CN109580351A - A kind of wave pad assembly pressure test device - Google Patents
A kind of wave pad assembly pressure test device Download PDFInfo
- Publication number
- CN109580351A CN109580351A CN201811567268.8A CN201811567268A CN109580351A CN 109580351 A CN109580351 A CN 109580351A CN 201811567268 A CN201811567268 A CN 201811567268A CN 109580351 A CN109580351 A CN 109580351A
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- China
- Prior art keywords
- control module
- power control
- test
- wave pad
- module
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M5/00—Investigating the elasticity of structures, e.g. deflection of bridges or air-craft wings
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Engineering & Computer Science (AREA)
- Aviation & Aerospace Engineering (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The present invention provides a kind of wave pad assembly pressure test devices, including test module, servo-drive mould group, product tooling, circuit control module, power control module, the servo-drive mould group is connect with power control module, the circuit control module is connect with servo-drive mould group, power control module and test module respectively, and the test module is connect with power control module；The present invention controls displacement and the loading force of wave pad using power control module, interacts with PLC or industrial personal computer, the relationship of test module automatic measurement wave pad displacement and loading force；Test data automatic transceiving, preservation and display can be carried out, automatic test is realized；It can be compared with the force value parameter of Bo Dian producer, complete the analysis of assembly actual conditions；The response of power control module is fast, and test speed is fast.
Description
Technical field
The present invention relates to waves to pad testing field, and in particular to a kind of wave pad assembly pressure test device.
Background technique
Electric appliance from industrial equipment to household, wave pad widely appear in the field with device-dependent.Wave pad exists
Can be provided after assembly effective and stable power be it is vital, the elasticity modulus after detection wave pad assembly is determining wave pad dress
An important parameter with rear mechanical property.When carrying out wave pad elasticity modulus test to the wave pad assembly after assembly, it will be appreciated that
The force value parameter of wave pad is loaded by padding assembly parts to wave, the elasticity modulus after measurement wave pad assembly.The phase of wave pad at present
It closes elastic parameter generally to be provided by producer, can not accurately know the actual forces value parameter of spring, nothing after the assembly is completed in wave pad
Method determines the actual use situation of spring.
Summary of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of wave pad assembly pressure test devices, to solve background skill
Technical problem in art.
To achieve the above object, the present invention adopts the following technical scheme:
A kind of wave pad assembly pressure test device, comprising: test module, servo-drive mould group, product tooling, circuit control
Module, power control module, the servo-drive mould group are connect with power control module, the circuit control module respectively with servo-drive mould
Group, power control module are connected with test module, and the test module is connect with power control module.
Further, the circuit control module includes power supply, circuit board, PLC or industrial personal computer, touch screen, on circuit board
There are power amplifier components.
Further, the power control module includes pressure sensor, displacement sensor, voice coil motor straight line loading system,
The displacement for reading wave pad assembly parts medium wave pad of loading force can be accurately controlled.
A kind of beneficial effect of wave pad assembly pressure test device provided by the invention is: the present invention uses power control module
Displacement and the loading force of wave pad are controlled, is interacted with PLC or industrial personal computer, the displacement of test module automatic measurement wave pad and load
The relationship of power；Test data automatic transceiving, preservation and display can be carried out, automatic test is realized；It can be with the power of Bo Dian producer
Value parameter compares, and completes the analysis of assembly actual conditions；The response of power control module is fast, and test speed is fast.
Detailed description of the invention
Fig. 1 is overall structure diagram of the invention.
In figure: 1, test module；2, servo-drive mould group；3, product tooling；4, circuit control module；5, power control module.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Whole description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Ability
Domain ordinary person every other embodiment obtained without making creative work, belongs to protection of the invention
Range.
A kind of embodiment: wave pad assembly pressure test device.
A kind of wave pad assembly pressure test device, comprising: test module 1, servo-drive mould group 2, product tooling 3, circuit
Control module 4, power control module 5, the servo-drive mould group 2 are connect with power control module 5, the circuit control module 4 respectively with
2 groups of servo-drive mould, power control module 5 and test module 1 connect, and the test module 1 is connect with power control module 5；The power control
Module 5 includes pressure sensor, displacement sensor, voice coil motor straight line loading system, can be accurately controlled the reading of loading force
The displacement of wave pad assembly parts medium wave pad；The circuit control module 4 includes power supply, circuit board, PLC or industrial personal computer, touch screen, electricity
There are power amplifier components on the plate of road, can accurately export electric current and voltage, powers to voice coil motor straight line loading system, it is accurate to control
Loading force, to realize the control to loading force and displacement, servo-drive mould group 2 drives lead screw to drive on guide rail using servo motor
It is dynamic, realize accurate position control.
In the above-mentioned technical solutions, in use, padding quantity according to wave in test module 1 on the touchscreen and producer provides
Spring parameter set the parameter that should reach after practical set, complete test editor.Product to be measured is placed in product tooling 3
On, starting device starts to test.Certain position is arrived in the movement of servo-drive mould group 2, and power control module 5 starts, and is maintained at loading force
Certain value, record position, then power control module 5 is retreated, the variation of loading force and displacement in fallback procedures is recorded, loading force is exported
It with displacement changing curve, analyzes whether curve meets the requirements, calculates elasticity modulus further according to Hooke's law.With the parameter of setting
It compares, determines the practical set situation of spring.Report can be carried out after the completion of test to provide, print and historical data analysis etc.
