CN109557376A - Resistance measurement device, base board checking device and resistance measurement method - Google Patents
Resistance measurement device, base board checking device and resistance measurement method Download PDFInfo
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- CN109557376A CN109557376A CN201811122773.1A CN201811122773A CN109557376A CN 109557376 A CN109557376 A CN 109557376A CN 201811122773 A CN201811122773 A CN 201811122773A CN 109557376 A CN109557376 A CN 109557376A
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- 238000005259 measurement Methods 0.000 title claims abstract description 104
- 238000000691 measurement method Methods 0.000 title claims abstract description 23
- 239000000523 sample Substances 0.000 claims abstract description 196
- 238000001514 detection method Methods 0.000 claims abstract description 89
- 238000000034 method Methods 0.000 claims description 56
- 239000000758 substrate Substances 0.000 claims description 49
- 239000004020 conductor Substances 0.000 claims description 35
- 230000005611 electricity Effects 0.000 claims description 17
- 238000007689 inspection Methods 0.000 claims description 7
- 238000000926 separation method Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 14
- 230000003071 parasitic effect Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000003990 capacitor Substances 0.000 description 4
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- 230000002950 deficient Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000997 High-speed steel Inorganic materials 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000003471 mutagenic agent Substances 0.000 description 1
- 231100000707 mutagenic chemical Toxicity 0.000 description 1
- 230000024241 parasitism Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
- -1 tungsten Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
- G01R31/2812—Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/08—Measuring resistance by measuring both voltage and current
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
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- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The present invention provides a kind of resistance measurement device, base board checking device and resistance measurement method.Resistance measurement device includes the first current probe, the second current probe, contact chip lateral electrode；First detection probe, the second detection probe contact export-oriented electrode；Voltage detection department detects the voltage the first detection probe, the second detection probe；First constant current source, anode are connect with the first current probe, and cathode is connect with ground, export the electric current of the first current value；Second constant current source, anode connect with the cathode of the first constant current source and ground and are connected in series with the first constant current source, and cathode is connect with the second current probe, the electric current of output and the second substantially the same current value of the first current value；Wiring is connected with ground in grounded probe；And resistance acquisition unit, the resistance of wiring is obtained according to the voltage detected by voltage detection department.
Description
Technical field
The present invention relates to a kind of resistance measurement device, base board checking devices using it, Yi Ji electricity for carrying out resistance measurement
Hinder measuring method.
Background technique
Before, in order to check the Wiring pattern being formed on the substrates such as printed wiring board, and the electricity of Wiring pattern is measured
Resistance value.As the inspection of Wiring pattern, whether there is or not the inspection of broken string is self-evident, it is also necessary to which the width of detection such as Wiring pattern becomes
Carefully or thickness it is thinning as not up to broken string it is bad.In order to detect the bad of such not up to broken string, it is necessary to carry out high-precision
Resistance measurement.As such high-precision resistance measurement method, it is known to use the resistance measurement device of four terminals measurement methods.
For example, the resistance measurement device recorded in Japanese Kokai special open 2004-184374 bulletin has: being used for court
A pair of of contact probe (P1, P2) of the electric current of resistance measurement is flowed out in the Wiring pattern of resistance measurement object and for measuring
A pair of of contact probe (P3, P4) of the voltage at resistance measurement position.
According to this configuration, the electric current of resistance measurement does not flow in the contact probe P3 of voltage determination, contact probe P4
It is dynamic, therefore the decline of the voltage as caused by the resistance of contact probe P3, contact probe P4 itself is reduced, and can carry out high-precision electricity
Resistance measurement.According to Fig. 1 of Japanese Kokai special open 2004-184374 bulletin, the contact of the side of the positive electrode of electric current output is visited
Needle P1 is connect with constant current source, and the contact probe P2 of negative side is connect with circuit ground (circuit ground).
But in the resistance measurement device recorded in Japanese Kokai special open 2004-184374 bulletin, resistance is surveyed
Surely electric current flows in the contact resistance of the contact probe P2 and measure object body M of negative side and generates voltage.This voltage
Contact probe P3, contact probe P4 relative to voltage determination become common-mode voltage (common mode voltage) (common mode
Noise).The contact resistance Ro of contact probe P2 becomes 100 Ω or so, if therefore being set as the electric current i of resistance measurement
20mA, then common-mode voltage Vc becomes Ro × i=100 Ω × 20mA=2000mV (referring to Fig. 7).
On the other hand, such as when measure object is Wiring pattern, resistance value Rx is 1m Ω or so.Then, if resistance
The electric current i of measurement is 20mA, then the measurement voltage Vm measured by contact probe P3, contact probe P4 becomes Rx × i=1m
Ω × 20mA=20 μ V=0.02mV (referring to Fig. 7).
Then, it relative to common-mode voltage, measures voltage and becomes 20log (measurement voltage/common-mode voltage)=20log (0.02/
2000)=- 100dB.The contact resistance as caused by the contact of contact probe P2 is unstable, therefore common-mode voltage is also astatically
It changes.Measurement voltage becomes the small voltage of -100dB degree relative to common-mode voltage, thus measure the measurement accuracy of voltage by
To the variation of common-mode voltage influence and decline.As a result, in the presence of the precision according to measurement voltage resistance measurements obtained
Also decline this unfavorable condition.
