CN109496019A - Led灯丝及led灯 - Google Patents
Led灯丝及led灯 Download PDFInfo
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- CN109496019A CN109496019A CN201811618061.9A CN201811618061A CN109496019A CN 109496019 A CN109496019 A CN 109496019A CN 201811618061 A CN201811618061 A CN 201811618061A CN 109496019 A CN109496019 A CN 109496019A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B45/00—Circuit arrangements for operating light-emitting diodes [LED]
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- H05B45/3574—Emulating the electrical or functional characteristics of incandescent lamps
- H05B45/3577—Emulating the dimming characteristics, brightness or colour temperature of incandescent lamps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
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- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
- F21K9/278—Arrangement or mounting of circuit elements integrated in the light source
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- H05B45/30—Driver circuits
- H05B45/357—Driver circuits specially adapted for retrofit LED light sources
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- H05B45/40—Details of LED load circuits
- H05B45/44—Details of LED load circuits with an active control inside an LED matrix
- H05B45/46—Details of LED load circuits with an active control inside an LED matrix having LEDs disposed in parallel lines
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
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- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
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- F21Y2113/13—Combination of light sources of different colours comprising an assembly of point-like light sources
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Abstract
本发明公开了一种LED灯丝及LED灯。该LED灯丝包括:先导通回路,先导通回路包括串联的第一LED晶元和不发光的元器件;及后导通回路,后导通回路包括至少两个串联的第二LED晶元,后导通回路与先导通回路并联设置;先导通回路中的第一LED晶元数目少于后导通回路中的第二LED晶元数目;在LED灯丝接通电源时,先导通回路先于后导通回路导通,点亮第一LED晶元;随着电源输出电流的逐步加大,元器件使先导通回路的正向压降逐渐升高至与后导通回路的正向压降相同,使后导通回路导通,点亮第二LED晶元。本发明提供的LED灯丝及LED灯中,元器件能使先导通回路的正向压降逐渐升高,先导通回路与后导通回路能实现先后导通点亮。
Description
技术领域
本发明涉及一种LED灯丝及LED灯。
背景技术
随着社会的发展,人们越来越追求高效节能的照明方式,因而LED灯的技术越来越受到重视,其应用也越来越广。
