CN109507456A - Probe unit and its guide plate - Google Patents
Probe unit and its guide plate Download PDFInfo
- Publication number
- CN109507456A CN109507456A CN201710832734.XA CN201710832734A CN109507456A CN 109507456 A CN109507456 A CN 109507456A CN 201710832734 A CN201710832734 A CN 201710832734A CN 109507456 A CN109507456 A CN 109507456A
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- China
- Prior art keywords
- insulation portion
- guide plate
- perforation
- probe unit
- interior
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
The present invention discloses a kind of probe unit, including the first guide plate and multiple conducting probes.First guide plate includes to be formed with the first plate body of multiple first perforations and be formed separately in multiple first interior insulations portion of multiple first perforation inner sidewalls, so that the inner sidewall of each first perforation is completely covered by corresponding first interior insulation portion, and the first perforation is formed on the inside of each first interior insulation portion, and each first perforation has the first aperture less than 100 microns.Multiple conducting probes respectively have the first end and the second end positioned at opposite side, and the first end of multiple conducting probes passes through multiple first perforation of the first guide plate respectively.The present invention separately provides a kind of guide plate of probe unit.Probe unit and its guide plate of the invention so that the machining accuracy of multiple perforation is effectively promoted, and can make the processing threshold of multiple perforation and the processing cost of entirety be effectively reduced through the above configuration.
Description
Technical field
The present invention relates to a kind of probe unit more particularly to a kind of probe unit suitable for vertical probe carb and its lead
Plate.
Background technique
The probe unit (namely probe) for being currently used for vertical probe carb includes probe base and multiple probes.Its
In, probe base has upper guide plate and bottom guide, and upper guide plate and bottom guide have micropore according to the demand of determinand (such as: chip)
Array.
As electronic product develops towards accurate with multifunction, the chip knot of the integrated circuit in electronic product is applied
Structure also tends to be complicated.In order to test the chip structure for tending to be complicated, the number of probes of probe unit has been increased to tens of thousands of
More than, and the spacing (pitch) between two probes is also smaller and smaller, so that the aperture for the micropore array that multiple probes pass through has connect
Nearly machinable limit, and its machining accuracy also can not increasingly be grasped.
It then, is the special utilization for concentrating on studies and cooperating the principles of science, finally inventors believe that drawbacks described above can improve
It is proposed that a kind of design is reasonable and is effectively improved the present invention of drawbacks described above.
Summary of the invention
The embodiment of the present invention is to provide a kind of probe unit and its guide plate, and can effectively improve existing probe unit can
The defect that can be generated.
The embodiment of the present invention discloses a kind of probe unit, including one first guide plate and multiple conducting probes, the first guide plate
It include one first plate body and multiple first interior insulations portion, the first plate body is formed with multiple first perforations；Multiple first interior insulations
Portion forms in the inner sidewall of multiple first perforations respectively, so that the inner sidewall of each first perforation is corresponding
First interior insulation portion completely cover, and be formed on the inside of each first interior insulation portion one first perforation,
And each first perforation has one first aperture less than 100 microns (μm)；Multiple conducting probes, which respectively have, to be located on the contrary
A first end and a second end for side, the first end of multiple conducting probes pass through first guide plate respectively
It is multiple it is described first perforate and be located at first guide plate outside.
Preferably, first guide plate includes the one first external insulation portion for forming in first plate body outer surface, and
And first external insulation portion is connected in the both ends in each first interior insulation portion, so that first plate body is completely embedded in
In first external insulation portion and multiple first interior insulation portions.
Preferably, first plate body is a metal plate, a ceramic wafer or a silicon substrate；First external insulation portion and every
The material in a first interior insulation portion is identical and is ceramic material, polytetrafluoroethylene (PTFE)
(Polytetrafluoroethylene, PTFE) or Parylene (parylene)；Each first interior insulation portion it is interior
The surface roughness on surface is less than the surface roughness of the inner sidewall of any one first perforation.
Preferably, the thickness at any position in first external insulation portion is substantially identical to any one described first interior insulation
The thickness in portion.
Preferably, first aperture is less than the thickness of first guide plate, and first aperture is less than 50 microns.
