CN109537015B - Device and method applied to micro-miniature multilayer circuit board electroplating - Google Patents
Device and method applied to micro-miniature multilayer circuit board electroplating Download PDFInfo
- Publication number
- CN109537015B CN109537015B CN201910018094.8A CN201910018094A CN109537015B CN 109537015 B CN109537015 B CN 109537015B CN 201910018094 A CN201910018094 A CN 201910018094A CN 109537015 B CN109537015 B CN 109537015B
- Authority
- CN
- China
- Prior art keywords
- guide rail
- sliding guide
- hole
- supporting boss
- base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a device and a method applied to electroplating of a microminiature multilayer circuit board. The device comprises a base, a sliding guide rail, a fixed platform, a supporting boss with adjustable height and a movable platform. A method comprising the steps of: s1, placing a transfer plate on a workpiece, and supporting the workpiece through the transfer plate; s2, placing the ceramic carrier plate on a fixed platform, fixing the ceramic carrier plate on screw fixing holes on the fixed platform through second fasteners, disassembling the first fasteners, and releasing the fixation between the transfer carrier plate and the ceramic carrier plate of the workpiece; s3, adjusting the height of the supporting boss with adjustable height; s4, adjusting the height of the movable platform; s5, taking out electroplating. The device can improve the yield in the production process, does not generate too much waste, reduces the cost, lightens the labor intensity of human bodies, improves the efficiency, can be put into an electroplating tank for electroplating, and has long service life; the method has the advantages of simple steps, easy operation, high efficiency and low cost.
Description
Technical Field
The invention relates to the technical field of producing microminiature multilayer circuit boards, in particular to a device and a method applied to electroplating of microminiature multilayer circuit boards.
Background
The production of miniature multilayer circuit boards is a very difficult task. Because the volume of the wafer is very small, the number of contact points required is very large, and thus the contact points need to be amplified to perform testing and transfer the electrical signals.
Only a few enterprises/institutes are able to produce such precision products nationally. In the production process, a plurality of tiny copper wires are required to be inserted between the carrier plate and the flexible plate, and waste products are generated by slightly taking care, so that the price is very high, and electroplating is required to be carried out after the product is manufactured.
Disclosure of Invention
The invention aims to solve the technical problems of overcoming the defects of the prior art and providing the device and the method applied to the electroplating of the microminiature multilayer circuit board, wherein the device can improve the yield in the production process, does not generate too much waste, reduces the cost, lightens the labor intensity of a human body, improves the efficiency, can be put into an electroplating pool for electroplating, and has long service life; the method has the advantages of simple steps, easy operation, high efficiency and low cost.
The technical scheme adopted by the invention is as follows:
an apparatus for plating a miniaturized multilayer circuit board, comprising:
a base;
the lower end of the sliding guide rail is fixedly arranged on the upper end surface of the base, and extends upwards from the upper end surface of the base;
the lower end of the fixed platform is fixedly arranged on the upper end face of the sliding guide rail, and four rectangular screw fixing holes distributed in a whole row are formed in the upper end face of the fixed platform;
the middle of the supporting boss with adjustable height is connected in series with the sliding guide rail, the supporting boss is arranged between the fixed platform and the base, and the supporting boss is fixedly arranged on the sliding guide rail through a fourth screw;
the middle of the movable platform is connected in series with the sliding guide rail, and the movable platform is provided with a plurality of supporting claws distributed around the circumference of the sliding guide rail in an array manner and is fixedly arranged on the sliding guide rail through a second bolt.
The sliding guide rail is in a thin strip shape, the side wall of the sliding guide rail is provided with a groove extending from one end to the other end, and the upper end of the sliding guide rail is provided with a third screw hole; the middle of the fixed platform is provided with a second fixed hole, the second fixed hole corresponds to a third screw hole, the fixed platform is fixedly connected with the sliding guide rail through a third bolt, and the third bolt penetrates through the second fixed hole to be connected to the third screw hole.
The upper end face of the fixed platform is provided with four protruding cylinders distributed in a rectangular array, and each protruding cylinder is provided with a screw fixing hole; the fixed platform is square.
The side wall of the supporting boss with adjustable height is provided with four inclined surfaces which are connected in a tail-to-tail mode, the upper end face of the supporting boss is square, and the lower end face of the supporting boss is square; each inclined plane approach is square; the area of the upper end surface of the supporting boss with adjustable height is smaller than that of the lower end surface of the supporting boss with adjustable height.
The lower end face of the supporting boss with adjustable height is provided with a square flange, the square flange extends downwards from the lower end face of the supporting boss with adjustable height, the middle of the supporting boss with adjustable height is provided with a series connection hole, the series connection hole is sleeved on the sliding guide rail, and the series connection hole is communicated from the upper end face of the supporting boss with adjustable height to the lower end face of the square flange; the side wall of the square flange is provided with a fourth fixing hole which extends from the side wall of the square flange to the direction of the serial connection hole and is communicated with the serial connection hole; the supporting boss with adjustable height is fixedly connected with the sliding guide rail through a fourth screw, and the fourth screw passes through a fourth fixing hole to be propped into the groove of the sliding guide rail.
The base is square, and it is equipped with the first hole that the cooperation sliding guide concatenated to be equipped with in the middle, and first hole is square, and the profile in first hole and sliding guide's lower extreme outline looks adaptation, the lateral wall of base are equipped with first screw hole, and first hole direction extension is put to first screw hole and link up, through first bolt fixed connection between base and the sliding guide, first bolt passes first screw hole roof pressure in the recess of sliding guide lower extreme.
The up end of base is equipped with four rectangular array distribution's first fixed orifices, and first fixed orifices link up from the up end of base to the up end of base.
The movable platform comprises a platform main body, a plurality of support arms and a plurality of support claws; the middle of the platform main body is provided with square perforations connected in series on the sliding guide rail, one end of each support arm is connected to the platform main body, the other end of each support arm is fixedly connected with a supporting claw, each supporting claw is provided with a third fixing hole, and each fixing hole extends downwards from the upper end face of each supporting claw.
The support arm is fixedly connected with the support claw through a screw.
A method comprising the steps of:
s1, placing a transfer plate on the upper end face of a workpiece, fixing the transfer plate and the workpiece together through a first fastener, wherein the workpiece comprises a ceramic carrier plate and a plurality of soft plates connected through copper wires, turning over the workpiece and the transfer plate together, and supporting the workpiece through the transfer plate;
s2, placing the ceramic carrier plate on a fixed platform, fixing the ceramic carrier plate on screw fixing holes on the fixed platform through a second fastener, disassembling the first fastener, and releasing the fixation between the transfer carrier plate and the ceramic carrier plate of the workpiece;
s3, adjusting the height of the supporting boss with the adjustable height to enable the inclined surface to be in contact with the soft board for supporting the soft board;
s4, adjusting the height of the movable platform to enable a plurality of soft boards to be distributed and isolated;
s5, placing the device which is loaded with the workpiece and applied to the micro-miniature multilayer circuit board electroplating in an electroplating pool for electroplating;
s6, fixedly mounting the waterproof cover above the ceramic substrate.
The device can improve the yield in the production process, does not generate too much waste, reduces the cost, lightens the labor intensity of human bodies, improves the efficiency, can be put into an electroplating tank for electroplating, and has long service life; the method has the advantages of simple steps, easy operation, high efficiency and low cost.
Drawings
FIG. 1 is a schematic view of the structure of an apparatus for plating a miniaturized multilayer circuit board according to the present invention;
FIG. 2 is a schematic view of the structure principle of the height-adjustable support boss in the present invention;
fig. 3 is a schematic diagram of a second structural principle of the device for electroplating a micro-miniature multilayer circuit board, with a waterproof cover;
fig. 4 is a schematic view of the structural principle of the waterproof cover in the invention;
FIG. 5 is a schematic view of the construction principle of the invention with some components disassembled and used for illustrating the product placed thereon and with the waterproof cover in a simple schematic manner;
FIG. 6 is a schematic illustration of the exploded construction of the present invention as it is used;
fig. 7 is a schematic view of the construction of the present invention after the insertion of a wire through the loading device.
Detailed Description
As shown in fig. 1 to 7, the present invention is applied to an apparatus for plating a miniaturized multi-layered circuit board, comprising:
a base 1;
the lower end of the sliding guide rail 2 is fixedly arranged on the upper end surface of the base 1, and extends upwards from the upper end surface of the base 1;
the lower end of the fixed platform is fixedly arranged on the upper end face of the sliding guide rail 2, and four rectangular screw fixing holes 31 distributed in a whole row are formed in the upper end face of the fixed platform;
a supporting boss 4 with adjustable height, the middle of which is connected in series with the sliding guide rail 2, is arranged between the fixed platform and the base 1, and is fixedly arranged on the sliding guide rail 2 through a fourth screw 45;
the second bolt 525, the middle of which is connected in series with the sliding guide rail 2, is provided with a plurality of supporting claws 51 distributed around the circumference of the sliding guide rail 2 in an array, and is fixedly arranged on the sliding guide rail 2 through the second bolt.
The sliding guide rail 2 is in a thin strip shape, the side wall of the sliding guide rail is provided with a groove 21 extending from one end to the other end, and the upper end of the sliding guide rail is provided with a third screw hole; the middle of the fixed platform is provided with a second fixed hole, the second fixed hole corresponds to a third screw hole, the fixed platform is fixedly connected with the sliding guide rail 2 through a third bolt, and the third bolt passes through the second fixed hole to be connected to the third screw hole.
The upper end face of the fixed platform is provided with four protruding cylinders distributed in a rectangular array, and each protruding cylinder is provided with a screw fixing hole 31; the fixed platform is square.
The side wall of the supporting boss 4 with adjustable height is provided with four inclined surfaces 41 which are connected in a tail-to-tail mode, the upper end face of the supporting boss is square, and the lower end face of the supporting boss is square; each inclined surface 41 is square in approach; the area of the upper end surface of the supporting boss 4 with adjustable height is smaller than the area of the lower end surface of the supporting boss 4 with adjustable height.
The lower end face of the supporting boss 4 with adjustable height is provided with a square flange 43, the square flange 43 extends downwards from the lower end face of the supporting boss 4 with adjustable height, the middle of the supporting boss 4 with adjustable height is provided with a series connection hole 42, the series connection hole 42 is sleeved on the sliding guide rail 2, and the series connection hole 42 runs through from the upper end face of the supporting boss 4 with adjustable height to the lower end face of the square flange 43; the side wall of the square flange 43 is provided with a fourth fixing hole 44, and the fourth fixing hole 44 extends from the side wall of the square flange 43 to the direction of the series connection hole 42 and penetrates through the side wall of the square flange; the supporting boss 4 with adjustable height is fixedly connected with the sliding guide rail 2 through a fourth screw 45, and the fourth screw 45 is propped into the groove 21 of the sliding guide rail 2 through a fourth fixing hole 44.
The base 1 is square, and is equipped with the first hole that the cooperation sliding guide 2 concatenated in the centre, and first hole is square, and the profile in first hole and sliding guide 2's lower extreme outline looks adaptation, and base 1's lateral wall is equipped with first screw hole, and first hole direction extension is put to first screw hole and link up, through first bolt fixed connection between base 1 and the sliding guide 2, first bolt passes first screw hole roof pressure in sliding guide 2 lower extreme recess 21.
The upper end face of the base 1 is provided with four first fixing holes distributed in rectangular arrays, and the first fixing holes penetrate through from the upper end face of the base 1 to the upper end face of the base 1.
The second bolt 525 includes a platform body, a plurality of support arms, and a plurality of support claws 51; the middle of the platform main body is provided with square perforations connected in series on the sliding guide rail 2, one end of each support arm is connected to the platform main body, the other end of each support arm is fixedly connected with a supporting claw 51, each supporting claw 51 is provided with a third fixing hole, and each fixing hole extends downwards from the upper end face of the supporting claw 51.
The arm is fixedly connected with the supporting claw 51 through a screw.
A method comprising the steps of:
s1, placing a transfer plate on the upper end face of a workpiece, fixing the transfer plate and the workpiece together through a first fastener, wherein the workpiece comprises a ceramic carrier plate and a plurality of soft plates connected through copper wires, turning over the workpiece and the transfer plate together, and supporting the workpiece through the transfer plate;
s2, placing the ceramic carrier plate on a fixed platform, fixing the ceramic carrier plate on screw fixing holes 31 on the fixed platform through second fasteners, disassembling the first fasteners, and releasing the fixation between the transfer carrier plate and the ceramic carrier plate of the workpiece;
s3, adjusting the height of the supporting boss 4 with the adjustable height so that the inclined surface 41 contacts the flexible board for supporting the flexible board;
s4, adjusting the height of the second bolts 525 to enable a plurality of soft boards to be distributed and isolated;
s5, placing the device which is loaded with the workpiece and applied to the micro-miniature multilayer circuit board electroplating in an electroplating pool for electroplating;
and S6, fixedly mounting a waterproof cover 6 above the ceramic substrate.
The device can improve the yield in the production process, does not generate too much waste, reduces the cost, lightens the labor intensity of human bodies, improves the efficiency, can be put into an electroplating tank for electroplating, and has long service life; the method has the advantages of simple steps, easy operation, high efficiency and low cost.
Claims (2)
1. An apparatus for plating a miniature multilayer circuit board, the apparatus comprising:
a base;
the lower end of the sliding guide rail is fixedly arranged on the upper end surface of the base, and extends upwards from the upper end surface of the base; the sliding guide rail is in a thin strip shape, the side wall of the sliding guide rail is provided with a groove extending from one end to the other end, and the upper end of the sliding guide rail is provided with a third screw hole; the middle of the fixed platform is provided with a second fixed hole, the second fixed hole corresponds to a third screw hole, the fixed platform is fixedly connected with the sliding guide rail through a third bolt, and the third bolt passes through the second fixed hole to be connected to the third screw hole; the upper end face of the fixed platform is provided with four protruding cylinders distributed in a rectangular array, and each protruding cylinder is provided with a screw fixing hole; the fixed platform is square;
the lower end of the fixed platform is fixedly arranged on the upper end face of the sliding guide rail, and four rectangular screw fixing holes distributed in a whole row are formed in the upper end face of the fixed platform;
the middle of the supporting boss with adjustable height is connected in series with the sliding guide rail, the supporting boss is arranged between the fixed platform and the base, and the supporting boss is fixedly arranged on the sliding guide rail through a fourth screw; the side wall of the supporting boss with adjustable height is provided with four inclined surfaces which are connected in a tail-to-tail mode, the upper end face of the supporting boss is square, and the lower end face of the supporting boss is square; each inclined plane approach is square; the area of the upper end surface of the supporting boss with adjustable height is smaller than that of the lower end surface of the supporting boss with adjustable height;
the movable platform is fixedly arranged on the sliding guide rail through a second bolt; the movable platform comprises a platform main body, a plurality of support arms and a plurality of support claws; the middle of the platform main body is provided with square perforations connected in series on the sliding guide rail, and the platform main body is provided with a plurality of supporting claws distributed around the circumference of the sliding guide rail in an array manner; one end of each support arm is connected to the platform main body, the other end of each support arm is fixedly connected with a supporting claw, a third fixing hole is formed in each supporting claw, and each fixing hole extends downwards from the upper end face of each supporting claw; the support arm is fixedly connected with the support claw through a screw;
the lower end face of the supporting boss with adjustable height is provided with a square flange, the square flange extends downwards from the lower end face of the supporting boss with adjustable height, the middle of the supporting boss with adjustable height is provided with a series connection hole, the series connection hole is sleeved on the sliding guide rail, and the series connection hole is communicated from the upper end face of the supporting boss with adjustable height to the lower end face of the square flange; the side wall of the square flange is provided with a fourth fixing hole which extends from the side wall of the square flange to the direction of the serial connection hole and is communicated with the serial connection hole; the supporting boss with adjustable height is fixedly connected with the sliding guide rail through a fourth screw, and the fourth screw passes through a fourth fixing hole to be propped into the groove of the sliding guide rail.
2. The apparatus for plating a miniaturized multilayer circuit board according to claim 1, wherein: the base is square, a first hole which is matched with the sliding guide rail in series connection is formed in the middle of the base, the first hole is square, the outline of the first hole is matched with the outer outline of the lower end of the sliding guide rail, a first screw hole is formed in the side wall of the base, the first screw hole extends in the direction of the first hole and penetrates through the first screw hole, the base is fixedly connected with the sliding guide rail through a first bolt, and the first bolt penetrates through the first screw hole to be propped against a groove at the lower end of the sliding guide rail; the up end of base is equipped with four rectangular array distribution's first fixed orifices, and first fixed orifices link up from the up end of base to the up end of base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910018094.8A CN109537015B (en) | 2019-01-09 | 2019-01-09 | Device and method applied to micro-miniature multilayer circuit board electroplating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910018094.8A CN109537015B (en) | 2019-01-09 | 2019-01-09 | Device and method applied to micro-miniature multilayer circuit board electroplating |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109537015A CN109537015A (en) | 2019-03-29 |
| CN109537015B true CN109537015B (en) | 2023-04-25 |
Family
ID=65834743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910018094.8A Active CN109537015B (en) | 2019-01-09 | 2019-01-09 | Device and method applied to micro-miniature multilayer circuit board electroplating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109537015B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755271A (en) * | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| US4933049A (en) * | 1989-04-03 | 1990-06-12 | Unisys Corporation | Cradle for supporting printed circuit board between plating manifolds |
| WO2014067275A1 (en) * | 2012-11-01 | 2014-05-08 | 广东欧珀移动通信有限公司 | Method for manufacturing circuit board |
| CN204752885U (en) * | 2015-05-29 | 2015-11-11 | 遂宁市广天电子有限公司 | Anchor clamps are used to perpendicular electroplating of circuit board |
| CN107371338A (en) * | 2016-05-13 | 2017-11-21 | 苏州卫鹏机电科技有限公司 | A kind of preparation method of the printed substrate of ultra-thin metal layer |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7576968B2 (en) * | 2002-04-15 | 2009-08-18 | Avx Corporation | Plated terminations and method of forming using electrolytic plating |
-
2019
- 2019-01-09 CN CN201910018094.8A patent/CN109537015B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4755271A (en) * | 1986-07-28 | 1988-07-05 | Siemens Aktiengesellschaft | Electroplating apparatus for plate-shaped workpieces, particularly printed circuit boards |
| US4933049A (en) * | 1989-04-03 | 1990-06-12 | Unisys Corporation | Cradle for supporting printed circuit board between plating manifolds |
| WO2014067275A1 (en) * | 2012-11-01 | 2014-05-08 | 广东欧珀移动通信有限公司 | Method for manufacturing circuit board |
| CN204752885U (en) * | 2015-05-29 | 2015-11-11 | 遂宁市广天电子有限公司 | Anchor clamps are used to perpendicular electroplating of circuit board |
| CN107371338A (en) * | 2016-05-13 | 2017-11-21 | 苏州卫鹏机电科技有限公司 | A kind of preparation method of the printed substrate of ultra-thin metal layer |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109537015A (en) | 2019-03-29 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US9412898B2 (en) | Apparatus and method of testing a substrate using a supporting nest and testing probes | |
| CN1816748A (en) | Probe card and semiconductor testing device using probe sheet or probe card semiconductor device producing method | |
| CN109537015B (en) | Device and method applied to micro-miniature multilayer circuit board electroplating | |
| KR101181639B1 (en) | Apparatus for planarizing a probe card and method using same | |
| TW201920966A (en) | Vertical probe array having a tiled membrane space transformer | |
| KR20080092704A (en) | Back-up table for chip mounter | |
| EP2437294A3 (en) | High-power semiconductor module with a base module and a connection module | |
| CN101344655B (en) | Liquid crystal panel bearing device | |
| CN218995427U (en) | Touch-press type electrifying debugging device for surface mount processing of unmanned aerial vehicle circuit board | |
| CN201438196U (en) | Modular probe card device | |
| KR100980396B1 (en) | loading a PCBplate board | |
| US6262571B1 (en) | Adjustable electrical connector for test fixture nest | |
| CN211689286U (en) | Universal electroplating table for wire needle testing instrument | |
| JPH09304472A (en) | Connecting device | |
| CN108928631B (en) | Automatic distributing device for FPC jointed boards | |
| CN112176378A (en) | Tool jig for electroplating lead frame and use method thereof | |
| CN209702886U (en) | Applied to microminiature multilayer circuit board electro plating device | |
| CN112658634A (en) | Device and method for assembling radiation unit and bottom plate | |
| CN209264227U (en) | A kind of vibration aging testing apparatus | |
| CN210347855U (en) | Substrate test fixture | |
| CN221040005U (en) | IC burning seat | |
| CN100443248C (en) | Diode machining welding method and special carbon graphite welding board | |
| CN115058560B (en) | Post-processing device for plate and strip pulse current and application method | |
| CN209707543U (en) | The connection structure of ceramic carrier and microminiature multilayer chiop and circuit board | |
| CN212723056U (en) | Front wiper combined row grinding frame and grinding device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: No.28, Xinqing 2nd Road, Jingan Town, Doumen District, Zhuhai City, Guangdong Province 519000 Applicant after: Zero one electronics (Zhuhai) Co.,Ltd. Address before: 519000 No. 28, Xinqing Second Road, Jing'an Town, Doumen District, Zhuhai City, Guangdong Province Applicant before: CORAD ELECTRONIC TECHNOLOGY (ZHUHAI) CO.,LTD. |
|
| GR01 | Patent grant | ||
| GR01 | Patent grant |