In addition, as the method for making common-mode voltage become zero, it is contemplated that following method: as Japanese Kokai is opened
As being recorded in 2007-333598 bulletin, by the reversion amplifying circuit of common-mode voltage feedback to operational amplifier, from there through
Common-mode voltage is eliminated in the output of operational amplifier.Fig. 8 is the figure that Japanese Kokai special open 2007-333598 bulletin is recorded
The equivalent circuit diagram of documented circuit in 1 indicates electric current feeding terminal 22, electric current feeding terminal 23 and voltage measurement with Ro
Terminal 24, contact resistance of voltage measurement terminal 25 etc. indicate parasitic capacitance with Co.
But in such method, generate as caused by the Ro or parasitic capacitance Co for the resistance components for becoming feed circuit
Time delay, the low-response of operational amplifier of feedback etc., therefore, it is difficult to high speed motions, eliminate the common mode changed astatically
Voltage is not easy to.
Summary of the invention
The purpose of the present invention is to provide a kind of easy resistance for promoting the resistance measurement precision using four terminals measurement methods
Measurement device, base board checking device and resistance measurement method.
[technical means to solve problem]
Resistance measurement device of the invention is the resistance measurement device for measuring the resistance of conductor, is had: the first electricity
Probe and the second current probe are flowed, for contacting the conductor and flowing out defined measurement electric current；First detection probe and
Two detection probes, for contacting the conductor and detecting the voltage generated in the conductor by the measurement with electric current；
Voltage detection department detects the voltage between first detection probe and the second detection probe；First constant current source, anode and institute
The connection of the first current probe is stated, cathode is connect with ground, exports the electric current for the first current value being previously set；Second constant current
Source, it is positive connect with the cathode of first constant current source and the ground and with the source-series company of the first constant current
It connects, cathode is connect with second current probe, the electricity of output and the second substantially the same current value of first current value
Stream；The predetermined portion in the conductor is connected with the ground in grounding parts；And resistance acquisition unit, according to by the voltage
Voltage detected by test section obtains the resistance.
In addition, resistance measurement method of the invention is the resistance measurement method for measuring the resistance of conductor comprising: (a) make
The process that first current probe contacts the conductor with the first detection probe；(b) make the second current probe and the second detection probe
The process for contacting the position of the conductor separated with the contact position of first current probe and first detection probe；
(c) it is connect by anode with first current probe, the first constant current source that cathode is connect with ground is set in advance to export
The electric current of the first fixed current value, by anode connect with the cathode of first constant current source and the ground and with it is described
First constant current source be connected in series, the second constant current source that cathode is connect with second current probe come export with it is described
The process of the electric current of the second substantially the same current value of first current value；(d) make predetermined portion in the conductor with it is described
The process of ground conducting；(e) process of the voltage between first detection probe and the second detection probe is detected；And (f) root
According to the process for obtaining the resistance by voltage detected by described (e) process.
It, can be by using the first current probe and the second current probe and the first detection probe and second according to these structures
Four terminals measurement methods of detection probe carry out resistance measurement.Moreover, be concatenated connection and its tie point be set as earthing potential
The first constant current source and the second constant current source be intended to maintain respectively the first current value, the second current value output electric current knot
Fruit substantially becomes zero from the predetermined portion of the conductor be connected with ground towards the electric current that ground is flowed.As a result, common-mode voltage is substantially
Become zero.Moreover, resistance can be obtained according to the measurement voltage measured in the state of making common-mode voltage substantially become zero, because
This is easy the measurement accuracy for promoting resistance.Therefore, it is easy to promote the resistance measurement precision for utilizing four terminals measurement methods.
Additionally, it is preferred that the grounding parts include the grounded probe for contacting the predetermined portion, and the grounded probe
It is connect with the ground.
Additionally, it is preferred that (d) process is the work for making the grounded probe connected with the ground contact the predetermined portion
Sequence.
Conductor can be made to be connected with ground by making grounded probe contact the predetermined portion of conductor according to these structures.
In addition, the grounding parts can be the wiring for connecting second detection probe with the ground.
In addition, second detection probe is connect with the ground, (b) process can also be as described (d) process.
According to these structures, the second detection probe can be also used as grounded probe and come using there is no need to separately be arranged to connect
Ground probe is contacted with conductor.
Additionally, it is preferred that the one end in the conductor is provided with first electrode, it is provided in the other end of the conductor
The big second electrode of first electrode described in area ratio, (a) process are to make first current probe and first detection
The process that probe contacts the first electrode, (b) process are to make second current probe and second detection probe
The process for contacting the second electrode, (d) process are to make the ground connection using the second electrode as the predetermined portion
The process that probe contacts the second electrode.
According to the method, the first electrode for keeping two probe contacts area small makes second that three probe contacts area are big
Electrode.Therefore, it is easy to make each probe contact first electrode and second electrode.
In addition, base board checking device of the invention has: the resistance measurement device；And inspecting substrate portion, according to by
The resistance that the resistance measurement device is measured be formed in the inspection of the wiring of the conductor as described on substrate.
According to this configuration, the wiring being formed on substrate can be carried out according to the resistance measured by resistance measurement device
It checks.
Resistance measurement device, base board checking device and the resistance measurement method of such structure, which are easy to be promoted, utilizes four ends
The resistance measurement precision of sub- measuring method.
Detailed description of the invention
Fig. 1 is the structure for indicating the base board checking device using resistance measurement device of first embodiment of the invention
The block diagram of an example.
