CN109571927A - Method for adhering film and pad-pasting fixture - Google Patents
Method for adhering film and pad-pasting fixture Download PDFInfo
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- CN109571927A CN109571927A CN201811453701.5A CN201811453701A CN109571927A CN 109571927 A CN109571927 A CN 109571927A CN 201811453701 A CN201811453701 A CN 201811453701A CN 109571927 A CN109571927 A CN 109571927A
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- pad pasting
- pad
- pasted
- pasting piece
- piece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/02—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor using sheet or web-like material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
- B29C63/0004—Component parts, details or accessories; Auxiliary operations
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- Manufacturing & Machinery (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
Abstract
The present disclosure discloses a kind of method for adhering film and pad-pasting fixture, the method for adhering film includes the following steps: to treat the heating of pad pasting piece；Material to be pasted is arranged on profiling jig, and the curved surface to be pasted wait paste on material is made to be directed at the contoured fields on the profiling jig；Make heating after to pad pasting piece be located on the contoured fields described in curved surface to be pasted it is opposite；Using described in direction punching press of the pressure head towards the contoured fields to pad pasting piece, the pressure head by the contoured fields extrusion deformation so that the corresponding portion to pad pasting piece be deformed into match with the shape of the curved surface to be pasted and with the application of a surface to be pasted.According to the method for adhering film of the disclosure, pad pasting can be simply and efficiently realized without pad pasting environment is vacuumized without treating the preforming processing of pad pasting piece progress, use scope is wide, and implementation cost is low.
Description
Technical field
This disclosure relates to Filming Technology field, more particularly, to a kind of method for adhering film and pad-pasting fixture.
Background technique
In the related technology, it when carrying out pad pasting to the curved surface on product, needs first to carry out preforming processing to diaphragm, makes diaphragm
Shape and product on curved surface match, carry out pad pasting operation again later, however, the mode of such pad pasting is complicated, Er Qieshi
The device structure of this existing pad pasting mode is complicated, at high cost, is unfavorable for promoting and applying on a large scale.Moreover, pad pasting in the related technology
Technique usually requires to carry out under vacuum conditions, higher cost.
Summary of the invention
The disclosure aims to solve at least one of the technical problems existing in the prior art.For this purpose, the disclosure is proposition one
Kind method for adhering film, the method for adhering film can simply and efficiently realize pad pasting.
The disclosure also proposes a kind of pad-pasting fixture for realizing above-mentioned method for adhering film.
According to the method for adhering film of disclosure first aspect embodiment, include the following steps: to treat the heating of pad pasting piece；It will be wait paste
Material is arranged on profiling jig, and the curved surface to be pasted wait paste on material is made to be directed at the profiling area on the profiling jig
Domain；Make heating after to pad pasting piece be located on the contoured fields described in curved surface to be pasted it is opposite；Using pressure head described in
To pad pasting piece described in the direction punching press of contoured fields, the pressure head by the contoured fields extrusion deformation so that described wait paste
The corresponding portion of diaphragm be deformed into match with the shape of the curved surface to be pasted and with the application of a surface to be pasted.
According to the method for adhering film of the disclosure, preforming processing is carried out without treating pad pasting piece, without vacuumizing pad pasting ring
Border can simply and efficiently realize pad pasting, and use scope is wide, and implementation cost is low.
According to the pad-pasting fixture of disclosure second aspect embodiment, comprising: heating device, the heating device include being used for
Treat the heating member of pad pasting piece heating；Profiling jig, the profiling jig are used to carry material to be pasted, and on the profiling jig
With with the contoured fields wait paste the curved surface profiling to be pasted on material；And stamping device, the stamping device include pressure head,
The pressure head is deformable and is used for described in punching press to pad pasting piece.
According to the pad-pasting fixture of the disclosure, structure is simple, at low cost.
The additional aspect and advantage of the disclosure will be set forth in part in the description, and will partially become from the following description
It obtains obviously, or recognized by the practice of the disclosure.
Detailed description of the invention
Fig. 1 is the schematic diagram to pad pasting piece according to an embodiment of the present disclosure；
Fig. 2 is the state diagram heated to pad pasting piece by heating device shown in Fig. 1；
Fig. 3 is the schematic diagram according to the material to be pasted of an embodiment of the present disclosure；
Fig. 4 is state diagram before pressing during the pad pasting according to an embodiment of the present disclosure；
Fig. 5 is the state of pressure keeping figure during the pad pasting according to an embodiment of the present disclosure；
Fig. 6 is the schematic diagram according to the pad-pasting fixture of an embodiment of the present disclosure.
