CN109520338A - Parallel-connection type condenser and radiator - Google Patents
Parallel-connection type condenser and radiator Download PDFInfo
- Publication number
- CN109520338A CN109520338A CN201710858345.4A CN201710858345A CN109520338A CN 109520338 A CN109520338 A CN 109520338A CN 201710858345 A CN201710858345 A CN 201710858345A CN 109520338 A CN109520338 A CN 109520338A
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- China
- Prior art keywords
- main
- base tube
- auxiliary
- parallel
- main base
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Abstract
The present invention relates to a kind of parallel-connection type condenser and radiators, radiator includes parallel-connection type condenser and evaporative component, parallel-connection type condenser includes main condensing modules and at least one auxiliary condensation module parallel with one another, evaporative component includes an evaporator, one input pipe and an efferent duct, input pipe both ends are separately connected the top of evaporator and the first main base tube of main condensing modules, efferent duct both ends are separately connected the second main base tube of evaporator and main condensing modules, parallel-connection type condenser and evaporative component is set to constitute a closed refrigerant circulation circuit, and refrigerant is filled in closed refrigerant circulation circuit, radiator of the present invention can pass through main condensing modules in parallel and auxiliary condensation module, gaseous coolant is provided and shunts cooling, liquefied function, the radiator can be effectively improved in gaseous coolant cooling and liquefied efficiency.
Description
Technical field
The present invention relates to a kind of parallel-connection type condenser and radiators, espespecially to provide the parallel condensation of cooling function
Device and radiator.
Background technique
When electronic device is easy to produce high temperature in operational process, if electronic device at high temperature continuous service when, may
The risk of irregular operating or damage is had, therefore can be filled by one heat dissipation of installing at the main pyrotoxin of the electronic device
It sets, and is distributed heat caused by pyrotoxin by principles such as heat transfer, thermal convections by radiator, to reduce electronic device
Temperature, achieve the purpose that cooling.
Wherein, the radiator includes an evaporator, a condenser and multiple refrigerant pipes, and multiple refrigerant pipe connects respectively
The evaporator and the condenser are connect, and forms a closed circuit, and is filled with refrigerant in the closed circuit, the evaporator
It can be set at the pyrotoxin of electronic device, when the pyrotoxin adstante febre of electronic device can be conducted to evaporator, and be located at and steam
Refrigerant in hair device can absorb heat and gasify to form gaseous refrigerant, and gaseous refrigerant can be entered in condenser by refrigerant pipe, and
After cooling is condensed into liquid when passing through condenser, it is back to evaporator again and absorbs heat again, by refrigerant in liquid and gaseous state
The cooling mechanism that circulates of phase transformation, to provide the pyrotoxin cooling function of electronic device.
However the radiator only has a condenser, and the condenser can be provided the flow that gaseous coolant passes through
Limited, the liquid refrigerants inside the evaporator is heated, and refrigerant amount of vaporization is cold greater than condenser offer gaseous coolant
But, when liquefaction amount, there is the problem that heat dissipation is bad.
Summary of the invention
The main purpose of the present invention is to provide a parallel-connection type condenser and radiators, it is desirable to thus improve now dissipate
Thermal is easy to be limited to the flow restriction of condenser, leads to the problem that heat dissipation is bad.
To achieve the aforementioned purpose, parallel-connection type condenser provided by the present invention includes:
One main condensing modules, it includes one first main base tube, one second main base tube and a main cooling mechanism, the first main bases
Pipe is alternatively arranged setting with the second main base tube, the main cooling mechanism be set to the first main base tube and the second main base tube it
Between；
At least one auxiliary condensation module, in parallel with the main condensing modules, the auxiliary condensation module includes one first auxiliary
Base tube, one second auxiliary base tube and an auxiliary heat dissipation mechanism are helped, which is alternatively arranged with the second auxiliary base tube
Setting, the first auxiliary base tube are connected to the first main base tube, which is connected to the second main base tube, the auxiliary heat dissipation
Mechanism is set between the first auxiliary base tube and the second auxiliary base tube.