Fig. 2 is the explanatory diagram for indicating the equivalent circuit of base board checking device and substrate shown in Fig. 1.
Fig. 3 is the flow chart for indicating an example of resistance measurement method of one embodiment of the present invention.
Fig. 4 is the base board checking device indicated when being checked integrated circuit (Integrated Circuit, IC)
The explanatory diagram of connection.
Fig. 5 is the structure for indicating the base board checking device using resistance measurement device of second embodiment of the present invention
The block diagram of an example.
Fig. 6 is the explanatory diagram for indicating the equivalent circuit of base board checking device and substrate shown in Fig. 5.
Fig. 7 is the explanatory diagram to illustrate the common-mode voltage of background technique.
Fig. 8 is the equivalent circuit diagram of circuit recorded in Fig. 1 of Japanese Kokai special open 2007-333598 bulletin.
[explanation of symbol]
1,1a: base board checking device (resistance measurement device)
4: voltage detection department
5: control unit
6: scanner
22,23: electric current feeding terminal
24,25: voltage measurement terminal
51: resistance acquisition unit
52: inspecting substrate portion
61,62,63,64,65: switch
100:IC
A: substrate
A1: chip lateral electrode (first electrode)
A2: export-oriented electrode (second electrode)
A3: wiring (conductor)
Co: parasitic capacitance
Cp: capacitor
CS1: constant current source (the first constant current source)
CS2: constant current source (the second constant current source)
D: diode
GND: ground/ground terminal
I: electric current is used in measurement
I1: the first current value
I2: the second current value
Is、I3: current value
P1~Pn: signal terminal
Pc1, Pc2, Pv1, Pv2, PG: probe
Rc1, Rc2, Rv1, Rv2, RG: resistance
Rc2、Rv2, Rx: resistance value
Rref: a reference value
Ro: contact resistance
Vc: common-mode voltage
Vm, Vs: measurement voltage
Vcc: power supply terminal
S1~S9: step
Specific embodiment
Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.
(first embodiment)
Fig. 1 is the structure for indicating the base board checking device 1 using resistance measurement device of first embodiment of the invention
An example block diagram.In addition, the same structure of the representation for marking the same symbol in the various figures, and the description thereof will be omitted.
Base board checking device 1 (resistance measurement device) shown in Fig. 1 has: constant current source CS1 (the first constant current
Source), constant current source CS2 (the second constant current source), voltage detection department 4, current probe Pc1 (the first current probe), electric current
Probe Pc2 (the second current probe), it detection probe Pv1 (the first detection probe), detection probe Pv2 (the second detection probe), connects
Ground probe PG (grounding parts), scanner 6 and control unit 5.
Fig. 1 shows the states that each probe of base board checking device 1 has been contacted with the substrate A for becoming check object.Substrate inspection
It looks into device 1 and carries out resistance measurement using so-called four terminals measurements method.Aftermentioned inspecting substrate is removed from base board checking device 1
Part behind portion 52 is equivalent to an example of resistance measurement device.
The substrate of check object for example can be the package substrate of semiconductor-sealing-purpose, interposer substrate (interposer
Substrate), film carrier (film carrier), printed wiring board, glass epoxy substrate, flexible base board, ceramic multilayer
It is aobvious to be also possible to liquid crystal display, electroluminescent (Electro-Luminescence, EL) display etc. for the substrates such as wiring substrate
Show the electrode plate of device or the transparent conductive panel of touch panel use etc., is also possible to semiconductor wafer, semiconductor chip, chip
The various substrates such as the semiconductor substrates such as sized package (Chip Size Package, CSP).
In addition, the substrate of check object is also possible to the part built-in substrate that embedment has the electronic components such as semiconductor chip
(built-in type substrate (embedded substrate)).In addition, check object is not limited to substrate, it is also possible to semiconductor core
The electronic components such as piece.Be formed in the substrate or electronic component of check object Wiring pattern, weld pad (pad), pad (land),
The checkpoints such as solder projection (solder bump) and terminal.
Exemplified as the sectional view of the interposer substrate of the semiconductor-sealing-purpose of the substrate A of check object in Fig. 1.In base
Multiple chip side electrode As 1 (first electrode) connecting with semiconductor chip are formed on the face of the side of plate A.Compare semiconductor
The fine electrode spacing of chip and the mutual interval of multiple chip side electrode As 1 is set as thin space, by chip side electrode A 1
Size be also set small.It is formed on the face of the other side of substrate A multiple for by semiconductor chip and external connection
Export-oriented electrode A 2 (second electrode).
Multiple export-oriented electrode As 2 are set as example being configured to clathrate, and by soldered ball come the ball bar with external connection
(ball grid).In order to make to become easy with external wiring, the interval for keeping multiple export-oriented electrode As 2 mutual is than chip side electricity
Pole A1 mutual interval is broad, and keeps the size of export-oriented electrode A 2 also bigger than chip side electrode A 1.
Each chip side electrode A 1 is formed in a manner of the thickness direction to run through substrate A respectively with each export-oriented electrode A 2
Wiring A3 (conductor) connects to be connected.Base board checking device 1 measures and checks the resistance value Rx of each wiring A3.Wiring A3 is equivalent to
An example of conductor, chip side electrode A 1 are equivalent to the one end of wiring A3, and export-oriented electrode A 2 is equivalent to the other end of wiring A3.
