CN109542190A - Heat-exchanger rig and equipment with heat-exchanger rig - Google Patents
Heat-exchanger rig and equipment with heat-exchanger rig Download PDFInfo
- Publication number
- CN109542190A CN109542190A CN201710861059.3A CN201710861059A CN109542190A CN 109542190 A CN109542190 A CN 109542190A CN 201710861059 A CN201710861059 A CN 201710861059A CN 109542190 A CN109542190 A CN 109542190A
- Authority
- CN
- China
- Prior art keywords
- heat
- exchanger rig
- pipe
- equipment
- steam
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of heat-exchanger rig and the equipment with heat-exchanger rig, it is situated between in being filled with hot medium in a pipe-line cell, through the circulation of a steam or gas pressure applicator, radiator and throttling set, hot medium Jie is flowed into a heat dump, the heat dump is equipped with a heat-absorbent surface, the heat-absorbent surface can be contacted with a heat source, and the hot medium for flowing through heat dump is situated between and can take away the heat of the heat source by heat-absorbent surface；And, the heat-exchanger rig can be set in an equipment, the equipment has an at least power supply unit and an at least working cell, the working cell will form the heat source when can operate, the heat absorption face contact of the working cell and the heat dump directly carries out heat-absorbing action and can carry out an effective heat exchange cycle to reach heat dissipation effect.
Description
Technical field
The present invention is related with a kind of heat-exchanger rig, and is suitable for the equipment with the heat-exchanger rig, such as a computer master
The heat dissipation of machine, but the equipment with the heat-exchanger rig is not limited to only apply in host computer.
Background technique
Press, the cooling system of early stage, for example, be installed in a computer a CPU (central processing unit, in
Central processor) and other chips on equal heat sources cooling system, it will usually be installed with above with heat dissipation and thermally conductive function
One fin (or radiating fin), through the fin by heat source derive come, with complete one heat dissipation program, but science and technology into
Step, so that the contact area of heat source reduces, and the instruction cycle increases, and the temperature of entire heat source fever is further caused to be promoted,
The radiating mode for only using radiating fin, other than efficiency is bad, because the main case of computer is semi-hermetic type, heat dissipation is not easy, long
After time use, internal dust accumulation but will reduce heat dissipation effect, so now with the improvement of more cooling systems.
Two kinds of radiating modes, first the first radiating mode have been developed refering to Figure 1, it is a liquid in industry at present
Body cooling system 40, the liquid-cooling system 40 are directly connect with the central processing unit 51 in a host computer 50, a pipeline
It is thermally conductive that the lower liquid of temperature is input to one contacted with the central processing unit 51 by system 41 from the liquid-cooling system 40
Behind portion 42, which can absorb heat caused by the central processing unit 51 and the temperature of the liquid is made to increase；Then, the liquid
Body is exported via the pipe-line system 41 to a radiating end 43 again, and through a radiator fan 44 to the liquid in the radiating end 43
It is radiated and declines the fluid temperature, it is cooling followed by the liquid is delivered to the liquid once again through the pipe-line system 41
System 40 and the heat-conducting part 42 and generate and heat dissipation effect to the central processing unit 51 recycled and reached in one.
Only, cooling mechanism is carried out with the liquid-cooling system 40, the circulation of flowing will receive in the host computer 50
The limitation in portion space, thus usually flow distance is very short, and route be it is fixed, other than the position of installation is limited, mistake
Short circulation meeting so that the radiating end 43 liquid can not by it is hot it is effective exclude, thus under prolonged use, flow into and be somebody's turn to do
The liquid of heat-conducting part 42 can be gradually warmed up, and then can not generate effective heat spreading function to the central processing unit 51.
Or second of radiating mode is please refer to fan cooling system shown in Fig. 2, is a main computer unit
60, the main computer unit 60 is in the central processing unit 51 and a graphics processor (GPU, graphics processing unit) 62
On be each provided with the radiator fan 44, meanwhile, on the main computer unit 60 and be equipped with an exhaust fan 64, through the radiation air
Fan 44, which can derive the thermal energy that the central processing unit 51 and the graphics processor 62 generate, to be come, and penetrates the exhaust fan 64
The main computer unit 60 is discharged to have the function that a heat extraction in hot-air.
