CN109511215A - PCB through hole type optical point shapes processing method - Google Patents
PCB through hole type optical point shapes processing method Download PDFInfo
- Publication number
- CN109511215A CN109511215A CN201811426758.6A CN201811426758A CN109511215A CN 109511215 A CN109511215 A CN 109511215A CN 201811426758 A CN201811426758 A CN 201811426758A CN 109511215 A CN109511215 A CN 109511215A
- Authority
- CN
- China
- Prior art keywords
- hole
- pcb
- ccd
- circle
- processing method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 13
- 238000003672 processing method Methods 0.000 title claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 claims abstract description 8
- 239000010949 copper Substances 0.000 claims abstract description 8
- 238000005286 illumination Methods 0.000 claims abstract description 6
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000001788 irregular Effects 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses PCB through hole type optical points to shape processing method; machine drills out through-hole in circle PAD, guarantees the proper circle of through-hole, and plating carries out copper facing to through-hole; guarantee there is copper in through-hole; it is protected with dry film device to hole and circle PAD, when outer layer etches, dry film carries out protection hole and circle PAD; etching solution device to hole is not allowed; destroyed, CCD para-position camera gets light, illumination to through-hole type optically.Through-hole type reflection hole image is imaged to CCD, because of the out of roundness in hole, guarantees that hole will not deform.PCB aperture is drilled out using drill point, the out of roundness in hole, PCB aperture by surface treatment after, in CCD machine illumination to PCB aperture after, hole edge radiate pass it is obvious, shape will not be distorted height, will not deform.
Description
Technical field
The present invention relates to the technical field of PCB optics point design, especially PCB through hole type optical points to shape processing method.
Background technique
Existing PCB optics point design, it is general using circle PAD type, cross PAD or square PAD design, because of PCB
Optical point technique is etched using image transfer etching solution carrys out pattern.In etching process round PAD, cross PAD or
Person's square PAD, it may appear that zigzag irregular pattern image blur or cannot be imaged after causing CCD machine to irradiate.
Summary of the invention
The purpose of the present invention is to provide a kind of PCB through hole type optical points to shape processing method, the etching of through-hole type optical point
When protected, the jagged risk that occurs when improving etching, when promoting SMD piece, light is beaten in through-hole type hole, progress at
Picture promotes the precision of CCD para-position, solves problems of the prior art.
To achieve the goals above, the technical solution of the present invention is as follows: PCB through hole type optical point shapes processing method, machine
Drill out through-hole in circle PAD, guarantee the proper circle of through-hole, plating gives through-hole to carry out copper facing, guarantee there is copper in through-hole, with dry film device to hole and
Circle PAD is protected, and when outer layer etches, dry film carries out protection hole and circle PAD, is not allowed etching solution device to hole, is destroyed, CCD pairs
Position camera gets light, illumination to through-hole type optically.Through-hole type reflection hole image is imaged to CCD, because of the out of roundness in hole, protects
Card hole will not deform.
The invention discloses a kind of PCB through hole type optical points to shape processing method, and PCB aperture drilled out using drill point, hole it is true
Circularity, PCB aperture by surface treatment after, in CCD machine illumination to PCB aperture after, hole edge radiate pass it is obvious, shape will not be lost
It is very high, it will not deform.
Detailed description of the invention
Fig. 1 is that through-hole type optical point shapes process flow diagram.
Fig. 2 through-hole type optical point structural schematic diagram.
Specific embodiment
With reference to the accompanying drawings, the present invention is further described below.
The invention discloses PCB through hole type optical points to shape processing method, and be different from the prior art and be: machine is in circle
PAD drills out through-hole, guarantees the proper circle of through-hole, and plating carries out copper facing to through-hole, guarantees there is copper in through-hole, with dry film device to hole and circle
PAD is protected, and when outer layer etches, dry film carries out protection hole and circle PAD, is not allowed etching solution device to hole, is destroyed, CCD para-position
Camera gets light, and optically to through-hole type, through-hole type reflection hole image to CCD is imaged for illumination, because of the out of roundness in hole, guarantees
Hole will not deform.
In the specific implementation, the aperture of through-hole is 1.0mm, and the diameter of circle PAD is 3.0mm.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
Present invention specific implementation is confined to these above-mentioned explanations.For those of ordinary skill in the art to which the present invention belongs,
Without departing from the inventive concept of the premise, a number of simple deductions or replacements can also be made, all shall be regarded as belonging to the present invention
Protection scope.
Claims (1)
1.PCB through-hole type optical point shapes processing method, it is characterised in that: machine is in circle PAD(1) it drills out through-hole (2), guarantee logical
The proper circle in hole, plating carry out copper facing to through-hole, guarantee there is copper in through-hole, are protected with dry film device to hole and circle PAD, outer layer etching
When, dry film carries out protection hole and circle PAD, does not allow etching solution device to hole, is destroyed, and CCD para-position camera gets light, and illumination is to leading to
Optically, through-hole type reflection hole image to CCD is imaged pass, because of the out of roundness in hole, guarantees that hole will not deform.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811426758.6A CN109511215A (en) | 2018-11-27 | 2018-11-27 | PCB through hole type optical point shapes processing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811426758.6A CN109511215A (en) | 2018-11-27 | 2018-11-27 | PCB through hole type optical point shapes processing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109511215A true CN109511215A (en) | 2019-03-22 |
Family
ID=65750865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811426758.6A Pending CN109511215A (en) | 2018-11-27 | 2018-11-27 | PCB through hole type optical point shapes processing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109511215A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181395A (en) * | 1994-12-22 | 1996-07-12 | Rohm Co Ltd | Structure of hole for positioning on circuit board |
| JPH11103166A (en) * | 1997-07-28 | 1999-04-13 | Ibiden Co Ltd | Positioning mark for forming resist pattern and manufacture of multilayered printed wiring board |
| CN103155728A (en) * | 2010-10-01 | 2013-06-12 | 名幸电子有限公司 | Component-embedded substrate, and method of manufacturing the component- embedded substrate |
| CN104885581A (en) * | 2012-12-28 | 2015-09-02 | 日立化成株式会社 | Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate |
-
2018
- 2018-11-27 CN CN201811426758.6A patent/CN109511215A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08181395A (en) * | 1994-12-22 | 1996-07-12 | Rohm Co Ltd | Structure of hole for positioning on circuit board |
| JPH11103166A (en) * | 1997-07-28 | 1999-04-13 | Ibiden Co Ltd | Positioning mark for forming resist pattern and manufacture of multilayered printed wiring board |
| CN103155728A (en) * | 2010-10-01 | 2013-06-12 | 名幸电子有限公司 | Component-embedded substrate, and method of manufacturing the component- embedded substrate |
| CN104885581A (en) * | 2012-12-28 | 2015-09-02 | 日立化成株式会社 | Layered body with support substrate, method for fabricating same, and method for fabricating multi-layer wiring substrate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190322 |