Current probe Pc1, current probe Pc2, detection probe Pv1, detection probe Pv2 and grounded probe PG such as conduct
Relative to base board checking device 1, removably inspection is constituted with fixture.Hereinafter, sometimes by current probe Pc1, current probe
Pc2, detection probe Pv1, detection probe Pv2 and grounded probe PG are only recorded as probe Pc1, probe Pc2, probe Pv1, probe
Pv2, probe PG.
Probe Pc1, probe Pc2, probe Pv1, probe Pv2, probe PG are, for example, that diameter is 100 μm~200 μm or so
Linear contactor with elastic (flexibility).Current probe Pc1, current probe Pc2 and detection probe Pv1, detection probe Pv2
Such as it is formed by the metals such as tungsten, high-speed steel (SKH), beryllium copper (Be-Cu) and other electric conductors.
The chip side electrode A 1 of the preceding end in contact substrate A of current probe Pc1 and detection probe Pv1.Current probe Pc2, inspection
The front end of probing needle Pv2 and grounded probe PG contact export-oriented electrode A 2 on the position separated with chip side electrode A 1.If making each
The such contact chip lateral electrode A1 of probe and export-oriented electrode A 2, then make two probes contact small and thin space chip lateral electrode
A1 keeps three probe contacts bigger than chip side electrode A 1 and the export-oriented electrode A 2 of wide spacing.Therefore, it is easy to make each probe contact core
Piece lateral electrode A1 and export-oriented electrode A 2.
In Fig. 1 to diagram carry out simplify and respectively one probe Pc1 of each record, probe Pc2, probe Pv1, probe Pv2,
Probe PG, but there is the case where hundreds to thousands checkpoint is set with to a plate base, and exist corresponding to such a large amount of
The situation of hundreds to thousands is respectively set in probe Pc1, probe Pc2, probe Pv1, probe Pv2, probe PG by checkpoint.
Scanner 6 is to the current probe Pc1, current probe Pc2 and constant current source CS1, constant current source CS2
The connection relationship of connection relationship, the detection probe Pv1, detection probe Pv2 and voltage detection department 4 and the grounded probe PG
The switching circuit switched over the connection relationship on ground.Scanner 6 for example has comprising switch 61, switch 62, switch 63, opens
Close the multiple switch of 64, switch 65.The switches such as switch 61, switch 62, switch 63, switch 64, switch 65 are, for example, transistor etc.
The various switch elements such as semiconductor switch or relay switch.Each switch for example corresponding to the control signal from control unit 5 and
On-off.
Constant current source CS1, constant current source CS2 are the constant current circuits of the fixed electric current of flowing, towards in wiring A3
Flow out the constant current of measurement.As constant current source CS1, constant current source CS2, such as it can be used and utilize transistor or neat
Receive diode person, using the various circuits known as constant current circuit such as current mirroring circuit person, or can also be with
It is constituted using switching power circuit etc..
The anode (+) of constant current source CS1 is connect via switch 61 with current probe Pc1, cathode (-) and ground G ND
Connection.Constant current source CS1 from its positive (+) towards current probe Pc1 in export the first current value I being previously set1Electric current.
By the first current value I1Such as be set as 20mA or so.
The anode (+) of constant current source CS2 connect with the cathode (-) of constant current source CS1 and ground G ND and with constant electricity
Stream source CS1 is connected in series, and cathode (-) is connect via switch 62 with current probe Pc2.Constant current source CS2 is positive from it
(+) is towards output in constant current source CS1 and the first current value I1The second substantially the same current value I2Electric current.Herein, so-called
It is substantially the same, even if referring in the presence of the manufacture deviation or current control accuracy because of constant current source CS1, constant current source CS2
Deng and generate degree difference, also regard the identical meaning as.
Ground G ND is the circuit ground of base board checking device 1.In addition, ground G ND is also possible to base board checking device 1
Rack earth (frame ground) (the earth is grounded), but more preferable circuit ground.
If being connected switch 61, switch 62, switch 63, switch 64, switch 65 by control unit 5, formed from ground
GND is visited via constant current source CS1, switch 61, current probe Pc1, chip side electrode A 1, wiring A3, export-oriented electrode A 2, electric current
Needle Pc2, switch 62 and constant current source CS2 and the current loop (current for being back to the measurement electric current I of ground G ND
loop)。
Voltage detection department 4 measures the voltage between detection probe Pv1, detection probe Pv2.Voltage detection department 4 is for example using mould
Intend digital quantizer or divider resistance etc. to constitute.Side of the positive electrode (+) terminal of voltage detection department 4 is visited via switch 63 with detection
Needle Pv1 connection, negative side (-) terminal of voltage detection department 4 are connect via switch 64 with detection probe Pv2.Voltage is examined as a result,
Survey portion 4 is measured by the voltage between the selected detection probe Pv1 of scanner 6, detection probe Pv2 as measurement voltage Vs,
And the data of measurement voltage Vs are indicated towards output in control unit 5.
Control unit 5 is, for example, so-called microcomputer, and the microcomputer, which has, executes defined calculation process
Random access memory (the Random of central processing unit (Central Processing Unit, CPU), temporarily storing data
Access Memory, RAM), the non-volatile storage device and their peripheral circuit of the control program of store predetermined etc.
Deng.Control unit 5 is functioned by executing defined control program as resistance acquisition unit 51 and inspecting substrate portion 52.
