CN109563844B

CN109563844B - Fan rotating speed adjusting method, device, equipment, storage medium and program product

Info

Publication number: CN109563844B
Application number: CN201880001928.8A
Authority: CN
Inventors: 张磊; 王国辉
Original assignee: Bitmain Technologies Inc
Current assignee: Bitmain Technologies Inc
Priority date: 2018-09-30
Filing date: 2018-09-30
Publication date: 2020-08-11
Anticipated expiration: 2038-09-30
Also published as: WO2020062238A1; CN109563844A

Abstract

The application provides a fan rotating speed adjusting method, a fan rotating speed adjusting device, fan rotating speed adjusting equipment, a storage medium and a program product. The method comprises the steps of obtaining the ambient temperature and the chip temperature of the electronic equipment; determining whether a forced heat dissipation condition is met or not according to the temperature of the chip, and if not, adjusting the rotating speed of a heat dissipation fan of the electronic equipment according to the ambient temperature and preset energy efficiency ratio information; the preset energy efficiency ratio information comprises a first corresponding relation between the environment temperature and the rotating speed of the cooling fan under the condition that the energy efficiency ratio is optimal, and the energy efficiency ratio is a ratio between energy consumption information and computing power of the electronic equipment. The method, the apparatus, the device, the storage medium, and the program product provided in this embodiment consider both the temperature of the electronic device chip and the influence of the ambient temperature of the electronic device on the heat dissipation of the device, and adjust the rotation speed of the fan according to the two temperatures, thereby improving the energy efficiency ratio of the electronic device.

Description

Fan rotating speed adjusting method, device, equipment, storage medium and program product

Technical Field

The present application relates to the field of heat dissipation of electronic devices, and for example, to a method and an apparatus for adjusting a rotational speed of a fan, an electronic device, a computer storage medium, and a computer program product.

Background

At present, many electronic equipment all are provided with radiator fan, and through radiator fan's rotation, for electronic equipment cooling, avoid electronic equipment when the operation, because equipment high temperature causes equipment to damage.

In the prior art, a speed regulation scheme of a cooling fan is provided. The method comprises the steps of presetting the appropriate operation temperature of a target chip, comparing the current temperature of the chip with the appropriate operation temperature by software, increasing the rotating speed of the cooling fan if the current temperature of the chip is higher than the appropriate operation temperature, and reducing the rotating speed of the cooling fan if the current temperature of the chip is lower than the appropriate operation temperature.

However, in the prior art, the rotation speed of the cooling fan is regulated according to the temperature of the chip. The method only considers whether the temperature of the chip is proper or not, and does not consider the relation between the rotating speed of the fan and the energy consumption, so that the problem that the energy utilization rate of the speed regulation scheme of the cooling fan in the prior art is low and the energy is wasted is caused.

The above background is only for the purpose of aiding understanding of the present application and does not constitute an admission or admission that any of the matter referred to is part of the common general knowledge relative to the present application.

Disclosure of Invention

The embodiment of the disclosure provides a method for adjusting the rotating speed of a fan, which comprises the following steps:

acquiring the ambient temperature and the chip temperature of the electronic equipment;

determining whether a forced heat dissipation condition is met or not according to the temperature of the chip, and if not, adjusting the rotating speed of a heat dissipation fan of the electronic equipment according to the environment temperature and preset energy efficiency ratio information;

the preset energy efficiency ratio information comprises a first corresponding relation between the environment temperature and the rotating speed of the cooling fan under the condition that the energy efficiency ratio is optimal, and the energy efficiency ratio is a ratio between energy consumption information and computing power of the electronic equipment.

The embodiment of the present disclosure further provides a device for adjusting a rotating speed of a fan, including an obtaining module and a determining module:

the acquisition module is used for acquiring the ambient temperature and the chip temperature of the electronic equipment;

the determining module is used for determining whether a forced heat dissipation condition is met or not according to the temperature of the chip, and if not, the adjusting module adjusts the rotating speed of a heat dissipation fan of the electronic equipment according to the environment temperature and preset energy efficiency ratio information;

The embodiment of the disclosure also provides an electronic device, which includes the fan rotating speed adjusting device.

An embodiment of the present disclosure further provides an electronic device, including:

a fan;

at least one processor; and

a memory communicatively coupled to the at least one processor; wherein the content of the first and second substances,

the memory stores instructions executable by the at least one processor, which when executed by the at least one processor, cause the at least one processor to perform the above-described method of adjusting the fan speed.

The embodiment of the disclosure also provides a computer-readable storage medium, which stores computer-executable instructions configured to execute the method for adjusting the rotating speed of the fan.

The disclosed embodiments also provide a computer program product comprising a computer program stored on a computer-readable storage medium, the computer program comprising program instructions that, when executed by a computer, cause the computer to perform the above-mentioned fan speed adjustment method.

The method, the device, the equipment, the storage medium and the program product for adjusting the rotating speed of the fan comprise the steps of obtaining the ambient temperature and the chip temperature of electronic equipment; determining whether a forced heat dissipation condition is met or not according to the temperature of the chip, and if not, adjusting the rotating speed of a heat dissipation fan of the electronic equipment according to the ambient temperature and preset energy efficiency ratio information; the preset energy efficiency ratio information comprises a first corresponding relation between the environment temperature and the rotating speed of the cooling fan under the condition that the energy efficiency ratio is optimal, and the energy efficiency ratio is a ratio between energy consumption information and computing power of the electronic equipment. According to the method, the device, the equipment, the storage medium and the program product for adjusting the rotating speed of the fan, when the temperature of the chip of the electronic equipment is not too high, the rotating speed of the cooling fan is adjusted based on the environmental temperature of the electronic equipment and the preset energy efficiency ratio information, so that the rotating speed of the cooling fan is adjusted by considering the external environmental temperature, and the energy efficiency of the electronic equipment is maximized.

Drawings

One or more embodiments are illustrated in the accompanying drawings, which correspond to the accompanying drawings, and which do not constitute a limitation on the embodiments, in which elements having the same reference numeral designations represent like elements, and in which:

FIG. 1 is a flow chart illustrating a method for adjusting fan speed according to an exemplary embodiment of the present invention;

FIG. 2 is a flow chart illustrating a method for adjusting fan speed according to another exemplary embodiment of the present invention;

fig. 2A is a schematic diagram illustrating preset energy efficiency ratio information according to an exemplary embodiment of the present invention;

FIG. 3 is a flow chart illustrating a method for adjusting fan speed according to another exemplary embodiment of the present invention;

fig. 3A is a schematic diagram illustrating preset energy efficiency ratio information according to another exemplary embodiment of the present invention;

FIG. 4 is a block diagram illustrating a fan speed adjustment apparatus according to an exemplary embodiment of the present invention;

FIG. 5 is a block diagram illustrating a fan speed adjustment apparatus according to another exemplary embodiment of the present invention;

fig. 6 is a block diagram illustrating an electronic device according to an exemplary embodiment of the present invention.