Appended drawing reference:
To pad pasting piece 1；Corresponding portion 11；Location hole 12；
Material 2 to be pasted；Curved surface 21 to be pasted；
Pad-pasting fixture 3；
Heating device 31；Heating member 311；4th driving mechanism 312；
Profiling jig 32；Jig body 321；Contoured fields 3210；Negative pressure mechanism 322；5th driving mechanism 323；
Stamping device 33；Pressure head 331；Third driving mechanism 332；
First device 34；First driving mechanism 341；First location structure 342；
Fixed frame 3421；Spring 3422；Claw 3423；
Second device 35；Second driving mechanism 351；Second location structure 352.
Specific embodiment
Embodiment of the disclosure is described below in detail, examples of the embodiments are shown in the accompanying drawings, wherein from beginning to end
Same or similar label indicates same or similar element or element with the same or similar functions.Below with reference to attached
The embodiment of figure description is exemplary, it is intended to for explaining the disclosure, and should not be understood as the limitation to the disclosure.
Following disclosure provides many different embodiments or example is used to realize the different structure of the disclosure.For letter
The disclosure for changing the disclosure, is hereinafter described the component of specific examples and setting.Certainly, they are merely examples, and
Purpose does not lie in the limitation disclosure.In addition, the disclosure can in different examples repeat reference numerals and/or letter.It is this heavy
It is for purposes of simplicity and clarity, itself not indicate the relationship between discussed various embodiments and/or setting again.This
Outside, present disclose provides various specific techniques and material example, but those of ordinary skill in the art may be aware that
The applicable property of other techniques and/or the use of other materials.
In the related technology, it when carrying out pad pasting to the curved surface on product, needs first to carry out preforming processing to diaphragm, makes diaphragm
Shape and product on curved surface match, carry out pad pasting operation again later, however, the mode of such pad pasting is complicated, Er Qieshi
Structure is complicated, at high cost for the equipment of this existing pad pasting mode, is unfavorable for promoting and applying on a large scale.In view of the above technical problems, originally
It is open to propose a kind of method for adhering film and pad-pasting fixture 3, according to the method for adhering film of the embodiment of the present disclosure, without treating pad pasting piece 1
Carry out preforming processing, so that it may it simply and efficiently completes to be bonded to pad pasting piece 1 with the intact of material 2 to be pasted, moreover, according to
The pad-pasting fixture 3 of the embodiment of the present disclosure, structure is simple, at low cost, is conducive to promote and apply on a large scale.
In the following, describing the method for adhering film according to disclosure first aspect embodiment in conjunction with Fig. 1-Fig. 5.
According to the method for adhering film of disclosure first aspect embodiment, may include steps of:
Step S1, the heating of pad pasting piece 1 is treated, such as can be using the heating member 311 in heating device 31 described hereinafter
It treats pad pasting piece 1 and is heated (as depicted in figs. 1 and 2).
Step S2, material 2 to be pasted is arranged on profiling jig 32, and is directed at the curved surface to be pasted 21 on material 2 to be pasted
Contoured fields 3210 (as Figure 3-Figure 4) on profiling jig 32, that is to say, that there is molded non-planar on material 2 to be pasted
Curved surface to be pasted 21, there is on profiling jig 32 contoured fields 3210, the shape of the shape of contoured fields 3210 and curved surface 21 to be pasted
Shape matches, coincide, and when that will be arranged on profiling jig 32 wait paste material 2, curved surface 21 to be pasted can paste almost seamlessly
It closes in contoured fields 3210 (as shown in Figure 5).
Step S3, after making heating to pad pasting piece 1 with the curved surface to be pasted 21 that is located on contoured fields 3210 with respect to (such as Fig. 3-
Shown in Fig. 4), such as can make to realize to the movement of at least one of pad pasting piece 1 and profiling jig 32.It should be noted that
The sequence of step S1 and step S2 do not limit, i.e. step S1 and step S2 can be carried out simultaneously, can also first carry out step S1, also
Step S2 can first be carried out.But step S3 needs carry out after step S2 and step S1, step S4 described hereinafter needs
It carries out after step s 3.In addition, the type to pad pasting piece 1 according to the embodiment of the present disclosure is unlimited, for example, can for PET film,
Colour film etc., the type according to the material to be pasted 2 of the embodiment of the present disclosure is also unlimited, such as can be ear casing, mobile phone shell etc..