Resistance acquisition unit 51 is according to the measurement voltage Vs as detected by voltage detection department 4, to the wiring A3 of measure object
Resistance value Rx carry out operation.Specifically, according to the first current value of current value Is=I of measurement electric current I1The second electric current of ≒
Value I2And measurement voltage Vs, resistance value Rx is calculated using following formulas (1).
Resistance value Rx=Vs/Is (1)
In addition, base board checking device 1 (resistance measurement device) has the electricity of the practical electric current flowed in wiring A3 of measurement
The current value Is and measurement electricity measured by amperometric determination portion also can be used in the amperometric determination portion of flow valuve Is, resistance acquisition unit 51
Vs is pressed to calculate resistance value Rx.In addition, resistance value Rx is proportional to measurement voltage Vs if current value Is is fixed value.Therefore,
Resistance acquisition unit 51 can also calculate resistance value Rx without using formula (1), and will measure voltage Vs directly as expression resistance value
The information of Rx obtains.
Inspecting substrate portion 52 carries out the wiring A3's as conductor according to the resistance value Rx as acquired by resistance acquisition unit 51
It checks.Specifically, inspecting substrate portion 52 is compared a reference value Rref being previously stored in storage unit with resistance value Rx,
When resistance value Rx is less than a reference value Rref, the wiring A3 is determined as non-defective unit, the value Rref or more on the basis of resistance value Rx
When, the wiring A3 is determined as bad.
Fig. 2 is the inspecting substrate dress indicated in the state that switch 61, switch 62, switch 63, switch 64, switch 65 have been turned on
Set the explanatory diagram of 1 with the equivalent circuit of substrate A.In Fig. 2, resistance Rc1 expression current probe Pc1 connects with chip side electrode A 1
Electric shock resistance and the equal resistance of switch 61, resistance Rc2 indicate contact resistance and switch 62 of current probe Pc2 and extroversion electrode A 2 etc.
Resistance, resistance Rv1 indicates detection probe Pv1 and the contact resistance of chip side electrode A 1 and the resistance of switch 63 etc., resistance Rv2
Indicate detection probe Pv2 and the export-oriented contact resistance of electrode A 2 and the resistance of switch 64 etc., resistance RG expression grounded probe PG and
The contact resistance of export-oriented electrode A 2 and the resistance of switch 65 etc..In addition, being indicated with capacitor Cp in equivalent electricity shown in Fig. 2
The parasitic capacitance generated in road.
Hereinafter, equivalent circuit shown according to fig. 2, is illustrated the movement of base board checking device 1.Firstly, constant
Current source CS1 exports the first current value I1Electric current, constant current source CS2 export the second current value I2Electric current as a result, electric current
The measurement of value Is is flowed in wiring A3 with electric current I.At this point, being flowed via with measurement with electric current I by voltage detection department 4
Dynamic current probe Pc1, current probe Pc2 different detection probe Pv1, detection probe Pv2, it is normal by what is generated in wiring A3
The voltage of mould (normalmode) is measured as measurement voltage Vs, and from voltage detection department 4 towards resistance acquisition unit 51 in send
Measure voltage Vs.
In the case, electric current does not flow in resistance Rv1, resistance Rv2, therefore by resistance acquisition unit 51, according to electricity
The measurement voltage Vs that resistance Rv1, resistance Rv2 have been excluded obtains resistance value Rx's as a result, with so-called two-terminal measuring method phase
Than high-precision resistance measurement can be carried out.
Then, common-mode voltage is illustrated.It is connect since constant current source CS2 is concatenated with resistance Rc2, second
Current value I2Electric current most start to flow in resistance Rc2 first.If the resistance value of resistance Rc2 is set as resistance value Rc2,
Then Rc is generated in resistance Rc22×I2Voltage.The usual internal resistance of constant current circuit is high impedance, constant current power supply
Cathode (-) current potential and earthing potential of CS2 is inconsistent, therefore the voltage generated in resistance Rc2 is not applied to electricity directly
It hinders in RG.But at least part of the voltage generated in resistance Rc2 is applied in resistance RG, current value I3Electric current
It will be flowed in resistance RG.
Herein, in the first current value I1, the second current value I2And current value I3Between exist by following formulas (2), formula (3)
Shown in relationship.
I1=I2+I3···(2)
I1≒I2···(3)
Herein, since constant current source CS1 is constant current source, the first current value I1For fixed value, due to
One current value I1The second current value of ≒ I2If therefore current value I3Electric current from measurement with electric current I towards shunting in resistance RG, then supply
To the electric current in the cathode (-) to constant current source CS2 relative to the second current value I2For it is insufficient, constant current source CS2 without
Method flows out the second current value I2Electric current.
Herein, constant current source CS2 is also constant current source, therefore is intended to forcibly flow out the second current value I2.At this point, by
It is connect in the anode (+) of constant current source CS2 with ground, therefore is intended to forcibly flow out the second electric current by constant current source CS2
Value I2Effect, cathode (-) the current potential decline of constant current source CS2, until to the cathode of constant current source CS2 (-) supply the
Two current value I2Electric current until.So-called cathode (-) second current value I of supply to constant current source CS22The first current value of (≒
I1) electric current state, refer to according to formula (2), become current value I3The state of ≒ 0.
