CN109500051A - A kind of waste printed circuit board recycling and reusing method - Google Patents
A kind of waste printed circuit board recycling and reusing method Download PDFInfo
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- CN109500051A CN109500051A CN201811213443.3A CN201811213443A CN109500051A CN 109500051 A CN109500051 A CN 109500051A CN 201811213443 A CN201811213443 A CN 201811213443A CN 109500051 A CN109500051 A CN 109500051A
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- 238000000034 method Methods 0.000 title claims abstract description 57
- 239000002699 waste material Substances 0.000 title claims abstract description 45
- 238000004064 recycling Methods 0.000 title claims abstract description 36
- 239000000843 powder Substances 0.000 claims abstract description 105
- 239000000463 material Substances 0.000 claims abstract description 37
- 229910052755 nonmetal Inorganic materials 0.000 claims abstract description 35
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 22
- 239000004033 plastic Substances 0.000 claims abstract description 17
- 229920003023 plastic Polymers 0.000 claims abstract description 17
- 238000000746 purification Methods 0.000 claims abstract description 16
- 238000012545 processing Methods 0.000 claims abstract description 11
- 229910052802 copper Inorganic materials 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 5
- 239000002184 metal Substances 0.000 claims description 31
- 229910052751 metal Inorganic materials 0.000 claims description 31
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 claims description 22
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 18
- 230000004927 fusion Effects 0.000 claims description 17
- 238000005188 flotation Methods 0.000 claims description 16
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 14
- 239000002270 dispersing agent Substances 0.000 claims description 12
- 239000004088 foaming agent Substances 0.000 claims description 12
- 239000002002 slurry Substances 0.000 claims description 12
- 239000000126 substance Substances 0.000 claims description 12
- 235000010299 hexamethylene tetramine Nutrition 0.000 claims description 11
- 239000004312 hexamethylene tetramine Substances 0.000 claims description 11
- 238000010298 pulverizing process Methods 0.000 claims description 11
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000654 additive Substances 0.000 claims description 8
- 230000000996 additive effect Effects 0.000 claims description 8
- 235000021355 Stearic acid Nutrition 0.000 claims description 7
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 claims description 7
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 claims description 7
- 239000002245 particle Substances 0.000 claims description 7
- 239000008117 stearic acid Substances 0.000 claims description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical group CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 6
- 239000012190 activator Substances 0.000 claims description 6
- 239000003795 chemical substances by application Substances 0.000 claims description 6
- 229960000935 dehydrated alcohol Drugs 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 4
- 238000010008 shearing Methods 0.000 claims description 4
- 239000002023 wood Substances 0.000 claims description 4
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 claims description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000005485 electric heating Methods 0.000 claims description 3
- ZSFDBVJMDCMTBM-UHFFFAOYSA-N ethane-1,2-diamine;phosphoric acid Chemical compound NCCN.OP(O)(O)=O ZSFDBVJMDCMTBM-UHFFFAOYSA-N 0.000 claims description 3
- 239000000945 filler Substances 0.000 claims description 3
- 239000012634 fragment Substances 0.000 claims description 3
- 238000010348 incorporation Methods 0.000 claims description 3
- 230000008595 infiltration Effects 0.000 claims description 3
- 238000001764 infiltration Methods 0.000 claims description 3
- 239000003350 kerosene Substances 0.000 claims description 3
- 238000009766 low-temperature sintering Methods 0.000 claims description 3
- SJWFXCIHNDVPSH-UHFFFAOYSA-N octan-2-ol Chemical compound CCCCCCC(C)O SJWFXCIHNDVPSH-UHFFFAOYSA-N 0.000 claims description 3
- 238000004663 powder metallurgy Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims description 3
- 150000003384 small molecules Chemical class 0.000 claims description 3
- 229910052708 sodium Inorganic materials 0.000 claims description 3
- 239000011734 sodium Substances 0.000 claims description 3
- 125000001434 methanylylidene group Chemical group [H]C#[*] 0.000 claims description 2