Step S4, in conjunction with Fig. 4-Fig. 5, pad pasting piece 1 is waited for using the direction punching press of pressure head 331 towards contoured fields 3210, is pressed
First 331 are deformed by the squeezing action of the contoured fields 3210 on profiling jig 32, so that the corresponding portion 11 to pad pasting piece 1 is (i.e.
To the part squeezed by pressure head 331 on pad pasting piece 1 or say to be clipped in pressure head 331 and contoured fields 3210 on pad pasting piece 1
Between part) be deformed into and match with the shape of curved surface 21 to be pasted, coincide so as to described corresponding on pad pasting piece 1
Part 11 is bonded with curved surface 21 to be pasted, to realize curved surface pad pasting.
As a result, according to the method for adhering film of the embodiment of the present disclosure, there is the spy of high temperature resistant, extrusion using pressure head 331
Property, it, will be after the heating of pad pasting piece 1, using pressure head 331 towards wait paste using having malleable characteristic after pad pasting piece 1 is heated
The direction of material 2 is pressed to pad pasting piece 1, can simply and efficiently complete the film coating process of curved surface 21 to be pasted.
Moreover, because the preforming step for treating pad pasting piece 1 can be saved, that is, being not necessarily in advance will be to the corresponding of pad pasting piece 1
Part 11 is pre-formed as the shape that matches with curved surface 21 to be pasted, so as to be effectively reduced processing cost.Moreover, when song to be pasted
When the shape in face 21 is complex, area is smaller, the fine preforming step to pad pasting piece 1 may be omitted with, so as to have
Effect ground reduces difficulty of processing, reduces processing cost.Moreover, by replacing profiling jig 32 of different shapes and matching dimension
Pressure head 331 after, different materials 2 to be pasted can be carried out with pad pastings, it is flexible and convenient to use.
Further, since being that the matching occurred during fitting with curved surface 21 to be pasted deforms to pad pasting piece 1, to eliminate
To the precise positioning step of pad pasting piece 1 and curved surface 21 to be pasted, only need to guarantee that curved surface 21 to be pasted can be covered to pad pasting piece 1, i.e.,
It can guarantee to be bonded to the corresponding portion 11 on pad pasting piece 1 with the intact of curved surface 21 to be pasted, simply and effectively ensure that pad pasting essence
Degree.And in the related art, when using preforming diaphragm and product application of a surface, needs to carry out precise positioning, just can guarantee
Intact fitting, processing cost are higher.
In addition, pressure head 331 squeeze deformed to pad pasting piece 1 during, while can also play the role of pushing away catching up with bubble, from
And can effectively improve and lead to the problem of pad pasting bubble, there is no need to vacuumize environment, without use vacuum film sticking equipment,
The pad pasting effect of bubble-free can be reached, to create a further reduction pad pasting cost.
Wherein, pressure head 331 can be silica gel pressure head, i.e. pressure head 331 can be process using silica gel material, so as to
Guarantee that pressure head 331 has preferable high temperature resistant, extrusion, the enough characteristics of pressure, so that pressure head 331 can be squeezed preferably
It presses and is deformed into the shape coincideing with curved surface 21 to be pasted to pad pasting piece 1.In addition, cost is relatively low for silica gel, it is easy to promote and utilize.When
So, the present disclosure is not limited thereto, pressure head 331 can also be processed using other materials, such as can be using air bag as pressure head 331.
According to some method for adhering film of the disclosure, as shown in fig. 4-5, during punching press waits for pad pasting piece 1, to pad pasting
Piece 1 and curved surface 21 to be pasted are horizontally disposed and opposite along the vertical direction, at this point, being arranged material 2 to be pasted on profiling jig 32
Before, first profiling jig 32 can be horizontally disposed with and makes contoured fields 3210 upward.That is, can will material 2 be pasted
It is carried on the top (i.e. step S5) of profiling jig 32, so that the setting of convenient material 2 to be pasted, reduces answering for pad-pasting fixture 3
Miscellaneous degree and cost.