Detailed Description

So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

In the prior art, the temperature specification of a target chip can be preset, and the rotating speed of a fan is adjusted by adopting a tangent speed regulation mode. Specifically, whether the temperature of the chip exceeds the specification temperature or not can be judged by software, if so, the rotating speed is increased, and if not, the rotating speed is reduced. Such a throttling strategy only considers the chip temperature, with the goal of throttling being to cause the chip temperature to fluctuate around the temperature specification. However, in an application scenario in which the energy consumption and the efficiency of the device are simultaneously regarded as important, the speed regulation mode in the prior art has obvious weakness, and does not consider the relationship between the energy consumption and the efficiency of the device, so that the energy efficiency cannot be optimized in the fan speed regulation scheme in the prior art.

According to the fan rotating speed adjusting scheme provided by the embodiment, the temperature of the chip and the temperature of the external environment can be considered at the same time, and the rotating speed of the fan is adjusted based on the preset energy efficiency ratio information, so that the performance of equipment is better.

Fig. 1 is a flowchart illustrating a method for adjusting a rotational speed of a fan according to an exemplary embodiment of the invention.

As shown in fig. 1, the method for adjusting the rotation speed of a fan according to this embodiment includes:

step 101, obtaining an ambient temperature and a chip temperature of an electronic device.

The method provided by the embodiment can be packaged in software, and the software is installed in the electronic device, so that the method provided by the embodiment can be executed by the electronic device. According to the method provided by the embodiment, the rotating speed of the cooling fan can be adjusted according to the preset energy efficiency ratio information, so that the utilization rate of the electronic equipment to the energy source is improved to the maximum.

Specifically, a temperature acquisition sensor may be further disposed at an air inlet of the electronic device, and the ambient temperature of the electronic device may be acquired based on the temperature acquisition sensor, for example, the temperature information may be acquired by the temperature acquisition sensor, and the acquired temperature information may be sent to a processor of the electronic device. Generally, the temperature of air entering the electronic device is the same as the ambient temperature, and therefore, the temperature of the air inlet of the electronic sensor can be collected as the ambient temperature.

Furthermore, in the electronic device, the temperature of the chip may affect the operating speed of the electronic device, and if the temperature of the chip is too high, the chip may be damaged, so that the temperature of the chip may be an important factor for adjusting the speed of the fan. The chip temperature at the air outlet of the electronic device can be collected, specifically, the chip junction temperature can be collected and determined as the chip temperature.

In practical application, whether the temperature of the electronic equipment is proper or not can be determined according to the temperature of the chip. If the temperature of the chip is too high, the electronic equipment is considered to need to be cooled. In addition, the external environment temperature also affects the heat dissipation of the electronic device. When the electronic equipment generates heat, the higher the external environment temperature is, the worse the heat dissipation effect is, the lower the external environment is, and the better the heat dissipation effect is. And the outside air enters the electronic equipment air inlet, so that the temperature of the electronic equipment air inlet can be acquired, and the outside environment temperature can be obtained.

According to the method provided by the embodiment, the temperature information of the electronic equipment can be determined according to the temperature of the chip of the electronic equipment, the external environment temperature of the electronic equipment can be acquired, the rotating speed of the cooling fan can be adjusted by combining the internal temperature and the external environment temperature of the electronic equipment, the most reasonable rotating speed of the fan can be determined, and the overall energy utilization rate of the electronic equipment is maximized.

And 102, judging whether the forced heat dissipation condition is met or not according to the temperature of the chip.

The upper limit value of the device temperature may be preset, and if the chip temperature is less than the upper limit value, it may be determined that the forced heat dissipation condition is not satisfied.

Specifically, if the temperature of the chip meets the forced heat dissipation condition, it can be said that the internal temperature of the electronic device is high, and at this time, the external environment temperature does not need to be considered, the rotating speed of the heat dissipation fan should be increased, the electronic device is cooled as soon as possible, and the internal parts of the electronic device are prevented from being damaged due to high temperature.

Furthermore, a dangerous temperature value can be set, and if the temperature of the chip reaches the dangerous temperature value, the electronic equipment is forcibly closed, so that the effect of shutdown protection is achieved.

If it is determined that the forced heat dissipation condition is not satisfied, step 103 is executed.

And 103, adjusting the rotating speed of a cooling fan of the electronic equipment according to the environment temperature and the preset energy efficiency ratio information.

In practical applications, if the chip temperature does not meet the forced heat dissipation condition, for example, if the chip temperature is less than or equal to the upper temperature limit, it indicates that the internal temperature of the electronic device is not particularly high, and the internal components of the electronic device will not be damaged.

In the method provided in this embodiment, energy efficiency ratio information is also preset. The preset energy efficiency ratio information comprises a first corresponding relation between the environment temperature and the rotating speed of the cooling fan under the condition that the energy efficiency ratio is optimal.

Specifically, the preset energy efficiency ratio information may be in the form of a curve, a table, or the like, and specifically may include a first corresponding relationship between the ambient temperature and the rotation speed of the cooling fan. When the environmental temperature and the rotating speed of the cooling fan of the electronic equipment correspond to the temperature and the rotating speed in the first corresponding relation, the energy efficiency ratio is optimal.

Further, the energy efficiency ratio is a ratio between energy consumption information and computing power of the electronic device. Specifically, when the ambient temperature of the electronic device is t and the rotational speed of the cooling fan is v, the ratio of the energy consumption of the electronic device to the computational power is determined. When the electronic equipment has the corresponding relation between the ambient temperature and the rotating speed of the cooling fan in the preset energy efficiency ratio information, the energy efficiency ratio of the electronic equipment is optimal. Computing power refers to the computing power of an electronic device, e.g., when the electronic device is used to compute tiles in a chain of tiles, then computing power may be a measure of bitcoin network processing power. I.e. the speed at which the hash function output is calculated for the Computer (CPU). For example, when the network reaches a hash rate of 10Th/s, it means that it can perform 10 trillion calculations per second.

During actual application, the rotating speed of the cooling fan with the optimal energy efficiency ratio can be determined according to the collected actual environment temperature of the electronic equipment and the first corresponding relation included by the preset energy efficiency ratio information. If the preset energy efficiency ratio information does not have the corresponding environment temperature, the rotating speed of the cooling fan corresponding to the environment temperature can be calculated according to the first corresponding relation. Specifically, the corresponding rotation speed may be calculated by a slope of a curve, for example, in the first correspondence, the corresponding fan rotation speed is 40% to 60% between 24 ℃ and 37 ℃, and the slope K is (0.6-0.4)/(37-24) ═ 0.015; the actual ambient temperature is 30 ℃, corresponding to a speed of 0.4+0.015 × 30-24 — 0.49, i.e. 49% at 30 ℃. According to the method provided by the embodiment, the rotating speed of the fan can be adjusted according to the preset energy efficiency ratio information, so that the energy efficiency utilization rate of the electronic equipment is improved.

