cooling system air conditioning room 02, and is connected to vent passages 001；Indirect evaporating-cooling unit is for passing through vent passages
Other hardware devices in 002 pair of computer room 00 carry out wind-cooling heat dissipating.
Wherein, include indirect evaporating-cooling unit by setting air cooling system 202, air cooling system 202 can be made to realize without cold
Water unit design can simplify the deployment of the cooling system 20 of data center in conjunction with liquid cooling system without water cooler design scheme
Scheme, while advantageously reducing energy consumption.
Illustratively, Fig. 5 is the built-in function section flow chart of the indirect evaporating-cooling unit of the air cooling system in Fig. 2.Ginseng
According to Fig. 5, each functional section is successively are as follows: outer circulation air-valve section 401, outer circulation fan section 403, is handed over outer circulation primary filter section 402
Cross-flow heat exchanger section 404, interior circulation blow valve section 406, interior is recycled back to air-valve section 407 and interior circulation at interior circulating fan section 405
Primary filter section 408.Hereby it is achieved that the circulation of cold air and hot-air, sets other hardware in computer room 00 to realize
It is standby to carry out wind-cooling heat dissipating.
Illustratively, Fig. 6 is the working principle diagram of the indirect evaporating-cooling unit cross flow heat exchanger in Fig. 5.Referring to figure
6, which evaporates in cooling procedure that there are two strands of air, and by taking orientation shown in Fig. 6 as an example, lateral air is referred to as primary sky
Gas, longitudinal air are referred to as auxiliary air；The auxiliary air that heat-transfer surface is flowed through using circulation water spray, makes to change due to spray
Water membrane is formed on hot face, the evaporation of water not only absorbs the heat of moisture film itself, but also absorbs the heat of one layer of air, thus
Cool down primary air.
It should be noted that merely exemplary in Fig. 6 show a kind of working principle of indirect evaporating-cooling unit, but simultaneously
The restriction of indirect evaporating-cooling unit in the non-cooling system 20 to data center provided in an embodiment of the present invention.In other realities
It applies in mode, indirect evaporating-cooling unit can also be set and use it according to the actual demand of the cooling system 20 of data center
He works at working principle, and the present embodiment is not construed as limiting this.
Optionally, it is contemplated that the economy and reliability of the cooling system 20 of data center and data center are steamed indirectly
The but unit that feels cold includes that at least five indirect evaporation coolers 2021 (illustratively, show 5 indirect evaporating-coolings in Fig. 2
Device 2021).
Wherein, it is provided at least one spare indirect evaporation cooler in multiple indirect evaporation coolers 2021, this is spare
Indirect evaporation cooler can start when the quantity of heat production of data center is larger, so as to be applicable in the cooling system of the data center
In the data center of different scales, the cooling system of Ye Keshigai data center is flexibly applied to the different works of same data center
Make state, thus under the premise of meeting the radiating requirements of data center, it can be achieved that the cooling system of the data center it is flexible
Using.
Illustratively, indirect evaporation cooler 2021 can be used " 4+1 " and design, i.e. in 5 indirect evaporation coolers 2021
1 spare indirect evaporation cooler is set.
It should be noted that this is only the illustrative explanation to the cooling system of the data center, but composition pair
The restriction of the cooling system of data center in the present embodiment.It in other embodiments, can be according to the heat dissipation system of data center
The actual demand of system, is arranged the quantity and design method of indirect evaporation cooler 2021, and the present embodiment is not construed as limiting this.
Embodiment three
Fig. 7 is the structural schematic diagram of the cooling system of the data center in the embodiment of the present invention three, in the various embodiments described above
On the basis of, the present embodiment illustratively shows data center when including multiple computer rooms, the deployment way of cooling system.Reference
Fig. 7, if data center includes multiple computer rooms 00 (illustrative, 2 computer rooms 00 are shown in Fig. 7), then two be disposed adjacent
The liquid cooling system of a computer room 00 is set in the same liquid cooling air conditioning room 01, and is located between two computer rooms 00.
So set, liquid cooling can be concentrated on the cold liquid allocation unit 2013 of the liquid cooling system 201 of two neighboring computer room 00
Dry and cold device 2014 outside 01 between system air conditioner is connected, consequently facilitating simplifying the design difficulty of entire liquid cooling system, is conducive to simultaneously
O&M difficulty is reduced, to lower O&M cost.
Example IV
The present embodiment provides a kind of data center, which can be used any data of the various embodiments described above offer
The cooling system at center radiates, and rapid deployment and the modularization construction of data center is thus easy to implement, thus in data
The construction period of the heart and cooling system entirety is short, and first cost and operation and maintenance cost (power consumption, consumptive material etc.) are lower, data
The TCO at center can be optimized to ultimate attainment.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (10)
1. a kind of cooling system of data center, the data center is arranged in computer room, including the cabinet being in a row set side by side,
Each cabinet includes multiple processing chips and other hardware devices；It is characterized in that, the cooling system includes: liquid cooling system
System and air cooling system；
The liquid cooling system is set to liquid cooling system air conditioning room, and the liquid cooling system air conditioning room is set to the side of the computer room,
The liquid cooling system is used to carry out liquid-cooling heat radiation to each processing chip in the cabinet；
The air cooling system is set to air cooling system air conditioning room, and the air cooling system air conditioning room is set to the another of the computer room
Side, the air cooling system are used to carry out wind-cooling heat dissipating to other hardware devices described in the computer room.