Parallel-connection type condenser above-mentioned, wherein the main cooling mechanism includes multiple main heat radiation conduits and multiple main heat dissipations
Part, multiple main heat radiation conduit between the upper and lower every being connected between the first main base tube and the second main base tube in a row, multiple master
Radiating piece is arranged evenly and thermal conductivity contacts the outer surface of multiple main heat radiation conduit；The auxiliary heat dissipation mechanism includes multiple auxiliary
Help heat radiation conduit and multiple auxiliary heat dissipation parts, multiple auxiliary heat dissipation conduit between the upper and lower every being connected to the first auxiliary base in a row
Between pipe and the second auxiliary base tube, multiple auxiliary heat dissipation part is arranged evenly and thermal conductivity contacts multiple auxiliary heat dissipation conduit
Outer surface.
Parallel-connection type condenser above-mentioned, wherein the main radiating piece of the main cooling mechanism and the auxiliary heat dissipation mechanism
Auxiliary heat dissipation part is wavy.
Parallel-connection type condenser above-mentioned, wherein the first auxiliary substrate tube of the auxiliary condensation module is formed with multiple
First runner, multiple first runner are directly or indirectly connected to the first main base tube, and the second of the auxiliary condensation module is auxiliary
Substrate tube is helped to be formed with multiple second flow channels, multiple second flow channel is directly or indirectly connected to the second main base tube.
To achieve the aforementioned purpose, radiator provided by the present invention includes:
One parallel-connection type condenser as the aforementioned；And
One evaporative component, it includes an evaporator, an input pipe and an efferent duct, which includes to have vaporization chamber in one
Shell, the bottom of the shell has a conductive base plate, the both ends of the input pipe be separately connected the case top of the evaporator with
And the first main base tube of the main condensing modules, the both ends of the efferent duct are separately connected side wall and master of the shell of the evaporator
The main base tube of the second of condensation module makes the parallel-connection type condenser and the evaporative component constitute a closed refrigerant circulation circuit, and
Refrigerant is filled in the closed refrigerant circulation circuit.
Radiator above-mentioned, wherein the main base tube upper section of the first of the main condensing modules of the radiator forms a refrigerant
The lower section of entrance, the lower section of the main base tube of the first of the main condensing modules and the second main base tube is respectively formed a refrigerant exit, this is defeated
The both ends for entering pipe are separately connected the case top of the evaporator and the refrigerant inlet of the main condensing modules, the both ends of the efferent duct
It is separately connected the refrigerant exit of the side wall of the shell of the evaporator and the second main base tube of the main condensing modules, and the evaporation group
Part includes a return pipe, the both ends of the return pipe be separately connected the shell of the evaporator side wall and the main condensing modules the
The refrigerant exit of one main base tube.
Radiator above-mentioned, wherein the bore of the input pipe is greater than the bore of the efferent duct.
Radiator above-mentioned, wherein the bore of the input pipe is greater than the efferent duct and the bore of the return pipe.
Parallel-connection type condenser of the present invention can be applied to general radiator or radiator as the aforementioned, and simultaneously by this
The main condensing modules and auxiliary condensation module of connection formula condenser provide refrigerant and are able to the cooling by way of shunting, and then provide object
The radiating and cooling effect of product or device, for being applied to offer electronic device and cool, the evaporator can be used to install
In on the pyrotoxin of electronic device.
It wherein, can be in the increase of refrigerant amount of vaporization by the refrigerant pressure of the closed refrigerant circulation circuit
It rises and refrigerant amount of vaporization can increase and increased characteristic with the fever source temperature of electronic device, if the fever of electronic device
Source fever so that refrigerant is gasified, and refrigerant amount of vaporization less than the main condensing modules can be provided the flow that gaseous coolant passes through when,
The gaseous coolant can directly pass through the main condensing modules；If the pyrotoxin fever of electronic device makes refrigerant gasify, and refrigerant
When amount of vaporization can be provided the flow that gaseous coolant passes through greater than the main condensing modules, the gaseous coolant can be because of refrigerant pressure
Power is big, and enters part gaseous coolant in auxiliary condensation module, and by way of shunting while is cooling, to improve described dissipate
The cooling medium liquefaction efficiency of thermal.
