CN109491163A - Array substrate renovation technique, array substrate and display panel - Google Patents
Array substrate renovation technique, array substrate and display panel Download PDFInfo
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- CN109491163A CN109491163A CN201811521482.XA CN201811521482A CN109491163A CN 109491163 A CN109491163 A CN 109491163A CN 201811521482 A CN201811521482 A CN 201811521482A CN 109491163 A CN109491163 A CN 109491163A
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- array substrate
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- renovation technique
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136259—Repairing; Defects
- G02F1/136263—Line defects
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a kind of array substrate renovation technique, specifically includes the following steps: the oxidation solder in detection array substrate；When detecting that the oxidation solder in array substrate has broken position, the broken position is repaired using metal wire；Insulating materials is coated in the broken position, the metal wire package isolation that will be repaired.A kind of array substrate and display panel is also disclosed in the application.In technical scheme, by being repaired in the oxidation solder broken position of array substantially using metal wire, ensure the integrality of array substrate, by coating insulating materials at repairing metal line position, with the metal wire package isolation that will be repaired, when effectively avoiding combine pressing with color membrane substrates in array substrate, metal wire is contacted with the oxidation solder on color membrane substrates, prevent metal wire with aoxidize that solder is contacted there is a situation where short-circuit and defect occur bad.
Description
Technical field
This application involves technical field of liquid crystal display, in particular to a kind of array substrate renovation technique, array substrate and
Display panel.
Background technique
Here statement only provides background information related with the application, without inevitably constituting the prior art.
Liquid crystal display is during array process (Array processing procedure), due to equipment operation, process environments, raw material material
All there is certain fluctuation in the factors such as matter, when these fluctuations exceed the specification of technique, it is bad to generate technique, such as occurs
Wire broken string etc., repair break lines are carried out usually in a manner of bridging, can promote product yield, but such repairing method is in array
When substrate combines (Cell processing procedure) with color membrane substrates (CF) progress unit, due to pass through two pieces of substrates of pressing, bridge is mended repairing line
Position is easy that short circuit phenomenon occurs with the oxidation solder on color membrane substrates, and it is bad to form line defect.
Summary of the invention
The main purpose of the application is to propose a kind of array substrate renovation technique, array substrate and display panel, it is intended to
It solves in the prior art, to carry out the mode of repair break lines after array process using bridge joint mode, cause pressure surface line in array substrate
When being combined with color membrane substrates, short circuit occurs with the oxidation solder on color membrane substrates, leads to the technical problem that line defect is bad.
To achieve the above object, a kind of array substrate renovation technique that the application proposes, the array substrate renovation technique
The following steps are included:
Detect the oxidation solder in array substrate；
When detecting that the oxidation solder in array substrate has broken position, the broken position is repaired using metal wire；
Insulating materials is coated in the broken position, the metal wire package isolation that will be repaired.
Optionally, described to include: the step of coating insulating materials in the broken position
The broken position is coated with using chromatic photoresist.
Optionally, after described the step of being coated with the broken position using chromatic photoresist, further includes:
Array substrate is put into vacuum plant and is dried in vacuo.
Optionally, described the step of the broken position coats chromatic photoresist, and the metal wire that will be repaired wraps up isolation
Later, further includes:
Chromatic photoresist in the array substrate is toasted.
Optionally, before the step of chromatic photoresist in the array substrate toasts, further includes:
Prebake conditions and cooling are carried out to by vacuum drying array substrate.
Optionally, it after described the step of repairing the broken position using metal wire, is coated in the broken position
Before the step of insulating materials, further includes:
Clean the array substrate.
To achieve the goals above, the application also provides a kind of array substrate, the array substrate include substrate body with
And the tin oxide film being disposed on the substrate, the broken position of the tin oxide film are connected with metal wire, coat on the metal wire
There is insulating layer.
Optionally, the insulating layer is color light resistance layer.
To achieve the goals above, the application also provides a kind of display panel, the display panel include color membrane substrates with
And array substrate as described above, the color membrane substrates and the array substrate form box by unit processing procedure, and press and to be formed
The display panel.
Optionally, color membrane substrates and when the array substrate group box, metal wire in the array substrate with it is described
The insulating layer is spaced between color membrane substrates.
