CN109587936A - A kind of manufacture craft of the unilateral double-deck circuit base plate - Google Patents
A kind of manufacture craft of the unilateral double-deck circuit base plate Download PDFInfo
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- CN109587936A CN109587936A CN201811523716.4A CN201811523716A CN109587936A CN 109587936 A CN109587936 A CN 109587936A CN 201811523716 A CN201811523716 A CN 201811523716A CN 109587936 A CN109587936 A CN 109587936A
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- Prior art keywords
- copper sheet
- plate
- copper
- sheet
- blind hole
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 89
- 239000010949 copper Substances 0.000 claims abstract description 89
- 229910052802 copper Inorganic materials 0.000 claims abstract description 89
- 239000003292 glue Substances 0.000 claims abstract description 16
- 239000012528 membrane Substances 0.000 claims abstract description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000741 silica gel Substances 0.000 claims abstract description 11
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 11
- 229960001866 silicon dioxide Drugs 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 10
- 230000008569 process Effects 0.000 claims abstract description 9
- 238000002360 preparation method Methods 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 26
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 230000001681 protective effect Effects 0.000 claims description 8
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 7
- 238000004513 sizing Methods 0.000 claims description 5
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 abstract description 4
- 230000003796 beauty Effects 0.000 abstract description 3
- 238000006073 displacement reaction Methods 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000004804 winding Methods 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 53
- 239000012790 adhesive layer Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 239000003921 oil Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- -1 polypropylene Polymers 0.000 description 3
- 229920001155 polypropylene Polymers 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 239000002344 surface layer Substances 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- GNFTZDOKVXKIBK-UHFFFAOYSA-N 3-(2-methoxyethoxy)benzohydrazide Chemical compound COCCOC1=CC=CC(C(=O)NN)=C1 GNFTZDOKVXKIBK-UHFFFAOYSA-N 0.000 description 2
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 150000003457 sulfones Chemical class 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- MCTWTZJPVLRJOU-UHFFFAOYSA-N 1-methyl-1H-imidazole Chemical compound CN1C=CN=C1 MCTWTZJPVLRJOU-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- ZYUVGYBAPZYKSA-UHFFFAOYSA-N 5-(3-hydroxybutan-2-yl)-4-methylbenzene-1,3-diol Chemical compound CC(O)C(C)C1=CC(O)=CC(O)=C1C ZYUVGYBAPZYKSA-UHFFFAOYSA-N 0.000 description 1
- 229910017083 AlN Inorganic materials 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 239000005041 Mylar™ Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 230000009172 bursting Effects 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- NHADDZMCASKINP-HTRCEHHLSA-N decarboxydihydrocitrinin Natural products C1=C(O)C(C)=C2[C@H](C)[C@@H](C)OCC2=C1O NHADDZMCASKINP-HTRCEHHLSA-N 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- VOOLKNUJNPZAHE-UHFFFAOYSA-N formaldehyde;2-methylphenol Chemical compound O=C.CC1=CC=CC=C1O VOOLKNUJNPZAHE-UHFFFAOYSA-N 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 150000002460 imidazoles Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/095—Conductive through-holes or vias
- H05K2201/09509—Blind vias, i.e. vias having one side closed
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of manufacture craft of unilateral double-deck circuit base plate, copper sheet processes the second blind hole；Copper sheet upper end attaches the glue film of semi-solid preparation, and the position of corresponding second blind hole opens up through-hole on glue film, and the aperture of through-hole is greater than the aperture of the second blind hole, the lower end lubricated of the second line layer；The second blind hole on copper sheet is successively encased inside high temperature membrane and gasket；Copper sheet is placed in silicagel pad, FR4 plate is bonded copper sheet, and FR4 plate and copper sheet pressing connect.It selects copper as base, its radiating efficiency is effectively ensured；Using the double-deck route, route distribution area is greatly reduced than the FR4 of single side route and does not lose original characteristic, to reduce small product size, reduce hardware and assembly cost, great power LED suitable for stage spotlighting, the second blind hole for passing to electrical connection position is lingered at the base copper back side, and electrical connection position can be used for welding plug, with external winding displacement convenient for assembly, improve the beauty of product and shell be facilitated to assemble.