Preferably, the probe unit further comprises having one second guide plate, and second guide plate includes one the
Two plate bodys and multiple second interior insulations portion, the second plate body are formed with multiple second perforations；Multiple second interior insulations portion is formed separately
In the inner sidewall of multiple second perforations, so that the inner sidewall of each second perforation is by corresponding described second
Interior insulation portion completely covers, and one second perforation is formed on the inside of each second interior insulation portion, and each described
Second perforation has one second aperture less than 100 microns (μm), and second aperture is less than first aperture；Its
In, the second end of multiple conducting probes passes through multiple second perforation of second guide plate and position respectively
In the outside of second guide plate.
Preferably, second guide plate includes the one second external insulation portion for forming in second plate body outer surface, and
And second external insulation portion is connected in the both ends in each second interior insulation portion, so that second plate body is completely embedded in
In second external insulation portion and multiple second interior insulation portions；Wherein, second plate body is a metal plate, a ceramic wafer
An or silicon substrate；Second external insulation portion is identical as the material in each second interior insulation portion, and is ceramic material, poly- four
Vinyl fluoride or Parylene；The surface roughness of the inner surface in each second interior insulation portion be less than any one described second
The surface roughness of the inner sidewall of perforation.
The embodiment of the present invention separately discloses a kind of guide plate of probe unit, including a plate body and multiple interior insulation portions, plate body
It is formed with multiple perforations；Multiple interior insulation portions form in the inner sidewall of multiple perforations respectively, so that each perforation
The inner sidewall is completely covered by the corresponding interior insulation portion, and is formed with one on the inside of each interior insulation portion
Perforation, and each perforation has the aperture less than 100 microns；Wherein, the table of the inner surface in each interior insulation portion
Surface roughness is less than the surface roughness of the inner sidewall of any one perforation.
Preferably, the guide plate of the probe unit further comprises having the external insulation for forming in the plate body outer surface
Portion, and the external insulation portion is connected in the both ends in each interior insulation portion, so that the plate body is completely embedded in outside described
In insulation division and multiple interior insulation portions.
Preferably, the plate body is a metal plate, a ceramic wafer or a silicon substrate；The external insulation portion and it is each it is described in
The material of insulation division is identical and is ceramic material, polytetrafluoroethylene (PTFE) or Parylene.
In conclusion the probe unit and its guide plate of the embodiment of the present invention, it is larger to be formed with aperture by the plate body
Multiple perforations and be formed separately multiple interior insulation portions, in the inner sidewall of multiple perforations to be respectively formed with aperture
Lesser multiple perforation (aperture is less than 100 microns), so that the machining accuracy of multiple perforation is sufficiently elevated, and
And the processing threshold of multiple perforation and the processing cost of entirety are effectively reduced.
For that can be further understood that feature and technology contents of the invention, please refer to the following detailed descriptions related to the present invention
With attached drawing, but these explanations are only used to illustrate the present invention with attached drawing, rather than make any limitation to protection scope of the present invention.
Detailed description of the invention
Fig. 1 is the stereoscopic schematic diagram of probe unit of the present invention.
Schematic cross-sectional view of the probe unit along II-II hatching line that Fig. 2 is Fig. 1.
Fig. 3 is the perspective cross-sectional schematic diagram of the first plate body of probe unit of the present invention.
Fig. 4 is the perspective cross-sectional schematic diagram of the first guide plate of probe unit of the present invention.
Fig. 5 is that the first perforation shape of probe unit of the present invention is in the perspective cross-sectional schematic diagram of rectangle.
Fig. 6 is that the first guide plate of probe unit of the present invention only includes the solid of the first plate body and multiple first interior insulations portion
Schematic cross-sectional view.
Specific embodiment
Fig. 1 to Fig. 6 is please referred to, is the embodiment of the present invention, need to first be illustrated, mentioned by the present embodiment respective figure
Correlated measure and external form, only be used to specifically describe embodiments of the present invention, in order to understand the contents of the present invention, rather than
For limiting to protection scope of the present invention.
Such as Fig. 1 and Fig. 2, the present embodiment provides a kind of probe unit 100, the probe unit 100 include a probe base 1 and
Multiple conducting probes 2.Wherein, the probe base 1 includes one first guide plate 11 (upper die) and one second guide plate 12
(lower die), first guide plate 11 and the second guide plate 12 are each other in being positioned apart from, and multiple 2 energy of the conducting probe
It is each passed through first guide plate 11 and the second guide plate 12, to be assembled into the probe unit 100.In addition, the probe base
A spacing board (not shown) can be provided between the first guide plate 11 and the second guide plate 12, but the present invention is not only restricted to this.