In addition, the first main base tube upper section of the main condensing modules of the radiator forms a refrigerant inlet, the main condenser mould
The lower section of the lower section of the main base tube of the first of block and the second main base tube is respectively formed a refrigerant exit, and the both ends of the input pipe connect respectively
The case top of the evaporator and the refrigerant inlet of the main condensing modules are connect, the both ends of the efferent duct are separately connected the evaporator
Shell side wall and the main condensing modules the second main base tube refrigerant exit, and the evaporative component include a return pipe,
The both ends of the return pipe are separately connected the refrigerant of the side wall of the shell of the evaporator and the first main base tube of the main condensing modules
Outlet, when gaseous coolant by the input pipe enter the main condensing modules the first main base tube in when, it is condensed at liquid
Refrigerant can flow downward to the main condensing modules the first main base tube lower section, and be directly back to evaporation from return pipe
In device, and after remaining gaseous coolant then can be condensed into liquid refrigerants by the main cooling mechanism, from the connection main condenser mould
The efferent duct of the main base tube of the second of block is back in evaporator, by multithread to refrigerant phase transformation circulate mode, make liquid, gas
State refrigerant can shunt really, and then improve the heat dissipation effect of the radiator.
Detailed description of the invention
Fig. 1 is a kind of three-dimensional appearance schematic diagram of preferred embodiment of parallel-connection type condenser of the present invention.
Fig. 2 is the schematic top plan view of parallel-connection type condenser of the present invention.
Fig. 3 is the side view floor map of parallel-connection type condenser of the present invention.
Fig. 4 is a kind of three-dimensional appearance schematic diagram of preferred embodiment of radiator of the present invention.
Fig. 5 is that the evaporator of radiator of the present invention is set to the partial cutaway schematic on pyrotoxin.
Fig. 6 is the use state diagram of radiator of the present invention.
Fig. 7 is the flow direction schematic diagram when refrigerant of radiator of the present invention does not shunt.
Flow direction schematic diagram when Fig. 8 is the coolant distribution of radiator of the present invention.
Description of symbols:
The main base tube of 10 main condensing modules 11 first
The 12 second main cooling mechanisms of main base tube 13
The 14 main radiating pieces of main heat radiation conduit 15
20 auxiliary condensation modules 21 first assist base tube
22 second auxiliary 23 auxiliary heat dissipation mechanisms of base tube
24 auxiliary heat dissipation conduit, 25 auxiliary heat dissipation part
30 evaporative component, 31 evaporator
32 input pipe, 33 efferent duct
35 shell, 36 conductive base plate
37 return pipes.
Specific embodiment
It please refers to Fig.1 to Fig.3, is a kind of preferred embodiment of parallel-connection type condenser of the present invention, it includes a main condenser moulds
Block 10 and at least one auxiliary condensation module 20.
As shown in Figure 1 to Figure 3, which includes one first main base tube 11, one second main base tube 12 and a master
Cooling mechanism 13, the first main base tube 11 are alternatively arranged setting with the second main base tube 12, which is set to this
Between first main base tube 11 and the second main base tube 12, wherein the main cooling mechanism 13 includes multiple main heat radiation conduits 14 and more
A main radiating piece 15, multiple main heat radiation conduit 14 between the upper and lower every being connected to the first main base tube 11 and the second main base tube in a row
Between 12, multiple main radiating piece 15 is arranged evenly and thermal conductivity contacts the outer surface of multiple main heat radiation conduit 14, the master
The main radiating piece 15 of cooling mechanism 13 is wavy.
As shown in Figure 1 to Figure 3, the auxiliary condensation module 20 is in parallel with the main condensing modules 10, and the auxiliary condenses mould
Block 20 includes that one first auxiliary base tube 21, one second assists base tube 22 and an auxiliary heat dissipation mechanism 23, the first auxiliary base tube 21
It is alternatively arranged setting with the second auxiliary base tube 22, which is connected to the first main base tube 11, the second auxiliary base
Pipe 22 is connected to the second main base tube 12, which is set to the first auxiliary base tube 21 and the second auxiliary base tube
22, wherein the auxiliary heat dissipation mechanism 23 includes multiple auxiliary heat dissipation conduits 24 and multiple auxiliary heat dissipation parts 25, multiple auxiliary
Heat radiation conduit 24 between the upper and lower every be connected in a row this first auxiliary base tube 21 and second auxiliary base tube 22 between, multiple auxiliary
Radiating piece 25 is arranged evenly and thermal conductivity contacts the outer surface of multiple auxiliary heat dissipation conduit 24, the auxiliary heat dissipation mechanism 23
Auxiliary heat dissipation part 25 is wavy.
In addition, as shown in Figure 2 and Figure 3, being formed with multiple the inside the first auxiliary base tube 21 of the auxiliary condensation module 20
One runner 26, multiple first runner 26 are directly or indirectly connected to the first main base tube 11, the auxiliary condensation module 20
Be formed with multiple second flow channels 27 inside second auxiliary base tube 22, multiple second flow channel 27 be directly or indirectly connected to this second
Main base tube 12.