Description
Technical field
The present invention relates to wiring board arts, more particularly, to a kind of manufacture craft of unilateral double-deck circuit base plate.
Background technique
It is increasingly mature with LED core chip technology；The input power of single led chip can be further improved 3W, 5W
Even higher, the current density and heat flow density that chip itself is born are increased sharply, therefore prevent the accumulation of heat of LED from becoming
It is more and more important.If these heats cannot effectively be dissipated, the following fuel factor will seriously affect entire LED and shine
The reliability of device and service life；If multiple high-power LED chip dense arrangements constitute white lumination system, the dissipation of heat is asked
It inscribes even more serious.
So how to improve LED product heat-sinking capability is one of the key technology that illumination level great power LED solves at this stage.
Summary of the invention
In order to overcome the deficiencies of the prior art, LED product heat-sinking capability is improved, the technical solution adopted by the present invention is that:
A kind of manufacture craft of the unilateral double-deck circuit base plate, comprising the following steps: step a, copper sheet and FR4 plate are cut out
Material, copper sheet process the second blind hole；
Copper fabrication on the downside of step b, FR4 plate is shaped to the second line layer；
Step c, FR4 plate and copper sheet carry out first time baking sheet, 135~160 DEG C of baking sheet temperature, 50~75min of duration；
Step d, copper sheet upper end attach the glue film of semi-solid preparation, and the position of corresponding second blind hole opens up through-hole, through-hole on glue film
Aperture be greater than the second blind hole aperture, the electrical connection of the lower end lubricated of the second line layer, wherein the second line layer lower end
Position is left a blank, second of baking sheet of FR4 plate of lubricated, 135~160 DEG C of baking sheet, 7~12min of duration；
Step e, the second blind hole on copper sheet are successively encased inside high temperature membrane and gasket, and high temperature membrane and gasket are peripheral walls far from
The thickness summation of 1~2mm of inner wall of two blind holes, high temperature membrane and gasket is smaller by 0.08 than the thickness summation of copper sheet and glue film~
0.15mm；
Step f, copper sheet is placed in silicagel pad, FR4 plate is bonded copper sheet and the electrical connection position corresponding second of the second wiring board
Blind hole；FR4 plate and copper sheet pressing connect, 170~240 DEG C of temperature, 40~65kg of pressure.
Another specific embodiment according to the present invention, further has, and the glue film and sizing material are application number
The resin combination of the high thermal conductivity of coating on metallic substrates documented by CN201510025216.8.
Another specific embodiment according to the present invention, further has, and in the step c, FR4 plate and copper sheet carry out the
Baking sheet, 145~155 DEG C of baking sheet temperature, 55~65min of duration；In step d, second of baking sheet of FR4 plate of lubricated,
130~150 DEG C of baking sheet temperature, 8~10min of duration.
Another specific embodiment according to the present invention, further has, the 1.3~1.8mm of copper plate thickness；FR4 plate
In, 1.2~1.6mm of thickness of insulating layer, insulating layer upper end copper and lower end copper thickness are 0.28~0.55mm；Silica gel mat thickness
1.2~2.5mm.
Another specific embodiment according to the present invention, further has, after the FR4 plate and copper sheet pressing connection, FR4
Plate upper end Copper fabrication is first line layer, takes out gasket and high temperature membrane in the second blind hole.
Another specific embodiment according to the present invention, further has, and further includes step g, successively pads below silicagel pad
There are release film, brown paper and bottom plate；Bottom plate is for holding material and mobile material.
Another specific embodiment according to the present invention, further has, and in the step a, copper sheet and FR4 plate add respectively
Work has first positioning hole and second location hole；When copper sheet is bonded with FR4 plate, first positioning hole and second location hole are corresponding, and first
Filled high-temperature film in location hole and second location hole.
Another specific embodiment according to the present invention, further has, and in the step a, it is blind that copper sheet processes second
Kong Hou, polished, go it is dirty.
Another specific embodiment according to the present invention, further has, in the step c, the upper end of FR4 plate and copper sheet
Lower end pasting protective film.