The various components specific configuration that will illustrate the present embodiment probe unit 100 respectively below, then illustrates to visit in due course again
Connection relationship between the various components of needle device 100.Need to first it illustrate, in order to facilitate understanding the present embodiment, so attached drawing is only
The local structure of presentation probe unit 100 closes in order to which the various components construction of probe unit 100 is clearly presented and connect
System.
Such as Fig. 2 to Fig. 4, first guide plate 11 includes one first plate body 111, multiple first interior insulations portion 112 and one
First external insulation portion 113.First plate body 111 is formed with rounded multiple first perforations 114 (such as: Fig. 3), and multiple institutes
Stating the first interior insulation portion 112 is formed separately in the inner sidewall of multiple first perforations 114, so that each first perforation 114
Inner sidewall completely covered by corresponding first interior insulation portion 112.First external insulation portion 113 is formed from the first plate
The outer surface of body 111, and first external insulation portion 113 is connected in the both ends in each first interior insulation portion 112, so that described
First plate body 111 is fully embedded in the first external insulation portion 113 and multiple first interior insulations portion 112.
In more detail, the inside in each first interior insulation portion 112 is formed with one first rounded perforation 115
(such as: Fig. 4), and first perforation 115 has the one first aperture R1 less than 100 microns (μm).Preferably, described first
Aperture R1 is less than 50 microns, and the first aperture R1 is less than the thickness of the first guide plate 11, and first external insulation
The thickness at any position in portion 113 is substantially identical to the thickness in any one the first interior insulation portion 112.
Furthermore second guide plate 12 includes one second plate body 121, outside multiple second interior insulations portion 122 and one second
Insulation division 123.Second plate body 121 is formed with rounded multiple second perforations 124, and multiple second interior insulation portions
122 are formed separately in the inner sidewall of multiple second perforations 124, so that the inner sidewall of each second perforation 124 is opposite
The the second interior insulation portion 122 answered completely covers.Second external insulation portion 123 is formed from the outer surface of the second plate body 121,
And second external insulation portion 123 is connected in the both ends in each second interior insulation portion 122, so that second plate body 121 is complete
It is embedded in the second external insulation portion 123 and multiple second interior insulations portion 122 entirely.
In more detail, the inside in each second interior insulation portion 122 is formed with one second rounded perforation 125,
And second perforation 125 has the one second aperture R2 less than 100 microns (μm).Preferably, the second aperture R2 is
Less than 50 microns, and the second aperture R2 is less than the thickness of the second guide plate 12, and first external insulation portion 113 appoints
The thickness at one position is substantially identical to the thickness in any one the first interior insulation portion 112.
Whereby, compared to the perforation structure of existing guide plate, the perforation knot of the present embodiment the first guide plate 11 and the second guide plate 12
Structure is easy to process, processing precision is high and can reduce whole manufacturing cost.Furthermore the processing essence of the piercing aperture of existing guide plate
Spending the limit substantially can only be in 100 microns, but the structure of first guide plate 11 of the present embodiment and the second guide plate 12, can make described in
First aperture R1 and the second aperture R2 are further less than 50 microns, to breach existing processing technology threshold.
Furthermore, first plate body 111 can be respectively that surface planarity is less than or equal to the second plate body 121
30 microns, the depth of parallelism be less than or equal to the thin layer substrate of 40 microns and substantially 0.3 micron of line arithmetic average height (Ra), and it is described
The material of thin layer substrate can be conductor or non-conductor.Preferably, the thin layer substrate can be selected with higher mechanical strength
Material, such as: metal plate, ceramic wafer or silicon substrate.
Furthermore the material in first external insulation portion 113 is identical as the material in each first interior insulation portion 112, and is
Molding construction integral with one another.And the material phase of the material in second external insulation portion 123 and each second interior insulation portion 122
It together, and is molding construction integral with one another.Preferably, first external insulation portion 113, the second external insulation portion 123, Mei Ge
The material in one interior insulation portion 112 and each second interior insulation portion 122 can distinguish Ceramics material, polytetrafluoroethylene (PTFE)
At least one of (Polytetrafluoroethylene, PTFE) or Parylene (parylene).And
The surface roughness of the inner surface in each first interior insulation portion 112 is less than the table of the inner sidewall of any one the first perforation 114
Surface roughness, and the surface roughness of the inner surface in each second interior insulation portion 122 is less than any one the second perforation 124
The surface roughness of inner sidewall.