Referring to Fig. 4, be a kind of preferred embodiment of radiator of the present invention, it includes a radiator as the aforementioned and
One evaporative component 30.
As shown in Figure 4, Figure 5, the evaporative component 30, it includes an evaporator 31, an input pipe 32 and an efferent ducts 33, should
Evaporator 31 includes the shell 35 for having vaporization chamber 34 in one, and the bottom of the shell 35 has a conductive base plate 36, the input pipe 32
Both ends be separately connected the top of shell 35 and the first main base tube 11 of the main condensing modules 10 of the evaporator 31, the efferent duct
33 both ends are separately connected the side wall of the shell 35 of the evaporator 31 and the second main base tube 12 of the main condensing modules 10, make this
Parallel-connection type condenser and the evaporative component 30 constitute a closed refrigerant circulation circuit, and in the closed refrigerant circulation circuit
Refrigerant 50 is filled, wherein the bore of the input pipe 32 is greater than the bore of the efferent duct 33.
In addition, as Figure 1 and Figure 4, it is cold that main 11 upper section of base tube of the first of the main condensing modules 10 of the radiator forms one
The lower section of matchmaker's entrance 16, the lower section of the main base tube 11 of the first of the main condensing modules 10 and the second main base tube 12 is respectively formed a refrigerant
Outlet 17,18, the both ends of the input pipe 32 are separately connected shell 35 top and the main condensing modules 10 of the evaporator 31
Refrigerant inlet 16, the both ends of the efferent duct 33 are separately connected the side wall and the main condensing modules 10 of the shell 35 of the evaporator 31
The second main base tube 12 refrigerant exit 18, and the evaporative component 30 includes a return pipe 37, and the both ends of the return pipe 37 are distinguished
The refrigerant exit 17 of the side wall of the shell 35 of the evaporator 31 and the first main base tube 11 of the main condensing modules 10 is connected, then
Person, the bore of the input pipe 32 are greater than the efferent duct 33 and the bore of the return pipe 37.
As shown in Figures 5 to 7, parallel-connection type condenser of the present invention can be applied to general radiator or as the aforementioned heat dissipation
Device, and provide refrigerant 50 by the main condensing modules 10 of the parallel-connection type condenser and auxiliary condensation module 20 and be able to pass through shunting
Mode it is cooling, and then provide the radiating and cooling effect of article or device, for being applied to provide electronic device and cool,
The evaporator 31 can be used to be installed on the pyrotoxin 40 of electronic device, when electronic device pyrotoxin 40 fever and in temperature
When rising, heat caused by the pyrotoxin 40 can be cold into vaporization chamber 34 by 36 heat transfer of conductive base plate of the evaporator 31
Matchmaker 50, and the refrigerant 50 being located in the vaporization chamber 34 can gasify because of heat absorption in gaseous coolant 50, while can be certainly using hot gas
The principle so risen, and flow into the input pipe 32 at the connection 35 top of shell, and enter main condenser along input pipe 32
In the main base tube 11 of the first of module 10, then the gaseous coolant 50 can sequentially be led by the main heat dissipation of the main cooling mechanism 13
After pipe 14 is condensed into liquid refrigerants 50, it can enter in the second main base tube 12, and be back to evaporator from the efferent duct 33
In 31.
It wherein, can be with by 50 pressure of refrigerant inside the closed refrigerant circulation circuit as shown in Fig. 5, Fig. 6, Fig. 8
In 50 amount of vaporization of refrigerant increase and rises and 50 amount of vaporization of refrigerant can with 40 temperature of pyrotoxin of electronic device raising and
Increased characteristic keeps the liquid refrigerants 50 being located inside vaporization chamber 34 quick when the temperature raising of the pyrotoxin 40 of electronic device
It is gasificated into gaseous coolant 50, and causes 50 amount of vaporization of refrigerant to be greater than the main condensing modules 10 and can be provided what gaseous coolant 50 passed through
When flow, 50 pressure of refrigerant inside the closed refrigerant circulation circuit can rise, at this point, gaseous coolant 50 can generate point
Stream respectively enters and passes through the main condensing modules 10 and the auxiliary condensation module 20, shunts cooling, liquefied effect to reach
Fruit, and the liquid refrigerants 50 after liquefying can be finally collected in the second main base tube 12, and be back to evaporation from the efferent duct 33
In device 31.