Array substrate renovation technique, array substrate and display panel provided by the present application, by array substantially
Solder broken position is aoxidized to repair using metal wire, it is ensured that the integrality of array substrate, by being coated at repairing metal line position
Insulating materials, the metal wire package isolation that will be repaired, when effectively avoiding combining pressing with color membrane substrates in array substrate, metal
Line is contacted with the oxidation solder on color membrane substrates, prevents metal wire from contact that generation is short-circuit with oxidation solder and defect occur undesirable
Situation.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those of ordinary skill in the art without creative efforts, can be with
The structure shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the flowage structure schematic diagram of the application array substrate renovation technique first embodiment；
Fig. 2 is the flowage structure schematic diagram of the application array substrate renovation technique second embodiment；
Fig. 3 is the structural schematic diagram of the application array substrate；
Fig. 4 is the structural schematic diagram of Section A-A in Fig. 3.
Drawing reference numeral explanation:
| Label | Title | Label | Title |
| 100 | Substrate body | 110 | Tin oxide film |
| 120 | Metal wire | 130 | Insulating layer |
The embodiments will be further described with reference to the accompanying drawings for realization, functional characteristics and the advantage of the application purpose.
Specific embodiment
Below in conjunction with the attached drawing in the embodiment of the present application, technical solutions in the embodiments of the present application carries out clear, complete
Site preparation description, it is clear that described embodiment is only a part of the embodiment of the application, instead of all the embodiments.Base
Embodiment in the application, it is obtained by those of ordinary skill in the art without making creative efforts it is all its
His embodiment, shall fall in the protection scope of this application.
It is to be appreciated that if relating to directionality instruction (such as up, down, left, right, before and after ...) in the embodiment of the present application,
Then directionality instruction be only used for explain under a certain particular pose (as shown in the picture) between each component relative positional relationship,
Motion conditions etc., if the particular pose changes, directionality instruction is also correspondingly changed correspondingly.
In addition, being somebody's turn to do " first ", " second " etc. if relating to the description of " first ", " second " etc. in the embodiment of the present application
Description be used for description purposes only, be not understood to indicate or imply its relative importance or implicitly indicate indicated skill
The quantity of art feature." first " is defined as a result, the feature of " second " can explicitly or implicitly include at least one spy
Sign.It in addition, the technical solution between each embodiment can be combined with each other, but must be with those of ordinary skill in the art's energy
It is enough realize based on, will be understood that the knot of this technical solution when conflicting or cannot achieve when occurs in the combination of technical solution
Conjunction is not present, also not this application claims protection scope within.
The application proposes a kind of array substrate renovation technique, array substrate and display panel.
With specific reference to the array substrate renovation technique first embodiment that Fig. 1, the application are proposed, the array substrate repairs work
Skill the following steps are included:
Step S10 detects the oxidation solder in array substrate；
Step S20, it is described disconnected using metal wire repairing when detecting that the oxidation solder in array substrate has broken position
Line position；
It during array substrate processing procedure described in the present embodiment, first forms a film on the glass substrate, on the glass substrate upper oxygen
Change tin film, and then successively forms final array substrate by development, light blockage coating, etching, exposure and photoresist removing.?
It after the completion of array substrate processing procedure, needs to detect array substrate and repaired, the detection of the present embodiment array substrate uses certainly
Dynamic optical detection method detection, such as logical electric-examination, successively detects the oxidation solder in array substrate for energization detection device,
When at broken position, energization detection device can issue warning note, determine that the check bit is set to broken position at this time.Other
In embodiment, the array substrate can also be detected also using micro devices acquisition image, pass through the microcosmic display on image
Judge whether the oxidation solder in array substrate broken string situation occurs.
When there is oxidation solder to break on detecting array substrate, in order to which the circuit guaranteed in array substrate can be just
It is often used, the oxidation solder to broken position is needed to repair, wherein there are many repairing methods, if the present embodiment is using gold
The mode for belonging to line bridge joint is repaired, and specifically can be aoxidized solder using the both ends of metal wire bridge joint broken position, be passed through welding
Mode metal wire is fixed in array substrate；Or directly oxidation solder broken position can be welded by welding
It picks up and.
It is understood that solder joint or bonding wire influence the installation of array substrate in order to prevent, it is described to be repaired using metal wire
The step of broken position includes: to bridge metal wire in the broken position；The metal wire is weldingly fixed on described
In array substrate；Remove bonding wire burr or the flash on the metal wire.It can specifically be removed on metal wire by way of friction
Bonding wire burr or flash.
Further, before the oxidation solder in detection array substrate, first the array substrate is cleaned, to protect
Demonstrate,prove the accuracy of array substrate defects detection.
Step S30 coats insulating materials in the broken position, the metal wire package isolation that will be repaired.