Please continue to refer to Fig. 3 and Fig. 4, then illustrate the preparation method of the first guide plate of the present embodiment 11 below, and described
The preparation method of two guide plates 12 is substantially identical as the preparation method of the first guide plate 11, seldom repeats herein.It should be noted that
The preparation method of following first guide plates 11 is only one embodiment of the present invention, and the present invention is not limited to this.That is,
As long as the preparation method of any structure feature that may achieve first guide plate 11 all meets spirit of the invention and belongs to this
The range of invention.In addition, the thickness of following first plate bodys 111, the first interior insulation portion 112 and the first external insulation portion 113, Yi Ji
One perforation 114 and the pore size of the first perforation 115 are merely exemplary explanation, and the present invention is not limited to this.
The preparation method of first guide plate 11 includes: to provide first plate body 111 that thickness is about 150 microns；It is right
First plate body 111 carries out a bore process (such as: machine drilling or laser drill), with the shape on first plate body 111
At there is multiple first perforations 114 (such as: Fig. 3) that aperture is about 150 microns；One depositing operation is carried out to first plate body 111
(such as: anodic oxidation, chemical vapor deposition or physical vapour deposition (PVD)), to distinguish in the inner sidewall of multiple first perforations 114
Multiple first interior insulations portion 112 that thickness is about 50 microns is formed, and is distinguished in two side external surfaces of first plate body 111
Form the first external insulation portion 113 (such as: Fig. 4) that thickness is about 50 microns.
By the production method of above-mentioned first guide plate 11, the plate thickness of first guide plate 11 can be effectively increased, and
The aperture of each first perforation 115 can effectively be reduced.In more detail, upper due to first plate body 111
Under each increase have about 50 microns of the first external insulation portion 113, therefore the thickness of first guide plate 11 can be effectively increased
To about 250 microns, and the two sides of the inner sidewall of each first perforation 114 respectively increase the first interior insulation portion for having about 50 microns
112, therefore the aperture of first perforation 115 can be effectively contracted to about 50 microns.Whereby, first guide plate 11
Aspect ratio (ratio of plate thickness and aperture) can significantly be promoted to 5:1 (250:50) by the 1:1 (150:150) of script, thus
115 (the micropore arrays) of multiple first perforation for effectively overcoming the first guide plate 11 in existing probe unit are tired in processing
Difficulty, and can effectively promote the machining accuracy of multiple first perforation 115.
It further says, when first plate body 111 is metal plate (conductive material), the first guide plate 11 must be with outside first
Insulation division 113 and the first interior insulation portion 112 are completely coated in the first plate body 111, to reach insulation effect.Whereby, described
One guide plate 11 can be used easy to process and process the high metal plate of precision as the first plate body 111.
Furthermore when first plate body 111 shapes the first perforation 114 with bore mode, the inner sidewall of the first perforation 114
Would generally be more coarse, but the first interior insulation portion 112 of the present embodiment be shaped by way of deposition, so its inner surface compared with
It is smooth.That is, the table of the inner surface in each first interior insulation portion 112 can be made by the depositing operation
Surface roughness is less than the surface roughness of the inner sidewall of any one the first perforation 114.Whereby, when multiple conducting probes 2 divide
It Chu Peng not be when the inner surface in multiple first interior insulations portion 112, it is possible to reduce first guide plate 11 is to multiple 2 institutes of conducting probe
Bring damage.
It is noted that in this present embodiment, the first perforation 115 that Fig. 4 is presented is rounded, but the present invention is unrestricted
In this.In practical application, the shape of first perforation 115 can cooperate the cross-sectional shape of conducting probe 2 and be adjusted
It is whole, such as: when the cross-sectional shape of conducting probe 2 is rectangle, the shape of first perforation 115 can be accordingly designed as
Rectangle (such as: Fig. 5).In addition, the thickness of first guide plate 11 can also cooperate probe base 1 mechanism design and adjusted (such as:
It thickeies or is thinned).Furthermore the thickness at any position in first external insulation portion 113 is also possible to be more than or less than any one
The thickness in the first interior insulation portion 112, it is not limited to as described in the embodiment.Alternatively, first guide plate 11 can also be wrapped only
Containing the first plate body 111 and multiple first interior insulations portion 112, without including the first external insulation portion 113 (such as: Fig. 6).As for
The structure design of two guide plates 12 is similar first guide plate 11, and not in this to go forth.