2. the cooling system of data center according to claim 1, which is characterized in that the liquid cooling system include cold plate,
Cooling liquid tube road, cold liquid allocation unit and dry and cold device；The cooling liquid tube road and the cold liquid allocation unit are set to the liquid cooling system
It unites in air conditioning room, the dry and cold device is set to the outdoor of the liquid cooling system air conditioning room；
The cold plate is attached at the surface of the processing chip, and the cold plate is used to absorb the heat of the processing chip attached
Amount；
The cooling liquid tube road is separately connected with each cold plate, and the cooling liquid tube road is for following the liquid in the cold plate
Ring；
The cold liquid allocation unit is connect with the cooling liquid tube road, and the cold liquid allocation unit is used for through the cooling liquid tube road point
With the liquid being recycled in the cold plate；
Piping connection in the dry and cold device and the cold liquid allocation unit, the dry and cold device are used for through outdoor environment to pipeline
Internal liquid cools down, then will be in the pipeline of the liquid circulation after cooling to the liquid cooling allocation unit.
3. the cooling system of data center according to claim 2, which is characterized in that the cooling liquid tube road includes water inlet pipe
Road and outlet pipeline；
In the computer room, the first water collector and the second water collector are additionally provided with outside each cabinet, described first catchments
Device includes multiple first valve ports, and second water collector includes multiple second valve ports；
The water inlet pipe road is connect by first valve port with the water inlet of the cold plate；The outlet pipeline passes through described the
Two valve ports are connect with the water outlet of the cold plate.
4. the cooling system of data center according to claim 2, which is characterized in that the quantity of the cold liquid allocation unit
It is at least two, the quantity of the dry and cold device is at least four.
5. the cooling system of data center according to claim 4, which is characterized in that in multiple cold liquid allocation units
It is provided at least one spare cold liquid allocation unit, is provided at least one spare dry and cold device in multiple dry and cold devices.
6. the cooling system of data center according to claim 2, which is characterized in that if the data center includes more
A computer room, the then liquid cooling system for two computer rooms being disposed adjacent are set to the same liquid cooling system air-conditioning
In, and be located between two computer rooms.
7. the cooling system of data center according to claim 1, which is characterized in that be additionally provided with ventilation in the computer room
Channel；
The air cooling system is used to carry out air-cooled dissipate to other hardware devices described in the computer room by the vent passages
Heat.
8. the cooling system of data center according to claim 7, which is characterized in that the air cooling system includes steaming indirectly
Feel cold but unit；
The indirect evaporating-cooling unit is set in the air cooling system air conditioning room, and is connected to the vent passages；
The indirect evaporating-cooling unit be used for by the vent passages to other hardware devices described in the computer room into
Row wind-cooling heat dissipating.
9. the cooling system of data center according to claim 8, which is characterized in that the indirect evaporating-cooling unit packet
Include at least five indirect evaporation coolers.
10. a kind of data center, which is characterized in that in the described in any item data of the data-center applications claim 1-9
The cooling system of the heart radiates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811594444.7A CN109588016B (en) | 2018-12-25 | 2018-12-25 | Data center and cooling system thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811594444.7A CN109588016B (en) | 2018-12-25 | 2018-12-25 | Data center and cooling system thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109588016A true CN109588016A (en) | 2019-04-05 |
| CN109588016B CN109588016B (en) | 2020-12-15 |
Family
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Family Applications (1)
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| CN201811594444.7A Active CN109588016B (en) | 2018-12-25 | 2018-12-25 | Data center and cooling system thereof |
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| CN111295080A (en) * | 2020-02-23 | 2020-06-16 | 苏州浪潮智能科技有限公司 | High-performance calculation data center loop system |
| CN112203481A (en) * | 2020-10-30 | 2021-01-08 | 上海德衡数据科技有限公司 | Container module prefabricated data center |
| CN113677159A (en) * | 2021-08-23 | 2021-11-19 | 联想长风科技(北京)有限公司 | Water-cooling and air-cooling compatible heat dissipation device |
| CN113703309A (en) * | 2021-08-31 | 2021-11-26 | 北京无线电测量研究所 | Personnel and equipment mixing cabin with high-integration ring control system |
| CN115334829A (en) * | 2022-07-07 | 2022-11-11 | 苏州浪潮智能科技有限公司 | Low-carbon data center and operation method thereof |
| CN115334847A (en) * | 2022-08-31 | 2022-11-11 | 苏州浪潮智能科技有限公司 | Liquid cooling data center secondary side pipe-line system |
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