CN109551360A - Dressing method, trimming device, polishing pad and the double-sided polisher of polishing pad - Google Patents
Dressing method, trimming device, polishing pad and the double-sided polisher of polishing pad Download PDFInfo
- Publication number
- CN109551360A CN109551360A CN201811609439.9A CN201811609439A CN109551360A CN 109551360 A CN109551360 A CN 109551360A CN 201811609439 A CN201811609439 A CN 201811609439A CN 109551360 A CN109551360 A CN 109551360A
- Authority
- CN
- China
- Prior art keywords
- polishing plate
- polishing
- polishing pad
- plate
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/12—Dressing tools; Holders therefor
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention provides dressing method, trimming device, polishing pad and the double-sided polisher of a kind of polishing pad, the dressing method includes: the polishing plate and lower polishing plate deformation by controlling double-sided polisher, so that the spacing between polishing plate and the lower polishing plate, is in increasing trend from close rotation axis to the direction far from rotation axis；And the dressing tool by being installed between upper polishing pad and lower polishing pad modifies the surface of upper polishing pad and lower polishing pad, has the ideal working clearance between the upper polishing pad and lower polishing pad after finishing, improves the polishing performance of double-sided polisher.Also, during modifying polishing pad, polishing plate and lower polishing plate deformation only need to be controlled, without the auxiliary of other carriers, rapidly and efficiently, and dressing accuracy is high for dressing process.
Description
Technical field
The present invention relates to polishing technology field more particularly to a kind of dressing method of polishing pad, trimming device, polishing pad and
Double-sided polisher.
Background technique
In order to meet manufacturer to the high request of silicon chip surface flatness, in wafer fabrication processes, develop a series of
For improving the flatness of wafer and reducing the process flow of roughness, wherein polishing technology is typically due to chemistry and machinery two
Kind mode combines, and can control the final surface parameter of wafer well.
Twin polishing (DSP) is exactly that the twin polishing of wafer is carried out in the way of above-mentioned chemical machinery, wherein polished crystalline substance
Circle is placed in the carrier between polishing plate and lower polishing plate, wherein polishing plate surface is pasted with above and below respectively above and below
Polishing pad.During the polishing process, carrier is placed at the gap between upper and lower polishing pad, and this gap, which is referred to as, to work
Gap, the carrier is by the driving of rotating device, around the rotary shaft of rotating device while around own axes rotation
Line revolves, and hereinafter referred to as this movement is cycloid motion.One main purpose of the twin polishing of wafer is to improve crystalline substance
Round surface characteristics parameter, but in polishing processing, due to the journey that wafer falls into the degree of polishing pad and edge is ground
Degree is different, to be easy to happen edge rolling phenomenon, and then reduces the surface smoothness of Silicon Wafer.
In order to solve this problem, propose in the related technology by modify pad interface pattern come change polishing pad it
Between working clearance.However, during modifying polishing pad, it usually needs be fixedly mounted between upper and lower polishing plate wedge-shaped
Load piece or the different spacer etc. of height, to obtain working clearance different polishing pad, although above-mentioned technology can lead to
Cross and change working clearance of polishing pad and realize the raising of silicon chip surface flatness, but in dressing process, on the one hand, load piece or
The fixed installation of spacer is more complicated, waste of time, still further aspect, in dressing process, loads piece or spacer is also same
Sample can be worn, so that the dressing accuracy of polishing pad reduces.
Summary of the invention
In view of this, the present invention provides dressing method, trimming device, polishing pad and the twin polishing dress of a kind of polishing pad
It sets, can quickly and efficiently modify polishing pad, and dressing accuracy is high.