The method for adjusting the rotating speed of the fan provided by the embodiment comprises the following steps: acquiring the ambient temperature and the chip temperature of the electronic equipment; judging whether a forced heat dissipation condition is met or not according to the temperature of the chip, and if not, adjusting the rotating speed of a heat dissipation fan of the electronic equipment according to the ambient temperature and preset energy efficiency ratio information; the preset energy efficiency ratio information comprises a first corresponding relation between the environment temperature and the rotating speed of the cooling fan under the condition that the energy efficiency ratio is optimal, and the energy efficiency ratio is a ratio between energy consumption information and computing power of the electronic equipment. According to the method provided by the embodiment, when the temperature of the electronic device chip is not too high, the rotating speed of the cooling fan is adjusted based on the ambient temperature of the electronic device and the preset energy efficiency ratio information, so that the rotating speed of the cooling fan is adjusted by considering the external ambient temperature, and the energy efficiency of the electronic device is maximized.

Fig. 2 is a flowchart illustrating a method for adjusting a rotational speed of a fan according to another exemplary embodiment of the present invention.

As shown in fig. 2, the method for adjusting the rotation speed of the fan according to the present embodiment includes:

step 201, acquiring energy consumption information and computing power of electronic equipment corresponding to different rotating speeds of the cooling fan at the same environmental temperature.

The preset energy efficiency ratio information can be predetermined, and specifically, the energy efficiency ratio of the electronic device can be determined under the condition of determining the same environmental temperature and different rotating speeds of the cooling fan, so that the rotating speed of the cooling fan with the optimal energy efficiency ratio at the environmental temperature is determined.

Specifically, the ambient temperature may be adjusted, and the rotation speed of the cooling fan of the electronic device may be adjusted at the same temperature. For example, when the ambient temperature is 30 ℃, the ratio of the number of rotations of the cooling fan of the electronic device may be adjusted to 20%, 25%, 30%, 35%, 40%, 45%, 50%, or the like.

Furthermore, under the conditions of the set environmental temperature and the adjusted rotating speed of the cooling fan, the energy consumption information and the computing power of the electronic equipment can be obtained. The energy consumption information refers to the situation that the electronic equipment consumes electric energy, for example, for the electronic equipment for mining in a block chain, the computing power of the electronic equipment is very important, and the energy consumption of the equipment is also high, and if the energy consumption is too high, the income obtained is lower than the consumed energy, and the income is not paid. Therefore, the electronic equipment can obtain the maximum benefit under the conditions of high computing power and low energy consumption, and the energy efficiency of the electronic equipment is optimal.

Step 202, determining energy efficiency ratio information corresponding to the rotating speed of the cooling fan when the electronic equipment is at the environment temperature according to the energy consumption information and the computing power, and determining the optimal energy efficiency ratio corresponding to the environment temperature in the energy efficiency ratio information.

In practical application, the energy efficiency ratio information corresponding to the rotation speed of the cooling fan when the electronic equipment is at the environment temperature can be determined according to the energy consumption information and the calculation force. Specifically, the ratio of the energy consumption information to the calculation force can be calculated, and the ratio is determined as the energy efficiency ratio corresponding to the rotating speed of the cooling fan when the electronic equipment is determined to be at the ambient temperature. And if the energy efficiency ratio is determined in a mode of energy consumption information and computational power ratio, the energy efficiency ratio is smaller and better. The energy efficiency ratio can also be determined by calculating the ratio of the force to the energy consumption information, and at the moment, the energy efficiency ratio is higher and better.

Step 203, determining a first corresponding relation of preset energy efficiency ratio information according to the optimal energy efficiency ratios corresponding to different environmental temperatures.

For the same environmental temperature, the rotating speeds of the cooling fans of the electronic equipment are different, and each rotating speed can correspond to one energy efficiency ratio information. Therefore, the optimal energy efficiency ratio, namely the energy efficiency ratio with high computational power and low energy consumption, can be determined from the plurality of energy efficiency ratio information. The optimal energy efficiency ratio corresponds to the temperature and the rotation speed, for example, when the air inlet of the electronic device is 40 ℃ and the rotation speed of the cooling fan is 50%, the energy efficiency ratio is optimal, and when the air inlet is 40 ℃, the rotation speed of the energy efficiency is 50%.

Specifically, the corresponding rotating speed of the cooling fan can be determined according to the optimal energy efficiency ratio corresponding to different environmental temperatures. And determining that the environment temperature and the rotating speed of the cooling fan have a corresponding relation, thereby determining the corresponding relation between different environment temperatures and the rotating speed of the cooling fan.

Step 204, collecting the junction temperature of the chip at the air outlet of the electronic equipment; the ambient temperature of the electronic device is obtained.

Specifically, after the preset energy efficiency ratio information corresponding to the electronic device is determined, the rotating speed of the cooling fan of the electronic device may be adjusted based on the preset energy efficiency ratio information. It should be noted that, for the same type or model of electronic equipment, the same preset energy efficiency ratio information may be used, and therefore, the above steps need not be performed each time the rotation speed of the fan of the electronic equipment is adjusted.

Further, the chip temperature of the electronic device and the ambient temperature can be collected. The junction temperature of the chip at the air outlet of the electronic equipment can be collected specifically, and the junction temperature is taken as the temperature of the chip. Junction Temperature (Junction Temperature) is the actual working Temperature of the semiconductor in the electronic device, and the internal working Temperature of the electronic device can be determined based on the Junction Temperature of the chip at the air outlet.

The junction temperature of the chip at the air outlet of the electronic device can be obtained and fed back to the electronic device, and specifically can be fed back to a processor of the electronic device.

The manner and principle of obtaining the ambient temperature of the electronic device in step 204 are similar to the manner of obtaining in step 101, and are not described again.

Step 205, determining whether the forced heat dissipation condition is met according to the chip temperature.

Step 205 may include:

and determining whether the chip temperatures continuously acquired for the preset times exceed the preset upper limit temperature.

In practical application, the electronic device may periodically collect the chip temperature, for example, collect the chip temperature once in 1 s. If the chip temperatures acquired for the consecutive preset times all exceed the preset upper limit temperature, the temperature inside the electronic device may be considered to be too high, and at this time, it may be considered to meet the forced heat dissipation condition, and step 206 is executed. Otherwise, step 208 is performed.

The preset times and the preset upper limit temperature can be set according to requirements, for example, the preset times can be set to 5, and the preset upper limit temperature is determined to be 85 ℃.

Step 205 may further include:

and determining whether the acquired chip temperature continuously exceeds a preset upper limit temperature for a preset time.

Specifically, the electronic device may further determine whether the time that the chip temperature exceeds the preset upper limit temperature reaches the preset time, if so, the temperature inside the electronic device may be considered to be too high, and at this time, the forced heat dissipation condition may be considered to be met, and then step 206 is executed. Otherwise, step 208 is performed.