- AGGKEGLBGGJEBZ-UHFFFAOYSA-N tetramethylenedisulfotetramine Chemical compound C1N(S2(=O)=O)CN3S(=O)(=O)N1CN2C3 AGGKEGLBGGJEBZ-UHFFFAOYSA-N 0.000 claims description 2
- 238000004073 vulcanization Methods 0.000 claims 1
- 239000000758 substrate Substances 0.000 abstract description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 238000000926 separation method Methods 0.000 abstract description 4
- 238000012216 screening Methods 0.000 abstract description 3
- 238000011084 recovery Methods 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000010793 electronic waste Substances 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 238000011049 filling Methods 0.000 description 3
- 150000002843 nonmetals Chemical class 0.000 description 3
- 238000005267 amalgamation Methods 0.000 description 2
- 238000002386 leaching Methods 0.000 description 2
- 239000002351 wastewater Substances 0.000 description 2
- XFXPMWWXUTWYJX-UHFFFAOYSA-N Cyanide Chemical compound N#[C-] XFXPMWWXUTWYJX-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 231100001261 hazardous Toxicity 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000010813 municipal solid waste Substances 0.000 description 1
- 230000001473 noxious effect Effects 0.000 description 1
- 239000013618 particulate matter Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 230000007096 poisonous effect Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B3/00—Destroying solid waste or transforming solid waste into something useful or harmless
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B09—DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
- B09B—DISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
- B09B5/00—Operations not covered by a single other subclass or by a single other group in this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The present invention relates to a kind of waste printed circuit board recycling and reusing material methods, by carrying out tin bath dismantling to waste printed circuit board, level-one crushes, standard screen screening, high-voltage electrostatic sorting, waterpower separation by shaking table, second level crushes, wet purification, copper powder recycles, a series of processing such as non-metal powder recycling, the copper in waste printed circuit board can be recycled, and the good plastic plate of substrate processability of waste printed circuit board can be utilized, recycling and reusing not only is carried out to material valuable in waste printed circuit board, and reduce pollution brought by conventional process, this method has applications well prospect.
Description
Technical field
The present invention relates to a kind of processing method of waste, in particular to a kind of waste printed circuit board recycling and reusing method.
Background technique
Electron wastes are also referred to as electronic waste, including various waste computers, communication apparatus, television set and refrigerator etc.
Household electrical appliance and superseded precision electronic device instrument etc.；Since the 1990s mid-term, electron wastes are considered as
Most fast one kind of growth rate in solid waste；Latest data shows that the annual output of global electronic rubbish is up to 4,000 ten thousand tons,
And is increased with the rate of 2.5%-2.7%, estimate that the electronic waste yield of the year two thousand twenty will be up to 1.23 thousand ten thousand tons.
Waste printed circuit board is the important component of electronic waste, data show that, it is total that waste printed circuit board accounts for electronic waste
4% or so of amount；The average annual growth rate of world's printed wire board industry is 8-9%, and the growth rate in China is 14.4%；To current
Until, for the wiring board in the whole world about 40% all in domestic product, China has become world's second largest wiring board producing country；It is producing
A large amount of leftover pieces and 1%-2% flaw product waste printed circuit board will be generated as one in electron wastes during printed circuit board
Kind, wherein accumulateing tens times or even the hundred times that metalliferous grade is native deposits；Circuit board be glass fiber reinforced plastics and
The mixture of various metals, wherein metal and it is nonmetallic combine closely, separate hardly possible, be most complicated, most difficulty in electron wastes
Reason.
The main metal using in the physical recovering methods waste printed circuit boards such as cracking and sorting at present, and generated in removal process
A large amount of non-metal powder ends are substantially carried out burning, landfill disposal or air storage, increase carrying capacity of environment and cause environmental pollution.