In addition, being horizontally disposed with and to pad pasting piece 1 and curved surface 21 to be pasted along perpendicular during punching press waits for pad pasting piece 1
Histogram to it is opposite when, first can will can be vertically arranged (i.e. step to pad pasting piece 1 before the step of punching press waits for pad pasting piece 1
S6, as shown in Figure 1), then horizontally disposed (i.e. step S7, as shown in Figure 2) will be gone to pad pasting piece 1.Thus, it is possible to avoid dust
Equal sundries are fallen in be attached to reduce dust to the possibility on pad pasting piece 1 on pad pasting piece 1, improve to pad pasting piece 1 with
The fitting effect of curved surface 21 to be pasted.
Certainly, the present disclosure is not limited thereto, in some other embodiment of the disclosure, waits for the process of pad pasting piece 1 in punching press
In, it is also possible that being vertically arranged to pad pasting piece 1 and curved surface 21 to be pasted and (Fig. 4 being rotated by 90 ° it relatively in the horizontal direction
State afterwards).Thus, it is possible to dust and other impurities is preferably avoided to fall in on pad pasting piece 1, thus reduce dust be attached to
Possibility between pad pasting piece 1 and curved surface to be pasted 21, and then improve and be bonded effect to pad pasting piece 1 and curved surface 21 to be pasted.
It can also include treating the edge positioning of pad pasting piece 1 and being tensioned to pad pasting according to some method for adhering film of the disclosure
The step of piece 1 (i.e. step S8), when step S8 above-mentioned steps S1 execution before, execute among execute always when, can be improved
To the being heated evenly property of pad pasting piece 1, enables and preferably extend to pad pasting piece 1.Moreover, because treating the edge of pad pasting piece 1
It is positioned, so as to avoid influence of the positioning operation to fitting process from therefore executing it in above-mentioned steps S3 and step S4
In can execute step S8 always, so as to avoid the problem that fold occurs during fitting to pad pasting piece 1, thus into one
Step improves fitting effect.
Specifically, in above-mentioned steps S1, pad pasting piece 1 is treated using heating device 31 and is heated, make heating device 31 (in
Heating member 311) with to pad pasting piece 1 keep 10cm ± 1cm (such as 9cm, 10cm, 11cm etc.) at a distance from, heating device 31 (in
Heating member 311) temperature be 300 DEG C ± 5 DEG C (such as 295 DEG C, 300 DEG C, 305 DEG C etc.) and treat pad pasting piece 1 heat 40s ±
5s (such as 35s, 40s, 45s etc.), so as to be warming up to 115 DEG C ± 5 DEG C (such as 110 DEG C, 115 DEG C, 120 DEG C etc.) to pad pasting piece 1.
Thus, it is possible to guarantee that preferable extending effect is presented to pad pasting piece 1, and can be more energy saving.
In addition, when pressure head 331 is silica gel pressure head, the temperature of silica gel pressure head can be 55 DEG C -60 in above-mentioned steps S4
DEG C (such as 55 DEG C, 58 DEG C, 60 DEG C etc.), the stamping press of silica gel pressure head are 6.5kg ± 0.5kg (such as 6.0kg, 6.5kg, 7.0kg
Deng), when punching press pressure maintaining of silica gel pressure head a length of 20s ± 5s (such as 15s, 20s, 25s etc.).Thus, it is possible to guarantee to pad pasting piece 1
It more preferably and is reliably deformed into and matches with the shape of curved surface 21 to be pasted, to reach preferably fitting effect.
In the following, describing the pad-pasting fixture 3 according to disclosure second aspect embodiment referring to Fig. 6.
Specifically, can be used to implement according to the pad-pasting fixture 3 of disclosure second aspect embodiment according to above-mentioned first
The method for adhering film of aspect embodiment, however, it is desirable to explanation, according to the method for adhering film of the above-mentioned first aspect embodiment of the disclosure
It is not limited to realize using according to the pad-pasting fixture 3 of disclosure second aspect embodiment.