Further, the preset time and the preset upper limit temperature can be set according to the requirement, for example, the preset number of times can be set to 10 seconds, and the preset upper limit temperature is determined to be 85 ℃.

In step 206, the rotation speed of the cooling fan of the electronic device is set to a first preset value.

The upper limit value of the device temperature may be preset, and if the chip temperature is greater than or equal to the upper limit value, it may be determined that a forced heat dissipation condition is satisfied, and at this time, the rotation speed of the heat dissipation fan of the electronic device may be set to a first preset value. The first preset value may be a maximum value of the rotation speed of the heat dissipation fan, such as 100%. The rotation speed of the heat dissipation fan can be expressed in percentage, 100% is the case of the maximum rotation speed of the fan, and 0 is the case of the fan stopping rotation.

Optionally, the method provided in this embodiment may further include:

and step 207, judging whether the conditions for removing the forced heat dissipation are met or not according to the temperature of the chip.

And if so, executing the step of adjusting the rotating speed of the cooling fan according to the environment temperature and the preset energy efficiency ratio information.

When the internal temperature of the electronic equipment is higher, the rotating speed of the cooling fan is set to be a first preset value, so that the cooling fan runs at a high speed, the internal temperature of the electronic equipment is reduced, and when the internal temperature of the electronic equipment is not high, forced cooling can be removed.

Specifically, a condition for releasing the forced heat radiation may be set in advance. Specifically, the cooling time can be set, and if the time that the temperature of the chip is lower than the preset upper limit temperature exceeds the cooling time, the condition of removing forced heat dissipation is judged to be met. For example, the preset upper limit temperature is 85 ℃, and the cooling time period can be 1 minute. In order to avoid frequent switching between the forced heat dissipation state and the state of releasing the forced heat dissipation of the electronic equipment, the forced heat dissipation state can be released when the time that the temperature of the chip is lower than the preset upper limit temperature exceeds the cooling time.

Further, if the condition for releasing the forced heat dissipation is satisfied, the step of adjusting the rotation speed of the heat dissipation fan according to the ambient temperature and the preset energy efficiency ratio information may be executed, specifically, in this embodiment, the step 208 may be executed.

And 208, comparing the environmental temperature with a preset upper limit value and a preset lower limit value of the environmental temperature.

In practical application, the method provided by this embodiment further includes setting an upper limit value of the ambient temperature and a lower limit value of the ambient temperature, where the upper limit value of the ambient temperature refers to a higher ambient temperature, and the heat dissipation effect of the electronic device is poor in this environment. The limit value of the ambient temperature refers to a lower ambient temperature, and the heat dissipation effect of the electronic device is better in such an environment. The limit value of the ambient temperature is less than the upper limit value of the ambient temperature. The environmental temperature is the environmental temperature, so the upper limit value of the environmental temperature is the upper limit value of the environmental temperature, and the lower limit value of the environmental temperature is the lower limit value of the environmental temperature.

The environmental temperature can be compared with the upper limit value of the environmental temperature and the lower limit value of the environmental temperature.

If the environmental temperature is greater than or equal to the environmental temperature limit value and less than or equal to the environmental temperature upper limit value, go to step 209; if the environmental temperature is less than the environmental temperature limit value, go to step 210; if the ambient temperature is greater than the upper limit of the ambient temperature, step 211 is executed.

And 209, determining a target rotating speed in the preset energy efficiency ratio information according to the environment temperature, and adjusting the rotating speed of the cooling fan to the target rotating speed.

Specifically, if the ambient temperature is between the upper limit value and the lower limit value of the ambient temperature, it may be considered that the external ambient temperature cannot accelerate the heat dissipation of the electronic device, and the fan is required to dissipate the heat of the electronic device. The target rotating speed can be determined in the preset energy efficiency ratio information according to the environment temperature, and the rotating speed of the cooling fan is adjusted to be the target rotating speed, so that the electronic equipment can be cooled, and the highest energy efficiency ratio can be achieved.

Further, if the preset energy efficiency ratio information includes a first corresponding relationship, a corresponding rotating speed can be determined in the first corresponding relationship as a target rotating speed according to the environment temperature of the electronic device, and when the rotating speed of the cooling fan of the electronic device is the same as the target rotating speed, the energy efficiency of the electronic device is optimal.

Step 210, determining the rotation speed of the cooling fan as the lowest rotation speed in the first corresponding relation.

Further, if the ambient temperature is lower than the ambient temperature limit value, it may be considered that the temperature of the electronic device is low, and the external environment is favorable for heat dissipation of the electronic device.

Step 211, determining the rotation speed of the cooling fan as the highest rotation speed in the first corresponding relationship.

In practical application, if the ambient temperature is greater than the upper limit value of the ambient temperature, it may be considered that the temperature of the electronic device is high, and the external environment may hinder the heat dissipation effect of the electronic device.

In this embodiment, in the first corresponding relationship, the lower limit value of the ring temperature corresponds to the lowest rotation speed;

in this embodiment, in the first corresponding relationship, the upper limit value of the ring temperature corresponds to the maximum rotation speed.

Fig. 2A is a schematic diagram illustrating preset energy efficiency ratio information according to an exemplary embodiment of the present invention.

Specifically, the preset energy efficiency ratio information may be represented by a curve, and the preset energy efficiency ratio information includes a first corresponding relationship between the ambient temperature and the rotation speed of the cooling fan when the energy efficiency ratio is optimal, so that the first corresponding relationship may be represented by a curve. Due to the characteristics of the electronic device, in the first corresponding relationship, the lower limit value of the ring temperature and the temperature lower than the lower limit value of the ring temperature both correspond to the lowest rotation speed in the first corresponding relationship. The upper limit value of the ring temperature and the temperature higher than the upper limit value of the ring temperature correspond to the highest rotation speed in the first corresponding relation.

If the environment temperature is lower than the environment temperature limit value, the rotating speed of the fan is the lowest rotating speed in the curve, and the energy efficiency ratio of the electronic equipment is highest; in the first corresponding relation, the upper limit value of the ambient temperature corresponds to the highest rotating speed, and when the ambient temperature is lower than the upper limit value of the ambient temperature or the ambient temperature is higher than the upper limit value of the ambient temperature, the energy efficiency ratio corresponding to the rotating speed of the cooling fan is determined to be optimal.

Fig. 3 is a flowchart illustrating a method for adjusting a rotational speed of a fan according to another exemplary embodiment of the present invention.

The method provided by this embodiment may determine preset energy efficiency ratio information in advance, where the preset energy efficiency ratio information includes a first corresponding relationship and a second corresponding relationship.

As shown in fig. 3, the method for adjusting the rotation speed of the fan according to the present embodiment includes:

step 301, acquiring energy consumption information and computational power of electronic equipment corresponding to different cooling fan rotating speeds at the same environmental temperature.

The specific principle and implementation of step 301 are similar to those of step 201, and are not described herein again.