In waste printed circuit board include thousands of substances, many substances be all it is poisonous and hazardous, some are with very high
Recovery value；Therefore, a large amount of generations and removal process of electron wastes, will cause great shadow to environment and human health
It rings；The Transport and environmental behaviour of noxious material in waste printed circuit board removal process are studied, there are mainly three types of substance sources for discovery:
(1) hyle for including in electron wastes, auxiliary material used in (2) recovery technology, the pair that the transformation of (3) hyle generates
Product；It specifically includes: filling the percolate of generation, disassemble the particulate matter of generation, burn the flying dust and residue of release, amalgamation,
Go to scolding tin and other smog for burning generation, dismantling, the broken waste water generated, Cyanide Leaching, other leachings and amalgamation institute
The waste water of generation.
For this purpose, the present invention is based on waste resource recycle principle, according to the composition at non-metal powder end, granular size,
The characteristics such as shape, the method recycled using physics are successfully prepared for the plastic plate of non-metal powder end filling.
Summary of the invention
The non-metal powder extracted in waste printed circuit board is mainly made of circuit board substrate reinforcing material and toner,
Wherein glass fibre has good reinforcing effect, provides premise for the filling recycling of non-metal powder.
Physical property is then based on by broken printed circuit board at fine particle using mechanical treatment technology appropriate
Difference carries out efficiently separating for different materials, is the key link in waste printed circuit board recovery system；And during Mechanical Crushing,
The properties such as partial size, the shape of particle have great influence to the distribution of different material and release characteristics, for broken and subsequent place
The selection of reason technology and the quality of recovery product and treatment effeciency are vital.
A kind of waste printed circuit board recycling and reusing method proposed the purpose of the present invention is to solve background technique, should
Method in turn includes the following steps:
1) circuit board discarded on electronic equipment is fitted into batches in electric heating detin furnace, carries out detin, then remove discarded circuit
Electronic component on plate；
2) circuit board by detin and after removing carries out level-one pulverization process；
3) smashed powder is screened by standard screen, sub-elects mesh number less than 16 mesh, 16-100 mesh and greater than 100
The powder of these three mesh numbers of mesh；
4) mesh number is passed through into high-voltage electrostatic sorting less than 16 mesh powders, isolates and does not will be completely dissociated particle and metal richness powder,
Meanwhile being sorted by mesh number between 16-100 mesh and greater than 100 mesh powders by waterpower shaking table, isolate metal richness
Powder and non-metal powder；
5) particle that not will be completely dissociated isolated in step 4) is subjected to second level pulverization process, smashed material carries out step 3)
Standard screen screened；Meanwhile the metal richness powder isolated in step 4) is subjected to wet purification and copper powder recycling；It will
The non-metal powder that step 4) is isolated carries out recycling technique together with toner, sawdust powder and additive.
It is limited as of the invention further, it is mainly to split that broken and what is ground cuts that level-one pulverization process, which selects force mechanism,
Cut type gyratory crusher, it is mainly that the impact type rotation impacted and be ground is ground that the second level pulverization process, which selects force mechanism,
Machine.
The present invention uses two-stage crushing, i.e., level-one coarse powder is broken and second level fine powder attrition process combines, in coarse powder process
Force mechanism is selected to split shearing gyratory crusher broken and based on grinding；It is main using force mechanism during fine powder
Impact type to impact and being ground rotates grater.
As further restriction of the invention, wet purification described in step 5) specifically: metal richness powder exists
It is configured to the slurry that concentration is 150g/L in dispersing agent, foaming agent is then added in the slurry according to the additional amount of 150g/t, benefit
Carry out flotation in flotation device with metal and nonmetallic hydrophilic difference, emersion substance be it is nonmetallic, stay in flotation cell
Substance is cleaned, it is dry after be pure metal richness powder.