In order to solve the above technical problems, the present invention provides a kind of dressing method of the polishing pad of double-sided polisher, it is described
Double-sided polisher includes: the polishing plate being oppositely arranged and lower polishing plate, the upper polishing pad being set in the polishing plate,
The lower polishing pad being set on the lower polishing plate has the rotation of common axis of rotation line with the polishing plate and lower polishing plate
Rotary device；The dressing method includes:
Set-up procedure: controlling the polishing plate and the lower polishing plate deformation so that the polishing plate and it is described under
Spacing between polishing plate is in increasing trend from the close rotation axis to the direction far from the rotation axis；
Pre-shaping step: the polishing plate, the lower polishing plate and rotating device rotation are controlled, is installed on driving
Dressing tool between the upper polishing pad and the lower polishing pad surrounds the axis rotation of itself and simultaneously around the rotary shaft
Line revolution, is modified, upper polishing pad and lower polishing after being modified with the surface to the upper polishing pad and lower polishing pad
Pad, the working clearance between upper polishing pad and lower polishing pad after finishing, from close to the rotation axis to the separate rotation
Taper off trend on the direction of axis.
Optionally, the set-up procedure includes:
The adjustment part of the polishing plate and lower polishing plate and pneumatic hydraulic system is connected, wherein the polishing plate
It is connect respectively with multiple adjustment parts with lower polishing plate；
The adjustment part deformation is controlled by the pneumatic hydraulic system, to control the polishing plate and the lower polishing
Plate deformation, so that the spacing between the polishing plate and the lower polishing plate, from the close rotation axis to far from described
It is in increasing trend on the direction of rotation axis.
Optionally, the polishing plate and lower polishing plate are spliced by the sub- polishing plate of muti-piece, each sub- polishing
Plate connects at least one adjustment part, described to control the adjustment part deformation by the pneumatic hydraulic system, described to control
Polishing plate and the lower polishing plate deformation include:
Each adjustment part thermal expansion is controlled by the pneumatic hydraulic system or is heat-shrinked, to adjust each sub- throwing
The tilt angle of tabula rasa, to control the polishing plate and the lower polishing plate deformation.
Optionally, the set-up procedure includes:
At at least two positions on the surface of the polishing plate and/or the surface of the lower polishing plate at least two
Range sensor is set at position；
According to the distance that the range sensor incudes, the polishing plate and the lower polishing plate deformation are controlled, so that
Spacing between the polishing plate and the lower polishing plate, the side from close to the rotation axis to far from the rotation axis
It is upwards in increasing trend.
Optionally, after the pre-shaping step further include:
Restore the deformation of the polishing plate and the lower polishing plate, so that the polishing plate and the lower polishing plate
Surface is parallel.
Optionally, the method also includes:
Polishing step: removing the dressing tool, and the carrier for being used to carry polished workpiece is installed on described
In working clearance between polishing pad and the lower polishing pad；Polished workpiece is placed in the carrier, described in control
Polishing plate, lower polishing plate and rotating device rotation, to drive the carrier around the axis rotation of itself and simultaneously around institute
Rotation axis revolution is stated, to polish to the polished workpiece.
Optionally, the set-up procedure and the pre-shaping step are in double-sided polisher execution first time polishing step
It executes before；
And/or
The set-up procedure and pre-shaping step execute after the every execution n times polishing step of the double-sided polisher, and N is big
In 1.
The present invention also provides a kind of trimming device of the polishing pad of double-sided polisher, the double-sided polisher includes:
The polishing plate being oppositely arranged and lower polishing plate, the upper polishing pad being set in the polishing plate are set to the lower polishing
Lower polishing pad on plate has the rotating device of common axis of rotation line with the polishing plate and lower polishing plate；The finishing
Device includes:
Module is adjusted, for controlling the polishing plate and the lower polishing plate deformation, so that the polishing plate and institute
The spacing between lower polishing plate is stated, is in increasing trend on the direction from close to the rotation axis to far from the rotation axis；
Repair module, for controlling the polishing plate, the lower polishing plate and rotating device rotation, to drive peace
Loaded on the dressing tool between the upper polishing pad and the lower polishing pad around the axis rotation of itself and simultaneously around the rotation
Shaft axis revolution, is modified with the surface to the upper polishing pad and lower polishing pad, and the upper polishing pad after being modified is under
Polishing pad, the working clearance between upper polishing pad and lower polishing pad after finishing, from the close rotation axis to far from described
Taper off trend on the direction of rotation axis.
