CN109586752B - Communication device and terminal - Google Patents

Communication device and terminal Download PDF

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Publication number
CN109586752B
CN109586752B CN201910029624.9A CN201910029624A CN109586752B CN 109586752 B CN109586752 B CN 109586752B CN 201910029624 A CN201910029624 A CN 201910029624A CN 109586752 B CN109586752 B CN 109586752B
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China
Prior art keywords
control chip
antenna module
antenna
circuit board
communication device
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Active
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CN201910029624.9A
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CN109586752A (en
Inventor
郭进良
余慧明
朱志荣
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Quectel Wireless Solutions Co Ltd
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Quectel Wireless Solutions Co Ltd
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Publication date
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Priority to CN201910029624.9A priority Critical patent/CN109586752B/en
Priority to PCT/CN2019/073250 priority patent/WO2020143079A1/en
Publication of CN109586752A publication Critical patent/CN109586752A/en
Application granted granted Critical
Publication of CN109586752B publication Critical patent/CN109586752B/en
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B1/00Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/40Circuits
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B7/00Radio transmission systems, i.e. using radiation field
    • H04B7/02Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas
    • H04B7/04Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas
    • H04B7/0404Diversity systems; Multi-antenna system, i.e. transmission or reception using multiple antennas using two or more spaced independent antennas the mobile station comprising multiple antennas, e.g. to provide uplink diversity
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components

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  • Engineering & Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Transceivers (AREA)
  • Support Of Aerials (AREA)

Abstract

The invention provides a communication device and a terminal, and relates to the technical field of communication devices. The communication device includes: the antenna comprises an antenna module, a control circuit and a circuit board; the control circuit includes: a main control chip and a control chip; the antenna module is arranged on the first surface of the circuit board, and the main control chip and the control chip are arranged on the second surface of the circuit board; the main control chip is electrically connected with the control chip, the antenna module is electrically connected with the control chip through the via hole on the circuit board, the control chip is used for controlling the antenna module to send and receive signals according to the instructions of the main control chip, the control circuit and the antenna module in the communication device are arranged on two sides of the circuit board, the space occupied by the antenna module and the control circuit is further saved, and the antenna module and the control circuit are arranged on the same circuit board, so that the path between the antenna module and the control circuit is reduced, the space is saved, the difference loss of radio frequency can be further reduced, and the radio frequency performance of the antenna module is improved.