And 302, determining energy efficiency ratio information corresponding to the rotating speed of the cooling fan when the electronic equipment is at the environment temperature according to the energy consumption information and the computing power, and determining the optimal energy efficiency ratio corresponding to the environment temperature in the energy efficiency ratio information.

The specific principle and implementation of step 302 are similar to those of step 202, and are not described herein again.

Step 303, determining a first corresponding relationship of preset energy efficiency ratio information according to the optimal energy efficiency ratios corresponding to different environmental temperatures.

The specific principle and implementation of step 303 are similar to those of step 203, and are not described herein again.

And step 304, determining a second corresponding relation according to the first corresponding relation.

If the ambient temperature of the electronic device changes, the rotating speed of the heat fan of the electronic device changes, and if the ambient temperature changes frequently, the rotating speed of the heat fan changes frequently. Therefore, the method provided by this embodiment may determine the second corresponding relationship based on the first corresponding relationship, and adjust the rotation speed of the fan according to the first corresponding relationship and the second corresponding relationship, thereby avoiding the problem of frequent change of the rotation speed of the fan. The second corresponding relationship also includes a corresponding relationship between the ambient temperature and the rotation speed of the cooling fan.

The first corresponding relationship includes a corresponding relationship between the ambient temperature and the rotational speed of the cooling fan, and when the ambient temperature at which the electronic device is located and the rotational speed of the cooling fan are consistent with the first corresponding relationship, the energy efficiency ratio of the electronic device is optimal, so that the first corresponding relationship can be considered as optimal, and then the second corresponding relationship can be determined according to the first corresponding relationship.

Specifically, the rotating speed interval corresponding to each environmental temperature can be obtained according to the first corresponding relationship and the second corresponding relationship, if the rotating speed of the cooling fan is in the rotating speed interval corresponding to the environmental temperature, the rotating speed does not need to be adjusted, otherwise, the rotating speed is adjusted to the rotating speed interval.

Further, the ambient temperature in the first corresponding relationship may be decreased by a preset value to obtain a second ambient temperature, and the rotation speed of the cooling fan corresponding to the ambient temperature in the first corresponding relationship may be determined to have a second corresponding relationship with the second ambient temperature.

In practical application, if the rotating speed of the fan is lower than the rotating speed corresponding to the temperature in the first corresponding relationship at the same ambient temperature, the internal temperature of the electronic device may become high, and for the electronic device, the lower temperature is more suitable for the normal operation of the electronic device.

Compared with the first corresponding relation, the rotating speed value in the second corresponding relation is higher than that in the first corresponding relation under the same environment temperature. If the rotating speed of the fan is between the rotating speeds in the first corresponding relation and the second corresponding relation, the energy efficiency of the electronic equipment is considered to be better, and the rotating speed of the fan does not need to be adjusted.

Fig. 3A is a schematic diagram illustrating preset energy efficiency ratio information according to another exemplary embodiment of the present invention.

As shown in fig. 3A, a curve 31 is a first corresponding relationship, and a curve 32 is a second corresponding relationship. In the graph, the abscissa is the ambient temperature, and therefore, the curve 31 can be shifted to the left to obtain the curve 32, and the shift distance is a preset value.

The preset value can be set according to requirements, and can be 1 ℃ for example. It can be seen from the figure that a "gap" is formed between the curve 1 and the curve 2, and the position of the electronic device can be determined in the figure according to the ambient temperature and the current rotating speed of the electronic device, if the position is in the "gap", the rotating speed of the fan of the electronic device is not adjusted, otherwise, the rotating speed of the fan of the electronic device can be adjusted to the position of the "gap". The specific adjustment manner will be described later.

Step 305, acquiring the ambient temperature and the chip temperature of the electronic device.

The specific principle and implementation of step 305 are similar to those of

step

204 or 101, and are not described herein again.

And step 306, determining whether the forced heat dissipation condition is met according to the temperature of the chip.

Step 306 is similar to step 205 in specific principles and implementation, and is not described here again.

If so, go to step 307, otherwise, go to step 309.

Step 307, setting the rotation speed of the cooling fan of the electronic device to a first preset value.

And step 308, judging whether the forced heat dissipation releasing condition is met or not according to the temperature of the chip.

Step 309, comparing the ambient temperature with a preset upper limit value and a preset lower limit value of the ambient temperature.

The steps 307-309 are similar to the steps 206-208 in specific principles and implementation, and are not described herein again.

If the environmental temperature is greater than or equal to the environmental temperature limit value and less than or equal to the environmental temperature upper limit value, executing step 310; if the environmental temperature is less than the limit value of the environmental temperature, executing step 313; if the ambient temperature is greater than the upper limit of the ambient temperature, step 314 is executed.

In step 310, a current rotation speed of a cooling fan of the electronic device is obtained.

In the method provided in this embodiment, the preset energy efficiency ratio information includes a first corresponding relationship and a second corresponding relationship, and therefore, the rotation speed of the cooling fan may be adjusted by combining the first corresponding relationship and the second corresponding relationship.

Further, the current rotating speed of the cooling fan of the electronic device can be obtained. The current rotating speed can be determined according to the signal for controlling the rotating speed of the cooling fan, and the current rotating speed of the cooling fan can be acquired through a sensor. For example, if the processor controls the rotation speed of the cooling fan, the current rotation speed of the cooling fan can be obtained according to the control information. And then whether the rotating speed needs to be adjusted can be determined according to the current rotating speed of the cooling fan.

And 311, determining a first rotating speed in the first corresponding relation according to the ambient temperature, and determining a second rotating speed in the second corresponding relation according to the ambient temperature.

The execution sequence of step 310 and step 311 is not limited, and step 310 may be executed first, step 311 may be executed first, or step 311 may be executed simultaneously. Similarly, the timing sequence for determining the first rotation speed and the second rotation speed in step 311 is not limited.

The first rotating speed can be determined in the first corresponding relation according to the acquired environment temperature of the electronic equipment. The first corresponding relation has a corresponding relation between the temperature and the rotating speed, so that the corresponding first rotating speed can be found according to the temperature. For example, if the first corresponding relationship is in the form of a curve, for example, the horizontal axis represents a temperature value, and the vertical axis represents a rotation speed value, a point corresponding to the temperature value can be found in the curve, and the rotation speed value corresponding to the point can be determined. For another example, if the first correspondence is in the form of a table, the rotation speed value corresponding to the temperature value can be found in the table. The manner of determining the second rotation speed according to the second corresponding relationship is similar to the manner of determining the first rotation speed, and is not repeated.

If the first or second corresponding relationship does not include the acquired ambient temperature value, the rotation speed value corresponding to the ambient temperature may be calculated as shown in fig. 2.

Step 312, determining a target rotation speed according to the first rotation speed, the second rotation speed, and the current rotation speed, and adjusting the rotation speed of the cooling fan to the target rotation speed.