Cooling mechanism person is carried out in a manner of the radiator fan 44, the radiator fan 44 and the exhaust fan 64 are in order to will generate
Good heat radiation function, need to keep operating condition in 60 start process of main computer unit, however the radiator fan 44 when operating
And the exhaust fan 64 can consume a large amount of electricity, while the operating of the radiator fan 44 and the exhaust fan 64 can also generate noise,
And after long-time use, the temperature of the central processing unit 51 and the graphics processor 62 can be increased；In addition, the radiation air
Heat is taken away in the flowing of 44 generation air of fan, the radiator fan 44 being installed in the central processing unit 51 and the graphics processor 62
An effective heat extraction directly directly can not be done for periphery operation chip, therefore integral heat sink effect is limited.
Summary of the invention
Main purpose of the present invention provides a kind of heat-exchanger rig quickly and efficiently to cool down and a kind of setting with heat-exchanger rig
It is standby, the heat-exchanger rig its include at least and have: a pipe-line cell can fill a hot medium in the pipe-line cell and be situated between；One steam or
Gas pressure applicator, the steam or gas pressure applicator are connect with the pipe-line cell；One radiator, the steam or gas pressure applicator with
The radiator is with pipe-line cell connection；One throttling set, the radiator are connect with the throttling set with the pipe-line cell；
One heat dump, the throttling set are connect with the heat dump with the pipe-line cell, and the heat dump and the steam or gas pressure applicator
With pipe-line cell connection, which is equipped with a heat-absorbent surface；One control unit, and the steam or gas pressure applicator, this dissipates
Thermal, the throttling set and heat dump signal connection.
Heat-exchanger rig as described above, wherein the heat-exchanger rig further includes a shell, and the inside of the shell is installed with the steaming
Gas or gas pressure applicator, the radiator, the throttling set and the control unit, and the heat dump is set to the outside of the shell.
Heat-exchanger rig as described above, wherein the radiator is fin type heat dissipation row, a fan or a water-cooling
Device is constituted.
Heat-exchanger rig as described above, wherein the throttling set is that a capillary, a thermal expansion valve, an electronic type are swollen
Swollen valve or a discharge orifice current limiting plate.
The equipment with heat-exchanger rig, including at least has: an equipment and the heat-exchanger rig as described above, wherein
The equipment is internally provided with an at least working cell；The heat dump is contacted with the working cell.
In another embodiment, this has the equipment of heat-exchanger rig, and including at least has: an equipment and a heat-exchanger rig；
Wherein, which includes at least and has: a pipe-line cell, and a hot medium can be filled in the pipe-line cell and is situated between；One steam or
Gas pressure applicator, the steam or gas pressure applicator are connect with the pipe-line cell；One radiator, the steam or gas pressure applicator with
The radiator is with pipe-line cell connection；One throttling set, the radiator are connect with the throttling set with the pipe-line cell；
A plurality of heat dumps, the throttling set are connect with the heat dump with the pipe-line cell, and the heat dump adds with the steam or gas
Depressor is equipped with a heat-absorbent surface with pipe-line cell connection, each heat dump；One control unit, with the steam or gas pressurized
Device, the radiator, the throttling set and heat dump signal connection；Wherein, the equipment be internally provided at least one work
Unit；The heat-absorbent surface is contacted with the working cell.
Equipment as described above with heat-exchanger rig, wherein a plurality of heat dumps are with pipe-line cell connection.
Equipment as described above with heat-exchanger rig, wherein a plurality of heat dumps are with pipe-line cell series winding.
Equipment as described above with heat-exchanger rig, wherein a plurality of heat dumps are sequentially contacted with the pipe-line cell.
Equipment as described above with heat-exchanger rig, wherein a plurality of working cells have a plurality of chips, the suction
Hot face and the contact wafers.
The equipment with heat-exchanger rig as described above, wherein a plurality of heat-absorbent surfaces and the corresponding contact wafers.