Description

Communication device and terminal
Technical Field
The invention relates to the technical field of communication devices, in particular to a communication device and a terminal.
Background
The communication terminal is an electronic terminal device capable of performing information interaction through a communication network, and is generally provided with a communication device for providing a communication function. With the development of communication technology, the application of communication terminals is becoming more common, and people have higher and higher requirements for communication devices in communication terminals. The antenna is a component of a communication terminal, radiates electromagnetic wave signals, receives the electromagnetic wave signals, and converts the received current signals into the electromagnetic wave signals for transmission and converts the received electromagnetic wave signals into electric signals.
In a communication device used in a communication terminal in the prior art, a communication control Circuit and an antenna are separately designed and connected by a Printed Circuit Board (PCB) or a radio frequency coaxial line, or an independent antenna module is connected by a Flexible Circuit Board (FPC).
However, in the above prior art, the communication control circuit and the antenna are separately designed, so that the communication device occupies a large space in the communication terminal, which affects the overall structure of the communication terminal or the layout of other components.
Disclosure of Invention
The present invention is directed to provide a communication device and a terminal, so as to solve the problem that the antenna and the module occupy a large space in the prior art.
In order to achieve the above purpose, the embodiment of the present invention adopts the following technical solutions:
in a first aspect, an embodiment of the present invention provides a communication apparatus, including: the antenna comprises an antenna module, a control circuit and a circuit board; the control circuit includes: a main control chip and a control chip;
the antenna module is arranged on the first surface of the circuit board, and the main control chip and the control chip are arranged on the second surface of the circuit board;
the main control chip is electrically connected with the control chip, the antenna module is electrically connected with the control chip through a via hole on the circuit board, and the control chip is used for controlling the antenna module to send and receive signals according to instructions of the main control chip.
Optionally, the antenna module includes multiple antenna arrays, each antenna array is correspondingly provided with a control chip, each control chip is electrically connected to one antenna array through a via hole on the circuit board, and each control chip controls a corresponding antenna array.
Optionally, the locations of the vias are mapped onto the leads of the antenna matrix.
Optionally, the location of the via is mapped onto a lead at a central location of the antenna matrix.
Optionally, the control circuit further includes a memory chip, and the memory chip is disposed on the second surface of the circuit board and electrically connected to the main control chip.
Optionally, the control circuit further includes a power chip disposed on the second surface of the circuit board, and the power chip is electrically connected to the main chip.
Optionally, the electronic device further comprises a shielding case, and the shielding case is arranged outside the control circuit.
In a second aspect, an embodiment of the present invention further provides a terminal, including a housing, a built-in motherboard, and the communication device of the first aspect;
the built-in mainboard and the communication device are arranged in the shell;
the second surface of the circuit board in the communication device is provided with a grid array packaging LGA pad;
the communication device is connected with the built-in mainboard through the LGA bonding pad.
Optionally, a through hole is formed in the built-in motherboard, a control circuit card of the communication device is disposed in the through hole, and the LGA pad is connected to one side of the built-in motherboard by soldering.
Optionally, the position on the housing corresponding to the antenna module is a hollowed structure or a wave-transparent material.
The invention has the beneficial effects that: the control circuit and the antenna module in the communication device are arranged on two sides of the circuit board, so that the space occupied by the antenna module and the control circuit is saved, and the antenna module and the control circuit are arranged on the same circuit board, so that the path between the antenna module and the control circuit is reduced, the space is saved, the difference loss of radio frequency can be reduced, the radio frequency performance of the antenna module is improved, and the design cost can be reduced.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a communication device according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of another communication device provided in the present application;
fig. 3 is a schematic structural diagram of another communication device provided in the present application;
fig. 4 is a schematic diagram of another communication device module provided herein;
fig. 5 is a schematic structural diagram of another communication device provided in the present application.
Icon: 1-a communication device; 11-a circuit board; a 111-via; 113-a shield can; 13-a main control chip; 14-a radio frequency processing module; 15-a control chip; 151-control chip a; 153-control chip B; 155-control chip C; 157-control chip D; 16-a power supply chip; 17-an antenna module; 171-antenna module a; 173-antenna module B; 175-antenna module C; 177-antenna module D; 18-a memory chip; 21-built-in mainboard; 23-a through hole; 25-LGA pad.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Fig. 1 is a schematic structural diagram of a communication device provided in the present application; fig. 2 is a schematic structural diagram of another communication device provided in the present application.
As shown in fig. 1 and 2, the communication apparatus 1 includes: an antenna module 17, a control circuit and a circuit board 11; the control circuit includes: a main control chip 13 and a control chip 15. The Circuit Board 11 may be a Printed Circuit Board (PCB), but is not limited thereto.