As shown in fig. 6, pad-pasting fixture 3 may include heating device 31, profiling jig 32 and stamping device 33, heating device
31 include for treating the heating member 311 of the heating of pad pasting piece 1, to realize that above-mentioned steps S1, profiling jig 32 are used to carry wait paste
Material 2, and have with the contoured fields 3210 in 21 direction of curved surface to be pasted on material 2 to be pasted, in realization on profiling jig 32
Step S2 is stated, stamping device 33 includes pressure head 331, and pressure head 331 is deformable and waits for pad pasting piece 1 to realize above-mentioned steps for punching press
S4.Here, it should be noted that the specific composition of heating member 311 is unlimited, such as can be heating plate, heating tube etc..
As a result, according to above description it is found that by pressure head 331 and can be imitated according to the pad-pasting fixture 3 of the embodiment of the present disclosure
The cooperation of shape jig 32 presses to pad pasting piece 1, by 331 extrusion of pressure head, make to be deformed into pad pasting piece 1 with wait paste
The shape that the shape of curved surface 21 matches, so as to will simply and efficiently be fitted on curved surface 21 to be pasted to pad pasting piece 1.This
Outside, composition according to the pad-pasting fixture of the embodiment of the present disclosure 3 is simple, it is at low cost, do not limited by external environmental condition, be suitable for big rule
Mould promotes and applies.In addition, according to other advantages of the pad-pasting fixture 3 of the embodiment of the present disclosure can from the description above in know, example
Can such as save diaphragm is preforming, vacuumize pad pasting operation, which is not described herein again.
In some embodiments of the present disclosure, as shown in fig. 6, pad-pasting fixture 3 can also include first device 34, the first dress
Setting 34 may include the first driving mechanism 341 and the first location structure 342, and the first driving mechanism 341 is for driving the first positioning
Structure 342 is mobile, and the first location structure 342 is suitable for treating the positioning of pad pasting piece 1.Thus, it is possible to be held using 34 machinery of first device
Row above-mentioned steps S3, step S6, step S7, step S8 etc., so as to save manual hand manipulation, it is strong to reduce hand labor
Degree and cost of labor, improve the safety of operation.Here, it should be noted that the concrete type of the first driving mechanism 341 is not
Limit, such as can be mechanical arm, sliding rail, cylinder etc., it is not construed as limiting here.
In addition, it is necessary to explanation, the specific structure of the first location structure 342 is also unlimited, for example, when to pad pasting piece 1 be square
When shape, several location holes 12 (in conjunction with Fig. 1) can be set in each corner position to pad pasting piece 1, the first location structure 342 can
To include 3421, four springs 3422 of fixed frame and four claws 3423, four claws 3423 and four springs 3422 are distinguished
It is distributed in 1 four corner positions of pad pasting piece, 12 clamping matching of location hole of each claw 3423 and corresponding vertex, and passes through
Corresponding spring 3422 is connected with fixed frame 3421, so as to be evened up under the effect of the elastic force of four springs 3422 automatically,
Tensioning is to pad pasting piece 1, and structure is simple, adaptivity is good.
In some embodiments of the present disclosure, pad-pasting fixture 3 can also include second device 35, and second device 35 includes the
Two driving mechanisms 351 and the second location structure 352, the second driving mechanism 351 is mobile for the second location structure 352 of driving, the
Two location structures 352 are suitable for treating patch material 2 and position.Thus, it is possible to execute above-mentioned steps S2, step using second device 35 is mechanical
Rapid S5 etc., so as to save manual hand manipulation, reduces labor intensity and cost of labor, improves the safety of operation
Property.Here, it should be noted that the concrete type of the second driving mechanism 351 is unlimited, such as can be mechanical arm, sliding rail, cylinder
Deng being not construed as limiting here.In addition, it is necessary to explanation, the specific structure of the second location structure 352 is also unlimited, such as can be
Buckle structure, fixture structure, threaded connector, vacuum pump etc..
In some embodiments of the present disclosure, stamping device 33 may include third driving mechanism 332, third driving mechanism
332 is mobile for drive ram 331.Thus, it is possible to above-mentioned steps S4 etc. is executed using third driving mechanism 332, so as to
Manual hand manipulation is saved, labor intensity and cost of labor are reduced, improves the safety of operation.Here, it needs
Bright, the concrete type of third driving mechanism 332 is unlimited, such as can be mechanical arm, sliding rail, cylinder etc., it does not limit here
It is fixed.