The equipment with heat-exchanger rig as described above, wherein each heat-absorbent surface and corresponding each contact wafers.
Equipment as described above with heat-exchanger rig, wherein the chip is a central processing unit or a graphics processor.
Equipment as described above with heat-exchanger rig, wherein the equipment is more provided with an at least power supply unit, the power supply
Unit and the working cell are electrically connected.
Equipment as described above with heat-exchanger rig, wherein the power supply unit and the heat-exchanger rig are electrically connected.
Equipment as described above with heat-exchanger rig, wherein the working cell is more equipped with a temperature sensor in this
Between heat-absorbent surface and the working cell, and contacted with the heat dump and the working cell.
Equipment as described above with heat-exchanger rig, wherein the working cell is simultaneously equipped with pulse width modulation speed regulation
Device, the control unit signal connect the pulse width modulation speed regulation device.
The heat-exchanger rig provided by the present invention and this there is the equipment of heat-exchanger rig, the heat dump of the heat-exchanger rig can
It is directly contacted with a heat source, generates the effect of direct cooling and heat dissipation, therefore cooling effect can be promoted.Moreover, the hot medium is situated between
After circulation, the temperature which is situated between can all keep low-temperature condition in the heat dump, therefore even if use for a long time
Its cooling effect will not be lost.Meanwhile this has the equipment of heat-exchanger rig, which can directly connect with the heat dump
Touching, and up to direct effective heat dissipation effect, and the heat-exchanger rig is installed in the equipment will not in addition increase volume, and because
The heat dump allows the operation temperature of the working cell in preferable temperature for direct and lasting heat dissipation effect, because
This can be to avoid slow caused by overheat or damage.
Detailed description of the invention
The schematic diagram of the known liquid-cooling system of Fig. 1.
The schematic diagram of the known fan cooling system of Fig. 2.
Fig. 3 is the stereo appearance figure of heat-exchanger rig of the present invention.
Fig. 4 is the three-dimensional appearance exploded view of the equipment first embodiment of present invention tool heat-exchanger rig.
Fig. 5 is the schematic diagram of the equipment second embodiment of present invention tool heat-exchanger rig.
Fig. 6 is the stereo appearance figure of the equipment second embodiment of present invention tool heat-exchanger rig.
Figure number explanation:
The present invention
10 heat-exchanger rigs
11 pipe-line cells
12 steams or gas pressure applicator
13 radiators
131 fin types heat dissipation row
132 fans
14 throttling sets
15 heat dumps
151 heat-absorbent surfaces
16 control units
20 shells
30 equipment
31 shells
32 power supply units
33 working cells
331 motherboards
3311 central processing units
3312 temperature sensors
3313 pulse width modulation speed regulation devices
3321 graphics processors
H heat source
It is known
40 liquid-cooling systems
41 pipe-line systems
42 heat-conducting parts
43 radiating ends
44 radiator fans
50 host computers
51 central processing units
60 main computer units
62 graphics processors
64 exhaust fans.
Specific embodiment
It please refers to shown in Fig. 3, is the stereo appearance figure of heat-exchanger rig of the present invention, alleged " heat exchange " refers to carry out cold and hot
Exchange, which includes: a pipe-line cell 11, and hot medium Jie (heat- can be filled in the pipe-line cell 11
Transfer medium) (scheming not draw), which is situated between for that can carry out the substance converted between gas-liquid, such as can
To be refrigerant or water.
One steam or gas pressure applicator 12, the steam or gas pressure applicator 12 are connect with the pipe-line cell 11, the steam or
The hot medium of this in the pipe-line cell 11 can be situated between by gas pressure applicator 12 is compressed into the gaseous state of high temperature and pressure；The steam or gas
Body pressurizer 12 can be a compressor.