The present invention also provides a kind of polishing pad, the polishing pad in a ring, including first surface and second surface, described
One surface is even curface, and the height of the second surface is presented from the inward flange to outer peripheral direction of the polishing pad
Increasing trend.
The present invention also provides a kind of double-sided polishers to be set to including the polishing plate being oppositely arranged and lower polishing plate
Upper polishing pad in the polishing plate, the lower polishing pad being set on the lower polishing plate, with the upper polishing pad and lower throwing
Light pad has the rotating device of common axis of rotation line；The upper polishing pad and lower polishing pad are above-mentioned polishing pad.
The advantageous effects of the above technical solutions of the present invention are as follows:
By controlling the polishing plate and lower polishing plate deformation of double-sided polisher, so that polishing plate and the lower polishing
Spacing between plate is in increasing trend from close rotation axis to the direction far from rotation axis；And by being installed on upthrow
Dressing tool between light pad and lower polishing pad modifies the surface of upper polishing pad and lower polishing pad, the upper polishing after finishing
There is the ideal working clearance between pad and lower polishing pad, improve the polishing performance of double-sided polisher.Also, it is thrown in finishing
During light pad, polishing plate and lower polishing plate deformation only need to be controlled, it is trimmed without the auxiliary of other carriers
Rapidly and efficiently, and dressing accuracy is high for journey.
Detailed description of the invention
Fig. 1 is the flow diagram of the dressing method of the polishing pad of double-sided polisher provided in an embodiment of the present invention；
Fig. 2 is the structural schematic diagram for not modifying the double-sided polisher before polishing pad of the embodiment of the present invention；
Fig. 3 is the structural schematic diagram for having modified the double-sided polisher after polishing pad of the embodiment of the present invention；
Fig. 4 is the deformation schematic diagram of the polishing plate of the embodiment of the present invention；
Fig. 5 is the schematic diagram after the polishing plate deformation of the embodiment of the present invention.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 1, Fig. 2 and Fig. 3 are please referred to, Fig. 1 is the finishing of the polishing pad of double-sided polisher provided in an embodiment of the present invention
The flow diagram of method, Fig. 2 are the structural representation for not modifying the double-sided polisher before polishing pad of the embodiment of the present invention
Figure, Fig. 3 are the structural schematic diagram for having modified the double-sided polisher after polishing pad of the embodiment of the present invention, twin polishing dress
Setting includes: the polishing plate 1 being oppositely arranged and lower polishing plate 2, and the upper polishing pad 3 being set in the polishing plate 1 is set to
Lower polishing pad 4 on the lower polishing plate 2 has the rotation of common axis of rotation line 9 with the polishing plate 1 and lower polishing plate 2
Rotary device；The dressing method includes:
Set-up procedure 11: controlling the polishing plate 1 and 2 deformation of lower polishing plate, so that the polishing plate 1 and institute
The spacing between lower polishing plate 2 is stated, is in be incremented by the direction from close to the rotation axis 9 to far from the rotation axis 9
Gesture；
In the embodiment of the present invention, optionally, the polishing plate 1 and lower polishing plate 2 are ring-type, the polishing plate 1
Spacing between the lower polishing plate 2 is presented from the rotation axis 9 to the direction of the separate rotation axis 9
Increasing trend is in increasing trend that is, from the inward flange to outer peripheral direction of polishing plate 1 and lower polishing plate 2.On that is,
The distance D of polishing plate 1 and lower polishing plate 2 in inside edgei, less than the distance D in outer edgeo。
In the embodiment of the present invention, optionally, the spacing between the polishing plate 1 and the lower polishing plate 2, from close to rotation
Linearly it is incremented by shaft axis 9 to the direction far from rotation axis 9.That is, from the inward flange of polishing plate 1 and lower polishing plate 2 to
Linearly it is incremented by outer peripheral direction.