The antenna module 17 is disposed on a first surface of the circuit board 11, and the main control chip 13 and the control chip 15 are disposed on a second surface of the circuit board 11. That is, the control circuit and the antenna module 17 are integrated on one circuit board 11 and distributed on both sides of the circuit board 11.
The main control chip 13 is electrically connected with the control chip 15, the antenna module 17 is electrically connected with the control chip 15 through a via hole 111 on the circuit board 11, and the control chip 15 is used for controlling the antenna module 17 to send and receive signals according to instructions of the main control chip 13.
Optionally, the antenna module 17 is disposed on one side of the circuit board 11 having the ground copper, and the ground copper of the circuit board 11 reflects the electromagnetic wave signal sent by the antenna module 17, so that the electromagnetic wave signal sent by the antenna module 17 is changed into all the electromagnetic wave signal sent outward according to convergence, thereby effectively reducing loss of the electromagnetic wave signal.
In an optional embodiment, the antenna module 17 is disposed on the first surface of the circuit board 11, the control chip 15 for controlling the antenna module 17 is disposed on the second surface of the circuit board 11, and the disposing position of the control chip 15 is the same as the projection position of the disposing position of the antenna module 17, so that the path between the antenna module 17 and the control circuit is reduced, the difference loss of the radio frequency is reduced, and the radio frequency performance of the antenna module 17 is improved.
Optionally, the antenna module 17 and the control chip 15 are electrically connected through a via hole 111 on the circuit board 11, and a hole may be formed in the circuit board 11, and then the antenna module 17 and the control chip 15 may be connected by passing a wire through the hole in the circuit board 11, or a metal layer is formed in the hole to connect the antenna module 17 and the control chip 15, and the like, and the main control chip 13 may be electrically connected with the antenna module 17 without being limited in detail.
The communication device 1 provided in the embodiment of the present application includes: antenna module 17, control circuit and circuit board 11, through setting up control circuit and antenna module 17 in communication device 1 at the both sides of circuit board 11, and then practiced thrift the space that antenna module 17 and control circuit occupy, and owing to set up antenna module 17 and control circuit on a circuit board 11, make the route between antenna module 17 and the control circuit reduce, practice thrift the space, and then can also reduce the difference of radio frequency and decrease, improve antenna module 17's radio frequency performance. In addition, the antenna module does not need to be purchased independently, and meanwhile, the design cost can be reduced.
Alternatively, as shown in fig. 2, the antenna module 17 may include a plurality of antenna arrays, one control chip 15 is correspondingly disposed on each antenna array, each control chip 15 is electrically connected to one antenna array through a via 111 on the circuit board 11, and each control chip 15 controls a corresponding antenna array.
The antenna matrix in the embodiment of the present application may be a 5G antenna, or may also be a 3G antenna or a 4G antenna, which is not limited herein and may support different frequency bands.
On the basis of the above embodiment, the plurality of groups of antenna arrays are disposed on the first surface of the circuit board 11, and a control chip 15 is disposed on the second surface of the circuit board 11 at a position corresponding to each group of antenna arrays, each control chip 15 is connected to its corresponding antenna array through a via 111, each control chip 15 controls a group of antenna arrays connected to it, and each control chip 15 is electrically connected to the main control chip 13, and is configured to receive a control instruction of the main control chip 13 and control the antenna arrays through the control instruction.
It should be noted that, taking the example that 4 groups of antenna arrays are arranged on the circuit board 11, 4 control chips 15 are correspondingly arranged, each control chip 15 controls one group of antenna arrays, and each control chip 15 is electrically connected to the main control chip 13 through a circuit of the circuit board 11 and is configured to receive and execute a control instruction of the main control chip 13.
It should be noted that each antenna array may include a plurality of antenna small arrays, the number of the antenna small arrays is determined by the number of the antenna small arrays that can be controlled by the control chip 15, and the number of rows and columns of the antenna array may be determined by the antenna controller.
For example, 4 control chips 15 are disposed on the second side of the circuit board 11, each antenna array disposed on the first side of the corresponding circuit board 11 may include 4 rows and 4 columns, and each control chip 15 may control 16 antenna small matrices in each antenna matrix.
Optionally, the locations of the vias 111 are mapped onto the leads of the antenna matrix. That is, the control chip 15 is connected to the leads of the antenna matrix through the via holes 111, thereby controlling the corresponding antenna matrix. Wherein the lead is connected between each of the small matrices of the antenna matrix.
The length of the lead between the antenna small matrices may be determined according to the actual frequency, and generally, the length of the lead in each antenna matrix group is 1/2 or 1/4 of the wavelength of the millimeter wave band. Optionally, the supported frequency bands are different, and the lead lengths in each group of antenna matrix are different.
In addition, in order to facilitate the complete and effective transmission of the electromagnetic wave signals received by the antenna array to the control chip 15, the position of the control chip 15 is opposite to the position of the antenna array, i.e. on both sides of the same position area of the circuit board 11. And a via hole 111 is provided on the circuit board 11 at the position of the antenna matrix lead wire, so that the control chip 15 is electrically connected with the antenna matrix through the via hole 111.