The current value I flowed in resistance RG3≒ 0 means that the current potential at the both ends of resistance RG becomes roughly equal.Due to
One end of resistance RG is connect with ground, therefore the other end of resistance RG, i.e., the big mutagens of current potential of export-oriented electrode A 2 shown in Fig. 2
At earthing potential.Since detection probe Pv2 is contacting export-oriented electrode A 2, the current potential of export-oriented electrode A 2 substantially becomes to be grounded
Current potential is exactly that the common-mode voltage applied to voltage detection department 4 substantially becomes zero.
As above, it is concatenated connection and its tie point is set as the constant current source CS1 and constant current of earthing potential
Source CS2 is intended to maintain the first current value I respectively1, the second current value I2Output electric current as a result, in constant current source CS1, constant
The movement is carried out in the time in an instant of the response time degree of current source CS2, common-mode voltage substantially becomes zero.
As described above, in the background technology measure voltage measurement accuracy by the variation of common-mode voltage influenced and under
Drop.In contrast, base board checking device 1 can make common-mode voltage substantially become zero, therefore compared with the background art, can be promoted becomes
The measurement accuracy of the resistance value Rx of measure object.Therefore, it is easy to promote the resistance measurement precision for utilizing four terminals measurement methods.
Fig. 3 is the flow chart for indicating an example of resistance measurement method of one embodiment of the present invention.Firstly, resistance obtains
Portion 51 makes current probe Pc1 and detection probe Pv1 mobile by omitting the driving mechanism of attached drawing, and contact chip lateral electrode A1
(step S1: process (a)).Then, resistance acquisition unit 51 makes current probe Pc2, detection by omitting the driving mechanism of attached drawing
Probe Pv2 and grounded probe PG is mobile, and contacts export-oriented electrode A 2 (step S2: process (b), process (d)).
Then, resistance acquisition unit 51 makes switch 61, switch 62, switch 63, switch 64, switch 65 connect (step S3).Step
Rapid S2, step S3 are equivalent to an example of process (d).Then, resistance acquisition unit 51 exports the first electricity by constant current source CS1
Flow valuve I1(=Is) electric current, the second current value I is exported by constant current source CS22(≒I1) electric current (step S4: process
(c))。
Then, voltage detection department 4 will test the voltage between probe Pv1, detection probe Pv2 as measurement voltage Vs to measure
(step S5: process (e)).Then, resistance acquisition unit 51 calculates the resistance value Rx (step S6) of measure object according to formula (1), and
This resistance value Rx is shown for example, by omitting the display device of attached drawing.
More than, it, can be according to institute in the state of making common-mode voltage substantially become zero by step S1~step S6 processing
The measurement voltage Vs of measurement calculates resistance value Rx, therefore is easy to promote the calculating precision of resistance value Rx.Therefore, it is easy to promote benefit
With the resistance measurement precision of four terminals measurement methods.
Then, (step S7) is compared with a reference value Rref to resistance value Rx by inspecting substrate portion 52.Moreover, if
The less than a reference value Rref of resistance value Rx (being in step S7 (YES)) then determines that wiring A3 is good (step by inspecting substrate portion 52
S8).On the other hand, if value Rref or more ((NO) no in step S7) on the basis of resistance value Rx, determined by inspecting substrate portion 52
Wiring A3 is bad (step S9), and shows that these determine as a result, and at end for example, by the display device of omission attached drawing
Reason.
For other wirings A3, processing identical with step S1~step S9 is also repeated, the survey in substrate A thus can be measured
Determine the resistance value Rx of all wiring A3 of object, and can check whether substrate A is non-defective unit.
In addition, making common-mode voltage substantially become zero since common-mode voltage is noise and being equivalent to promotion measurement voltage Vs
Noise (Signal/Noise, S/N) ratio.Therefore, according to the base board checking device 1 and resistance measurement method, S/N can be promoted
Than and promoted according to measurement voltage Vs resistance value Rx measurement accuracy.
As the method for the S/N ratio for promoting measurement voltage Vs, make it is contemplated that increasing the current value of measurement electric current to increase
For the measurement voltage of signal component.But if recorded in Fig. 1 of Japanese Kokai special open 2004-184374 bulletin
The current value for increasing measurement electric current in circuit, then in the contact resistance of the contact probe P2 of negative side and measure object body M
The voltage of generation increases, as a result, common-mode voltage increases.Therefore, in Japanese Kokai special open 2004-184374 bulletin
S/N ratio is promoted in the circuit recorded in Fig. 1 to be not easy to.
On the other hand, according to base board checking device 1, by making common-mode voltage substantially become zero, measurement voltage Vs can be promoted
S/N ratio, therefore be easy to be promoted S/N than and promote the measurement accuracy of resistance value Rx.
In addition, in the circuit recorded in Fig. 1 of Japanese Kokai special open 2004-184374 bulletin, to part
In the case that the measure objects such as built-in substrate or electronic component carry out resistance measurement, if generating common-mode voltage in measurement, have
When relative to electronic components such as the semiconductor elements being assembled into part built-in substrate, because of the parasitic capacitance with measure object
The relationship of charging charge and potential difference is generated between measure object and base board checking device.In this case, exist because of institute
The worry stated potential difference and voltage stress or current stress is caused to be applied in electronic component, and damage electronic component.