Pre-shaping step 12: the polishing plate 1, lower polishing plate 2 and rotating device rotation are controlled, is installed on driving described
Dressing tool 5 between upper polishing pad 3 and lower polishing pad 4 surrounds the axis rotation of itself and simultaneously around 9 public affairs of rotation axis
Turn, is modified with the surface to the upper polishing pad 3 and lower polishing pad 4, due to the polishing plate 1 and the lower polishing plate
Spacing between 2, from being in increasing trend on the rotation axis to the direction of the separate rotation axis, so modifying
In the process, the surface abrasion amount of upper polishing pad 3 and lower polishing pad 4 is from close to the rotation axis 9 to the separate rotation axis 9
Direction on taper off trend so that the working clearance between the upper polishing pad 3 and lower polishing pad 4 after finishing, from close
Taper off trend on the rotation axis 9 to the direction far from the rotation axis 9.
In the embodiment of the present invention, optionally, the working clearance between the upper polishing pad 3 and lower polishing pad 4, from close to rotation
Linearly successively decrease on shaft axis 9 to the direction far from rotation axis 9.
Working clearance between upper polishing pad 3 and lower polishing pad 4 is from close to the rotation axis 9 to the separate rotary shaft
Taper off trend on the direction of line 9, is conducive to the flatness for improving polished workpiece, the fringe region of especially polished workpiece
Flatness.
In the embodiment of the present invention, optionally, the rotating device includes: internal gear 8 and outer tooth ring 7, the dressing tool 5
The circle or ring device with external tooth, dressing tool 5 between internal gear 8 and outer tooth ring 7, and respectively with internal gear 8
It is ratcheting with outer tooth ring 7, it is rotated by control internal gear 8 and outer tooth ring 7, dressing tool 5 can be driven to surround the axis of itself certainly
Turn and revolve simultaneously around the rotation axis 9, is modified with the surface to the upper polishing pad 3 and lower polishing pad 4.
In the embodiment of the present invention, optionally, the dressing tool 5 can be the two-sided dressing tool with abrasive body 6, when
Around itself axis rotation and simultaneously around the rotation axis 9 revolve when, abrasive body 6 can be to upper polishing pad 3 and lower polishing
The material of pad 4 is worn, and the degree of wear is different at different locations, to change between upper polishing pad 3 and lower polishing pad 4
Spacing, obtain the working clearance of gradual change.
In the embodiment of the present invention, optionally, the upper polishing pad 3 and lower polishing pad 4 are ring-type, the upper polishing pad 3
Spacing between lower polishing pad 4 tapers off from the rotation axis 9 to the direction of the separate rotation axis 9
Gesture, i.e. working clearance taper off trend from the inward flange to outer peripheral direction of upper polishing pad 3 and lower polishing pad 4.Namely
Say, upper polishing pad 3 and lower polishing pad 4 inside edge distance Di ', greater than the distance Do ' in outer edge.
In the embodiment of the present invention, it is preferable that upper polishing pad 3 and lower polishing pad 4 are in the distance Di ' of inside edge and in outside
The difference of distance Do ' at edge is 10um-250um, further preferably 30um-150um.
In the embodiment of the present invention, by controlling the polishing plate and lower polishing plate deformation of double-sided polisher, so that upthrow
Spacing between tabula rasa and the lower polishing plate is in increasing trend from close rotation axis to the direction far from rotation axis；
And the dressing tool by being installed between upper polishing pad and lower polishing pad repairs the surface of upper polishing pad and lower polishing pad
It is whole, there is the ideal working clearance between the upper polishing pad and lower polishing pad after finishing, improve the polishing of double-sided polisher
Performance.Also, during modifying polishing pad, polishing plate and lower polishing plate deformation only need to be controlled, without it
The auxiliary of his carrier, rapidly and efficiently, and dressing accuracy is high for dressing process.Meanwhile by adjusting the work between upper and lower polishing pad
The flatness of polished workpiece is improved in gap, without spending enormous expenditure.
In some embodiments of the present invention, optionally, above-mentioned set-up procedure may include:
Step A1: the polishing plate 1 and lower polishing plate 2 are connect with the adjustment part of pneumatic hydraulic system, wherein described
Polishing plate 1 and lower polishing plate 2 are connect with multiple adjustment parts respectively；
Step A2: controlling the adjustment part deformation by the pneumatic hydraulic system, come control polishing plate 1 and it is described under
2 deformation of polishing plate so that the spacing between the polishing plate 1 and the lower polishing plate 2, from close to the rotation axis 9 to
It is in increasing trend on direction far from the rotation axis 9.