One radiator 13, which connect with the pipe-line cell 11, and is arranged in the steam or gas pressurized
After device 12, that is, the steam or gas pressure applicator 12 are connect with the radiator 13 with the pipe-line cell 11；The radiator 13
It include fin type heat dissipation row 131 and a fan 132, which is situated between after inflow fin type heat dissipation row 131, and can pass through should
The movement that fan 132 cools down, and then the hot medium of this in the pipe-line cell 11 can be situated between and be converted into the liquid of cryogenic high pressure
State；For example, the radiator 13 can be fin type heat dissipation row 131, the fan 132 or a water-cooling heat radiating device；It is described
The water-cooling heat radiating device is the groove body for being filled with water, and fin type heat dissipation row 131 or the pipe-line cell 11 are soaked into
It is filled with the water-cooling heat radiating device that the groove body of water is constituted, the effect of to reach heat dissipation.
One throttling set 14, the throttling set 14 are connect with the pipe-line cell 11, and after being arranged in the radiator 13, also
I.e. the radiator 13 is connect with the throttling set 14 with the pipe-line cell 11；The throttling set 14 is a capillary, a temperature-sensitive
Formula expansion valve, an electronic expansion valve or a discharge orifice current limiting plate (oriface), the throttling set 14 can will be in the pipe-line cells 11
Hot medium be situated between and be converted into the gaseous state of low-temp low-pressure.
One heat dump 15, the heat dump 15 are connect with the pipe-line cell 11, the heat dump 15 be set to the throttling set 14 with
Between the steam or gas pressure applicator 12, that is, the throttling set 14 is connect with the heat dump 15 with the pipe-line cell 11, and should
Heat dump 15 is connect with the steam or gas pressure applicator 12 with the pipe-line cell 11；The heat dump 15 is equipped with a heat-absorbent surface 151,
The heat-absorbent surface 151 can contact with a heat source H and cold and hot exchange with the heat source H, it is however generally that the heat source H is by heat transfer
The temperature of the heat source H is enabled to reduce or maintain Mr. Yu's specific temperature to the heat-absorbent surface 151；And flow through the heat dump 15
The gaseous state of the low-temp low-pressure hot medium is situated between and can pass through the heat-absorbent surface 151 and will pass to the heat-absorbent surface 151 from the heat source H
Heat is taken away, and is converted into the gaseous state of the low-voltage high-temperature hot medium and is situated between, then flows to the steam through the pipe-line cell 11 or gas adds
Depressor 12 is to complete a circulation loop.
One control unit 16, with the steam or gas pressure applicator 12, the radiator 13, the throttling set 14 and the suction
Hot 15 signal of device connects and can provide electric power and controls the steam or gas pressure applicator 12, the radiator 13, the throttling set
14 and the heat dump 15 running.
One shell 20 is installed with the steam or gas pressure applicator 12, the radiator 13, the throttling inside the shell 20
Device 14 and the control unit 16, and the heat dump 15 is set to outside the shell 20.
Please refer to shown in Fig. 3, the shell 20 heat-exchanger rig 10 can be accommodated it is integral to be convenient for carrying and install, when
It only needs to contact the heat-absorbent surface 151 of the heat dump 15 with the heat source H when being exchanged heat, in this present embodiment the heat source H
For an a chip such as central processing unit, which can low-temp low-pressure gaseous state to fill in the pipe-line cell 11
The hot medium is situated between to carry out heat exchange, the heat absorption which is generated, and hot medium Jie is made to be converted into high-temperature low-pressure
Gaseous state；Then, which, which is situated between, is delivered to the steam or gas pressure applicator 12 via the pipe-line cell 11 and via the steam
Or it after gas pressure applicator 12 is pressed to form the gaseous state of high temperature and pressure hot medium Jie, conveys import via the pipe-line cell 11 once again
The fin type heat dissipation of the radiator 13 arranges 131 and after the heat elimination and cooling of the fan 132, and the heat in the pipe-line cell 11 passes
Medium can be converted into the liquid of cryogenic high pressure hot medium Jie；Followed by, then via the capillary conversion of the throttling set 14
Become the gaseous state of the low-temp low-pressure hot medium afterwards to be situated between, make the hot medium for importing the heat dump 15 be situated between be low-temp low-pressure state with
Complete the circulation loop.This circulation loop may insure that the heat biography medium temp of the heat-absorbent surface 151 can be effectively for this
Heat source H radiates；Therefore still can ensure that the running of the central processing unit still in an operation temperature appropriate under prolonged operation
In degree.