In some embodiments of the present disclosure, heating device 31 may include the 4th driving mechanism 312, the 4th driving mechanism
312 for driving heating member 311 mobile.Thus, it is possible to above-mentioned steps S1 etc. is executed using the 4th driving mechanism 312, so as to
To save manual hand manipulation, labor intensity and cost of labor are reduced, improves the safety of operation.Here, it needs
Illustrating, the concrete type of the 4th driving mechanism 312 is unlimited, such as can be mechanical arm, sliding rail, cylinder etc., do not make here
It limits.
In some embodiments of the present disclosure, profiling jig 32 may include jig body 321 and negative pressure mechanism 322, control
For carrying material 2 to be pasted, contoured fields 3210 are formed in jig body 321 tool ontology 321, negative pressure mechanism 322 (such as wind
Machine, vacuum pump etc.) for making material 2 to be pasted be adsorbed onto jig body 321.Thus, it is possible to simply and efficiently guarantee wait paste
The accurate reliability of curved surface 21 and contoured fields 3210 prevents material 2 to be pasted from opposite play occurs with profiling jig 32, improves patch
Film effect.In addition, being adsorbed on material 2 to be pasted in jig body 321 by negative pressure mechanism 322, so as to avoid using it
His location structure treats adverse effect caused by patch material 2.
In addition, profiling jig 32 can also include: the 5th driving mechanism 323, the 5th driving mechanism 323 is for driving jig
Ontology 321 is mobile.Thus, it is possible to above-mentioned steps S3 etc. be executed using the 5th driving mechanism 323, so as to save manually
Operation, reduces labor intensity and cost of labor, improves the safety of operation.Here, it should be noted that the 5th drives
The concrete type of motivation structure 323 is unlimited, such as can be mechanical arm, sliding rail, cylinder etc., it is not construed as limiting here.
In the following, briefly describing the step of membrane sticking of the pad-pasting fixture 3 according to one specific embodiment of the disclosure.
Make to be vertically arranged to pad pasting piece 1 (in conjunction with Fig. 1) by first device 34；Made by first device 34 to pad pasting piece 1
Rotate to horizontal direction (in conjunction with Fig. 2)；Heating member 311 (such as heating plate) is slid by the 4th driving mechanism 312 (such as slide unit)
To the lower section to pad pasting piece 1, so that 311 distance of heating member is treated pad pasting piece 1 to 1 certain distance of pad pasting piece and heats (in conjunction with Fig. 2),
115 DEG C ± 5 DEG C will be heated to pad pasting piece 1；Material 2 (such as ear casing) to be pasted is put on profiling jig 32 (in conjunction with Fig. 4), is imitated
Material 2 to be pasted is located on profiling jig 32 by shape jig 32 using negative pressure mechanism 322 (i.e. by the way of air-breathing)；It is driven using the 5th
The profiling jig 32 for carrying material 2 to be pasted is slid onto the lower section (in conjunction with Fig. 4) to pad pasting piece 1 by motivation structure 323 (such as slide unit)；
Top (in conjunction with Fig. 4) to pad pasting piece 1 is moved to using 332 drive ram 331 of third driving mechanism, and pushes pressure head 331
It is moved down to pad pasting piece 1, pressure head 331 makes to fit on curved surface 21 to be pasted to pad pasting piece 1 (in conjunction with Fig. 5) by being squeezed and deformed；
Pressure maintaining for a period of time, can fit on material 2 to be pasted to pad pasting piece 1, hereafter, using pressure head 331 when third driving mechanism 332
Rise and resets；Pickup simultaneously cuts the edge extra to pad pasting piece 1.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is contained at least one embodiment or example of the disclosure.In the present specification, schematic expression of the above terms are not
It must be directed to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be in office
It can be combined in any suitable manner in one or more embodiment or examples.In addition, without conflicting with each other, the skill of this field
Art personnel can tie the feature of different embodiments or examples described in this specification and different embodiments or examples
It closes and combines.
While there has been shown and described that embodiment of the disclosure, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle and objective of the disclosure, this
Scope of disclosure is defined by the claims and their equivalents.