In the embodiment of the present invention, the pneumatic hydraulic system can also include proportioning valve and cylinder, by proportioning valve to gas
The effect of cylinder controls the gas hot expanding type in cylinder or thermal contraction, to control adjustment part deformation, and drives the upper polishing
Plate 1 and 2 deformation of lower polishing plate.
In the embodiment of the present invention, the proportioning valve can connect high-speed central processor, to guarantee the accuracy of adjustment
With the speed of adjustment.
Fig. 4 and Fig. 5 are please referred to, Fig. 4 is the deformation schematic diagram of the polishing plate of the embodiment of the present invention, and Fig. 5 is that the present invention is real
Schematic diagram after applying the polishing plate deformation of example, after it can be seen that 1 deformation of polishing plate in Fig. 4 and Fig. 5, upper polishing
1 outer end of plate (Do/2) at a distance from central plane M, hence it is evident that greater than inner end at a distance from central plane M (Di/2), the center is flat
When face, that is, polishing plate 1 and lower polishing plate 2 are arranged in parallel, the plane where the midpoint of spacing between the two.
In the embodiment of the present invention, optionally, the polishing plate 1 and lower polishing plate 2 by the sub- polishing plate splicing of muti-piece and
At each sub- polishing plate connects at least one adjustment part, described to control the adjustment by the pneumatic hydraulic system
Part deformation, come control polishing plate 1 and 2 deformation of lower polishing plate include: controlled by the pneumatic hydraulic system it is each described
Adjustment part thermal expansion is heat-shrinked, to adjust the tilt angle of each sub- polishing plate, to control polishing plate 1 and the lower throwing
2 deformation of tabula rasa.
In the embodiment of the present invention, in order to accurately adjust the spacing between the polishing plate 1 and the lower polishing plate 2, institute
Stating set-up procedure may include:
Step B1: at least two positions on the surface of the polishing plate 1 and/or the surface of lower polishing plate 2 extremely
Range sensor is set at few two positions；
Step B2: the distance incuded according to the range sensor controls the polishing plate 1 and the lower polishing plate 2
Deformation, so that the spacing between the polishing plate 1 and the lower polishing plate 2, from the close rotation axis 9 to far from described
It is in increasing trend on the direction of rotation axis 9.
In the embodiment of the present invention, optionally, can also include: after the pre-shaping step
Step 13: restore the polishing plate 1 and 2 deformation of lower polishing plate so that the polishing plate 1 and it is described under
The surface of polishing plate 2 is parallel, i.e. the spacing of surface everywhere is equal, to carry out subsequent polishing step.
In the embodiment of the present invention, before the pre-shaping step further include: be substituted for carrying wait throw by the dressing tool 5
The carrier of light workpiece was installed in the working clearance between the upper polishing pad 3 and the lower polishing pad 4.
In the embodiment of the present invention, referring to FIG. 3, the carrier 10 is the circular apparatus with external tooth, surface has
For carrying the groove of polished workpiece 11, carrier 10 and internal gear 8 and outer tooth ring 7 are ratcheting, by control internal gear 8 and outside
Ring gear 7 rotates, and can drive carrier 10 around the axis rotation of itself and revolve simultaneously around the rotation axis 9, to institute
Polished workpiece is stated to be polished.
In the embodiment of the present invention, optionally, the dressing method further include:
Polishing step 14: polished workpiece being placed in the carrier of the double-sided polisher, controls the upthrow
Tabula rasa, the lower polishing plate and rotating device rotation, with driving be installed on the upper polishing pad and the lower polishing pad it
Between carrier around itself axis rotation and simultaneously around the rotation axis revolve, to be thrown to the polished workpiece
Light.