In addition, as shown in fig. 6, when gaseous coolant 50 by the input pipe 32 enter the first main base tube 11 in when, meeting
There is part gaseous coolant 50 to be liquefied as liquid refrigerants 50 due to far from heat source, and be condensed into the refrigerant 50 of liquid enter this first
After main base tube 11, the lower section of the first main base tube 11 can be flowed downward to, and is directly back to evaporator 31 from return pipe 37
In, and remaining gaseous coolant 50 then can be sequentially by returning after the main cooling mechanism 13 and the second main base tube 12 from efferent duct 33
It flow in evaporator 31.
In conclusion radiator of the present invention can be provided by main condensing modules 10 in parallel and auxiliary condensation module 20
Gaseous coolant 50 shunts cooling, liquefied function, and it is cooling and liquefied in gaseous coolant 50 to effectively improve the radiator
Efficiency, in addition, being condensed into the refrigerant 50 of liquid when into the first main base tube 11 in advance can directly be flowed back by return pipe 37 in advance
Absorb heat again again into evaporator 31, thus multithread to 50 phase transformation of refrigerant circulate mode dynamical heat dissipation effect be provided
Fruit.
Claims (8)
1. a kind of parallel-connection type condenser, characterized by comprising:
One main condensing modules, it includes one first main base tube, one second main base tube and a main cooling mechanism, the first main base tube with
The second main base tube is alternatively arranged setting, which is set between the first main base tube and the second main base tube；With
And
At least one auxiliary condensation module, in parallel with the main condensing modules, the auxiliary condensation module includes one first auxiliary base
Pipe, one second auxiliary base tube and an auxiliary heat dissipation mechanism, the first auxiliary base tube and the second auxiliary base tube are alternatively arranged setting,
The first auxiliary base tube is connected to the first main base tube, which is connected to the second main base tube, the auxiliary heat dissipation mechanism
It is set between the first auxiliary base tube and the second auxiliary base tube.
2. parallel-connection type condenser as described in claim 1, which is characterized in that the main cooling mechanism includes that multiple main heat dissipations are led
Pipe and multiple main radiating pieces, multiple main heat radiation conduit between the upper and lower every being connected to the first main base tube and the second main base tube in a row
Between, multiple main radiating piece is arranged evenly and thermal conductivity contacts the outer surface of multiple main heat radiation conduit；The auxiliary heat dissipation
Mechanism includes multiple auxiliary heat dissipation conduits and multiple auxiliary heat dissipation parts, and multiple auxiliary heat dissipation conduit between the upper and lower every connecting in a row
Between the first auxiliary base tube and the second auxiliary base tube, multiple auxiliary heat dissipation part is arranged evenly and thermal conductivity contact is multiple
The outer surface of auxiliary heat dissipation conduit.
3. parallel-connection type condenser as claimed in claim 2, which is characterized in that the main radiating piece of the main cooling mechanism and described
The auxiliary heat dissipation part of auxiliary heat dissipation mechanism is wavy.
4. parallel-connection type condenser as claimed any one in claims 1 to 3, which is characterized in that the auxiliary condensation module
First auxiliary substrate tube is formed with multiple first runners, and multiple first runner is directly or indirectly connected to the first main base
Second auxiliary substrate tube of pipe, the auxiliary condensation module is formed with multiple second flow channels, multiple second flow channel directly or
It is connected to the second main base tube indirectly.
5. a kind of radiator, characterized by comprising:
One parallel-connection type condenser according to any one of claims 1 to 4；And
One evaporative component, it includes an evaporator, an input pipe and an efferent duct, which includes the shell for having vaporization chamber in one
Body, the bottom of the shell have a conductive base plate, and the both ends of the input pipe are separately connected the case top of the evaporator and are somebody's turn to do
The main base tube of the first of main condensing modules, the both ends of the efferent duct are separately connected the side wall and the main condenser of the shell of the evaporator
The main base tube of the second of module makes the parallel-connection type condenser and the evaporative component constitute a closed refrigerant circulation circuit, and at this
Refrigerant is filled in closed refrigerant circulation circuit.