Please continue to refer to Fig. 2, multiple conducting probes 2 are in this present embodiment strip columnar structure, and its material can be
Nickel (Ni), copper (Cu), golden (Au), or the like.Each conducting probe 2 have a first end 21 positioned at opposite side with
One the second end 22, what the first end 21 of multiple conducting probes 2 was each passed through above-mentioned first guide plate 11 multiple first wears
Hole 115 and be located at first guide plate 11 outside, and the second end 22 of multiple conducting probes 2 be each passed through it is above-mentioned
Multiple second perforation 125 of second guide plate 12 and the outside for being located at second guide plate 12.
Wherein, the part that multiple first ends 21 protrude out the first guide plate 11 can be assembled and be electrically connected at a circuit
Plate or support plate (figure is not painted), to form a vertical probe card structure.Multiple the second ends 22 protrude out the second guide plate
12 part can be used to an electrical contact for one chip of touching (figure is not painted) to be electrically connected with chip.In the present embodiment, more
The end of a first end 21 and multiple the second ends 22 is in planar, but can also in the embodiment that the present invention is not painted
In cone-shaped.
It is noted that in this present embodiment, multiple conducting probes 2 can be each passed through first guide plate 11 and
Second guide plate 12, to be assembled into the probe unit 100.But in the embodiment that the present invention is not painted, the probe unit 100
It can also only include first guide plate 11, without including second guide plate 12.
Additional description is needed, " first " used in the present embodiment and " second " are for the ease of the different group of difference
Part, but do not have the connotation of precedence, so " first " and " second " in component Name also can be omitted.For example, on
Guide plate can also be named as by stating the first guide plate 11 and the second guide plate 12, and the first plate body 111 can also be named as with the second plate body 121
Plate body, and the first interior insulation portion 112 and the second interior insulation portion 122 can also be named as interior insulation portion.In addition, the present embodiment is mentioned
The guide plate (such as: above-mentioned first guide plate 11 or the second guide plate 12) of confession can be the product individually peddled, and it does not limit and is only capable of
Applied to above-mentioned probe unit 100.That is, the guide plate also can be applied to other types of probe unit 100.
[technical effect of the embodiment of the present invention]
In conclusion the probe unit of the embodiment of the present invention and the guide plate of probe unit, can be formed with by the plate body
The biggish multiple perforations in aperture and the inner sidewall of multiple perforations be formed separately multiple interior insulation portions, with respectively shape
At there is the lesser multiple perforation (aperture is less than 100 microns) in aperture so that the aspect ratio of the guide plate (plate thickness and aperture
Ratio) and the machining accuracy of multiple perforation be sufficiently elevated, and make the processing threshold of multiple perforation and whole
The processing cost of body is effectively reduced.
Furthermore the probe unit of the embodiment of the present invention and the guide plate of probe unit can pass through each interior insulation portion
The surface roughness of inner surface is less than the surface roughness of the inner sidewall of any one perforation, so that when multiple conductive spies
Needle is touched respectively when the inner surface in multiple interior insulation portions, it is possible to reduce the guide plate is damaged to brought by multiple conducting probes
It is bad.
The foregoing is merely preferred possible embodiments of the invention, are not used to limit to protection scope of the present invention, it is all according to
The equivalent changes and modifications that claims of the present invention is done should all belong to the protection scope of claims of the present invention.
Claims (10)
1. a kind of probe unit, which is characterized in that the probe unit includes:
One first guide plate includes
One first plate body is formed with multiple first perforations；And
Multiple first interior insulations portion is formed separately in the inner sidewall of multiple first perforations, so that each first perforation
The inner sidewall completely covered by corresponding first interior insulation portion, and each first interior insulation portion is interior
Side is formed with one first perforation, and each first perforation has one first aperture less than 100 microns；And
Multiple conducting probes respectively have a first end and a second end positioned at opposite side, multiple conducting probes
The first end passes through multiple first perforation of first guide plate respectively and is located at the outside of first guide plate.
2. probe unit according to claim 1, which is characterized in that first guide plate includes to form in described first
One first external insulation portion of plate body outer surface, and first external insulation portion is connected in the two of each first interior insulation portion
End, so that first plate body is completely embedded in first external insulation portion and multiple first interior insulation portions.