Another specific embodiment according to the present invention, further has, and the FR4 plate and copper sheet carry out first time baking sheet
Before, the lower end of copper-based upper end and FR4 carry out brownification processing.
A kind of manufacture craft for unilateral double-deck circuit base plate that the present invention uses, has the advantages that and copper is selected to make
For base, unilateral circuit base plate, its radiating efficiency is effectively ensured；This product using the double-deck route, than single side route FR4 significantly
Reduce route distribution area and do not lose original characteristic, to reduce small product size, reduces hardware and assembly cost, be suitable for
The second blind hole for passing to electrical connection position is lingered at the great power LED of stage spotlighting, the base copper back side, and electrical connection position can be used for
It welds plug, with external winding displacement convenient for assembly, improves the beauty of product and shell is facilitated to assemble.
Detailed description of the invention
Fig. 1 is the structural diagram of the present invention.
Specific embodiment
Below in conjunction with attached drawing, specific embodiments of the present invention will be described in further detail.
As shown in Figure 1, a kind of unilateral double-deck circuit base plate, including successively folding the first line layer 11 set, absolutely from top to bottom
Edge layer 12, the second line layer 13, adhesive-layer 2 and base copper 3；It further include having the first blind hole 4 and the second blind hole 5, the first blind hole 4 connects
Logical first line layer 11, insulating layer 12 and the second line layer 13, the inner wall of the first blind hole 4 are provided with layers of copper 4a, first line layer
11 and second line layer 13 connected by layers of copper 4a, the second blind hole 5 is connected to base copper 3 and adhesive-layer 2, right on the second line layer 13
The position of the second blind hole 5 is answered to be provided with electrical connection position.FR4 than single side route greatly reduces route distribution area and does not lose original
The characteristic come reduces hardware and assembly cost to reduce small product size.
The second blind hole 5 for passing to electrical connection position is lingered at 3 back side of base copper, and electrical connection position can be used for welding plug, with side
Civilian dress matches external winding displacement.External socket line can be directly connected to 13 (circuit base plate internal layer circuit/1 internal layer of FR4 plate of the second line layer
Route), it improves external socket line and draws from first line layer 11 (circuit base plate outer-layer circuit/1 outer-layer circuit of FR4 plate) face LED
Out, it improves the beauty of product and shell is facilitated to assemble.
Adhesive-layer 2 is the resin of the high thermal conductivity of coating on metallic substrates documented by application number CN201510025216.8
Composition.Using the adhesive-layer 2 of the material, two-sided FR4 plate 1 and copper sheet are combined, use copper as Metal Substrate, thermal coefficient is
1386KJ/ (M.H.K) is about 2 times of aluminium, is more advantageous to distributing for heat, prevents electronic component from generating and fails under long term high temperature,
Improve job stability product service life.
2 thermal conductivitys of the adhesive-layer >=3.0W/mK guarantees the good heat-conducting effect of product insulating layer 12 and passes through aluminum substrate
Rapid cooling improves life of product, improves the ability to bear of product load current and solves the heat dissipation problem of end product, insulation
12 binding force of layer: >=17N/mm2, heat shock resistance: the requirement of 300 DEG C/60s/6cycle related functionality.The adhesive-layer 2 have compared with
High thermal conductivity, adhesive, base copper and each line layer be not easy because uneven in temperature and/or adhesion loosely and bending deformation, point
Layer etc..12 resin material of insulating layer, such as polypropylene material or even modified polypropylene material, 2116 model polypropylene.FR4 plate 1,
The selection of adhesive-layer 2, circuit base plate are not easy bending deformation, layering etc., and electrical property needed for meeting intelligent LED and signal are correct
Property.