Please together simultaneously as shown in fig.4, the three-dimensional appearance point of the equipment first embodiment for present invention tool heat-exchanger rig
Xie Tu, the heat-exchanger rig is same with previous embodiment, and so it will not be repeated.Wherein, which is directly installed in an equipment 30
Interior, which can be a host computer, a counter or a building, and the equipment 30 of illustrating in this present embodiment is computer master
Machine.The equipment 30 have a shell 31, illustrate in this present embodiment the shell 31 be computer chassis, the inside of the shell 31 or should
The inside of equipment 30 separately has a power supply unit 32 and a working cell 33, which is a motherboard 331, the host
Plate 331 is equipped with a central processing unit 3311 (being in this present embodiment the heat source), and the heat-exchanger rig 10 is relative to the job note
Member 33 is equipped with the heat dump 15, and wherein the heat-absorbent surface 151 is contacted with the central processing unit 3311.Meanwhile the power supply unit 32 can
It directly feeds electric power and gives the heat-exchanger rig 10, the heat-exchanger rig 10 is made not need additionally to use power supply；In general the heat absorption
The active area of device 15 is smaller, so relatively the power consumption of the steam or gas pressure applicator 12 is also little, therefore the heat-exchanger rig
10 directly using the electric power of the power supply unit 32 will not efficiency for the working cell 33 and stability have an impact.Together
When, a temperature sensor 3312 is more equipped on the motherboard 331 of the working cell 33 set on the heat dump 15 and the center
Between processor 3311, the temperature sensor 3312 be clamped between the heat dump 15 and the central processing unit 3311 and with this
Heat-absorbent surface 151 contacts.On the motherboard 331 and it is equipped with a pulse width modulation (PWM, Pulse Width Modulation)
Speed regulation device 3313,16 signal of control unit connect the pulse width modulation speed regulation device 3313 to control the heat-exchanger rig 10
Operating state.When the working cell 33 has just started starting, at a temperature below a threshold value, therefore the control unit 16 can't
Start the steam or gas pressure applicator 12 and the fan 132；Central processing unit after a period of time, on the working cell 33
3311 temperature can increase, therefore the temperature that the temperature sensor 3312 can perceive the central processing unit 3311 has improved；When
When the temperature that the temperature sensor 3312 perceives the central processing unit 3311 equals or exceeds the threshold value, then by the pulse width tune
Modified tone speed variator 3313 notifies the control unit 16 with a signal, which can drive the steam or gas pressure applicator
12 and the fan 132 operating to carry out the hot medium between the circulation temperature lowering of the circulation loop.Then after the completion of temperature decline,
Such as the temperature sensor 3312 perceive the central processing unit 3311 temperature be less than the threshold value when, then by the pulse width modulation
Speed regulation device 3313 notifies the control unit 16 with an another signal, which can be slowed or shut off heat exchange dress
Set 10 running.Therefore, which can be operated again when needed, therefore can be reduced the loss of the energy and be avoided the suction
The excessively heat dissipation of hot device 15, and cause the central processing unit 3311 and 33 frosting of working cell or the too low situation of temperature.
Please together simultaneously refering to shown in Fig. 5 and Fig. 6, have the equipment of the heat-exchanger rig for the present invention second is implemented
Example, the heat-exchanger rig 10 is substantially same with previous embodiment, and so it will not be repeated.Wherein, the inside of the equipment 30 has a plurality of be somebody's turn to do
The heat-exchanger rig 10 of working cell 33, the present embodiment has a plurality of heat dumps 15, and a plurality of heat dumps 15 are with the pipe
Road unit 11 is connected to complete the circulation loop, and preferably a plurality of heat dumps 15 are contacted with the pipe-line cell 11 to complete this
Circulation loop, most preferably a plurality of heat dumps 15 are sequentially contacted with the pipe-line cell 11 to complete the circulation loop；The heat absorption
The heat-absorbent surface 151 of device 15 is contacted with the central processing unit 3311 (being in this present embodiment the heat source), preferably the heat-absorbent surface
151 contact with the corresponding central processing unit 3311 (being in this present embodiment the heat source), most preferably each heat-absorbent surface 151 with
The corresponding each central processing unit 3311 (being in this present embodiment the heat source) contact.