Claims (16)
1. a kind of method for adhering film, which comprises the steps of:
Treat the heating of pad pasting piece；
Material to be pasted is arranged on profiling jig, and is made described wait paste on the alignment of the curved surface to be pasted on the material profiling jig
Contoured fields；
Make heating after to pad pasting piece be located on the contoured fields described in curved surface to be pasted it is opposite；
Using, to pad pasting piece, the pressure head is squeezed by the contoured fields described in direction punching press of the pressure head towards the contoured fields
Compressive strain matches and with described with the shape of the curved surface to be pasted wait paste so that the corresponding portion to pad pasting piece is deformed into
Application of a surface.
2. method for adhering film according to claim 1, which is characterized in that described in punching press to pad pasting piece during, it is described to
Pad pasting piece and the curved surface to be pasted are horizontally disposed and opposite along the vertical direction, wherein material to be pasted is arranged in profiling jig
Before upper, the profiling jig is horizontally disposed with and makes the contoured fields upward.
3. method for adhering film according to claim 2, which is characterized in that described in punching press to pad pasting piece before, first will be to pad pasting
Piece is vertically arranged, then by it is described go to pad pasting piece it is horizontally disposed.
4. method for adhering film according to claim 1, which is characterized in that described in punching press to pad pasting piece during, it is described to
Pad pasting piece and the curved surface to be pasted are vertically arranged and opposite in the horizontal direction.
5. method for adhering film according to claim 1, which is characterized in that positioned to the edge to pad pasting piece and be tensioned institute
It states to pad pasting piece.
6. method for adhering film according to claim 1, which is characterized in that described to be filled using heating in the heating of pad pasting piece
It sets and is heated to described to pad pasting piece, keep the heating device at a distance from 10cm ± 1cm to pad pasting piece with described, the heating
The temperature of device is 300 DEG C ± 5 DEG C and heats 40s ± 5s to pad pasting piece to described, so that described be warming up to 115 DEG C to pad pasting piece
±5℃。
7. method for adhering film according to claim 1 to 6, which is characterized in that the pressure head is silica gel pressure head.
8. method for adhering film according to claim 7, which is characterized in that the temperature of the silica gel pressure head is 55 DEG C -60 DEG C, institute
The stamping press for stating silica gel pressure head is 6.5kg ± 0.5kg, when punching press pressure maintaining of the silica gel pressure head a length of 20s ± 5s.
9. a kind of pad-pasting fixture characterized by comprising
Heating device, the heating device include the heating member for treating the heating of pad pasting piece；
Profiling jig, the profiling jig have and the material to be pasted for carrying material to be pasted, and on the profiling jig
On curved surface profiling to be pasted contoured fields；With
Stamping device, the stamping device include pressure head, and the pressure head is deformable and is used for described in punching press to pad pasting piece.
10. pad-pasting fixture according to claim 9, which is characterized in that further include:
First device, the first device include the first driving mechanism and the first location structure, and first driving mechanism is used for
Drive first location structure mobile, first location structure is suitable for treating the positioning of pad pasting piece.
11. pad-pasting fixture according to claim 9, which is characterized in that further include:
Second device, the second device include the second driving mechanism and the second location structure, and second driving mechanism is used for
Drive second location structure mobile, second location structure is suitable for treating patch material positioning.
12. pad-pasting fixture according to claim 9, which is characterized in that the stamping device further include:
Third driving mechanism, the third driving mechanism is for driving the movable press head.
13. pad-pasting fixture according to claim 9, which is characterized in that the heating device further include:
4th driving mechanism, the 4th driving mechanism is for driving the heating member mobile.
14. pad-pasting fixture according to claim 9, which is characterized in that the profiling jig includes:
Jig body and negative pressure mechanism, the contoured fields are formed in the jig body, and the negative pressure mechanism is for making institute
Material to be pasted is stated to be adsorbed onto the jig body.
15. pad-pasting fixture according to claim 14, which is characterized in that the profiling jig further include:
5th driving mechanism, the 5th driving mechanism is for driving the jig body mobile.