Further optionally, the location of the via 111 is mapped onto a lead at a central location of the antenna matrix. Thereby realizing that the electromagnetic wave signals received by the antenna matrix can be transmitted to the control chip 15 in a path as short as possible. Further, the difference loss of the radio frequency can be reduced more favorably, and the radio frequency performance of the communication device 1 can be improved.
Fig. 3 is a schematic structural diagram of another communication device provided in the present application; as shown in fig. 3, optionally, the control circuit further includes: and the memory chip 18 is arranged on the second surface of the circuit board 11, and is electrically connected with the main control chip 13.
Optionally, the memory chip 18 is electrically connected to the main control chip 13, and is configured to store the electromagnetic wave signal and the control instruction received by the main control chip 13, and may also convert the stored electromagnetic wave signal and the control instruction into a language recognizable by the main control chip 13, so that the main control chip 13 extracts and processes the electromagnetic wave signal and the control instruction stored in the memory chip 18.
In practical application, the memory chip 18 is integrated on the circuit board 11, and is located on the same plane as the main control chip 13 and electrically connected to the main control chip 13.
Optionally, the control circuit further includes a power chip 16, the power chip 16 is disposed on the second surface of the circuit board 11, and the power chip 16 is electrically connected to the main control chip 13.
Specifically, the power chip 16 is integrated on the circuit board 11 and located on the same plane as the main control chip 13, the power chip 16 and the power supply are electrically connected to the main control chip 13, and the power chip 16 is used for controlling the power supply to supply power to the communication device 1 under the control of the main control chip 13.
Optionally, as shown in fig. 3, a shielding cover 113 is further included, and the shielding cover 113 covers the outside of the control circuit.
Since the communication device 1 needs to transmit and receive electromagnetic wave signals through the antenna matrix, and the electromagnetic wave signals may generate certain interference to the control chip 15, the shielding cover 113 is disposed at the periphery of the control chip 15, the shielding cover 113 may be used to isolate the interference of the electromagnetic wave signals or other signals to the control chip 15, and the material and structure of the shielding cover 113 are not limited as long as the control chip 15 can isolate the interference of the electromagnetic wave signals or other signals to the control chip 15 by disposing the shielding cover 113.
Fig. 4 is a schematic diagram of another communication device module provided herein; for example, as shown in fig. 4, optionally, the communication device 1 further includes: a radio frequency processing module 14, where the radio frequency processing module 14 is disposed between the control chip 15 and the main control chip 13, and is configured to perform radio frequency processing on the electromagnetic wave signal received by the antenna module 17, where the radio frequency processing includes: denoising, amplifying, filtering and the like.
By way of example, the workflow of the communication device 1 may include: the main control chip 13 generates an instruction to the control chip 15, the control chip 15 controls the antenna module 17 to send and receive signals according to the instruction, and when the instruction is to transmit an electromagnetic wave signal, the control chip 15 directly controls the antenna module 17 to transmit the electromagnetic wave; when the command is to receive an electromagnetic wave signal, the control chip 15 directly controls the antenna module 17 to receive the electromagnetic wave and send the received electromagnetic wave signal to the radio frequency processing module 14, and the radio frequency processing module 14 performs signal processing on the received electromagnetic wave signal and sends the processed electromagnetic wave signal to the main control chip 13.
The communication apparatus 1 includes: the antenna comprises a main control chip 13, a radio frequency processing module 14, a power supply chip 16, a control chip A151, a control chip B153, a control chip C155, a control chip D157, an antenna module A171, an antenna module B173, an antenna module C175 and an antenna module D177.
The main control chip 13 sends a control instruction to one or more of the control chip a151, the control chip B153, the control chip C155 and the control chip D157, and the control chip receiving the control instruction controls the corresponding antenna module to send an electromagnetic wave signal. Or one or more of the antenna module a171, the antenna module B173, the antenna module C175, and the antenna module D177 is controlled to receive the electromagnetic wave signals, and send the received electromagnetic wave signals to the corresponding control chip, and the control chip sends the electromagnetic wave signals to the radio frequency processing module 14, and the radio frequency processing module 14 performs radio frequency processing on the received electromagnetic wave signals according to an instruction of the main control chip 13, and sends the processed electromagnetic wave signals to the main control chip 13, and the power supply chip 16 is used for supplying power to the communication device 1.
The communication device 1 provided by the embodiment of the application sets up the control circuit and the antenna module 17 in the communication device 1 on the two sides of the circuit board 11, and then saves the space occupied by the antenna module 17 and the control circuit, and because the antenna module 17 and the control circuit are arranged on one circuit board 11, the path between the antenna module 17 and the control circuit is reduced, and then the difference loss of radio frequency is reduced, and the radio frequency performance of the antenna module 17 is improved.
Fig. 5 is a schematic structural diagram of a terminal provided in the present application; as shown in fig. 3 and 5, the terminal includes: a housing, a built-in motherboard 21, and the above-described communication device 1.
The built-in mainboard 21 and the communication device 1 are arranged in the shell;