In the embodiment of Fig. 5 and Fig. 6, there are two the working cell 33, two job notes for the inside tool of the equipment 30
Member 33 is respectively the motherboard 331 and a display adapter 332, which is equipped with the central processing unit 3311, this is aobvious
Show that adapter 332 is equipped with a graphics processor 3321, which is equipped with relative to two working cells 33 with this
Two heat dumps 15 that pipe-line cell 11 is sequentially contacted；Wherein, two heat dumps 15 penetrate the respective heat-absorbent surface respectively
151 contact with the central processing unit 3311 and the graphics processor 3321.
Certainly, which can also be equipped with a plurality of power supply units 32, be switched to the demand deployed in response to electric power
Supply power to a plurality of working cells 33 or the heat-exchanger rig 10.
Claims (18)
1. a kind of heat-exchanger rig, which is characterized in that include at least:
One pipe-line cell (11)；
One steam or gas pressure applicator (12), the steam or gas pressure applicator (12) are connect with the pipe-line cell (11)；
One radiator (13), the steam or gas pressure applicator (12) and the radiator (13) are connected with the pipe-line cell (11)
It connects；
One throttling set (14), the radiator (13) are connect with the throttling set (14) with the pipe-line cell (11)；
One heat dump (15), which is connect with the heat dump (15) with the pipe-line cell (11), and the heat dump
(15) it is connect with the steam or gas pressure applicator (12) with the pipe-line cell (11), which is equipped with a heat-absorbent surface
(151)；
One control unit (16), with the steam or gas pressure applicator (12), the radiator (13), the throttling set (14) and
Heat dump (15) signal connection；
One shell (20), the inside of the shell (20) are installed with the steam or gas pressure applicator (12), the radiator (13), are somebody's turn to do
Throttling set (14) and the control unit (16), and the heat dump (15) is set to the outside of the shell (20).
2. heat-exchanger rig as described in claim 1, which is characterized in that the radiator (13) is fin type heat dissipation row
(131), a fan (132) or a water-cooling heat radiating device are constituted.
3. heat-exchanger rig as claimed in claim 1 or 2, which is characterized in that the throttling set (14) is a capillary, a temperature-sensitive
Formula expansion valve, an electronic expansion valve or a discharge orifice current limiting plate.
4. a kind of equipment with heat-exchanger rig, which is characterized in that including at least having:
One equipment (30) and a heat-exchanger rig (10)；
Wherein, which includes at least and has:
One pipe-line cell (11)；
One steam or gas pressure applicator (12), the steam or gas pressure applicator (12) are connect with the pipe-line cell (11)；
One radiator (13), the steam or gas pressure applicator (12) and the radiator (13) are connected with the pipe-line cell (11)
It connects；
One throttling set (14), the radiator (13) are connect with the throttling set (14) with the pipe-line cell (11)；
One heat dump (15), which is connect with the heat dump (15) with the pipe-line cell (11), and the heat dump
(15) it is connect with the steam or gas pressure applicator (12) with the pipe-line cell (11), which is equipped with a heat-absorbent surface
(151)；
One control unit (16), with the steam or gas pressure applicator (12), the radiator (13), the throttling set (14) and
Heat dump (15) signal connection；
Wherein, which is internally provided with an at least working cell (33)；The heat-absorbent surface (151) and the working cell
(33) it contacts.
5. as claimed in claim 4 with the equipment of heat-exchanger rig, which is characterized in that the heat-absorbent surface (151) and the job note
One contact wafers of first (33).
6. as claimed in claim 5 with the equipment of heat-exchanger rig, which is characterized in that the chip is a central processing unit
(3311) or a graphics processor (3321).