6. radiator as claimed in claim 5, which is characterized in that the main base tube of the first of the main condensing modules of the radiator
The lower section of upper section one refrigerant inlet of formation, the lower section of the main base tube of the first of the main condensing modules and the second main base tube is respectively formed one
Refrigerant exit, the both ends of the input pipe are separately connected the case top of the evaporator and the refrigerant inlet of the main condensing modules,
The both ends of the efferent duct are separately connected the refrigerant of the side wall of the shell of the evaporator and the second main base tube of the main condensing modules
Outlet, and the evaporative component include a return pipe, the both ends of the return pipe be separately connected the shell of the evaporator side wall and
The refrigerant exit of the main base tube of the first of the main condensing modules.
7. radiator as claimed in claim 6, which is characterized in that the bore of the input pipe is greater than the bore of the efferent duct.
8. radiator as claimed in claim 7, which is characterized in that the bore of the input pipe is greater than the efferent duct and the reflux
The bore of pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858345.4A CN109520338A (en) | 2017-09-19 | 2017-09-19 | Parallel-connection type condenser and radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710858345.4A CN109520338A (en) | 2017-09-19 | 2017-09-19 | Parallel-connection type condenser and radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109520338A true CN109520338A (en) | 2019-03-26 |
Family
ID=65767862
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710858345.4A Pending CN109520338A (en) | 2017-09-19 | 2017-09-19 | Parallel-connection type condenser and radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109520338A (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2530645A1 (en) * | 1974-07-09 | 1976-01-29 | Eastman Kodak Co | COLOR PHOTOGRAPHIC RECORDING MATERIAL |
| CN1403776A (en) * | 2001-08-28 | 2003-03-19 | 和信国际有限公司 | Heat exchanger machine set for freezing air conditioner equipment |
| CN1606153A (en) * | 2003-10-09 | 2005-04-13 | 株式会社东芝 | Liquid cooling type electric power conversion device |
| TWI234638B (en) * | 2004-03-25 | 2005-06-21 | Jin-Wei Jang | Assembly structure of one kind of heat pipe |
| CN201731690U (en) * | 2010-07-12 | 2011-02-02 | 广东增城市基业汽车空调有限公司 | Commercial air conditioner four-radiating-plate parallel-connection type condenser with throttle pipes |
| CN102016483A (en) * | 2008-04-29 | 2011-04-13 | 开利公司 | Modular heat exchanger |
| CN201819585U (en) * | 2010-06-30 | 2011-05-04 | 鞍钢集团工程技术有限公司 | Heat exchanger used for recovering waste heat of steelmaking disintegrating slag wastewater |
| CN205793890U (en) * | 2015-05-21 | 2016-12-07 | 万在工业股份有限公司 | Refrigerant type heat dissipation device |
| CN207379340U (en) * | 2017-09-19 | 2018-05-18 | 万在工业股份有限公司 | Parallel-connection type condenser and radiator |
-
2017
- 2017-09-19 CN CN201710858345.4A patent/CN109520338A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2530645A1 (en) * | 1974-07-09 | 1976-01-29 | Eastman Kodak Co | COLOR PHOTOGRAPHIC RECORDING MATERIAL |
| CN1403776A (en) * | 2001-08-28 | 2003-03-19 | 和信国际有限公司 | Heat exchanger machine set for freezing air conditioner equipment |
| CN1606153A (en) * | 2003-10-09 | 2005-04-13 | 株式会社东芝 | Liquid cooling type electric power conversion device |
| TWI234638B (en) * | 2004-03-25 | 2005-06-21 | Jin-Wei Jang | Assembly structure of one kind of heat pipe |
| CN102016483A (en) * | 2008-04-29 | 2011-04-13 | 开利公司 | Modular heat exchanger |
| CN201819585U (en) * | 2010-06-30 | 2011-05-04 | 鞍钢集团工程技术有限公司 | Heat exchanger used for recovering waste heat of steelmaking disintegrating slag wastewater |
| CN201731690U (en) * | 2010-07-12 | 2011-02-02 | 广东增城市基业汽车空调有限公司 | Commercial air conditioner four-radiating-plate parallel-connection type condenser with throttle pipes |
| CN205793890U (en) * | 2015-05-21 | 2016-12-07 | 万在工业股份有限公司 | Refrigerant type heat dissipation device |
| CN207379340U (en) * | 2017-09-19 | 2018-05-18 | 万在工业股份有限公司 | Parallel-connection type condenser and radiator |
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Application publication date: 20190326 |