As further restriction of the invention, dispersing agent is at least one of dehydrated alcohol, ethylene glycol；The foaming agent
For at least one of terpenic oil, sec-octyl alcohol, No. 2 oil.
As further restriction of the invention, the copper powder after wet purification in step 5) is recycled specifically: will be wet
The metal richness powder that method purifies carries out being milled to 100 mesh of granularity or more, and it is 100g/L's that concentration is configured in dispersing agent
Then foaming agent, activator and collecting agent is added in slurry in the slurry, flotation is carried out in flotation device, and emersion substance is floating for copper
Object is selected, after emersion object is cleaned, dried, obtains pure copper powder；Resulting pure copper powder is filled into product mold,
And it is doped and added to assistant metal powder, it mixes laggard row and is molded, the green compact being molded sequentially is subjected to low-temperature sintering, high temperature
Sintering, part cooling, can be prepared by the finished product of powder metallurgy.
As further restriction of the invention, dispersing agent is at least one of dehydrated alcohol, ethylene glycol；The foaming agent
For at least one of terpenic oil, No. 2 oil；The activator is at least one of vulcanized sodium, Ethylene diamine phosphate；The collecting agent
For kerosene.
It is further limited as of the invention, the recycling technique in step 5) specifically: isolate step 4)
Non-metal powder and toner, sawdust powder and additive carry out mixed processing, and mixed material carries out fusion treatment,
The fusion material that fusion treatment is crossed is in fragment shape, then cool down, crush, sieve and at mould compression process, can be prepared by finished product
Plastic plate.
As further restriction of the invention, mixed processing specifically: first crush resin and toner is made, by six
Methine tetramine and sawdust powder are sent into mixing machine with the ratio of mass ratio 9:1 to be mixed, and after 45min, mixture is sent into
It is crushed in pulverizer；Then each group sub-material is sequentially added to mixer, incorporation time 60min, feeding sequence is
Sawdust powder, talcum powder, non-metal powder, the hexamethylenetetramine for being mixed with wood powder and other components, finally in the same of stirring
When toner is added.
It is further limited as of the invention, the material component mass percent in mixer are as follows: 35-40% resin-oatmeal
End, 5-15% sawdust powder, 10-40% non-metal powder, 5-25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6%
Stearic acid.
As further restriction of the invention, fusion treatment specifically: by mixed material in single screw rod reciprocating spiral
Mixing operation is carried out on extruder, the temperature of fusion treatment is controlled at 95-105 DEG C, mixes each component further, equal to obtain
One performance, under conditions of being heated and pressurizeed, resin infiltration, which penetrates into filler, goes and is uniformly mixed each component, is merging
When, it include the heated volatilization of small molecule in mixed material, while taking away the free phenol in resin.
The present invention by waste printed circuit board carry out tin bath dismantling, level-one crushing, standard screen screening, high-voltage electrostatic sorting,
A series of processing such as waterpower separation by shaking table, second level crushing, wet purification, copper powder recycling, non-metal powder recycling, can return
The copper in waste printed circuit board is received, and the good plastic plate of substrate processability of waste printed circuit board can be utilized, not only to useless
It abandons valuable material in circuit board and carries out recycling and reusing, and reduce pollution brought by conventional process, this method has good
Good application prospect.
The beneficial effects of the present invention are:
1, it can be realized the separation to material in substrate by a series of processing of waste printed circuit board, obtain metal richness powder and non-
Metal powder, convenient for the subsequent recycling to metal material in substrate and nonmetallic materials.
2, the rate of recovery for the copper powder that the present invention carries out wet purification to treated metal powder is high, and copper powder purity is reachable
96% or more, equipment and technology is simple, at low cost.
3, the present invention is by adding various ingredients into non-metal powder, and through the invention in treatment process can be real
The recycling of existing non-metal powder, and the good plastic plate of processability.
Detailed description of the invention
Fig. 1 is the flow diagram of waste printed circuit board recycling and reusing method proposed by the present invention.