In the embodiment of the present invention, polishing workpiece is treated using the polishing pad after finishing and is polished, can be mitigated polished
The generation of the collapsing of the edges phenomenon of workpiece during the polishing process, improves its integral smoothness.
In the embodiment of the present invention, optionally, the set-up procedure and the pre-shaping step are held in the double-sided polisher
It is executed before row first time polishing step；And/or
The set-up procedure and pre-shaping step execute after the every execution n times polishing step of the double-sided polisher, and N is big
In 1.
That is, can be modified before first time polishes to polishing pad, can also after multiple polishing,
Polishing pad is modified, avoids causing the working clearance to change the abrasion of polishing pad during the polishing process.
Rotation axis 9 in above-described embodiment is located at the center position of polishing plate 1 and lower polishing plate 2.
The embodiment of the present invention also provides a kind of trimming device of the polishing pad of double-sided polisher, the double-sided polisher
Include: the polishing plate being oppositely arranged and lower polishing plate, the upper polishing pad being set in the polishing plate, be set to it is described under
Lower polishing pad on polishing plate has the rotating device of common axis of rotation line with the polishing plate and lower polishing plate；It is described
Trimming device includes:
Module is adjusted, for controlling the polishing plate and the lower polishing plate deformation, so that the polishing plate and institute
The spacing between lower polishing plate is stated, is in increasing trend on the direction from close to the rotation axis to far from the rotation axis；
Repair module, for controlling the polishing plate, the lower polishing plate and rotating device rotation, to drive peace
Loaded on the dressing tool between the upper polishing pad and the lower polishing pad around the axis rotation of itself and simultaneously around the rotation
Shaft axis revolution, is modified with the surface to the upper polishing pad and lower polishing pad, and the upper polishing pad after being modified is under
Polishing pad, the working clearance between upper polishing pad and lower polishing pad after finishing, from the close rotation axis to far from described
Taper off trend on the direction of rotation axis.
The embodiment of the present invention also provides a kind of polishing pad, the polishing pad in a ring, including first surface and second surface,
The first surface is even curface, and the height of the second surface is from the inward flange of the polishing pad to outer peripheral direction
Upper is in increasing trend.
The embodiment of the present invention also provides a kind of double-sided polisher, comprising: the polishing plate being oppositely arranged and lower polishing plate,
The upper polishing pad being set in the polishing plate, the lower polishing pad being set on the lower polishing plate, with the upper polishing pad
There is the rotating device of common axis of rotation line with lower polishing pad；The upper polishing pad and lower polishing pad are above-mentioned polishing pad.
In the above embodiment of the present invention, the polished workpiece can be wafer.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of dressing method of the polishing pad of double-sided polisher, which is characterized in that the double-sided polisher includes: opposite
The polishing plate of setting and lower polishing plate, the upper polishing pad being set in the polishing plate are set on the lower polishing plate
Lower polishing pad, there is the rotating device of common axis of rotation line with the polishing plate and lower polishing plate；The dressing method
Include:
Set-up procedure: controlling the polishing plate and the lower polishing plate deformation, so that the polishing plate and the lower polishing
Spacing between plate is in increasing trend from the close rotation axis to the direction far from the rotation axis；
Pre-shaping step: the polishing plate, the lower polishing plate and rotating device rotation are controlled, is installed on driving described
Dressing tool between upper polishing pad and the lower polishing pad surrounds the axis rotation of itself and simultaneously around the rotation axis public affairs
Turn, is modified with the surface to the upper polishing pad and lower polishing pad, upper polishing pad and lower polishing pad after being modified are repaired
The working clearance between upper polishing pad and lower polishing pad after whole, from close to the rotation axis to the separate rotation axis
Taper off trend on direction.
2. the method as described in claim 1, which is characterized in that the set-up procedure includes:
The adjustment part of the polishing plate and lower polishing plate and pneumatic hydraulic system is connected, wherein the polishing plate is under
Polishing plate is connect with multiple adjustment parts respectively；
The adjustment part deformation is controlled by the pneumatic hydraulic system, to control the polishing plate and the lower polishing plate shape
Become, so that the spacing between the polishing plate and the lower polishing plate, from close to the rotation axis to the separate rotation
It is in increasing trend on the direction of axis.