Metal wire is contacted with the oxidation solder on the color membrane substrates of abutting joint in order to prevent, causes color membrane substrates to occur short
The defect on road coats insulating materials on the position that the broken string and bridge joint have metal wire, metal wire is wrapped up and is isolated, such as
This, in color membrane substrates and when array substrate abutting joint, even if metal wire is contacted with the oxidation solder on color membrane substrates, based on having
Insulating materials isolation not will cause color membrane substrates short circuit.
Optionally, it after described the step of repairing the broken position using metal wire, is coated in the broken position
Before the step of insulating materials, further includes:
Clean the array substrate.
Before bridge metal line, first washing array substrate, it is ensured that when coating insulating materials, do not added on metal wire miscellaneous
Matter guarantees the coating effect of insulating materials, guarantees the beauty of insulating layer.
In the embodiment of the present application, by being repaired in the oxidation solder broken position of array substantially using metal wire, it is ensured that
The integrality of array substrate, by coating insulating materials at repairing metal line position, the metal wire package isolation that will be repaired has
When effect avoids combining pressing with color membrane substrates in array substrate, metal wire is contacted with the oxidation solder on color membrane substrates, prevents gold
Belong to that line is contacted with oxidation solder there is a situation where short-circuit and defect occur bad.
Optionally, the array substrate renovation technique second embodiment proposed referring to Fig. 2, the application, the present embodiment are based on upper
First embodiment is stated, it is described to include: the step of coating insulating materials in the broken position
Step S31 is coated with the broken position using chromatic photoresist.
The insulating materials being coated in broken position in order to prevent influences the light transmission of array substrate and color membrane substrates, this
Apply for that embodiment is coated with the broken position using chromatic photoresist.Wherein, there are many modes of chromatic photoresist coating, such as spin-coating method
Blade coating and spin coating combined techniques and fine knife coating, for the uniformity for guaranteeing coated thin film, it is preferred to use fine knife coating is fine
Coating.
It is understood that the present embodiment can also carry out chromatic photoresist coating using ink-jet printing, it is specific using spray
It, can be according to the size or metal wire and array base for the metal wire that broken position bridges when black impact system is coated broken position
The distance of other tin oxide films determines the size of spraying on plate.
With continued reference to Fig. 2, after described the step of being coated with the broken position using chromatic photoresist, further includes:
Step S40, array substrate is put into vacuum plant and is dried in vacuo.
Light blockage coating is carried out in the broken position of array substrate, it is fast for the ease of chromatic photoresist after covering isolating metal line
Rapid-curing cutback is dry, and prevents from being influenced by air plankton or external factor in the drying process, and the array substrate is put into vacuum plant
In, it is dried in vacuo.Wherein, vacuum plant is vacuum tank, has bleeding point in vacuum tank, the array is put into institute substantially
After stating vacuum plant, the air in the vacuum tank is detached.Array substrate vacuum drying time is applied with specific reference to chromatic photoresist
Cloth amount determines.
It is described to coat chromatic photoresist in the broken position with continued reference to Fig. 2, the metal wire package isolation that will be repaired
After step, specifically array substrate was put into after the step of being dried in vacuo in vacuum plant, further includes:
Step S50 toasts the chromatic photoresist in the array substrate.
Baking process is the high temperature curing process carried out to photoresist, i.e., array substrate is placed under about 230 DEG C of high temperature
A period of time is maintained, the solvent in photoresist is made thoroughly to distil, the resin in photoresist carries out sufficient heat polymerization, reaches post bake
And improve the effect of its adhesive force.After array substrate is dried in vacuo, chromatic photoresist is toasted using roasting plant, improves its height
Warm curing efficiency.
It is understood that in order to further increase high temperature heat cure effect, the colour in the array substrate
Before the step of photoresist is toasted, further includes:
Step S60 carries out prebake conditions and cooling to by vacuum drying array substrate.
After array substrate vacuum drying, before being toasted, in order to guarantee cured effect, first array substrate is carried out pre-
It toasts, after prebake conditions preset time, after the array substrate is placed cooling, then carries out high-temperature baking, wherein prebake conditions temperature
Less than target baking temperature used when being toasted in step 50 to the chromatic photoresist in array substrate.
To achieve the goals above, the application also provides a kind of array substrate, is the application array referring in particular to Fig. 3, Fig. 3
The structural schematic diagram of substrate, the array substrate include the tin oxide film 110 of substrate body 100 and setting on the substrate 100,
The broken position of the tin oxide film 110 is connected with metal wire 120, is coated with insulating layer 130 on the metal wire 120.