Specific embodiment
It is next combined with specific embodiments below that the present invention is further described.
Embodiment one
A kind of waste printed circuit board recycling and reusing method, this method in turn include the following steps:
1) circuit board discarded on electronic equipment is fitted into batches in electric heating detin furnace, carries out detin, then remove discarded circuit
Electronic component on plate；
2) circuit board by detin and after removing carries out level-one pulverization process；
3) smashed powder is screened by standard screen, sub-elects mesh number less than 16 mesh, 16-100 mesh and greater than 100
The powder of these three mesh numbers of mesh；
4) mesh number is passed through into high-voltage electrostatic sorting less than 16 mesh powders, isolates and does not will be completely dissociated particle and metal richness powder,
Meanwhile being sorted by mesh number between 16-100 mesh and greater than 100 mesh powders by waterpower shaking table, isolate metal richness
Powder and non-metal powder；
5) particle that not will be completely dissociated isolated in step 4) is subjected to second level pulverization process, smashed material carries out step 3)
Standard screen screened；Meanwhile the metal richness powder isolated in step 4) is subjected to wet purification and copper powder recycling；It will
The non-metal powder that step 4) is isolated carries out recycling technique together with toner, sawdust powder and additive.
Wherein, level-one pulverization process selects force mechanism predominantly to split broken and shearing gyratory crusher that is grinding, described
It is mainly that the impact type impacted and be ground rotates grater that second level pulverization process, which selects force mechanism,.
The present invention uses two-stage crushing, i.e., level-one coarse powder is broken and second level fine powder attrition process combines, in coarse powder process
Force mechanism is selected to split shearing gyratory crusher broken and based on grinding；It is main using force mechanism during fine powder
Impact type to impact and being ground rotates grater.
In order to carry out recycling and reusing to the metal richness powder of acquisition, the sharp again of metal richness powder is formulated in the present invention
With method, wet purification described in step 5) specifically: it is 150g/L that metal richness powder is configured to concentration in dispersing agent
Slurry, foaming agent is then added in the slurry according to the additional amount of 150g/t, utilizes metal and nonmetallic hydrophilic difference
Carry out flotation in flotation device, emersion substance be it is nonmetallic, stay in the substance in flotation cell it is cleaned, it is dry after be pure gold
Belong to rich powder.
Wherein, dispersing agent is at least one of dehydrated alcohol, ethylene glycol；The foaming agent is terpenic oil, sec-octyl alcohol, No. 2
At least one of oil.
Wherein, the copper powder after the wet purification in step 5) recycles specifically: the metal richness powder for obtaining wet purification
End carries out being milled to 100 mesh of granularity or more, and the slurry that concentration is 100g/L is configured in dispersing agent, is then added in the slurry
Foaming agent, activator and collecting agent carry out flotation in flotation device, and emersion substance is copper flotation object, emersion object is cleaned,
After drying, pure copper powder is obtained；Resulting pure copper powder is filled into product mold, and is doped and added to assistant metal powder
End, mixes laggard row and is molded, and the green compact being molded sequentially is carried out low-temperature sintering, high temperature sintering, part cooling, can be made
Obtain the finished product of powder metallurgy.
Wherein, dispersing agent is at least one of dehydrated alcohol, ethylene glycol；The foaming agent be terpenic oil, in No. 2 oil at least
It is a kind of；The activator is at least one of vulcanized sodium, Ethylene diamine phosphate；The collecting agent is kerosene.
Wherein, the recycling technique in step 5) specifically: the non-metal powder of isolating step 4) and toner,
Sawdust powder and additive carry out mixed processing, and mixed material carries out fusion treatment, the fusion material that fusion treatment is crossed
In fragment shape, then cool down, crush, sieve and at mould compression process, can be prepared by finished plastic plate.