现有照明领域的调光调色LED照明产品一般是将控制灯光色温的智能电路设置在电源上,然后通过共正级或者共负级的双路输出,来实现调光调色功能。导致电源的结构复杂,尺寸较大。电源的安装也较为困难。难以将设有控制灯光色温的能电路的电源放入LED灯灯头腔体内。此外,LED灯泡壳封泡完成后需要预留3根电气连接线,生产工艺复杂,不良率和成本偏高。
发明内容
本发明的目的之一是为了克服现有技术中的至少一个不足,提供一种实现先导通回路优先导通的LED灯丝及LED灯。
为实现以上目的,本发明通过以下技术方案实现:
根据本发明的第一方面,提供了一种LED灯丝。该LED灯丝包括:先导通回路,所述先导通回路包括串联的第一LED晶元和不发光的元器件;及
后导通回路,所述后导通回路包括至少两个串联的第二LED晶元,所述后导通回路与所述先导通回路并联设置;所述先导通回路中的第一LED晶元数目少于所述后导通回路中的第二LED晶元数目;
其中,在所述LED灯丝接通电源时,所述先导通回路先于所述后导通回路导通,点亮所述第一LED晶元;
随着电源输出电流的逐步加大,所述元器件使所述先导通回路的正向压降逐渐升高至与所述后导通回路的正向压降相同,使所述后导通回路导通,点亮所述第二LED晶元。
可选地,所述元器件包括与所述第一LED晶元串联设置在同一先导通回路上的IC芯片。
可选地,所述元器件包括与所述第一LED晶元串联设置在同一先导通回路上的半导体恒流器件。
可选地,所述半导体恒流器件为恒流二级管。
可选地,所述元器件包括与所述第一LED晶元串联设置在同一先导通回路上的阻性元件。
可选地,所述阻性元件为电阻、电阻或者电感。
可选地,所述先导通回路包括一个或者多个所述第一LED晶元;所述多个LED晶元串联、并联或者串并联后整体与所述元器件串联设置。
可选地,所述先导通回路包括一个或者多个所述元器件;所述多个元器件串联、并联或者串并联后整体与所述第一LED晶元串联设置。
可选地,当所述LED灯丝开始接通电源时,所述先导通回路的正向压降小于所述后导通回路的正向压降。
可选地,电源电流增大过程中,所述后导通电路正向压降变化幅度小于先导通电路正向压降变化幅度。
可选地,所述LED灯丝包括并联设置的至少一路所述先导通回路和至少一路所述后导通回路。
可选地,所述LED灯丝包括一路所述先导通回路和一路所述后导通回路;或者,所述LED灯丝包括一路所述先导通回路和两路所述后导通回路;或者,所述LED灯丝包括两路所述先导通回路和一路所述后导通回路。
可选地,所述LED灯丝包括多个串联设置的整体回路;每个所述整体回路均包括至少一路所述先导通回路和至少一路所述后导通回路,所述至少一路所述先导通回路与所述至少一路所述后导通回路并联设置。
根据本发明的第二方面,提供了一种LED灯。该LED灯包括:灯条,所述灯条包括基板和上述LED灯丝,所述LED灯丝至少部分封装在所述基板上;及电源,所述电源用于接入所述LED灯丝;所述电源被配置为能逐步加大输出电流,使所述先导通回路的正向压降逐渐升高。
可选地,当所述LED灯丝开始接通所述电源时,所述先导通回路的正向压降小于所述后导通回路的正向压降。
可选地,所述基板为陶瓷基板、玻璃基板、蓝宝石基板、金属基板或石墨烯基板,以及柔性线路板基板。
可选地,通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化。LED灯的颜色和色温变化根据需求调节。
通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化;LED色温变化30%以上。可选地LED色温变化40%以上。
可选地,还包括:泡壳,所述灯条通过封泡工艺封在所述泡壳内。
与现有技术相比,本发明提供的LED灯丝及LED灯中,LED灯丝包括先导通回路,先导通回路上设有串联的第一LED晶元和元器件。通过设置元器件,在LED灯丝接通电源时,随着电源的输出电流的逐步加大,能使先导通回路的正向压降逐渐升高。先导通回路通过第一LED晶元数目和元器件的设置,能优先与其他回路导通点亮第一LED晶元。
后导通回路包括至少两个串联的第二LED晶元。后导通回路与先导通回路并联设置。先导通回路中的第一LED晶元数目少于后导通回路中的第二LED晶元数目,先导通回路与后导通回路中导通点亮时的色温不同。先导通回路与后导通回路能实现先后导通点亮。本发明中,可通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化。LED色温变化可达40%以上。
通过LED灯丝上的自身回路设置,即可获得灯光色温调节功能,避免了在电源上设置灯光色温智能电路。
LED灯丝封装在基板上,基板设置在泡壳内,使用现有的封泡技术和电源技术就可实现智能调光调色功能,极大的简化了生产工艺,降低了生产成本和产品不良率。
通过以下参照附图对本发明的示例性实施例的详细描述,本发明的其它特征及其优点将会变得清楚。
附图说明
图1为本发明实施例1提供的LED灯结构示意图。
图2为本发明实施例1提供的LED灯条结构示意图。
图3为本发明实施例1提供的LED灯电路示意图。
图4为本发明实施例2提供的LED灯电路示意图。
图5为本发明实施例3提供的LED灯电路示意图。
图6为本发明实施例4提供的LED灯电路示意图。
图7为本发明实施例5提供的LED灯电路示意图。
具体实施方式
下面结合附图对本发明进行详细的描述:
实施例1:
请参阅图1,其为本发明提供的一种LED灯100。LED灯100包括泡壳101,泡壳101围成一容腔110。泡壳的材质为玻璃或塑料,形状可以是常见的梨形泡A灯、蜡烛灯、球形灯,也可以包括但不限于反射灯或者装饰灯等,例如T灯、ST灯和BR灯等。容腔110内设置有两条第一灯条120和四条第二灯条130。两条第一灯条120和四条第二灯条130通过导体并联。如图2所示,本发明中的第一灯条120,其结构包括封装壳1201、基板123和先导通回路10。封装壳1201可采用硅胶材料,将先导通回路10封闭在基板123上。封装壳1201也可以采用其他现有技术可用的材料或结构。先导通回路10设置在基板123上,由基板123支撑,并导电。基板123为所述基板为陶瓷基板、玻璃基板、蓝宝石基板、金属基板、石墨烯基板或柔性线路板基板等。其可根据具体使用场景选择确定。第二灯条130结构与第一灯条120相似,第二灯条130内设置有后导通回路20,后导通回路20设置在基板上,基板与第一灯条120内的基板123相同。如图2和图3所示,第一灯条120内的先导通回路10包括多个第一LED晶元121以及元器件122。多个第一LED晶元121以及元器件122通过导体124串联设置。导体124端部连接有端子125。端子125用于与外部供电电源电连接,以为第一LED晶元121以及元器件122供电。所述元器件122为非发光的元器件,其可以是IC芯片、半导体恒流器件或者阻性元件等非发光元件。例如,所述半导体恒流器件可以是恒流二级管、稳压二极管或者恒流三级管等。例如,所述阻性元件可以是电阻、电容或者电感等。本实施例中元器件122为IC芯片。所述后导通回路20包括至少两个串联设置的第二LED晶元201。所述先导通回路10与所述后导通回路20并联设置。所述先导通回路10中的第一LED晶元121数目少于所述后导通回路20中的第二LED晶元201的数目。由于LED晶元数目的不同,所述先导通回路10与所述后导通回路20导通时的色温不同。如图所示的本实施例中的LED灯100包括并联设置的两路所述先导通回路10和四路所述后导通回路20。所述先导通回路10包括三个所述第一LED晶元121和一个所述元器件122。三个所述第一LED晶元121串联设置。所述三个第一LED晶元121与所述一个元器件122串联设置。所述后导通回路20包括串联设置的四个所述第二LED晶元201。
使用时,LED灯100电连接调光LED驱动器40,调光LED驱动器40电连接交流电源30。交流电源30可以是市电交流电源。调光LED驱动器40的输出电流能逐步加大地设置。初始接通时,调光LED驱动器40的输出电流较小,并且逐步加大。电流逐渐增大,还可以通过LED电源驱动器与调光开关的组合实现。LED电源驱动器输出电流恒定,通过调光开关调节输出电流的逐渐增大。当所述先导通回路10初始接通交流电源30时,所述先导通回路10的正向压降小于所述后导通回路20的正向压降。所述先导通回路10的正向压降较低会被优先导通,从而点亮其上的第一LED晶元121。通过所述元器件122的设置,随着交流电源30输出电流的逐步增大,所述先导通回路10的正向压降也逐渐升高。在交流电源30输出电流逐步增大的过程中,所述后导通电路20正向压降基本保持不变,其变化幅度小于先导通回路10的正向压降变化幅度,直至先导通回路10与后导通回路20的正向压降相同。先导通回路10与后导通回路20均导通,第一灯条120与第二灯条130均发光。通过使第一灯条120和第二灯条130发光的先后顺序,可实现LED灯100的调色功能。比如,第一灯条120设置为一种颜色,第二灯条130设置为另一种颜色。当其发光时,LED灯100呈现一种颜色。当第一灯条120和第二灯条130均发光时,两种颜色的灯条发光是的LED灯呈现出另外的颜色,从而可实现调色功能。
实施例2
作为实施例一的变形,请参阅图4,其为本发明提供的的另一种LED灯。与实施例1不同的是:所述LED灯包括三条LED灯条。每条LED灯条设置一条灯丝。三条灯丝包括一路先导通回路10和两路后导通回路20,一路先导通回路10和两路后导通回路20并联设置。三路回路只要并联即可,其排布位置可根据需要具体设置。本实施例中,元器件122为恒流二极管。
实施例3
作为实施例1的变形,请参阅图5,其为本发明提供的的又一种LED灯。与实施例1不同的是:所述LED灯包括三条LED灯条。每条LED灯条设置一条灯丝。三条灯丝包括两路先导通回路10和一路后导通回路20,三路回路并联设置。三路回路只要并联即可,其排布位置可根据需要具体设置。本实施例中,元器件122为电阻。
实施例4
作为实施例1的变形,请参阅图6,其为本发明提供的的又一种LED灯。与实施例1不同的是:所述LED灯包括四条灯条。其中两条灯条设置分别设置两条先导通回路10,另外两条灯条分别设置两条后导通回路20。其中一个设置先导通回路10的灯条与其中一条设置后导通回路20的灯条并联形成第一组件50,设置另一条先导通回路10的灯条与设置另一条后导通回路20的灯条并联组成第二组件650。第一组件50与第二组件60串联后与调光LED驱动器40电连接。
实施例5
作为实施例1的变形,请参阅图7,其为本发明提供的的又一种LED灯。与实施例1不同的是:所述LED灯包括两条LED灯条,两条灯条并联设置。每条LED灯条设置一条灯丝。两条灯丝包括一先导通回路10和一路后导通回路20,两路回路并联设置。本实施例中,元器件122为电容。