3. method according to claim 2, which is characterized in that the polishing plate and lower polishing plate are by the sub- polishing plate of muti-piece
It is spliced, each sub- polishing plate connects at least one adjustment part, described to control institute by the pneumatic hydraulic system
Adjustment part deformation is stated, to control the polishing plate and the lower polishing plate deformation includes:
Each adjustment part thermal expansion is controlled by the pneumatic hydraulic system or is heat-shrinked, to adjust each sub- polishing plate
Tilt angle, to control the polishing plate and the lower polishing plate deformation.
4. the method as described in claim 1, which is characterized in that the set-up procedure includes:
At at least two positions on the surface of the polishing plate and/or at least two positions on the surface of the lower polishing plate
Place's setting range sensor；
According to the distance that the range sensor incudes, the polishing plate and the lower polishing plate deformation are controlled, so that described
Spacing between polishing plate and the lower polishing plate, from the rotation axis to the direction of the separate rotation axis
In increasing trend.
5. the method as described in claim 1, which is characterized in that after the pre-shaping step further include:
Restore the deformation of the polishing plate and the lower polishing plate, so that the surface of the polishing plate and the lower polishing plate
In parallel.
6. the method as described in claim 1, which is characterized in that further include:
Polishing step: the dressing tool is removed, and the carrier for being used to carry polished workpiece is installed on the upper polishing
In working clearance between pad and the lower polishing pad；Polished workpiece is placed in the carrier, the upthrow is controlled
Tabula rasa, lower polishing plate and rotating device rotation, to drive the carrier around the axis rotation of itself and simultaneously around the rotation
Shaft axis revolution, to be polished to the polished workpiece.
7. method as claimed in claim 6, which is characterized in that
The set-up procedure and the pre-shaping step execute before the double-sided polisher executes first time polishing step；
And/or
The set-up procedure and pre-shaping step execute after the every execution n times polishing step of the double-sided polisher, and N is greater than 1.
8. a kind of trimming device of the polishing pad of double-sided polisher, which is characterized in that the double-sided polisher includes: opposite
The polishing plate of setting and lower polishing plate, the upper polishing pad being set in the polishing plate are set on the lower polishing plate
Lower polishing pad, there is the rotating device of common axis of rotation line with the polishing plate and lower polishing plate；The trimming device
Include:
Adjust module, for controlling the polishing plate and the lower polishing plate deformation so that the polishing plate and it is described under
Spacing between polishing plate is in increasing trend from the close rotation axis to the direction far from the rotation axis；
Repair module is installed on for controlling the polishing plate, the lower polishing plate and rotating device rotation with driving
Dressing tool between the upper polishing pad and the lower polishing pad surrounds the axis rotation of itself and simultaneously around the rotary shaft
Line revolution, is modified, upper polishing pad and lower polishing after being modified with the surface to the upper polishing pad and lower polishing pad
Pad, the working clearance between upper polishing pad and lower polishing pad after finishing, from close to the rotation axis to the separate rotation
Taper off trend on the direction of axis.
9. a kind of polishing pad, which is characterized in that the polishing pad in a ring, including first surface and second surface, described first
Surface is even curface, and the height of the second surface is from the inward flange to outer peripheral direction of the polishing pad in incremental
Trend.