Wherein, mixed processing specifically: first resin is crushed, toner is made, by hexamethylenetetramine and sawdust powder
It is sent into mixing machine and is mixed with the ratio of mass ratio 9:1, after 45min, mixture is sent into pulverizer and is crushed；Then
Each group sub-material is sequentially added to mixer, incorporation time 60min, feeding sequence is sawdust powder, talcum powder, nonmetallic
Powder, the hexamethylenetetramine for being mixed with wood powder and other components, are finally added toner while agitating.
Wherein, the material component mass percent in mixer are as follows: 35-40% toner, 5-15% sawdust powder, 10%
Non-metal powder, 5-25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6% stearic acid.
Wherein, fusion treatment specifically: mixed material is subjected to mixing operation on single screw rod reciprocating spiral extruder,
The temperature of fusion treatment is controlled at 95-105 DEG C, is mixed each component further, to obtain uniform performance, is being heated and pressurizeed
Under conditions of, it, in fusion, includes in mixed material that resin infiltration, which penetrates into filler, which goes and be uniformly mixed each component,
The heated volatilization of small molecule, while taking away the free phenol in resin.
Embodiment two
What is different from the first embodiment is that the material component mass percent in mixer are as follows: 35-40% toner, 5-15% wood
Crumbs powder, 20% non-metal powder, 5-25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6% stearic acid.
Embodiment three
It is unlike the embodiments above, the material component mass percent in mixer are as follows: 35-40% toner, 5-15%
Sawdust powder, 30% non-metal powder, 5-25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6% stearic acid.
Example IV
It is unlike the embodiments above, the material component mass percent in mixer are as follows: 35-40% toner, 5-15%
Sawdust powder, 40% non-metal powder, 5-25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6% stearic acid.
Embodiment five
It is unlike the embodiments above, the material component mass percent in mixer are as follows: 35-40% toner, 5-15%
Sawdust powder, 0% non-metal powder, 5-25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6% stearic acid.
It is tested by the performance of the plastic plate prepared to embodiment one to five, obtains non-metal powder in the following table 1
Influence of the Different adding amount to plastic plate performance.
The various performances of plastic plate when the Different adding amount of 1 non-metal powder of table
| Project | Standard | Embodiment one | Embodiment two | Embodiment three | Example IV | Embodiment five |
| Non-metal powder content (mass percent) | 10% | 20% | 30% | 40% | 0% | |
| Relative density | ≤1.65 | 1.53 | 1.53 | 1.56 | 1.54 | 1.54 |
| Notch impact strength/(KJ/m2) | ≥2.0 | 2.1 | 2.1 | 2.5 | 2.3 | 2.1 |
| Bending strength/MPa | ≥60 | 76 | 63 | 80 | 81 | 68 |
| Heat distortion temperature/DEG C | ≥155 | 175 | 174 | 168 | 172 | 172 |
| Dielectric strength/(MV/m) | ≥3.5 | 3.5 | 3.7 | 3.4 | 4.6 | 3.5 |
As it can be seen from table 1 the bending strength of plastic plate is minimum when the additional amount of non-metal powder is 20%；And it is nonmetallic
When the additional amount of powder is 30% and 40%, bending strength is higher, than the embodiment five of comparison (additive amount of non-metal powder is 0)
Improve 17.6%.
Also, the heat distortion temperature for the plastic plate processed as can be seen from the above table is all satisfied standard；And 30% additive amount
The dielectric strength of plastic plate is slightly less than standard, it may be considered that is used for low-voltage electrical apparatus product；When being added to 40%, plastic plate
The dielectric strength of material is significantly improved, and the embodiment five than comparison improves 31.4%.
Each performance of the plastic plate of different additional amounts, the plastic plate of the additional amount of 40% non-metal powder is comprehensively compared
Material has relatively good mechanical performance and dielectric strength etc., and its performance is all satisfied the requirement of such product.