Fig. 4 is the IC indicated to having signal terminal P1~signal terminal Pn, power supply terminal Vcc and ground terminal GND
The explanatory diagram of the connection of base board checking device 1 when (Integrated Circuit) 100 is checked.As described above, in benefit
It is surveyed with the resistance without using two-terminal method or four-terminal method before two constant current sources (CS1, CS2) and grounded probe PG
In fixed, the terminal for the IC for contacting current probe Pc1, current probe Pc2 or detection probe Pv1, detection probe Pv2 is applied
Common-mode voltage.There is the parasitic capacitance Co as caused by IC 100 itself or outside wiring in IC 100, therefore is applied to IC
Terminal in common-mode voltage around entering in parasitic capacitance Co, and stress is applied in IC 100 or generates breakage.
In this case, it is contemplated that gradually increasing measurement with electric current gradually increase common-mode voltage, thus
It is gradually charged by common-mode voltage to parasitic capacitance, thus reduces the current value flowed into parasitic capacitance, and remove
Potential difference between measure object and base board checking device.Thus, it is believed that the damage of electronic component can be prevented.But make
Measurement is gradually increased in the method gradually to charge to parasitic capacitance with electric current, it is necessary in the parasitism electricity of measure object
Voltage determination is waited before appearance is charged by common-mode voltage and potential difference disappears, measures required time increase.
But according to base board checking device 1, since common-mode voltage substantially becomes zero, there is no need to posting in measure object
Voltage determination is waited before raw capacitor is charged by common-mode voltage and potential difference disappears.As a result, being easy to shorten resistance measurement
Time and review time.
In addition, as the method for making common-mode voltage become zero, it is contemplated that following method: such as Japanese Kokai special open
As being recorded in 2007-333598 bulletin, by the reversion amplifying circuit of common-mode voltage feedback to operational amplifier, from there through
Common-mode voltage is eliminated in the output of operational amplifier.But in such method, generates the resistance components by feed circuit or post
Time delay, the low-response of operational amplifier etc. of feedback caused by raw capacitor, therefore eliminate the common mode changed astatically
Voltage is not easy to.
On the other hand, it according to base board checking device 1, is concatenated connection and its tie point is set as the constant of earthing potential
Current source CS1 and constant current source CS2 are intended to maintain the first current value I respectively1, the second current value I2Output electric current as a result, altogether
Mode voltage substantially becomes zero, therefore easily reduces common-mode voltage.
In addition, base board checking device 1 is also possible to the resistance measurement device for not having inspecting substrate portion 52, can not also hold
Row step S7~step S9.Alternatively, it is also possible to not have scanner 6.In addition, grounded probe PG may not be defined in the export-oriented electricity of contact
Pole A2, the i.e. example of one end of the negative side of wiring A3 (conductor).Grounded probe PG preferably contacts the one of the negative side of wiring A3
End, but the chip side electrode A 1 of one end of side of the positive electrode as wiring A3 can also be contacted, the centre of wiring A3 can also be contacted
Part.
It is surveyed in addition, current probe Pc1, current probe Pc2 and detection probe Pv1, detection probe Pv2 may not be defined in contact
Determine the example at the both ends of the wiring A3 (conductor) of object.Even if in current probe Pc1, current probe Pc2 and detection probe
In the case that Pv1, detection probe Pv2 contact the middle section of measure object, current probe Pc1 can also be measured and detection is visited
Resistance value between the contact site and current probe Pc2 of needle Pv1 and the contact site of detection probe Pv2.
(second embodiment)
Then, being said using the base board checking device 1a of resistance measurement device to second embodiment of the present invention
It is bright.Fig. 5 be indicate the base board checking device 1a using resistance measurement device of second embodiment of the present invention structure one
The block diagram of example.Fig. 6 is the explanatory diagram for indicating the equivalent circuit of base board checking device 1a shown in Fig. 5 and substrate A.Fig. 5, figure
Base board checking device 1a and base board checking device 1 shown in Fig. 1 shown in 6 are different in the following aspects.
Although that is, base board checking device 1a shown in Fig. 5, Fig. 6 and 1 difference of base board checking device are that do not have ground connection
Probe PG and switch 65, but cathode (-) terminal of voltage detection department 4 is connect with ground.In the case, by voltage detection department
The wiring that 4 cathode (-) terminal is connect with ground is equivalent to an example of grounding parts.In addition, not making grounded probe in step s 2
PG contacts export-oriented electrode A 2, in step s3 connects also switch 65.
Other structures are identical as base board checking device 1 shown in Fig. 1, therefore the description thereof will be omitted.It is filled by inspecting substrate
Set 1a, also with base board checking device 1 the case where in the same manner as, be concatenated connection and its tie point be set as the constant of earthing potential
Current source CS1 and constant current source CS2 are intended to maintain the first current value I respectively1, the second current value I2Output electric current.As a result,
The current value I flowed in resistance Rv23Substantially become zero, common-mode voltage substantially becomes zero, therefore easily reduces common-mode voltage.
In addition, according to base board checking device 1a, without being separately arranged grounded probe PG, therefore with 1 phase of base board checking device
Than easily reducing cost.In addition, the number of probes of contact wiring A3 is two, therefore match with three probes must be made to contact
The base board checking device 1 of line A3 is compared, and is easy to contact probe.