The resin combination of the high thermal conductivity of coating on metallic substrates, the resin group documented by CN201510025216.8
Object is closed by weight mainly by following material composition: 5-35 parts of bisphenol A type epoxy resin, o-cresol formaldehyde epoxy resin 5-10
Part, 5-10 part of nbr carboxyl terminal epoxy prepolymer, 50-80 parts of filler, 1-10 parts of aromatic amine or sulfone class curing agent, rush
Into 0.1-2 parts of agent.Preferably, filler is one or more of aluminium oxide, boron nitride, aluminium nitride and silicon carbide.Preferably, double
Phenol A type ring oxygen resin epoxy equivalent weight is 430-450；O-cresol formaldehyde epoxy resin epoxide equivalent 200-230；Above-mentioned carboxyl end group butyronitrile
The rubber content of rubber epoxy prepolymer is 40%, and viscosity is 200PS80 DEG C, epoxide equivalent 850-950.Preferably, fragrant
Race's amine and/or sulfone class curing agent are diaminodiphenylmethane (DDM), diaminodiphenylsulfone (DDS) and/or m-phenylene diamine (MPD) (m
PDA), promotor is imidazoles promotor, such as 2-methylimidazole, N- methylimidazole.
Adhesive-layer 2 with a thickness of 70~120um, 1.3~1.8mm of thickness of base copper 3.Preferably, the thickness of adhesive-layer 2
For 90~110um, such as 105um；1.4~1.6mm of thickness of base copper 3, such as 1.5mm.
The thickness of 1.2~1.6mm of thickness of insulating layer 12, first line layer 11 and the second line layer 13 is 0.28~
0.55mm.Preferably, 1.3~1.5mm of thickness of insulating layer 12, such as 1.45mm；First line layer 11 and the second line layer 13
Thickness is 0.35~0.45mm, such as 0.4mm.
The upper end of base copper 3 and the lower end of the second line layer 13 are provided with brownification layer.The upper end of first line layer 11 is coated with
There is the first solder mask；The lower end of second line layer 13 is coated with the second solder mask, and solder mask is PE material or polyimide material
Deng.
A kind of manufacture craft of the unilateral double-deck circuit base plate, includes the following steps a to f.
Step a, copper sheet and FR4 plate 1 cut sawing sheet, and copper sheet processes the second blind hole 5.In step a, copper sheet and FR4 plate 1 divide
First positioning hole and second location hole are not machined with it；When copper sheet is bonded with FR4 plate 1, first positioning hole and second location hole are corresponding,
Filled high-temperature film in first positioning hole and second location hole.In step a, after copper sheet processes the second blind hole 5, is polished, gone
It is dirty.In FR4 plate 1, insulating layer is resin material.
The Copper fabrication of 1 downside of step b, FR4 plate is shaped to the second line layer 13.FR4 plate 1 and copper sheet carry out first time baking sheet
Before, the lower end of copper-based upper end and FR4 carry out brownification processing.
Step c, FR4 plate 1 and copper sheet carry out first time baking sheet, 135~160 DEG C of baking sheet temperature, 50~75min of duration.Step
In rapid c, the upper end of FR4 plate 1 and the lower end pasting protective film of copper sheet.
Step d, copper sheet upper end attach the glue film of semi-solid preparation, and the position of corresponding second blind hole 5 opens up through-hole, through-hole on glue film
Aperture be greater than the second blind hole 5 aperture, the electricity of the lower end lubricated of the second line layer 13, wherein 13 lower end of the second line layer
Connection position is left a blank, second of baking sheet of FR4 plate 1 of lubricated, 135~160 DEG C of baking sheet, 7~12min of duration.Glue film and sizing material
For the resin combination for coating high thermal conductivity on metallic substrates documented by application number CN201510025216.8.
Step e, the second blind hole 5 on copper sheet are successively encased inside high temperature membrane and gasket, and high temperature membrane and gasket are that peripheral wall is separate
The thickness summation of 1~2mm of inner wall of second blind hole 5, high temperature membrane and gasket is smaller by 0.08 than the thickness summation of copper sheet and glue film~
0.15mm.Second blind hole 5 is used as gong slot position, filled high-temperature film and gasket, and whole plate increases silica gel cushion, balance pressure when pressing
Power, not will lead to that line layer is impaired, wiring board plate bursting.Coating hair welding resistance oil (is chosen under gained FR4 plate 1 on second line layer 13
It is that side copper is included or that 13 later period of the second line layer is coated with), 5 filled high-temperature film of the second blind hole and gasket are not easy to press after pressing
Hurt route, welding resistance oil will not fall off discoloration.The base of circuit base plate is copper sheet, and preferably aluminium is as gasket.
Step f, copper sheet is placed in silicagel pad, FR4 plate 1 is bonded copper sheet and the electrical connection position of the second wiring board corresponding the
Two blind holes 5；FR4 plate 1 and copper sheet pressing connect, 170~240 DEG C of temperature, 40~65kg of pressure, glue film and sizing material thermoplastic.
In step c, FR4 plate 1 and copper sheet carry out first time baking sheet, 145~155 DEG C of baking sheet temperature, 55~65min of duration；
In step d, second of baking sheet of FR4 plate 1 of lubricated, 130~150 DEG C of baking sheet temperature, 8~10min of duration.
1.3~1.8mm of copper plate thickness；In FR4 plate 1,12 1.2~1.6mm of thickness of insulating layer, 12 upper end copper of insulating layer is under
Holding copper thickness is 0.28~0.55mm；1.2~2.5mm of silica gel mat thickness.
After FR4 plate 1 and copper sheet pressing connection, 1 upper end Copper fabrication of FR4 plate is first line layer 11, is taken out in the second blind hole 5
Gasket and high temperature membrane.In step g, release film, brown paper and bottom plate are successively lined with below silicagel pad；Bottom plate for hold material and
Mobile material.
The ingredient of protective film: successively including surface layer, protective layer, adhesive layer, releasing layer from top to bottom.1. surface layer prevents from scraping
Colored and antistatic function, usual thickness is in 1um, and the protective film surface layer being especially used on green oil can add some points shiny surface, protection
Film has added anti-sticking layer, avoids dust and dry film is broken is attached on protective film, effect is very good, is particularly useful green oil process more preferably.②
Adhesive layer: the bonding effect of protective film and film is a kind of presser sensor glue, not increasing too big pressure can its it is viscous
The effect connect, pressure are adjusted in 4~6BAR.3. protective layer: it is exactly the major part of protective film, is mylar, this
Layer cannot be too thick, and typically 6um is more.4. releasing layer: this layer to tear it down when being exactly pad pasting plays protection adhesive layer
Effect all uses 25 microns of polymer PET in the market.
High temperature membrane material can be PE, polyester material, epoxide resin material etc.；In thermoplastic pressing connection process, high temperature resistant.
Release film refers to that film surface can have the film of differentiation, and release film contacts under limited conditions with specific material
Do not have viscosity or slight viscosity afterwards.PE release film, PET release film, OPP release film, PC release film, PS isolation film, PMMA
Release film, BOPP release film, PE stripping film, plastic film, TPX release film, PVC stripping film, PTFE release film, PET release film,
Single silicon release film, polyester release film etc..
In the description of the present invention, it is to be understood that, term " center ", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom" "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise ", " axial direction ", " radial direction ", " circumferential direction " be orientation based on the figure or
Positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include at least one this feature.In the description of the present invention, the meaning of " plurality " is at least two, such as two, three
It is a etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " installation ", " connected ", " connection ", " fixation " etc.
Term shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integral；It can be mechanical connect
It connects, is also possible to be electrically connected or can communicate each other；It can be directly connected, can also indirectly connected through an intermediary, it can be with
It is the interaction relationship of the connection or two elements inside two elements, unless otherwise restricted clearly.For this field
For those of ordinary skill, the specific meanings of the above terms in the present invention can be understood according to specific conditions.
In the present invention unless specifically defined or limited otherwise, fisrt feature in the second feature " on " or " down " can be with
It is that the first and second features directly contact or the first and second features pass through intermediary mediate contact.Moreover, fisrt feature exists
Second feature " on ", " top " and " above " but fisrt feature be directly above or diagonally above the second feature, or be merely representative of
First feature horizontal height is higher than second feature.Fisrt feature can be under the second feature " below ", " below " and " below "
One feature is directly under or diagonally below the second feature, or is merely representative of first feature horizontal height less than second feature.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
The above embodiments are merely illustrative of the technical solutions of the present invention and is not intended to limit it, all without departing from the present invention
Any modification of spirit and scope or equivalent replacement, shall fall within the scope of the technical solution of the present invention.
Claims (10)
1. a kind of manufacture craft of the unilateral double-deck circuit base plate, which comprises the following steps: step a, copper sheet and FR4
Plate (1) cuts sawing sheet, and copper sheet processes the second blind hole (5)；
Copper fabrication on the downside of step b, FR4 plate (1) is shaped to the second line layer (13)；
Step c, FR4 plate (1) and copper sheet carry out first time baking sheet, 135~160 DEG C of baking sheet temperature, 50~75min of duration；
Step d, copper sheet upper end attach the glue film of semi-solid preparation, and the position of corresponding second blind hole (5) opens up through-hole on glue film, through-hole
Aperture is greater than the aperture of the second blind hole (5), the lower end lubricated of the second line layer (13), wherein the second line layer (13) lower end
Electrical connection position leave a blank, second of baking sheet of FR4 plate (1) of lubricated, 135~160 DEG C of baking sheet, 7~12min of duration；
Step e, the second blind hole (5) on copper sheet are successively encased inside high temperature membrane and gasket, and high temperature membrane and gasket are peripheral walls far from
The thickness summation of 1~2mm of inner wall of two blind holes (5), high temperature membrane and gasket is smaller by 0.08 than the thickness summation of copper sheet and glue film~
0.15mm；
Step f, copper sheet is placed in silicagel pad, FR4 plate (1) is bonded copper sheet and the electrical connection position corresponding second of the second wiring board
Blind hole (5)；FR4 plate (1) and copper sheet pressing connect, 170~240 DEG C of temperature, 40~65kg of pressure.
2. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the glue film and
Sizing material is the resin combination of the high thermal conductivity of coating on metallic substrates documented by application number CN201510025216.8.
3. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the step c
In, FR4 plate (1) and copper sheet carry out first time baking sheet, 145~155 DEG C of baking sheet temperature, 55~65min of duration；In step d, coating
Second of baking sheet of FR4 plate (1) of sizing material, 130~150 DEG C of baking sheet temperature, 8~10min of duration.
4. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the copper sheet is thick
Spend 1.3~1.8mm；In FR4 plate (1), insulating layer (12) 1.2~1.6mm of thickness, insulating layer (12) upper end copper and lower end copper thickness
It is 0.28~0.55mm；1.2~2.5mm of silica gel mat thickness.
5. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the FR4 plate
(1) and after copper sheet pressing connection, FR4 plate (1) upper end Copper fabrication is first line layer (11), takes out gasket in the second blind hole (5)
And high temperature membrane.
6. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that further include step
G, silicagel pad lower section are successively lined with release film, brown paper and bottom plate；Bottom plate is for holding material and mobile material.
7. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the step a
In, copper sheet and FR4 plate (1) are machined with first positioning hole and second location hole respectively；When copper sheet is bonded with FR4 plate (1), first is fixed
Position hole and second location hole are corresponding, filled high-temperature film in first positioning hole and second location hole.
8. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the step a
In, after copper sheet processes the second blind hole (5), polished, go it is dirty.
9. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the step c
In, the upper end of FR4 plate (1) and the lower end pasting protective film of copper sheet.
10. a kind of manufacture craft of unilateral double-deck circuit base plate according to claim 1, which is characterized in that the FR4 plate
(1) and before copper sheet progress first time baking sheet, the lower end of copper-based upper end and FR4 carry out brownification processing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811523716.4A CN109587936A (en) | 2018-12-13 | 2018-12-13 | A kind of manufacture craft of the unilateral double-deck circuit base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811523716.4A CN109587936A (en) | 2018-12-13 | 2018-12-13 | A kind of manufacture craft of the unilateral double-deck circuit base plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109587936A true CN109587936A (en) | 2019-04-05 |
Family
ID=65928360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811523716.4A Pending CN109587936A (en) | 2018-12-13 | 2018-12-13 | A kind of manufacture craft of the unilateral double-deck circuit base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109587936A (en) |
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| JP2004342930A (en) * | 2003-05-16 | 2004-12-02 | Hitachi Aic Inc | Multilayer substrate having non-through conduction hole |
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