From the comparison of above-mentioned performance can be seen that by carrying out tin bath dismantling to waste printed circuit board, level-one crushes, standard screen
Screening, high-voltage electrostatic sorting, waterpower separation by shaking table, second level crushing, wet purification, copper powder recycles, non-metal powder recycles
Etc. a series of processing, the rate of recovery that the metal powder after being capable of handling carries out the copper powder of wet purification is high, and copper powder purity is up to 96%
More than, equipment and technology is simple, at low cost；And the good plastic plate of substrate processability of waste printed circuit board can be utilized,
Recycling and reusing not only is carried out to material valuable in waste printed circuit board, and reduces pollution, the party brought by conventional process
Method has applications well prospect.
The foregoing is only a preferred embodiment of the present invention, but scope of protection of the present invention is not limited thereto,
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
Inventive concept is subject to equivalent substitution or change, should be covered by the protection scope of the present invention.
Claims (10)
1. a kind of waste printed circuit board recycling and reusing method, which is characterized in that successively use following steps:
1) circuit board discarded on electronic equipment is fitted into batches in electric heating detin furnace, carries out detin, then remove discarded circuit
Electronic component on plate；
2) circuit board by detin and after removing carries out level-one pulverization process；
3) smashed powder is screened by standard screen, sub-elects mesh number less than 16 mesh, 16-100 mesh and greater than 100
The powder of these three mesh numbers of mesh；
4) mesh number is passed through into high-voltage electrostatic sorting less than 16 mesh powders, isolates and does not will be completely dissociated particle and metal richness powder,
Meanwhile being sorted by mesh number between 16-100 mesh and greater than 100 mesh powders by waterpower shaking table, isolate metal richness
Powder and non-metal powder；
5) particle that not will be completely dissociated isolated in step 4) is subjected to second level pulverization process, smashed material carries out step 3)
Standard screen screened；Meanwhile the metal richness powder isolated in step 4) is subjected to wet purification and copper powder recycling；It will
The non-metal powder that step 4) is isolated carries out recycling technique together with toner, sawdust powder and additive.
2. a kind of waste printed circuit board recycling and reusing method according to claim 1, it is characterised in that: the level-one crushes
Processing selects force mechanism predominantly to split broken and shearing gyratory crusher that is grinding, and the second level pulverization process selects force side
Formula is mainly that the impact type impacted and be ground rotates grater.
3. a kind of waste printed circuit board recycling and reusing method according to claim 1, it is characterised in that: in the step 5)
The wet purification specifically: by metal richness powder be configured in dispersing agent concentration be 150g/L slurry, then according to
Foaming agent is added in the additional amount of 150g/t in the slurry, is floated in flotation device using metal and nonmetallic hydrophilic difference
Choosing, emersion substance be it is nonmetallic, stay in the substance in flotation cell it is cleaned, it is dry after be pure metal richness powder.
4. a kind of waste printed circuit board recycling and reusing method according to claim 3, it is characterised in that: the dispersing agent is
Dehydrated alcohol, at least one of ethylene glycol；The foaming agent is at least one of terpenic oil, sec-octyl alcohol, No. 2 oil.
5. a kind of waste printed circuit board recycling and reusing method according to claim 1, it is characterised in that: in the step 5)
Wet purification after copper powder recycle specifically: carry out the metal richness powder that wet purification obtains to be milled to 100 mesh of granularity
More than, it is configured to the slurry that concentration is 100g/L in dispersing agent, foaming agent, activator and collecting are then added in the slurry
Agent carries out flotation in flotation device, and emersion substance is copper flotation object, after emersion object is cleaned, dried, obtains pure copper
Powder；Resulting pure copper powder is filled into product mold, and is doped and added to assistant metal powder, laggard row is mixed and carries out mould
Pressure, sequentially carries out low-temperature sintering, high temperature sintering, part cooling for the green compact being molded, can be prepared by the finished product of powder metallurgy.