本发明提供的LED灯丝及LED灯中,LED灯丝包括先导通回路,先导通回路上设有串联的第一LED晶元和元器件。通过设置元器件,在LED灯丝接通电源时,随着电源的输出电流的逐步加大,能使先导通回路的正向压降逐渐升高。先导通回路通过第一LED晶元数目和元器件的设置,能优先与其他回路导通点亮第一LED晶元。本发明中,可通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化。LED色温变化可达40%以上。
后导通回路包括至少两个串联的第二LED晶元。后导通回路与先导通回路并联设置。先导通回路中的第一LED晶元数目少于后导通回路中的第二LED晶元数目,先导通回路与后导通回路中导通点亮时的色温不同。先导通回路与后导通回路能实现先后导通点亮。本发明中,可通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化。LED色温变化可达40%以上。
通过LED灯丝上的自身回路设置,即可获得灯光色温调节功能,避免了在电源上设置灯光色温智能电路。
LED灯丝封装在基板上,基板设置在泡壳内,使用现有的封泡技术和电源技术就可实现智能调光调色功能,极大的简化了生产工艺,降低了生产成本和产品不良率。
以上仅为本发明较佳的实施例,并不用于局限本发明的保护范围,任何在本发明精神内的修改、等同替换或改进等,都涵盖在本发明的权利要求范围内。
Claims (19)
1.一种LED灯丝,其特征在于,包括:
先导通回路,所述先导通回路包括串联的第一LED晶元和非发光的元器件;及
后导通回路,所述后导通回路包括至少两个串联的第二LED晶元,所述后导通回路与所述先导通回路并联设置;所述先导通回路中的第一LED晶元数目少于所述后导通回路中的第二LED晶元数目;
其中,在所述LED灯丝接通电源时,所述先导通回路先于所述后导通回路导通,点亮所述第一LED晶元;
随着电源输出电流的逐步加大,所述元器件使所述先导通回路的正向压降逐渐升高至与所述后导通回路的正向压降相同,使所述后导通回路导通,点亮所述第二LED晶元。
2.根据权利要求1所述的LED灯丝,其特征在于:
所述元器件包括与所述第一LED晶元串联设置在同一先导通回路上的IC芯片。
3.根据权利要求1所述的LED灯丝,其特征在于:
所述元器件包括与所述第一LED晶元串联设置在同一先导通回路上的半导体恒流器件。
4.根据权利要求3所述的LED灯丝,其特征在于:
所述半导体恒流器件为恒流二级管。
5.根据权利要求1所述的LED灯丝,其特征在于:
所述元器件包括与所述第一LED晶元串联设置在同一先导通回路上的阻性元件。
6.根据权利要求5所述的LED灯丝,其特征在于:
所述阻性元件为电阻、电阻或者电感。
7.根据权利要求1所述的LED灯丝,其特征在于:
所述先导通回路包括一个或者多个所述第一LED晶元;所述多个LED晶元串联、并联或者串并联后整体与所述元器件串联设置。
8.根据权利要求1所述的LED灯丝,其特征在于:
所述先导通回路包括一个或者多个所述元器件;所述多个元器件串联、并联或者串并联后整体与所述第一LED晶元串联设置。
9.根据权利要求1所述的LED灯丝,其特征在于:
当所述LED灯丝开始接通电源时,所述先导通回路的正向压降小于所述后导通回路的正向压降。
10.根据权利要求1所述的LED灯丝,其特征在于:
电源电流增大过程中,所述后导通电路正向压降变化幅度小于先导通电路正向压降变化幅度。
11.根据权利要求1所述的LED灯丝,其特征在于:
所述LED灯丝包括并联设置的至少一路所述先导通回路和至少一路所述后导通回路。
12.根据权利要求11所述的LED灯丝,其特征在于:
所述LED灯丝包括一路所述先导通回路和一路所述后导通回路;或者,
所述LED灯丝包括一路所述先导通回路和两路所述后导通回路;或者,
所述LED灯丝包括两路所述先导通回路和一路所述后导通回路。
13.根据权利要求1所述的LED灯丝,其特征在于:
所述LED灯丝包括多个串联设置的整体回路;
每个所述整体回路均包括至少一路所述先导通回路和至少一路所述后导通回路,所述至少一路所述先导通回路与所述至少一路所述后导通回路并联设置。
14.一种LED灯,其特征在于,包括:
灯条,所述灯条包括基板和权利要求1-13中任一项所述的LED灯丝,所述LED灯丝至少部分封装在所述基板上;及
电源,所述电源用于接入所述LED灯丝;
所述电源被配置为能逐步加大输出电流,使所述先导通回路的正向压降逐渐升高。
15.根据权利要求14所述的LED灯丝,其特征在于:
当所述LED灯丝开始接通所述电源时,所述先导通回路的正向压降小于所述后导通回路的正向压降。
16.根据权利要求14所述的LED灯,其特征在于:
所述基板为陶瓷基板、玻璃基板、蓝宝石基板、金属基板或石墨烯基板,以及柔性线路板基板。
17.根据权利要求14所述的LED灯,其特征在于,还包括:
泡壳,所述灯条通过封泡工艺封在所述泡壳内。
18.根据权利要求14所述的LED灯,其特征在于,
通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化。
19.根据权利要求14所述的LED灯,其特征在于,还包括:
通过导通回路的导通时间先后顺序不同,来控制LED灯的颜色和色温变化;
LED色温变化30%以上。
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