3. probe unit according to claim 2, which is characterized in that first plate body is a metal plate, a ceramic wafer
An or silicon substrate；First external insulation portion is identical as the material in each first interior insulation portion and is ceramic material, poly-
Tetrafluoroethene or Parylene；The surface roughness of the inner surface in each first interior insulation portion be less than any one described the
The surface roughness of the inner sidewall of one perforation.
4. probe unit according to claim 2, which is characterized in that the thickness at any position in first external insulation portion
It is equal to the thickness in any one first interior insulation portion.
5. probe unit according to claim 1, which is characterized in that first aperture is less than the thickness of first guide plate
Degree, first aperture is less than 50 microns.
6. according to probe unit described in any one of claims 1 to 5, which is characterized in that the probe unit further wraps
One second guide plate is included, and second guide plate includes:
One second plate body is formed with multiple second perforations；And
Multiple second interior insulations portion is formed separately in the inner sidewall of multiple second perforations, so that each second perforation
The inner sidewall completely covered by corresponding second interior insulation portion, and each second interior insulation portion is interior
Side is formed with one second perforation, and each second perforation has one second aperture less than 100 microns, and described second
Aperture is less than first aperture；
Wherein, what the second end of multiple conducting probes passed through second guide plate respectively multiple described second wears
Hole and the outside for being located at second guide plate.
7. probe unit according to claim 6, which is characterized in that second guide plate includes to form in described second
One second external insulation portion of plate body outer surface, and second external insulation portion is connected in the two of each second interior insulation portion
End, so that second plate body is completely embedded in second external insulation portion and multiple second interior insulation portions；Wherein, institute
Stating the second plate body is a metal plate, a ceramic wafer or a silicon substrate；Second external insulation portion and each second interior insulation
The material in portion is identical, and is ceramic material, polytetrafluoroethylene (PTFE) or Parylene；The inner surface in each second interior insulation portion
Surface roughness be less than any one second perforation the inner sidewall surface roughness.
8. a kind of guide plate of probe unit, which is characterized in that the guide plate of the probe unit includes:
One plate body is formed with multiple perforations；And
Multiple interior insulation portions are formed separately in the inner sidewall of multiple perforations, so that the inner sidewall of each perforation
It is completely covered by the corresponding interior insulation portion, and is formed with a perforation on the inside of each interior insulation portion, and it is every
A perforation has the aperture less than 100 microns；
Wherein, the surface roughness of the inner surface in each interior insulation portion is less than the inner sidewall of any one perforation
Surface roughness.
9. the guide plate of probe unit according to claim 8, which is characterized in that the guide plate of the probe unit further wraps
The external insulation portion for forming in the plate body outer surface is included, and the external insulation portion is connected in each interior insulation portion
Both ends, so that the plate body is completely embedded in the external insulation portion and multiple interior insulation portions.
10. the guide plate of probe unit according to claim 9, which is characterized in that the plate body is a metal plate, a ceramics
Plate or a silicon substrate；The external insulation portion is identical as the material in each interior insulation portion and is ceramic material, polytetrafluoroethyl-ne
Alkene or Parylene.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710832734.XA CN109507456A (en) | 2017-09-15 | 2017-09-15 | Probe unit and its guide plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710832734.XA CN109507456A (en) | 2017-09-15 | 2017-09-15 | Probe unit and its guide plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109507456A true CN109507456A (en) | 2019-03-22 |
Family
ID=65744898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710832734.XA Pending CN109507456A (en) | 2017-09-15 | 2017-09-15 | Probe unit and its guide plate |
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| CN (1) | CN109507456A (en) |
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| JP2004140009A (en) * | 2002-10-15 | 2004-05-13 | Ibiden Engineering Kk | Inspection tool for printed wiring board |
| CN1979176A (en) * | 2005-11-29 | 2007-06-13 | 旺矽科技股份有限公司 | Method for producing in batch vertical probe clasp micro-hole guide plate |
| CN1979177A (en) * | 2005-12-07 | 2007-06-13 | 旺矽科技股份有限公司 | Micro-hole guide with reinforcing structure |
| CN101207069A (en) * | 2006-12-22 | 2008-06-25 | 中芯国际集成电路制造(上海)有限公司 | Method for forming of via hole |
| CN104508499A (en) * | 2012-08-01 | 2015-04-08 | 日本电子材料株式会社 | Guide plate for probe guard and probe guard provided with same |
| CN104062476A (en) * | 2013-03-18 | 2014-09-24 | 日本电子材料株式会社 | Guide Plate For Probe Card |
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