6. a kind of waste printed circuit board recycling and reusing method according to claim 5, it is characterised in that: the dispersing agent is
At least one of dehydrated alcohol, ethylene glycol；The foaming agent is at least one of terpenic oil, No. 2 oil；The activator is vulcanization
At least one of sodium, Ethylene diamine phosphate；The collecting agent is kerosene.
7. a kind of waste printed circuit board recycling and reusing method according to claim 1, it is characterised in that: in the step 5)
Recycling technique specifically: the non-metal powder of isolating step 4) and toner, sawdust powder and additive into
Row mixed processing, mixed material carry out fusion treatment, and the fusion material that fusion treatment is crossed is in fragment shape, then carry out it is cooling,
It crushes, sieve and at mould compression process, can be prepared by finished plastic plate.
8. a kind of waste printed circuit board recycling and reusing method according to claim 7, it is characterised in that: the mixed processing
Specifically: first resin is crushed, toner is made, hexamethylenetetramine and sawdust powder are sent into the ratio of mass ratio 9:1
It is mixed in mixing machine, after 45min, mixture is sent into pulverizer and is crushed；Then sequentially each group sub-material is added
To mixer, incorporation time 60min, feeding sequence be sawdust powder, talcum powder, non-metal powder, be mixed with wood powder six
Methine tetramine and other components, are finally added toner while agitating.
9. a kind of waste printed circuit board recycling and reusing method according to claim 8, it is characterised in that: the mixing is added
Material component mass percent in device are as follows: 35-40% toner, 5-15% sawdust powder, 10-40% non-metal powder, 5-
25% calcium carbonate, 0.6% talcum powder, 7% hexamethylenetetramine, 1.6% stearic acid.
10. a kind of waste printed circuit board recycling and reusing method according to claim 7, it is characterised in that: at the fusion
Reason specifically: mixed material is subjected to mixing operation, the temperature control of fusion treatment on single screw rod reciprocating spiral extruder
At 95-105 DEG C, mix each component further, to obtain uniform performance, under conditions of being heated and pressurizeed, resin infiltration
It penetrates into filler and goes and be uniformly mixed each component, include the heated volatilization of small molecule in mixed material, together in fusion
When take away free phenol in resin.
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| CN110434158A (en) * | 2019-08-26 | 2019-11-12 | 华南理工大学 | A kind of technique that mechanical approach processing waste printed circuit board prepares copper alloy powder |
| CN110453076A (en) * | 2019-08-26 | 2019-11-15 | 华南理工大学 | A kind of method of waste printed circuit board metal concentrate recycling preparation regeneration copper alloy |
| CN110496846A (en) * | 2019-07-05 | 2019-11-26 | 苏州鑫达资源再生利用有限公司 | A method of recycling copper from useless circuit board |
| CN111014242A (en) * | 2019-12-16 | 2020-04-17 | 中山大学 | Ball milling debromination method for nonmetal components of waste circuit board |
| CN113005296A (en) * | 2021-03-05 | 2021-06-22 | 苏州鑫达资源再生利用有限公司 | Method for recovering copper in copper-clad circuit board |
| CN113718106A (en) * | 2021-07-30 | 2021-11-30 | 中南大学 | Harmless and recycling treatment method for waste circuit board resin powder |
| CN114433597A (en) * | 2022-02-14 | 2022-05-06 | 安徽燊岚环境科技有限公司 | Printed circuit board recovery processing method |
| TWI796107B (en) * | 2022-01-20 | 2023-03-11 | 菖鼎科技股份有限公司 | Recycling methods of waste printed circuit boards |
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| CN113718106A (en) * | 2021-07-30 | 2021-11-30 | 中南大学 | Harmless and recycling treatment method for waste circuit board resin powder |
| TWI796107B (en) * | 2022-01-20 | 2023-03-11 | 菖鼎科技股份有限公司 | Recycling methods of waste printed circuit boards |
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