The first rotational speed may be determined according to the first correspondence, and the second rotational speed may be determined according to the second correspondence. And the current rotating speed is adjusted according to the first rotating speed and the second rotating speed, so that the rotating speed of the cooling fan of the electronic equipment can be adjusted according to the first corresponding relation and the second corresponding relation. As described above, when the energy efficiency ratio is optimal in the first corresponding relationship, the temperature and the rotation speed correspond to each other, and the second corresponding relationship is obtained based on the first corresponding relationship, and when the ambient temperature is the same, if the current rotation speed is between the first rotation speed and the second rotation speed, the energy efficiency of the electronic device may be considered to be better, and no adjustment is required, otherwise, the rotation speed may be adjusted.

The current rotation speed can be compared with the first rotation speed and the second rotation speed. The comparison result can be classified into three, the first is that the current rotation speed is less than the first rotation speed, the second is that the current rotation speed is greater than or equal to the first rotation speed and less than or equal to the second rotation speed, and the third is that the current rotation speed is greater than the second rotation speed.

Specifically, if the current rotation speed is less than the first rotation speed, the first rotation speed is determined as the target rotation speed. In the method provided in this embodiment, the temperature value in the first corresponding relationship is reduced by the preset value, but the second corresponding relationship obtained by changing the fan rotation speed value is not changed, so that the first rotation speed in the first corresponding relationship is less than or equal to the second rotation speed in the second corresponding relationship at the same ambient temperature.

If the current rotating speed is lower than the first rotating speed, the rotating speed is not matched with the current environment temperature, the electronic equipment cannot be effectively cooled, and the energy efficiency of the electronic equipment is not the best, so that the first rotating speed can be determined as the target rotating speed, the electronic equipment can be effectively cooled, the electronic equipment can be in the state of the optimal energy efficiency, and the win-win effect is achieved.

Further, if the current rotating speed is greater than the second rotating speed, the second rotating speed is determined as the target rotating speed. If the current rotating speed is greater than the second rotating speed, the current rotating speed is considered to be too large for the current environment temperature, although the cooling effect can be achieved on the electronic equipment, the energy efficiency is poor, and for the equipment with higher requirements on energy consumption, the operation mode is not compensated, so that the second rotating speed can be determined as the target rotating speed, the cooling effect can be brought to the electronic equipment by the cooling fan, and the energy efficiency of the electronic equipment can be better.

In practical application, if the current rotating speed is greater than or equal to the first rotating speed and less than or equal to the second rotating speed, the current rotating speed is determined as the target rotating speed.

If the current rotating speed is within the interval between the first rotating speed and the second rotating speed, the current rotating speed of the cooling fan can be considered, the temperature of the equipment can be timely reduced, and the electronic equipment is in a better energy efficiency state.

Step 313, if the ambient temperature is less than the ambient temperature limit, determining the rotation speed of the cooling fan as the lowest rotation speed in the second corresponding relationship.

And in the second corresponding relation, the ring temperature limit value corresponds to the lowest rotating speed.

Due to the characteristics of the electronic device, in the second corresponding relationship, the lower limit value of the ring temperature and the temperature lower than the lower limit value of the ring temperature both correspond to the lowest rotation speed in the second corresponding relationship. Therefore, when the ambient temperature is lower than the ambient temperature limit value, the speed of the cooling fan of the electronic device can be adjusted according to the lowest rotating speed in the second corresponding relationship, so that the energy efficiency ratio of the electronic device is optimal.

In actual application, the lowest rotation speed in the first corresponding relation is the same as the lowest rotation speed in the second corresponding relation, but the environment temperature interval corresponding to the lowest rotation speed is different. The lower limit of the ring temperature in this embodiment may be the same as that in the embodiment shown in fig. 2.

In step 314, the rotation speed of the cooling fan is determined as the highest rotation speed in the first corresponding relationship.

In the first corresponding relation, the upper limit value of the ring temperature corresponds to the highest rotating speed.

The specific principle and implementation of step 314 are similar to those of step 211, and are not described herein again.

Fig. 4 is a structural diagram illustrating a fan rotation speed adjusting apparatus according to an exemplary embodiment of the present invention.

As shown in fig. 4, the fan speed adjusting apparatus provided in this embodiment includes an obtaining module 41, a determining module 42, and an adjusting module 43; wherein:

an obtaining module 41, configured to obtain an ambient temperature and a chip temperature of the electronic device;

a determining module 42, configured to determine whether a forced heat dissipation condition is met according to the chip temperature, and if not, an adjusting module 43 adjusts a rotation speed of a heat dissipation fan of the electronic device according to the environment temperature and preset energy efficiency ratio information;

The fan rotating speed adjusting device provided by the embodiment comprises an obtaining module, a control module and a control module, wherein the obtaining module is used for obtaining the environmental temperature and the chip temperature of the electronic equipment; the determining module is used for judging whether the forced heat dissipation condition is met or not according to the temperature of the chip, and if not, the adjusting module adjusts the rotating speed of the heat dissipation fan according to the environment temperature and the preset energy efficiency ratio information; the preset energy efficiency ratio information comprises a first corresponding relation between the environment temperature and the rotating speed of the cooling fan under the condition that the energy efficiency ratio is optimal, and the energy efficiency ratio is a ratio between energy consumption information and computing power of the electronic equipment. When the temperature of the chip of the electronic device is not too high, the rotating speed of the cooling fan is adjusted based on the ambient temperature of the electronic device and the preset energy efficiency ratio information, so that the rotating speed of the cooling fan is adjusted by considering the external ambient temperature, and the energy efficiency of the electronic device is maximized.

Fig. 5 is a structural view illustrating a fan rotation speed adjusting apparatus according to another exemplary embodiment of the present invention.

As shown in fig. 5, on the basis of the foregoing embodiment, in the fan rotation speed adjusting apparatus provided in this embodiment, the adjusting module 43 is specifically configured to:

comparing the environment temperature with a preset upper limit value and a preset lower limit value of the environment temperature;

and if the environment temperature is greater than or equal to the environment temperature limit value and less than or equal to the environment temperature upper limit value, determining a target rotating speed in the preset energy efficiency ratio information according to the environment temperature, and adjusting the rotating speed of the cooling fan to be the target rotating speed.

The adjusting module 43 is specifically configured to:

if the environmental temperature is higher than the upper limit value of the environmental temperature, determining the rotating speed of the cooling fan as the highest rotating speed in the first corresponding relation in the preset energy efficiency ratio information;

in the first corresponding relation, the upper limit value of the ring temperature corresponds to the maximum rotating speed.

Optionally, an energy efficiency ratio determining module 44 is further included, configured to:

acquiring the energy consumption information and the computing power of the electronic equipment corresponding to different rotating speeds of the cooling fan at the same environmental temperature;

determining energy efficiency ratio information corresponding to the rotating speed of the cooling fan when the electronic equipment is at the environmental temperature according to the energy consumption information and the computing power, and determining an optimal energy efficiency ratio corresponding to the environmental temperature in the energy efficiency ratio information;

and determining the first corresponding relation in the preset energy efficiency ratio information according to the optimal energy efficiency ratio corresponding to different environment temperatures.