16. the pad-pasting fixture according to any one of claim 9-15, which is characterized in that the pressure head is silica gel pressure head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811453701.5A CN109571927A (en) | 2018-11-30 | 2018-11-30 | Method for adhering film and pad-pasting fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811453701.5A CN109571927A (en) | 2018-11-30 | 2018-11-30 | Method for adhering film and pad-pasting fixture |
Publications (1)
| Publication Number | Publication Date |
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| CN109571927A true CN109571927A (en) | 2019-04-05 |
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| CN201811453701.5A Pending CN109571927A (en) | 2018-11-30 | 2018-11-30 | Method for adhering film and pad-pasting fixture |
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| CN (1) | CN109571927A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110775340A (en) * | 2019-11-29 | 2020-02-11 | 深圳市承熹机电设备有限公司 | Inner curved surface film pasting device |
| CN110996246A (en) * | 2019-12-20 | 2020-04-10 | 东莞市达瑞电子股份有限公司 | Double-layer cloth wrapping process suitable for headset |
| CN111451954A (en) * | 2020-04-03 | 2020-07-28 | 京东方科技集团股份有限公司 | Curved surface laminating tool |
| CN113002109A (en) * | 2021-03-10 | 2021-06-22 | 业成科技（成都）有限公司 | Thermoplastic laminating method and preforming method thereof, light-transmitting structural member and electronic equipment |
| CN113106403A (en) * | 2020-01-09 | 2021-07-13 | 昆山微电子技术研究院 | Coating method for inner curved surface of optical device |
| CN113733710A (en) * | 2020-05-28 | 2021-12-03 | 惠州比亚迪电子有限公司 | Molded diaphragm, curved glass diaphragm complex, preparation method of curved glass diaphragm complex and electronic equipment |
| CN114407489A (en) * | 2022-02-07 | 2022-04-29 | 京东方科技集团股份有限公司 | Laminating equipment and film laminating method |
| CN114589915A (en) * | 2022-03-10 | 2022-06-07 | 业成科技（成都）有限公司 | Laminating equipment |
| CN114734620A (en) * | 2022-05-10 | 2022-07-12 | 业成科技（成都）有限公司 | Concave surface laminating method |
| CN116394508A (en) * | 2023-05-12 | 2023-07-07 | 深圳市利和腾鑫科技有限公司 | Film pasting device and method for free-form surface reflector in head-up display |
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| CN110775340A (en) * | 2019-11-29 | 2020-02-11 | 深圳市承熹机电设备有限公司 | Inner curved surface film pasting device |
| CN110996246A (en) * | 2019-12-20 | 2020-04-10 | 东莞市达瑞电子股份有限公司 | Double-layer cloth wrapping process suitable for headset |
| CN113106403B (en) * | 2020-01-09 | 2023-02-28 | 昆山微电子技术研究院 | Coating method for inner curved surface of optical device |
| CN113106403A (en) * | 2020-01-09 | 2021-07-13 | 昆山微电子技术研究院 | Coating method for inner curved surface of optical device |
| CN111451954A (en) * | 2020-04-03 | 2020-07-28 | 京东方科技集团股份有限公司 | Curved surface laminating tool |
| CN113733710A (en) * | 2020-05-28 | 2021-12-03 | 惠州比亚迪电子有限公司 | Molded diaphragm, curved glass diaphragm complex, preparation method of curved glass diaphragm complex and electronic equipment |
| CN113002109A (en) * | 2021-03-10 | 2021-06-22 | 业成科技（成都）有限公司 | Thermoplastic laminating method and preforming method thereof, light-transmitting structural member and electronic equipment |
| CN114407489A (en) * | 2022-02-07 | 2022-04-29 | 京东方科技集团股份有限公司 | Laminating equipment and film laminating method |
| CN114589915A (en) * | 2022-03-10 | 2022-06-07 | 业成科技（成都）有限公司 | Laminating equipment |
| CN114589915B (en) * | 2022-03-10 | 2023-07-25 | 业成科技（成都）有限公司 | Laminating equipment |
| CN114734620A (en) * | 2022-05-10 | 2022-07-12 | 业成科技（成都）有限公司 | Concave surface laminating method |
| CN114734620B (en) * | 2022-05-10 | 2023-03-24 | 业成科技（成都）有限公司 | Concave surface attaching method |
| CN116394508A (en) * | 2023-05-12 | 2023-07-07 | 深圳市利和腾鑫科技有限公司 | Film pasting device and method for free-form surface reflector in head-up display |
| CN116394508B (en) * | 2023-05-12 | 2024-06-28 | 深圳市利和腾鑫科技有限公司 | Film pasting device and method for free-form surface reflector in head-up display |
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Application publication date: 20190405 |
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