10. a kind of double-sided polisher characterized by comprising the polishing plate being oppositely arranged and lower polishing plate are set to institute
The upper polishing pad in polishing plate is stated, the lower polishing pad being set on the lower polishing plate, with the upper polishing pad and lower polishing
Pad the rotating device with common axis of rotation line；The upper polishing pad and lower polishing pad are polishing as claimed in claim 9
Pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609439.9A CN109551360B (en) | 2018-12-27 | 2018-12-27 | Method and apparatus for dressing polishing pad, and double-side polishing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811609439.9A CN109551360B (en) | 2018-12-27 | 2018-12-27 | Method and apparatus for dressing polishing pad, and double-side polishing apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109551360A true CN109551360A (en) | 2019-04-02 |
| CN109551360B CN109551360B (en) | 2020-07-28 |
Family
ID=65871573
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811609439.9A Active CN109551360B (en) | 2018-12-27 | 2018-12-27 | Method and apparatus for dressing polishing pad, and double-side polishing apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109551360B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873648A (en) * | 2012-11-01 | 2013-01-16 | 昆山市大金机械设备厂 | Air cushion polishing disk |
| CN103231320A (en) * | 2013-04-16 | 2013-08-07 | 北京理工大学 | Multi-point supporting surface type adjustable self-locking polishing disk for surface machining |
| DE102013202488A1 (en) * | 2013-02-15 | 2014-09-04 | Siltronic Ag | Process for dressing polishing cloths for simultaneous two-sided polishing of semiconductor wafers |
| CN104097134A (en) * | 2013-04-12 | 2014-10-15 | 硅电子股份公司 | Method for polishing semiconductor wafers by means of simultaneous double-side polishing |
-
2018
- 2018-12-27 CN CN201811609439.9A patent/CN109551360B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102873648A (en) * | 2012-11-01 | 2013-01-16 | 昆山市大金机械设备厂 | Air cushion polishing disk |
| DE102013202488A1 (en) * | 2013-02-15 | 2014-09-04 | Siltronic Ag | Process for dressing polishing cloths for simultaneous two-sided polishing of semiconductor wafers |
| CN104097134A (en) * | 2013-04-12 | 2014-10-15 | 硅电子股份公司 | Method for polishing semiconductor wafers by means of simultaneous double-side polishing |
| CN103231320A (en) * | 2013-04-16 | 2013-08-07 | 北京理工大学 | Multi-point supporting surface type adjustable self-locking polishing disk for surface machining |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109551360B (en) | 2020-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6831835B2 (en) | Machines with highly controllable processing tools for finishing workpieces | |
| JP2014156006A (en) | Method for conditioning polishing pads for simultaneous double-side polishing of semiconductor wafer | |
| CN111266937B (en) | Rocker arm type polishing device and method for full-caliber deterministic polishing of planar parts | |
| JPWO2011092748A1 (en) | Grinding method of lens spherical surface using dish-shaped grinding wheel | |
| WO2022257489A1 (en) | Double-sided polishing method for optical lens | |
| TW201803690A (en) | Polishing device | |
| CN113231957A (en) | Wafer grinding process based on double-side grinding equipment and semiconductor wafer | |
| US7090567B2 (en) | Method and an element for surface polishing | |
| JP5399109B2 (en) | Mask blank substrate manufacturing method, mask blank manufacturing method, and mask manufacturing method | |
| CN106826492A (en) | A kind of multistation lapping device | |
| KR102039771B1 (en) | Double side polisher with platen parallelism control | |
| CN109551360A (en) | Dressing method, trimming device, polishing pad and the double-sided polisher of polishing pad | |
| CN102463512A (en) | Double-grinding wheel profiling machine | |
| TWI635928B (en) | Lens centering method of ball center processing machine, lens processing method and ball center processing machine | |
| JP3493208B2 (en) | Method of manufacturing plate having flat main surface and method of manufacturing plate having two parallel main surfaces | |
| JP2013516332A (en) | Wafer polisher | |
| JP5688820B2 (en) | Polishing equipment | |
| RU2202462C2 (en) | Method for dressing laps in two-disc lapping machine tools | |
| CN104942678B (en) | Device for processing large-caliber optical element by swing frame type active grinding disc | |
| CN108214306A (en) | The trimmer and polishing system of polishing pad | |
| CN105437018B (en) | A kind of aspherical optical element intermediate frequency error control device and control method | |
| KR20190072743A (en) | Drum pad dressing apparatus for wafer edge polishing | |
| JP2008149389A (en) | Centerless grinding method and device | |
| JP2003011058A (en) | Polishing device and polishing method and manufacturing method for optical part | |
| US20230364737A1 (en) | Method for Configuring a Double- or Single-Sided Processing Machine, and Double- or Single-Sided Processing Machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |