CN109531457B - Powdered active brazing filler metal for diamond grinding tool - Google Patents
Powdered active brazing filler metal for diamond grinding tool Download PDFInfo
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- CN109531457B CN109531457B CN201811630776.6A CN201811630776A CN109531457B CN 109531457 B CN109531457 B CN 109531457B CN 201811630776 A CN201811630776 A CN 201811630776A CN 109531457 B CN109531457 B CN 109531457B
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 80
- 239000002184 metal Substances 0.000 title claims abstract description 78
- 238000005219 brazing Methods 0.000 title claims abstract description 56
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 46
- 239000010432 diamond Substances 0.000 title claims abstract description 46
- 239000000945 filler Substances 0.000 title claims abstract description 37
- 238000000227 grinding Methods 0.000 title claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 68
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 29
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 27
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 27
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims abstract description 26
- 239000011701 zinc Substances 0.000 claims abstract description 20
- 239000010936 titanium Substances 0.000 claims abstract description 18
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 15
- 239000000956 alloy Substances 0.000 claims abstract description 15
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 13
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 13
- 239000010439 graphite Substances 0.000 claims abstract description 13
- 239000010959 steel Substances 0.000 claims abstract description 13
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 13
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 12
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 11
- 239000010703 silicon Substances 0.000 claims abstract description 11
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 11
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 9
- 239000000843 powder Substances 0.000 claims description 67
- 238000000498 ball milling Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 28
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 27
- 239000010949 copper Substances 0.000 claims description 26
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 25
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 23
- 238000001035 drying Methods 0.000 claims description 21
- 239000011863 silicon-based powder Substances 0.000 claims description 16
- 239000011135 tin Substances 0.000 claims description 16
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 239000011259 mixed solution Substances 0.000 claims description 9
- 238000000967 suction filtration Methods 0.000 claims description 9
- 229910052718 tin Inorganic materials 0.000 claims description 9
- 229910052684 Cerium Inorganic materials 0.000 claims description 8
- 229910052733 gallium Inorganic materials 0.000 claims description 8
- 229910052746 lanthanum Inorganic materials 0.000 claims description 8
- 239000011573 trace mineral Substances 0.000 claims description 8
- 235000013619 trace mineral Nutrition 0.000 claims description 8
- 238000010907 mechanical stirring Methods 0.000 claims description 7
- 239000006185 dispersion Substances 0.000 claims description 6
- 239000002994 raw material Substances 0.000 claims description 6
- 238000001291 vacuum drying Methods 0.000 claims description 6
- 229910052726 zirconium Inorganic materials 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 239000012065 filter cake Substances 0.000 claims description 5
- 238000002360 preparation method Methods 0.000 claims description 5
- 238000001132 ultrasonic dispersion Methods 0.000 claims description 3
- 239000003153 chemical reaction reagent Substances 0.000 claims description 2
- 230000008018 melting Effects 0.000 abstract description 16
- 238000002844 melting Methods 0.000 abstract description 16
- KCGHDPMYVVPKGJ-UHFFFAOYSA-N [Ti].[Cu].[Sn] Chemical compound [Ti].[Cu].[Sn] KCGHDPMYVVPKGJ-UHFFFAOYSA-N 0.000 abstract description 8
- 239000011159 matrix material Substances 0.000 abstract description 8
- 239000007791 liquid phase Substances 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000006104 solid solution Substances 0.000 abstract description 3
- 239000010970 precious metal Substances 0.000 abstract description 2
- 238000005728 strengthening Methods 0.000 abstract description 2
- 238000003466 welding Methods 0.000 abstract 2
- NPXOKRUENSOPAO-UHFFFAOYSA-N Raney nickel Chemical compound [Al].[Ni] NPXOKRUENSOPAO-UHFFFAOYSA-N 0.000 abstract 1
- 238000013329 compounding Methods 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 6
- 239000011812 mixed powder Substances 0.000 description 5
- 238000005476 soldering Methods 0.000 description 5
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 4
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 4
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 4
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 4
- FZLIPJUXYLNCLC-UHFFFAOYSA-N lanthanum atom Chemical compound [La] FZLIPJUXYLNCLC-UHFFFAOYSA-N 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000011651 chromium Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 230000003685 thermal hair damage Effects 0.000 description 3
- 238000009736 wetting Methods 0.000 description 3
- 239000003575 carbonaceous material Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 229910008423 Si—B Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- KHYBPSFKEHXSLX-UHFFFAOYSA-N iminotitanium Chemical compound [Ti]=N KHYBPSFKEHXSLX-UHFFFAOYSA-N 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 229910000765 intermetallic Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 150000001247 metal acetylides Chemical class 0.000 description 1
- 229910001000 nickel titanium Inorganic materials 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 238000001878 scanning electron micrograph Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D18/00—Manufacture of grinding tools or other grinding devices, e.g. wheels, not otherwise provided for
-
- B22F1/0003—
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/02—Alloys based on copper with tin as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F9/00—Making metallic powder or suspensions thereof
- B22F9/02—Making metallic powder or suspensions thereof using physical processes
- B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
- B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling
Abstract
The invention provides a powdery active solder for a diamond grinding tool, which is prepared by compounding and adding aluminum, zinc, silicon and nickel on the basis of a copper-tin-titanium active solder, wherein the obtained solder alloy has low melting temperature and low melting point to diamond, and can obtain a complete liquid phase below 800 ℃. Under the solid solution strengthening effect of the aluminum nickel element and the multiple effects of the active element titanium and the like, when the active solder alloy is used for brazing the diamond and the matrix, the diamond and the matrix can form firm metallurgical bonding, and the shear strength of the graphite/45 steel joint brazed by using the solder can reach more than 35.7 MPa. The powdery active brazing filler metal for the diamond grinding tool has low welding temperature during brazing, has small heat loss to diamond, does not contain precious metal elements, can sinter or braze diamond products under gas shielded welding, is favorable for simplifying the production process and reducing the production cost.
Description
Technical Field
The invention belongs to the technical field of brazing materials, and particularly relates to a powdery active brazing filler metal for a diamond grinding tool.
Background
The active brazing refers to a connection method in which carbide forming elements such as Ti, Zr, Hf and V in the liquid brazing filler metal interact with a carbon material (such as diamond) in the brazing process, and intermetallic compound layers such as Ti C and VC are formed on the interface of the carbon material, so that atomic layer bonding among a matrix, the brazing filler metal and the diamond is realized. The commonly used active solder suitable for soldering diamond comprises nickel-based active solder, copper-based active solder and silver-based active solder, wherein the Ni-based active solder mainly comprises Ni-Ti, Ni-Cr-Si-B alloy solder and the like. The liquidus melting temperature of the Ni-based active solder is generally higher than 900 ℃, and the diamond is easy to have thermal damage in the brazing process. The Ag-based active solder has low soldering temperature and good soldering joint performance, but the higher silver content increases the soldering cost and limits the use amount of the Ag-based active solder.
The Cu-based active solder has better wettability to diamond, saves the soldering cost and has better economy, thereby being concerned about. The common Cu-based active solder comprises CuSnTi, CuSnTiNi and CuSnTiZr, wherein the liquidus line of the copper-based active solder is above 850 ℃ under the condition of ensuring the strength of the solder, and the maximum shearing strength of graphite and No. 45 steel joints brazed by using the active solder can reach 35.0 MPa. The patent CN101913036B discloses a CuSnTi active solder, which can obtain a complete liquid phase below 800 ℃, and the shear strength of the joint between the graphite and No. 45 steel soldered by the active solder can reach 30.14 MPa.
At present, the preparation method of the copper-tin-titanium brazing filler metal mainly comprises two methods of arc melting and vacuum melting. In the arc melting method, the arc heating range is small, so that the copper-tin-titanium brazing filler metal prepared each time is insufficient, and industrial production cannot be realized. The vacuum melting method has certain advantages when preparing the copper-tin-titanium solder, but cannot be applied to the solder containing volatile elements, and the copper-tin-titanium alloy has brittle phases, so that the plasticity of the solder is poor, and meanwhile, impurity elements are easily introduced, so that the mechanical property of the copper-tin-titanium solder is reduced, and the actual performance index requirements of engineering cannot be met. Therefore, the arc melting and vacuum melting method has certain limitation in the aspect of preparing the copper-tin-titanium solder.
Disclosure of Invention
In order to solve the problems, the invention provides the powdery active brazing filler metal for the diamond grinding tool, which can improve the wear resistance and the holding force of the diamond saw blade.
In order to achieve the purpose, the invention adopts the technical scheme that:
the powdered active brazing filler metal for the diamond grinding tool is characterized in that: the powdery active brazing filler metal comprises the following components in percentage by mass: 55-70% of Cu, 12-18% of Sn, 3-10% of Al, 1-10% of Zn, 5-10% of Ti, 1-6% of Si and 0.01-3% of Ni.
Further, the powdery active brazing filler metal comprises the following components in percentage by mass: 55-70% of Cu, 12-18% of Sn, 3-10% of Al, 1-10% of Zn, 5-10% of Ti and 1-6% of Si.
Further, the powdery active brazing filler metal also comprises 0-0.1% of trace elements by mass percent, and the trace elements comprise at least one of La, Ce, Ga, Cr and Zr.
Further, the granularity of the powdery brazing filler metal is 50-500 meshes.
Furthermore, the raw materials of the active solder comprise Cu metal powder, Sn metal powder, Al metal powder, Zn metal powder, Ti metal powder, Si metal powder and Ni metal powder, and the purity of the Cu metal powder, the Sn metal powder, the Al metal powder, the Zn metal powder, the Ti metal powder, the Si metal powder and the Ni metal powder is not less than 99%.
Further, the raw materials are pre-dispersed by adopting a mechanical stirring method, an ultrasonic vibration method and a chemical reagent dispersion method, and then active solder powder is prepared by ball milling, wherein the prepared active solder powder comprises the following components in percentage by mass: 55-70% of copper powder, 12-18% of tin powder, 3-10% of aluminum powder, 1-10% of zinc powder, 5-10% of titanium powder, 1-6% of silicon powder, 0.01-3% of nickel powder and 0-0.1% of trace elements, wherein the trace elements are at least one of La, Ce, Ga, Cr and Zr.
Further, the preparation method of the active solder powder comprises the following steps:
step one, pre-dispersing metal powder: adding metal powder of copper, tin, aluminum, titanium, zinc, silicon and nickel into absolute ethyl alcohol, and simultaneously carrying out mechanical stirring and ultrasonic dispersion on the mixed solution of the metal powder and the absolute ethyl alcohol;
step two, wet ball milling: transferring the mixed solution of the pre-dispersed metal powder of copper, tin, aluminum, titanium, zinc, silicon and nickel and absolute ethyl alcohol into a ball milling tank, and adjusting the amount of the absolute ethyl alcohol to ensure that all steel balls are completely immersed in the absolute ethyl alcohol for ball milling;
step three, suction filtration: carrying out suction filtration on the mixed solution after ball milling, and repeatedly carrying out suction filtration for 3-5 times to obtain a filter cake;
step four, vacuum drying: and (4) carrying out vacuum drying treatment on the filter cake obtained in the step three to obtain active solder powder.
Further, three-piece type propeller blades are adopted for mechanical stirring, and the rotating speed is 50-300 r/min; the vibration frequency of the ultrasonic vibration instrument is 50-100 Hz, and the action time is 30-500 min.
Furthermore, in the ball milling process, the ball-material ratio is 3: 1-30: 1, the ball milling rotation speed is 30-300 r/min, and the ball milling time is 0.5-72 hours, wherein the total addition amount of absolute ethyl alcohol is 0.8-3.5 times of the total weight of the active solder powder.
Further, the drying temperature is 50-110 ℃, the drying time is 3-72 hours, and the vacuum degree is not higher than 5 multiplied by 10-2Pa。
The active powdered brazing filler metal is compounded and added with aluminum, zinc and silicon on the basis of the copper-tin-titanium active brazing filler metal, the obtained powdered brazing filler metal is low in alloy melting point, diamond and a matrix form firm metallurgical bonding during brazing, the bonding strength is high, the holding force for diamond is high, the temperature is low during brazing connection, the thermal damage to diamond is small, the brazing is easy, silver and other precious metal elements are not contained, diamond products can be sintered or brazed under the protection of gas, the process is simple, and the cost is low.
The invention is based on the characteristic principle of the following elements and is selected as the raw material for preparing the brazing filler metal: tin can reduce the melting point of the alloy, but increases the brittleness of active elements, and can form a compound with carbon and zinc to form firm connection; the aluminum has higher solid solubility in Cu, forms continuous solid solutions with Cu respectively, has a single-phase region with a larger range, and can obviously improve the hardness and the wear resistance of the Cu-based active solder; the zinc can reduce the melting point of the alloy and can form a solid solution with good shaping with the copper; titanium can improve the strength and the wettability of the solder, but can increase the melting point of the solder; silicon can reduce the melting point of the brazing filler metal, prevent the evaporation of zinc and manganese and improve the wetting; the nickel can improve the strength and the wettability of the solder, but can increase the melting point of the solder; zirconium is slightly soluble in Cu, and has a dispersion strengthening effect on Cu at room temperature, so that the strength of the brazing filler metal is improved; chromium and carbide forming elements can improve wetting and form firm bonding; trace lanthanum or cerium can purify grain boundary, refine crystal grains and improve the wettability of the brazing filler metal; gallium reduces the surface tension of the Cu-based active solder and improves the wettability of the solder.
The invention has the beneficial effects that:
1. according to the powdery active solder for the diamond grinding tool, zinc, aluminum and silicon are added on the basis of copper, tin and titanium, so that the hardness and the wear resistance of the Cu-based active solder are remarkably improved, and the melting point of the alloy is further reduced; the diamond, the brazing filler metal and the matrix can form firm metallurgical bonding by wetting the diamond by the active elements and forming a certain amount of carbides;
2. the invention can directly prepare various metal powders into pre-alloy powder by wet ball milling, has simple process and low production cost, and can be popularized in a large range.
Drawings
FIG. 1 is a scanning electron micrograph of diamond/active braze.
Wherein, each reference number in the figure is: A. diamond; B. a diamond/active braze interface; C. and (3) active solder.
Detailed Description
In order that those skilled in the art will be able to better understand the technical solutions provided by the present invention, the following description is provided in conjunction with the specific embodiments.
The active powdery brazing filler metal comprises the following components in percentage by mass: cu 55-65%, Sn 10-20%, Al 5-15%, Zn 1-10%, Ti 5-10% and Si 2-5%.
The preparation method of the active powdery brazing filler metal comprises the following steps:
1) pre-dispersing metal powder: adding metal powder of copper, tin, aluminum, titanium, zinc, silicon and nickel into absolute ethyl alcohol, and simultaneously carrying out mechanical stirring and ultrasonic dispersion on the mixed solution of the metal powder and the absolute ethyl alcohol. In the process, the vibration frequency of the ultrasonic vibration instrument is 50-100 Hz, and the action time is 30-500 min.
2) And (3) wet ball milling: and transferring the pre-dispersed mixed solution of metal powder of copper, tin, aluminum, titanium, zinc, silicon and nickel and absolute ethyl alcohol into a ball milling tank, and adjusting the amount of the absolute ethyl alcohol to ensure that all the steel balls are completely immersed in the absolute ethyl alcohol for ball milling. In the process, the ball-material ratio is 3: 1-30: 1, the ball milling rotation speed is 30-300 r/min, and the ball milling time is 0.5-72 hours, wherein the total addition amount of absolute ethyl alcohol is 0.8-3.5 times of the total weight of the composite powder of the active solder.
3) And (3) suction filtration: and (4) carrying out suction filtration on the mixed solution after ball milling, and repeatedly carrying out suction filtration for 3-5 times.
4) And (3) vacuum drying: and carrying out vacuum drying treatment on the filter cake to obtain active solder powder. In the process, the drying temperature is 50-110 ℃, the drying time is 3-72 hours, and the vacuum degree is not higher than 5 multiplied by 10-2Pa。
The following are specific examples of the preparation of the composite powder of the present invention to further illustrate the present invention, and are not meant to limit the scope of the present invention.
Example 1
The operation is carried out with reference to the specific steps described above. The mixed coarse powder containing 60wt% of copper powder, 15wt% of tin powder, 8wt% of aluminum powder, 7wt% of zinc powder, 7wt% of titanium powder and 3wt% of silicon powder is adopted. The average grain size of the mixed powder is about 200 meshes, and the purities of copper powder, tin powder, aluminum powder, zinc powder, titanium powder and silicon powder are all 99.5%. Pre-dispersing, namely adding 6g of copper powder, 1.5g of tin powder, 0.8g of aluminum powder, 0.7g of zinc powder, 0.7g of titanium powder and 0.3g of silicon powder, wherein the addition amount of absolute ethyl alcohol is 20g, the rotating speed of a stirrer is 200r/min, the ultrasonic vibration frequency is 60Hz, the action time is 200min, and the solution temperature is 30 ℃. The ball-material ratio in the ball milling process is 10:1, the ball milling time is 24 hours, and the rotating speed of the ball mill is 150 r/min. The drying temperature is 100 ℃, the drying time is 24 hours, and the vacuum degree after the drying is finished is 4.5 multiplied by 10-2Pa。
The active solder alloy of the embodiment can obtain a complete liquid phase at the temperature of below 810 ℃; in the characterization of the active filler metal of the present invention, it is difficult to quantify the brazing bonding strength of diamond and the substrate due to the brazing of diamond particles. The elements of the graphite and the diamond are carbon, the matrix brazing graphite is used as a shearing sample, the bonding strength of the carbon and the matrix is quantized, and the bonding strength of the matrix and the diamond particles is further proved. Specifically, the active solder prepared in the embodiment is used as a raw material, an active solder brazing graphite shear sample is prepared, the shear strength of the active solder brazing graphite and No. 45 steel in the embodiment is measured, and the shear strength of the active solder brazing graphite/No. 45 steel joint can reach 36.0 MPa.
Fig. 1 is a scanning electron microscope picture of the diamond/active solder according to the embodiment, the prepared powdered active solder is welded on the surface of the diamond, and the scanning electron microscope is used for observation, wherein an area a is a diamond area, an area B is a diamond/active solder interface area, and an area C is an active solder area; as can be seen, the diamond is smooth and intact, and no significant thermal damage is produced. And the interface bonding between the diamond and the active braze is good.
Example 2
The operation is carried out with reference to the specific steps described above. The mixed coarse powder containing 55wt% of copper powder, 23wt% of tin powder, 7wt% of aluminum powder, 8wt% of zinc powder, 5wt% of titanium powder and 2wt% of silicon powder is adopted. The average grain size of the mixed powder is about 180 meshes, and the purities of copper powder, tin powder, aluminum powder, zinc powder, titanium powder and silicon powder are all 99.5%. The pre-dispersion process comprises the steps of adding 5.5g of copper powder, 2.3g of tin powder, 0.7g of aluminum powder, 0.8g of zinc powder, 0.5g of titanium powder, 0.2g of silicon powder, 25g of absolute ethyl alcohol, rotating speed of a stirrer at 250r/min, ultrasonic vibration frequency at 100Hz, action time at 250min and solution temperature at room temperature of 30 ℃. The ball-material ratio in the ball milling process is 15:1, the ball milling time is 36 hours, and the rotating speed of the ball mill is 200 r/min. The drying temperature is 100 ℃, the drying time is 24 hours, and the vacuum degree after the drying is finished is 4.9 multiplied by 10-2Pa。
The active solder alloy of the embodiment can obtain a complete liquid phase at the temperature of below 810 ℃; the shear strength of the active solder brazing graphite/No. 45 steel joint can reach 36.50 MPa.
Example 3
The operation is carried out with reference to the specific steps described above. The alloy comprises 60wt% of copper powder, 15wt% of tin powder, 8wt% of aluminum powder, 7wt% of zinc powder, 6.9wt% of titanium powder and 3 w% of silicon powdert%, chromium powder 0.05wt%, zirconium powder 0.05 wt%. The average grain size of the mixed powder is about 200 meshes, and the purities of copper powder, tin powder, aluminum powder, zinc powder, titanium powder, silicon powder, chromium powder and zirconium powder are all 99.5%. The pre-dispersion process comprises the steps of adding 6g of copper powder, 1.5g of tin powder, 0.8g of aluminum powder, 0.7g of zinc powder, 0.69g of titanium powder, 0.3g of silicon powder, 0.005g of chromium powder and 0.005g of zirconium powder, wherein the addition amount of absolute ethyl alcohol is 20g, the rotating speed of a stirrer is 200r/min, the ultrasonic vibration frequency is 60Hz, the action time is 300min, and the solution temperature is 30 ℃. The ball-material ratio in the ball milling process is 16:1, the ball milling time is 30 hours, and the rotating speed of the ball mill is 200 r/min. The drying temperature is 100 ℃, the drying time is 35 hours, and the vacuum degree after the drying is 4.5 multiplied by 10- 2Pa。
The active solder alloy of the embodiment can obtain a complete liquid phase at the temperature of below 810 ℃; the shear strength of the active solder brazing graphite/No. 45 steel joint can reach 37.0 MPa.
Example 4
The operation is carried out with reference to the specific steps described above. The mixed coarse powder which contains 55wt% of copper powder, 23wt% of tin powder, 7wt% of aluminum powder, 8wt% of zinc powder, 5wt% of titanium powder, 2wt% of silicon powder, 0.04wt% of lanthanum powder and 0.06wt% of cerium powder is adopted. The average particle size of the mixed powder is about 200 meshes, and the purities of copper powder, tin powder, aluminum powder, zinc powder, titanium powder, silicon powder, lanthanum powder and cerium powder are all 99.5%. The pre-dispersion process comprises the steps of adding 6g of copper powder, 1.5g of tin powder, 0.8g of aluminum powder, 0.7g of zinc powder, 0.69g of titanium powder, 0.3g of silicon powder, 0.004g of lanthanum powder, 0.006g of cerium powder, 25g of absolute ethyl alcohol, controlling the rotating speed of a stirrer to be 250r/min, the ultrasonic vibration frequency to be 100Hz, the action time to be 200min and the solution temperature to be 30 ℃. The ball-material ratio in the ball milling process is 15:1, the ball milling time is 42 hours, and the rotating speed of the ball mill is 250 r/min. The drying temperature is 100 ℃, the drying time is 28 hours, and the vacuum degree after the drying is finished is 4.7 multiplied by 10-2Pa。
The powdery active solder alloy of the embodiment can obtain a complete liquid phase at the temperature of below 810 ℃; the shear strength of the active solder brazing graphite/No. 45 steel joint can reach 36.50 MPa.
Example 5
The operation is carried out with reference to the specific steps described above. Using copper powder containing 6015wt% of tin powder, 8wt% of aluminum powder, 7wt% of zinc powder, 6.9wt% of titanium powder, 3wt% of silicon powder and 0.1wt% of gallium powder. The average grain size of the mixed powder is about 200 meshes, and the purities of copper powder, tin powder, aluminum powder, zinc powder, titanium powder, silicon powder and gallium powder are all 99.5%. Pre-dispersing, adding 6g of copper powder, 1.5g of tin powder, 0.8g of aluminum powder, 0.7g of zinc powder, 0.69g of titanium powder, 0.3g of silicon powder and 0.01g of gallium powder, wherein the addition amount of absolute ethyl alcohol is 20g, the rotating speed of a stirrer is 200r/min, the ultrasonic vibration frequency is 60Hz, the action time is 200min, and the solution temperature is 30 ℃. The ball-material ratio in the ball milling process is 20:1, the ball milling time is 32 hours, and the rotating speed of the ball mill is 250 r/min. The drying temperature is 100 ℃, the drying time is 48 hours, and the vacuum degree after the drying is finished is 4.6 multiplied by 10-2Pa。
The active solder alloy of the embodiment can obtain a complete liquid phase at the temperature of below 810 ℃; the shear strength of the active solder brazing graphite/No. 45 steel joint can reach 36.0 MPa.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. The present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (8)
1. The powdered active brazing filler metal for the diamond grinding tool is characterized in that: the powdery active brazing filler metal comprises the following components in percentage by mass: 55-70% of Cu, 12-18% of Sn, 3-10% of Al, 1-10% of Zn, 5-10% of Ti, 1-6% of Si and 0.01-3% of Ni;
the powdery active brazing filler metal also comprises 0-0.1% of trace elements by mass percent, wherein the trace elements comprise at least one of La, Ce, Ga, Cr and Zr;
the liquidus temperature of the active solder alloy is less than 810 ℃, and the shear strength of the active solder brazing graphite/No. 45 steel joint reaches 36.0 MPa.
2. The powdered activated brazing filler metal for diamond grinding tools according to claim 1, wherein: the granularity of the powdery active brazing filler metal is 50-500 meshes.
3. The powdered activated brazing filler metal for diamond grinding tools according to claim 1, wherein: the raw materials of the powdery active brazing filler metal comprise Cu metal powder, Sn metal powder, Al metal powder, Zn metal powder, Ti metal powder, Si metal powder and Ni metal powder, and the purity of the Cu metal powder, the Sn metal powder, the Al metal powder, the Zn metal powder, the Ti metal powder, the Si metal powder and the Ni metal powder is greater than or equal to 99%.
4. The powdered activated brazing filler metal for diamond grinding tools according to claim 3, wherein: the raw materials are pre-dispersed by adopting a mechanical stirring method, an ultrasonic vibration method and a chemical reagent dispersion method, and then active solder powder is prepared by ball milling, wherein the prepared active solder powder comprises the following components in percentage by mass: 55-70% of copper powder, 12-18% of tin powder, 3-10% of aluminum powder, 1-10% of zinc powder, 5-10% of titanium powder, 1-6% of silicon powder, 0.01-3% of nickel powder and 0-0.1% of trace elements, wherein the trace elements are at least one of La, Ce, Ga, Cr and Zr.
5. The powdered activated brazing filler metal for diamond grinding tools according to claim 3, wherein: the preparation method of the active solder powder comprises the following steps:
step one, pre-dispersing metal powder: adding metal powder of copper, tin, aluminum, titanium, zinc, silicon and nickel into absolute ethyl alcohol, and simultaneously carrying out mechanical stirring and ultrasonic dispersion on the mixed solution of the metal powder and the absolute ethyl alcohol;
step two, wet ball milling: transferring the mixed solution of the pre-dispersed metal powder of copper, tin, aluminum, titanium, zinc, silicon and nickel and absolute ethyl alcohol into a ball milling tank, and adjusting the amount of the absolute ethyl alcohol to ensure that all steel balls are completely immersed in the absolute ethyl alcohol for ball milling;
step three, suction filtration: carrying out suction filtration on the mixed solution after ball milling, and repeatedly carrying out suction filtration for 3-5 times to obtain a filter cake;
step four, vacuum drying: and (4) carrying out vacuum drying treatment on the filter cake obtained in the step three to obtain active solder powder.
6. The powdered activated brazing filler metal for diamond grinding tools according to claim 5, wherein: three-piece type propeller blades are adopted for mechanical stirring, and the rotating speed is 50-300 r/min; the vibration frequency of the ultrasonic vibration instrument is 50-100 Hz, and the action time is 30-500 min.
7. The powdered activated brazing filler metal for diamond grinding tools according to claim 5, wherein: in the ball milling process, the ball-material ratio is 3: 1-30: 1, the ball milling rotation speed is 30-300 r/min, and the ball milling time is 0.5-72 hours, wherein the total addition amount of absolute ethyl alcohol is 0.8-3.5 times of the total weight of the active solder powder.
8. The powdered activated brazing filler metal for diamond grinding tools according to claim 5, wherein: the drying temperature is 50-110 ℃, the drying time is 3-72 hours, and the vacuum degree is not higher than 5 multiplied by 10-2Pa。
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| CN114182136B (en) * | 2022-01-24 | 2022-05-03 | 中机智能装备创新研究院(宁波)有限公司 | Copper-aluminum prealloy, preparation method and diamond tool |
| CN114952077A (en) * | 2022-04-14 | 2022-08-30 | 天诺光电材料股份有限公司 | Composite soldering paste and preparation method and application thereof |
| CN115042100B (en) * | 2022-06-09 | 2023-07-18 | 江西华丽丰光电有限公司 | Grinding head with long service life and preparation method thereof |
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| JPS62179889A (en) * | 1986-01-31 | 1987-08-07 | Senjiyu Kinzoku Kogyo Kk | Creamy solder |
| CN101913036B (en) * | 2010-09-08 | 2011-12-07 | 郑州机械研究所 | CuZnTi solder for soldering diamond tool |
| CN103170764B (en) * | 2011-12-26 | 2015-02-18 | 北京有色金属研究总院 | Brazing filler alloy powder and preparation method thereof |
| CN103231064B (en) * | 2013-04-28 | 2014-12-10 | 中原工学院 | Manufacturing method for novel nickel base solder brazing monolayer diamond grinding wheel |
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| CN106238962A (en) * | 2016-08-30 | 2016-12-21 | 郑州机械研究所 | A kind of active solder alloy |
| CN107363255B (en) * | 2017-06-15 | 2019-11-05 | 江苏华昌工具制造有限公司 | Powdered filler metal for compact diamond tool |
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