7. a kind of equipment with heat-exchanger rig, which is characterized in that including at least having:
One equipment (30) and a heat-exchanger rig (10)；
Wherein, which includes at least and has:
One pipe-line cell (11)；
One steam or gas pressure applicator (12), the steam or gas pressure applicator (12) are connect with the pipe-line cell (11)；
One radiator (13), the steam or gas pressure applicator (12) and the radiator (13) are connected with the pipe-line cell (11)
It connects；
One throttling set (14), the radiator (13) are connect with the throttling set (14) with the pipe-line cell (11)；
A plurality of heat dumps (15), which is connect with the heat dump (15) with the pipe-line cell (11), and the suction
Hot device (15) is connect with the steam or gas pressure applicator (12) with the pipe-line cell (11), and each heat dump (15) is equipped with one and inhales
Hot face (151)；
One control unit (16), with the steam or gas pressure applicator (12), the radiator (13), the throttling set (14) and
Heat dump (15) signal connection；
Wherein, which is internally provided at least a plurality of working cells (33)；The heat-absorbent surface (151) and the job note
First (33) contact.
8. as claimed in claim 7 with the equipment of heat-exchanger rig, which is characterized in that a plurality of heat dumps (15) are with the pipe
Road unit (11) connection.
9. as claimed in claim 7 with the equipment of heat-exchanger rig, which is characterized in that a plurality of heat dumps (15) are with the pipe
Road unit (11) series winding.
10. as claimed in claim 7 with the equipment of heat-exchanger rig, which is characterized in that a plurality of heat dumps (15) are with this
Pipe-line cell (11) is sequentially contacted.
11. as claimed in claim 7 with the equipment of heat-exchanger rig, which is characterized in that a plurality of working cell (33) tools
There are a plurality of chips, the heat-absorbent surface (151) and the contact wafers.
12. as claimed in claim 11 with heat-exchanger rig equipment, which is characterized in that a plurality of heat-absorbent surfaces (151) with
The corresponding contact wafers.
13. as claimed in claim 11 with heat-exchanger rig equipment, which is characterized in that each heat-absorbent surface (151) with it is right
The each contact wafers answered.
14. the equipment with heat-exchanger rig as described in claim 11 to 13 is any, which is characterized in that the chip is a center
Processor (3311) or a graphics processor (3321).
15. the equipment with heat-exchanger rig as described in claim 4 to 13 is any, which is characterized in that the equipment (30) setting
There is an at least power supply unit (32), the power supply unit (32) and the working cell (33) are electrically connected.
16. as claimed in claim 15 with the equipment of heat-exchanger rig, which is characterized in that the power supply unit (32) and the heat exchange
Device (10) is electrically connected.
17. as claimed in claim 15 with the equipment of heat-exchanger rig, which is characterized in that the working cell (33) is equipped with one
Temperature sensor (3312) between the heat-absorbent surface (151) and the working cell (33), and with the heat dump (15) and the work
Unit (33) contact.