The energy efficiency ratio determining module 44 is specifically configured to:

and calculating the ratio of the energy consumption information to the calculated force, and determining the ratio as energy efficiency ratio information corresponding to the rotating speed of the cooling fan when the electronic equipment is determined to be at the ambient temperature.

The obtaining module 41 is specifically configured to:

and collecting the junction temperature of the chip at the air outlet of the electronic equipment.

The determining module 42 is specifically configured to:

and determining whether the chip temperatures continuously acquired for a preset number of times exceed a preset upper limit temperature, and if so, determining that the forced heat dissipation condition is met.

The determining module 42 is specifically configured to:

and determining whether the acquired chip temperature continuously exceeds a preset upper limit temperature for a preset time, and if so, determining that the forced heat dissipation condition is met.

The adjusting module 33 is further configured to:

if the environment temperature is lower than the ambient temperature limit value, determining the rotating speed of the cooling fan as the lowest rotating speed in the first corresponding relation;

wherein, in the first corresponding relationship, the ring temperature lower limit value corresponds to the minimum rotation speed.

Optionally, the adjusting module 43 is specifically configured to:

and determining the target rotating speed in the first corresponding relation according to the environment temperature.

Optionally, the preset energy efficiency ratio information further includes a second corresponding relationship between the ambient temperature and the rotation speed of the cooling fan;

the apparatus further comprises a second energy efficiency ratio determining module 45 configured to determine the second corresponding relationship according to the first corresponding relationship.

The second energy efficiency ratio determining module 45 is specifically configured to:

and reducing the ambient temperature in the first corresponding relation by a preset value to obtain a second ambient temperature, and determining the rotating speed of the cooling fan corresponding to the ambient temperature in the first corresponding relation, wherein the second corresponding relation is formed between the rotating speed of the cooling fan and the second ambient temperature.

Optionally, the adjusting module 43 is specifically used for

If the environmental temperature is lower than the ambient temperature limit value, determining the rotating speed of the cooling fan as the lowest rotating speed in the second corresponding relation;

and in the second corresponding relation, the ring temperature limit value corresponds to the minimum rotating speed.

Optionally, the adjusting module 43 is specifically configured to:

acquiring the current rotating speed of a cooling fan of the electronic equipment;

determining a first rotating speed in the first corresponding relation according to the environment temperature, and determining a second rotating speed in the second corresponding relation according to the environment temperature;

and determining the target rotating speed according to the first rotating speed, the second rotating speed and the current rotating speed, and adjusting the rotating speed of the cooling fan to be the target rotating speed.

Optionally, the adjusting module 43 is specifically configured to:

comparing the current rotating speed with the first rotating speed and the second rotating speed;

and if the current rotating speed is less than a first rotating speed, determining the first rotating speed as the target rotating speed.

Optionally, the adjusting module 43 is specifically configured to:

and if the current rotating speed is greater than the second rotating speed, determining the second rotating speed as the target rotating speed.

Optionally, the adjusting module 43 is specifically configured to:

and if the current rotating speed is greater than or equal to the first rotating speed and less than or equal to the second rotating speed, determining the current rotating speed as the target rotating speed.

Optionally, the apparatus provided in this embodiment further includes:

a forced heat dissipation module 46, configured to set a rotation speed of a heat dissipation fan of the electronic device to a first preset value if the forced heat dissipation condition is met

The embodiment of the disclosure also provides an electronic device comprising the fan rotating speed adjusting device.

An embodiment of the present disclosure further provides an electronic device, a structure of which is shown in fig. 6, where the electronic device includes:

a fan 61;

at least one processor (processor)62, one processor 62 being exemplified in FIG. 6; and a memory (memory)63, and may further include a Communication Interface (Communication Interface)64 and a bus 65. The processor 62, the communication interface 64, and the memory 63 may communicate with each other via a bus 65. Communication interface 64 may be used for information transfer. The processor 62 may call logic instructions in the memory 63 to perform the method of adjusting the rotational speed of the fan 61 of the above-described embodiment.

Furthermore, the logic instructions in the memory 63 may be implemented in the form of software functional units and stored in a computer readable storage medium when sold or used as a stand-alone product.

The memory 63 is a computer readable storage medium, and can be used for storing software programs, computer executable programs, such as program instructions/modules corresponding to the methods in the embodiments of the present disclosure. The processor 62 executes functional applications and data processing by executing software programs, instructions and modules stored in the memory 63, so as to implement the fan speed adjusting method in the above method embodiment.

The memory 63 may include a storage program area and a storage data area, wherein the storage program area may store an operating system, an application program required for at least one function; the storage data area may store data created according to the use of the terminal device, and the like. Further, the memory 63 may include a high-speed random access memory, and may also include a nonvolatile memory.

Embodiments of the present disclosure also provide a computer-readable storage medium storing computer-executable instructions configured to perform any one of the fan speed adjustment methods described above.

The disclosed embodiments also provide a computer program product comprising a computer program stored on a computer readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to perform any of the fan speed adjustment methods described above.

The computer-readable storage medium described above may be a transitory computer-readable storage medium or a non-transitory computer-readable storage medium.

The technical solution of the embodiments of the present disclosure may be embodied in the form of a software product, where the computer software product is stored in a storage medium and includes one or more instructions to enable a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method of the embodiments of the present disclosure. And the aforementioned storage medium may be a non-transitory storage medium comprising: a U-disk, a removable hard disk, a Read-Only Memory (ROM), a Random Access Memory (RAM), a magnetic disk or an optical disk, and other various media capable of storing program codes, and may also be a transient storage medium.

As used in this application, although the terms "first," "second," etc. may be used in this application to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element, unless the meaning of the description changes, so long as all occurrences of the "first element" are renamed consistently and all occurrences of the "second element" are renamed consistently. The first and second elements are both elements, but may not be the same element.

The words used in this application are words of description only and not of limitation of the claims. As used in the description of the embodiments and the claims, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. Similarly, the term "and/or" as used in this application is meant to encompass any and all possible combinations of one or more of the associated listed. Furthermore, the terms "comprises" and/or "comprising," when used in this application, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.

The various aspects, implementations, or features of the described embodiments can be used alone or in any combination. Aspects of the described embodiments may be implemented by software, hardware, or a combination of software and hardware. The described embodiments may also be embodied by a computer-readable medium having computer-readable code stored thereon, the computer-readable code comprising instructions executable by at least one computing device. The computer readable medium can be associated with any data storage device that can store data which can be read by a computer system. Exemplary computer readable media can include read-only memory, random-access memory, CD-ROMs, HDDs, DVDs, magnetic tape, and optical data storage devices, among others. The computer readable medium can also be distributed over network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.