Operation.It is analyzed when test using loading force when the rebound of wave pad and the data of displacement, avoids power control module 5 and groups of springs piece installing
The contact that starts be to generate the true effect hit after capable of more intuitively reacting spring assembly on resulting influence.
The above is presently preferred embodiments of the present invention, but the present invention should not be limited to embodiment and attached drawing institute public affairs
The content opened both falls within protection of the present invention so all do not depart from the lower equivalent or modification completed of spirit disclosed in this invention
Range.
Claims (3)
1. a kind of wave pad assembly pressure test device characterized by comprising test module, servo-drive mould group, product work
Dress, circuit control module, power control module, the servo-drive mould group are connect with power control module, the circuit control module difference
It is connect with servo-drive mould group, power control module and test module, the test module is connect with power control module.
2. wave pad assembly pressure test device as described in claim 1, it is characterised in that: the circuit control module includes electricity
Source, circuit board, PLC or industrial personal computer, touch screen have power amplifier components on circuit board.
3. wave pad assembly pressure test device as claimed in claim 2, it is characterised in that: the power control module includes that pressure passes
Sensor, displacement sensor, voice coil motor straight line loading system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811567268.8A CN109580351A (en) | 2018-12-19 | 2018-12-19 | A kind of wave pad assembly pressure test device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811567268.8A CN109580351A (en) | 2018-12-19 | 2018-12-19 | A kind of wave pad assembly pressure test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109580351A true CN109580351A (en) | 2019-04-05 |
Family
ID=65930313
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811567268.8A Pending CN109580351A (en) | 2018-12-19 | 2018-12-19 | A kind of wave pad assembly pressure test device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109580351A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112146862A (en) * | 2020-09-23 | 2020-12-29 | 珠海市精实测控技术有限公司 | Equipment for detecting deformation of motor wave pad and pull-down mechanism |
| CN115185224A (en) * | 2022-08-26 | 2022-10-14 | 深圳市软赢科技有限公司 | Force control motion control method and system with precision and high efficiency |
Citations (7)
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|---|---|---|---|---|
| JP2005084044A (en) * | 2003-09-04 | 2005-03-31 | Taketomo Denki:Kk | Cumulative compression and rotation type viscoelasticity measuring apparatus |
| CN202869895U (en) * | 2012-10-09 | 2013-04-10 | 中国科学院金属研究所 | Load-displacement curve indentation testing device controlled by PC (Personal Computer) |
| CN202974629U (en) * | 2012-11-01 | 2013-06-05 | 王亭岭 | Precise spring leaf performance tester |
| CN204165748U (en) * | 2014-11-15 | 2015-02-18 | 北华航天工业学院 | A kind of sensor spring leaf elasticity coefficient test macro |
| CN105181452A (en) * | 2015-07-13 | 2015-12-23 | 苏州博众精工科技有限公司 | Force measurement assembly |
| CN207147734U (en) * | 2017-08-28 | 2018-03-27 | 比亚迪股份有限公司 | A kind of elasticity test device |
| CN207215585U (en) * | 2016-11-12 | 2018-04-10 | 交通运输部公路科学研究所 | A kind of device for detecting mechanical property |
-
2018
- 2018-12-19 CN CN201811567268.8A patent/CN109580351A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005084044A (en) * | 2003-09-04 | 2005-03-31 | Taketomo Denki:Kk | Cumulative compression and rotation type viscoelasticity measuring apparatus |
| CN202869895U (en) * | 2012-10-09 | 2013-04-10 | 中国科学院金属研究所 | Load-displacement curve indentation testing device controlled by PC (Personal Computer) |
| CN202974629U (en) * | 2012-11-01 | 2013-06-05 | 王亭岭 | Precise spring leaf performance tester |
| CN204165748U (en) * | 2014-11-15 | 2015-02-18 | 北华航天工业学院 | A kind of sensor spring leaf elasticity coefficient test macro |
| CN105181452A (en) * | 2015-07-13 | 2015-12-23 | 苏州博众精工科技有限公司 | Force measurement assembly |
| CN207215585U (en) * | 2016-11-12 | 2018-04-10 | 交通运输部公路科学研究所 | A kind of device for detecting mechanical property |
| CN207147734U (en) * | 2017-08-28 | 2018-03-27 | 比亚迪股份有限公司 | A kind of elasticity test device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112146862A (en) * | 2020-09-23 | 2020-12-29 | 珠海市精实测控技术有限公司 | Equipment for detecting deformation of motor wave pad and pull-down mechanism |
| CN115185224A (en) * | 2022-08-26 | 2022-10-14 | 深圳市软赢科技有限公司 | Force control motion control method and system with precision and high efficiency |
| CN115185224B (en) * | 2022-08-26 | 2023-05-16 | 深圳市软赢科技有限公司 | Force control motion control method and system with precision and high efficiency |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190405 |