Although however, the first current value I of constant current source CS1, constant current source CS21With the second current value I2Substantially
Identical (I1≒I2), but generated in the presence of because of the manufacture deviation or current control accuracy of constant current source CS1, constant current source CS2
The worry of a little difference.When in the first current value I1With the second current value I2Between when producing difference, be equivalent to the current value of this difference
I3Electric current flowed in the resistance Rv2 shown in Fig. 6.In the case, if the resistance value of resistance Rv2 is set as resistance value
Rv2, then Rv is generated in resistance Rv22×I3Voltage.This voltage is included in the measurement voltage Vs measured by voltage detection department 4
In, therefore generate the evaluated error of measurement voltage Vs.
On the other hand, in base board checking device 1 shown in Fig. 2, when in the first current value I1With the second current value I2It
Between when producing difference, be equivalent to the current value I of this difference3Electric current flowed in resistance RG.In base board checking device 1, because of electricity
The voltage that stream is flowed in resistance RG and generated is not included in measurement voltage Vs.Therefore, it is being difficult to generate by the first current value
I1With the second current value I2Between difference caused by measurement accuracy error on this point, base board checking device 1 is filled than inspecting substrate
It is more preferable to set 1a.
Claims (8)
- The resistance for measuring conductor 1. a kind of resistance measurement device, the resistance measurement device be characterized in that include:First current probe and the second current probe, for contacting the conductor and flowing out defined measurement electric current；First detection probe and the second detection probe, for contacting the conductor and detecting through the measurement electric current in institute State the voltage generated in conductor；Voltage detection department detects the voltage between first detection probe and second detection probe；The anode of first constant current source, first constant current source is connect with first current probe, and described first is permanent The cathode of constant current source is connect with ground, exports the electric current for the first current value being previously set；Second constant current source, the anode of second constant current source and the cathode of first constant current source and described Face connection is simultaneously connected in series with first constant current source, and the cathode of second constant current source and second electric current are visited Needle connection, the electric current of output and the second substantially the same current value of first current value；The predetermined portion in the conductor is connected with the ground in grounding parts；AndResistance acquisition unit obtains the resistance according to the voltage detected by the voltage detection department.
- 2. resistance measurement device according to claim 1, which is characterized in thatThe grounding parts include the grounded probe for contacting the predetermined portion, andThe grounded probe is connect with the ground.
- 3. resistance measurement device according to claim 1, which is characterized in thatThe grounding parts are the wirings for connecting second detection probe with the ground.
- 4. a kind of base board checking device, characterized by comprising:Resistance measurement device according to any one of claim 1 to 3；AndInspecting substrate portion carries out described in the conduct being formed on substrate according to the resistance measured by the resistance measurement device The inspection of the wiring of conductor.
- 5. a kind of resistance measurement method is the resistance measurement method for measuring the resistance of conductor, the spy of the resistance measurement method Sign is(a) process for making the first current probe contact the conductor with the first detection probe；(b) make that the second current probe contacts the conductor with the second detection probe with first current probe and described first The process of the position of the contact position separation of detection probe；(c) it is connect by anode with first current probe, the first constant current source that cathode is connect with ground exports thing The electric current of the first current value first set, by anode connect with the cathode of first constant current source and the ground and with First constant current source is connected in series, the second constant current source that cathode is connect with second current probe exporting and The process of the electric current of the second substantially the same current value of first current value；(d) process that the predetermined portion in the conductor is connected with the ground；(e) process of the voltage between first detection probe and second detection probe is detected；And(f) process that the resistance is obtained according to voltage detected by the process by (e).
- 6. resistance measurement method according to claim 5, which is characterized in thatThe process of (d) is the process for making the grounded probe connected with the ground contact the predetermined portion.
- 7. resistance measurement method according to claim 5, which is characterized in thatSecond detection probe is connect with the ground, andThe process that the process of (b) doubles as (d).
- 8. resistance measurement method according to claim 6, which is characterized in thatThe one end of the conductor is provided with first electrode, is provided with first described in area ratio in the other end of the conductor The great second electrode of electricity,The process of (a) is the work for making first current probe contact the first electrode with first detection probe Sequence,The process of (b) is the work for making second current probe contact the second electrode with second detection probe Sequence,The process of (d) is to make the grounded probe contact described second using the second electrode as the predetermined portion The process of electrode.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017186641A JP6765125B2 (en) | 2017-09-27 | 2017-09-27 | Resistance measuring device, substrate inspection device, and resistance measuring method |
| JP2017-186641 | 2017-09-27 |
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| JP (1) | JP6765125B2 (en) |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110832329A (en) * | 2017-07-05 | 2020-02-21 | 罗伯特·博世有限公司 | Device and method for checking the functional validity of a system resistor of a battery system |
| CN112505102A (en) * | 2019-09-16 | 2021-03-16 | 力成科技股份有限公司 | Method for measuring resistance of package substrate and package substrate thereof |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11346883B2 (en) * | 2019-11-05 | 2022-05-31 | Formfactor, Inc. | Probe systems and methods for testing a device under test |
| TWI824686B (en) * | 2022-08-31 | 2023-12-01 | 牧德科技股份有限公司 | Detection circuit |
| WO2024106052A1 (en) * | 2022-11-17 | 2024-05-23 | 三菱電機株式会社 | Semiconductor testing device, semiconductor testing method, and method for producing semiconductor device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TW201915500A (en) | 2019-04-16 |
| JP2019060768A (en) | 2019-04-18 |
| KR20190036472A (en) | 2019-04-04 |
| JP6765125B2 (en) | 2020-10-07 |
| CN109557376B (en) | 2023-05-16 |
| TWI793179B (en) | 2023-02-21 |
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