The above description of the technology may refer to the accompanying drawings, which form a part hereof, and in which is shown by way of illustration embodiments in which the described embodiments may be practiced. These embodiments, while described in sufficient detail to enable those skilled in the art to practice them, are non-limiting; other embodiments may be utilized and changes may be made without departing from the scope of the described embodiments. For example, the order of operations described in a flowchart is non-limiting, and thus the order of two or more operations illustrated in and described in accordance with the flowchart may be altered in accordance with several embodiments. As another example, in several embodiments, one or more operations illustrated in and described with respect to the flowcharts are optional or may be eliminated. Additionally, certain steps or functions may be added to the disclosed embodiments, or two or more steps may be permuted in order. All such variations are considered to be encompassed by the disclosed embodiments and the claims.

Additionally, terminology is used in the foregoing description of the technology to provide a thorough understanding of the described embodiments. However, no unnecessary detail is required to implement the described embodiments. Accordingly, the foregoing description of the embodiments has been presented for purposes of illustration and description. The embodiments presented in the foregoing description and the examples disclosed in accordance with these embodiments are provided solely to add context and aid in the understanding of the described embodiments. The above description is not intended to be exhaustive or to limit the described embodiments to the precise form disclosed. Many modifications, alternative uses, and variations are possible in light of the above teaching. In some instances, well known process steps have not been described in detail in order to avoid unnecessarily obscuring the described embodiments.

Industrial applicability

According to the technical scheme, when the temperature of the chip of the electronic equipment is too high, the rotating speed of a cooling fan of the electronic equipment is set to be a first preset value; when the temperature of the electronic equipment chip is not too high, the rotating speed of the cooling fan is adjusted based on the ambient temperature of the electronic equipment and the preset energy efficiency ratio information, so that the rotating speed of the cooling fan is adjusted by considering the external ambient temperature, and the energy efficiency of the electronic equipment is maximized.

Claims

1. A method for adjusting the rotating speed of a fan is characterized by comprising the following steps:

2. The method according to claim 1, wherein the adjusting the rotation speed of the cooling fan of the electronic device according to the environmental temperature and the preset energy efficiency ratio information comprises:

3. The method of claim 2,

4. The method of claim 2 or 3, further comprising:

5. The method according to claim 4, wherein the determining energy efficiency ratio information corresponding to the rotation speed of the cooling fan when the electronic device is at the ambient temperature according to the energy consumption information and the computing power comprises:

6. The method according to any one of claims 1-3 and 5, wherein the obtaining the chip temperature of the electronic device comprises:

7. The method of claim 6, wherein the determining whether a forced heat dissipation condition is met according to the chip temperature comprises:

8. The method according to any one of claims 1-3 and 5, wherein the determining whether a forced heat dissipation condition is met according to the chip temperature comprises:

9. The method of any one of claims 2, 3, and 5, further comprising:

10. The method according to any one of claims 2, 3 and 5, wherein the determining a target rotation speed in the preset energy efficiency ratio information according to the ambient temperature includes:

11. The method according to any one of claims 2, 3 and 5, wherein the preset energy efficiency ratio information further includes a second correspondence relationship between the ambient temperature and the rotational speed of the radiator fan;

the method further comprises the following steps: and determining the second corresponding relation according to the first corresponding relation.

12. The method of claim 11, wherein determining the second correspondence from the first correspondence comprises:

13. The method of claim 11,

14. The method according to claim 11, wherein the determining a target rotation speed in the preset energy efficiency ratio information according to the ambient temperature includes:

15. The method of claim 14, wherein determining a target speed based on the first speed, the second speed, and the current speed comprises:

16. The method of claim 15, wherein the second rotational speed is determined as the target rotational speed if the current rotational speed is greater than the second rotational speed.

17. The method according to claim 15 or 16, characterized in that if the current rotation speed is equal to or greater than the first rotation speed and equal to or less than the second rotation speed, the current rotation speed is determined as the target rotation speed.

18. The method according to any one of claims 1-3, 7, 12-16, wherein if the forced heat dissipation condition is met, setting a rotation speed of a heat dissipation fan of the electronic device to a first preset value.

19. The fan rotating speed adjusting device is characterized by comprising an obtaining module, a determining module and an adjusting module; wherein:

the determining module is used for determining whether a forced heat dissipation condition is met or not according to the chip temperature, and if not, the adjusting module adjusts the rotating speed of a heat dissipation fan of the electronic equipment according to the environment temperature and preset energy efficiency ratio information;

20. The apparatus of claim 19, wherein the adjustment module is specifically configured to:

21. The apparatus of claim 20, wherein the adjustment module is specifically configured to:

22. The apparatus of claim 20 or 21, further comprising an energy efficiency ratio determination module configured to:

23. The apparatus according to claim 22, wherein the energy efficiency ratio determining module is specifically configured to:

24. The apparatus according to any one of claims 19-21, 23, wherein the obtaining module is specifically configured to:

25. The apparatus of claim 24, wherein the determining module is specifically configured to:

26. The apparatus according to any one of claims 19-21, 23, wherein the determining module is specifically configured to:

27. The apparatus according to any one of claims 20, 21, and 23, wherein the adjusting module is further configured to:

28. The apparatus according to any one of claims 20, 21, 23, wherein the adjusting module is specifically configured to:

29. The apparatus according to any one of claims 20, 21, and 23, wherein the preset energy efficiency ratio information further includes a second correspondence relationship between the ambient temperature and the rotational speed of the radiator fan;

the device further comprises a second energy efficiency ratio determining module for determining the second corresponding relation according to the first corresponding relation.

30. The apparatus according to claim 29, wherein the second energy efficiency ratio determining module is specifically configured to:

31. The apparatus of claim 29, wherein the adjustment module is specifically configured to

32. The apparatus of claim 29, wherein the adjustment module is specifically configured to:

33. The apparatus of claim 32, wherein the adjustment module is specifically configured to:

34. The apparatus of claim 33, wherein the adjustment module is specifically configured to:

35. The apparatus according to claim 33 or 34, wherein the adjusting module is specifically configured to:

36. The apparatus of any one of claims 19-21, 25, 30-34, further comprising: and the forced heat dissipation module is used for setting the rotating speed of a heat dissipation fan of the electronic equipment to be a first preset value if the forced heat dissipation condition is met.

37. An electronic device comprising the apparatus of any of claims 19-36.

38. An electronic device, comprising:

a fan;

at least one processor; and

the memory stores instructions executable by the at least one processor, the instructions, when executed by the at least one processor, cause the at least one processor to perform the method of adjusting the fan speed of any of claims 1-18.

39. A computer-readable storage medium having stored thereon computer-executable instructions configured to perform the method of any one of claims 1-18.

40. A computer program product, characterized in that the computer program product comprises a computer program stored on a computer-readable storage medium, the computer program comprising program instructions which, when executed by a computer, cause the computer to carry out the method of any one of claims 1-18.