18. as claimed in claim 15 with the equipment of heat-exchanger rig, which is characterized in that the working cell (33) is simultaneously equipped with one
Pulse width modulation speed regulation device (3313), control unit (16) signal connect the pulse width modulation speed regulation device
(3313)。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710861059.3A CN109542190A (en) | 2017-09-21 | 2017-09-21 | Heat-exchanger rig and equipment with heat-exchanger rig |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710861059.3A CN109542190A (en) | 2017-09-21 | 2017-09-21 | Heat-exchanger rig and equipment with heat-exchanger rig |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109542190A true CN109542190A (en) | 2019-03-29 |
Family
ID=65827829
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710861059.3A Withdrawn CN109542190A (en) | 2017-09-21 | 2017-09-21 | Heat-exchanger rig and equipment with heat-exchanger rig |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109542190A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2650207Y (en) * | 2003-06-19 | 2004-10-20 | 中国科学院理化技术研究所 | Miniature refrigerating device for radiating computer chip |
| CN1598736A (en) * | 2003-09-16 | 2005-03-23 | 董克 | Computer heat sink with compression cooling function |
| TWM285200U (en) * | 2005-10-14 | 2006-01-01 | Thermaltake Technology Co Ltd | Liquid-cooling heat dissipating module suitable for various installation modes |
| US20060196207A1 (en) * | 2005-02-25 | 2006-09-07 | Chih-Peng Lee | Cooling device for multiple heat-generating components |
| CN101435637A (en) * | 2007-11-13 | 2009-05-20 | 京威科技有限公司 | Miniaturisation ice water cooling circulating system |
| CN101517736A (en) * | 2006-09-28 | 2009-08-26 | 三洋电机株式会社 | Cooling apparatus |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN103218023A (en) * | 2013-04-18 | 2013-07-24 | 深圳市七彩虹科技发展有限公司 | Compressor refrigeration video card |
-
2017
- 2017-09-21 CN CN201710861059.3A patent/CN109542190A/en not_active Withdrawn
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2650207Y (en) * | 2003-06-19 | 2004-10-20 | 中国科学院理化技术研究所 | Miniature refrigerating device for radiating computer chip |
| CN1598736A (en) * | 2003-09-16 | 2005-03-23 | 董克 | Computer heat sink with compression cooling function |
| US20060196207A1 (en) * | 2005-02-25 | 2006-09-07 | Chih-Peng Lee | Cooling device for multiple heat-generating components |
| TWM285200U (en) * | 2005-10-14 | 2006-01-01 | Thermaltake Technology Co Ltd | Liquid-cooling heat dissipating module suitable for various installation modes |
| CN101517736A (en) * | 2006-09-28 | 2009-08-26 | 三洋电机株式会社 | Cooling apparatus |
| CN101435637A (en) * | 2007-11-13 | 2009-05-20 | 京威科技有限公司 | Miniaturisation ice water cooling circulating system |
| CN102026527A (en) * | 2010-11-16 | 2011-04-20 | 深圳市航宇德升科技有限公司 | Miniature refrigerator for cooling electronic equipment |
| CN103218023A (en) * | 2013-04-18 | 2013-07-24 | 深圳市七彩虹科技发展有限公司 | Compressor refrigeration video card |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI392432B (en) | A cabinet of server | |
| JP7403742B2 (en) | Vacuum-based thermal management system | |
| CN104519722A (en) | Liquid cooling device and server with same | |
| US20090272144A1 (en) | Computer cooling apparatus | |
| CN107396599A (en) | A kind of heat abstractor and thermal management algorithm of movable cabinet level server system | |
| CN207040117U (en) | A kind of heat abstractor of movable cabinet level server system | |
| US20190079568A1 (en) | Heat exchange device and equipment system having heat exchange ability | |
| CN206363240U (en) | A kind of notebook computer water circulation radiator | |
| CN106163242B (en) | A kind of cabinet heat-exchange system and server | |
| CN207301955U (en) | A kind of radiator of host computer | |
| CN204883558U (en) | Split type computer cooling system | |
| KR101490341B1 (en) | Cooling and heating water system | |
| CN214901821U (en) | Combined type cooling system | |
| CN207164691U (en) | Heat-exchanger rig and the equipment with heat-exchanger rig | |
| CN208367613U (en) | Liquid cooling heat-exchanger rig and the equipment with liquid cooling heat-exchanger rig | |
| CN109542190A (en) | Heat-exchanger rig and equipment with heat-exchanger rig | |
| CN205142760U (en) | Data center cooling system with two absorbing device | |
| CN102736711B (en) | Structure improvement of condensation device and heat dissipation module of condensation device | |
| CN103791665A (en) | Recovery device for refrigeration storage condensation heat | |
| CN112578875A (en) | Computer water-cooling heat abstractor | |
| TWM566318U (en) | Liquid cooling heat exchange device and apparatus having the same | |
| CN212227181U (en) | Cooling and heating system of electronic computing equipment | |
| CN114968722A (en) | High-temperature alarm system based on computer | |
| TWI651506B (en) | Heat exchanger | |
| CN2665919Y (en) | Expansive heat radiation device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190329 |