the second side of the circuit board 11 in the communication device 1 is provided with a land grid array package LGA pad 25;
the communication apparatus 1 is connected to the built-in motherboard 21 through the LGA pad 25.
Alternatively, the communication apparatus 1 solder-connects the circuit board 11 of the communication apparatus 1 with the built-in main board 21 of the terminal through the LGA pads 25, and the soldered built-in main board 21 is set inside the housing.
Alternatively, the built-in motherboard 21 is provided with a through hole 23, the control circuit card of the communication device 1 is provided in the through hole 23, and the LGA pad 25 is soldered to one surface of the built-in motherboard 21.
Specifically, a through hole 23 is dug in a position of the built-in motherboard 21 corresponding to the control circuit in the communication device 1, the communication device 1 is snapped into the through hole 23 on the built-in motherboard 21, and then the communication device 1 is soldered on one side of the built-in motherboard 21 using the LGA pad 25, thereby saving the space occupied by the antenna module 17 and the control circuit.
Optionally, the position of the housing corresponding to the antenna module 17 is a hollowed structure or a wave-transparent material.
Specifically, the communication device 1 is soldered to the built-in main board 21 of the terminal, and the main board is mounted inside the housing of the terminal, because the communication device 1 is used for transmitting and receiving electromagnetic wave signals, but the electromagnetic wave signals are easily reflected or absorbed during propagation, and in order to make the electromagnetic wave signals propagate better, the wave-transparent processing is performed at a position on the housing corresponding to the antenna module 17, wherein the wave-transparent processing includes: the position that corresponds with this antenna module 17 on the casing is excavated for the electromagnetic wave signal that antenna module 17 produced is not absorbed by the casing or is reflected in the transmission course, and then reduces the poor loss of radio frequency, perhaps, changes the material of the position that corresponds with this antenna module 17 on the casing into wave-transparent material, and in practical application, wave-transparent material includes: at least one wave-transparent material selected from glass fiber and ceramic.
In the terminal that this application provided, set up antenna module 17 and control circuit on a circuit board 11 for the route between antenna module 17 and the control circuit reduces, practices thrift the space, and then can also reduce the difference of radio frequency and decrease, improves antenna module 17's radio frequency performance. In addition, the antenna module does not need to be purchased independently, and meanwhile, the design cost can be reduced. Further, the position on the shell corresponding to the antenna module 17 is subjected to wave-transmitting processing, so that electromagnetic wave signals generated by the antenna module 17 are not absorbed or reflected by the shell in the transmission process, and the difference loss of radio frequency is reduced.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. A communications apparatus, comprising: the antenna comprises an antenna module, a control circuit and a circuit board; the control circuit includes: a main control chip and a control chip;
the antenna module is arranged on the first surface of the circuit board, and the main control chip and the control chip are arranged on the second surface of the circuit board, wherein the antenna module is arranged on the surface of the circuit board with the ground copper;
the main control chip is electrically connected with the control chip, the antenna module is electrically connected with the control chip through a via hole on the circuit board, and the control chip is used for controlling the antenna module to send and receive signals according to instructions of the main control chip;
the antenna module comprises a plurality of groups of antenna matrixes, each group of antenna matrixes is correspondingly provided with a control chip, each control chip is electrically connected with one group of antenna matrixes through the through holes on the circuit board, and each control chip controls the corresponding group of antenna matrixes.
2. The communications device of claim 1, wherein the location of the via is mapped onto a lead of the antenna matrix.
3. The communications device of claim 2, wherein the location of the via is mapped to a lead at a central location of the antenna matrix.
4. The communication device of claim 1, wherein the control circuit further comprises a memory chip disposed on the second side of the circuit board and electrically connected to the main control chip.
5. The communication device of claim 1, wherein the control circuit further comprises a power chip disposed on the second side of the circuit board, the power chip being electrically connected to the main control chip.
6. The communication device of claim 1, further comprising a shield disposed outside the control circuit.
7. A terminal, comprising: a housing, a built-in motherboard and a communication device according to any of claims 1-6;
the built-in mainboard and the communication device are arranged in the shell;
the second surface of the circuit board in the communication device is provided with a grid array package (LGA) pad;
the communication device is connected with the built-in mainboard through the LGA bonding pad.
8. A terminal according to claim 7, wherein the built-in motherboard is provided with a through hole, the control circuit card of the communication device is arranged in the through hole, and the LGA pad is connected with one surface of the built-in motherboard by soldering.
9. The terminal of claim 7, wherein the housing is hollowed or made of a wave-transparent material at a position corresponding to the antenna module.
CN201910029624.9A 2019-01-11 2019-01-11 Communication device and terminal Active CN109586752B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201910029624.9A CN109586752B (en) 2019-01-11 2019-01-11 Communication device and terminal
PCT/CN2019/073250 WO2020143079A1 (en) 2019-01-11 2019-01-25 Communication device and terminal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201910029624.9A CN109586752B (en) 2019-01-11 2019-01-11 Communication device and terminal

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Publication Number Publication Date
CN109586752A CN109586752A (en) 2019-04-05
CN109586752B true CN109586752B (en) 2020-09-25

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WO (1) WO2020143079A1 (en)

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Publication number Priority date Publication date Assignee Title
CN110138941B (en) * 2019-06-18 2021-03-02 深圳市福日中诺电子科技有限公司 Mainboard device of three-rear-camera mobile phone
CN114158187A (en) * 2021-12-30 2022-03-08 上海华测导航技术股份有限公司 Measuring device

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Publication number Priority date Publication date Assignee Title
US20040048583A1 (en) * 2002-08-21 2004-03-11 Everett Gregory J. Wireless control system for multiple networks
CN101431182B (en) * 2008-12-17 2012-09-05 清华大学 Reconfigurable antenna used for mobile terminal
CN201741263U (en) * 2010-05-05 2011-02-09 无锡皓月汽车安全***有限公司 Intelligent vehicle remote control unit
CN105207914A (en) * 2014-06-23 2015-12-30 南京升平通信设备有限公司 Wireless router
CN205028198U (en) * 2015-09-19 2016-02-10 深圳市睿祺智尚科技有限公司 Portable mini host computer
CN205921084U (en) * 2016-08-30 2017-02-01 嘉善金昌电子有限公司 Miniaturized LTE MIMO navigation combined antenna
CN107464986A (en) * 2017-09-01 2017-12-12 哈尔滨电工仪表研究所 A kind of ultra-high frequency RFID label antenna

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WO2020143079A1 (en) 2020-07-16

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