Wherein, the substrate body 100 is glass substrate 100, and the glass substrate 100 is applied by film forming, development, photoresist
Cloth, etching, exposure and photoresist removing, form the battle array with 100 layers of glass substrate, tin oxide film layer 110 and photoresist layer
Column substrate.
Film 110 is inhaled during the preparation process based on the oxidation, it is possible that broken string or the situation of short circuit, therefore in array base
After the completion of plate preparation, in order to guarantee that array substrate is able to use, the broken position of the oxidation film is bridged using metal wire 120.
The oxidation of array substrate described in the present embodiment is inhaled on film, and bridge joint has the position of metal wire 120 to be coated with insulating layer 130, with isolation
Metal wire 120 prevents metal wire 120 exposed.In the present embodiment, the insulating layer 130 is color light resistance layer namely the insulation
The insulating materials that layer 130 uses is chromatic photoresist.
Array substrate is specifically made of above-mentioned manufacturing process in the present embodiment, since this array substrate uses above-mentioned institute
There are whole technical solutions of embodiment, therefore at least all beneficial effects brought by the technical solution with above-described embodiment.
The metal wire 120 bridged in the present embodiment array substrate passes through coating one layer insulating 130 isolation, array substrate and color membrane substrates
When 100 combination installation pressing, even if metal wire 120 is contacted with the oxidation solder on color membrane substrates 100, based on insulating layer 130
The position of isolation, array substrate and color membrane substrates 100 will not be conductive, effectively avoids in array substrate and color membrane substrates 100
When combination pressing, metal wire 120 is contacted with the oxidation solder on color membrane substrates 100, prevents metal wire 120 from contacting with oxidation solder
It is bad to there is defect there is a situation where short circuit.
To achieve the goals above, the application also provides a kind of display panel, the display panel include color membrane substrates with
And array substrate as described above, the color membrane substrates and the array substrate form box by unit processing procedure, and press and to be formed
The display panel.Metal wire and the coloured silk when color membrane substrates and the array substrate group box, in the array substrate
The insulating layer is spaced between ilm substrate.Specific structure reference above-described embodiment of array substrate in the display panel, due to
This display panel uses whole technical solutions of above-mentioned all embodiments, therefore at least with the technical solution of above-described embodiment
Brought all beneficial effects, this is no longer going to repeat them.
The foregoing is merely preferred embodiment of the present application, are not intended to limit the scope of the patents of the application, all at this
Under the application design of application, using equivalent structure transformation made by present specification and accompanying drawing content, or directly/use indirectly
In the scope of patent protection that other related technical areas are included in the application.
Claims (10)
1. a kind of array substrate renovation technique, which is characterized in that the array substrate renovation technique the following steps are included:
Detect the oxidation solder in array substrate；
When detecting that the oxidation solder in array substrate has broken position, the broken position is repaired using metal wire；
Insulating materials is coated in the broken position, the metal wire package isolation that will be repaired.
2. array substrate renovation technique as described in claim 1, which is characterized in that described to be coated absolutely in the broken position
The step of edge material includes:
The broken position is coated with using chromatic photoresist.
3. array substrate renovation technique as claimed in claim 2, which is characterized in that described described disconnected using chromatic photoresist coating
After the step of line position, further includes:
Array substrate is put into vacuum plant and is dried in vacuo.
4. array substrate renovation technique as claimed in claim 3, which is characterized in that described to coat colour in the broken position
After the step of photoresist, the metal wire package isolation that will be repaired, further includes:
Chromatic photoresist in the array substrate is toasted.
5. array substrate renovation technique as claimed in claim 4, which is characterized in that the colour in the array substrate
Before the step of photoresist is toasted, further includes:
Prebake conditions and cooling are carried out to by vacuum drying array substrate.
6. the array substrate renovation technique as described in claim 1-5 any one, which is characterized in that described to be repaired using metal wire
After the step of mending the broken position, before the step of coating insulating materials in the broken position, further includes:
Clean the array substrate.
7. a kind of array substrate, which is characterized in that the array substrate includes substrate body and the oxidation being disposed on the substrate
Tin film, the broken position of the tin oxide film are connected with metal wire, are coated with insulating layer on the metal wire.
8. array substrate as claimed in claim 7, which is characterized in that the insulating layer is color light resistance layer.
9. a kind of display panel, which is characterized in that the display panel includes color membrane substrates and such as claim 7 or 8 any
Array substrate described in one, the color membrane substrates and the array substrate form box by unit processing procedure, and press and form institute
State display panel.
10. display panel as claimed in claim 9, which is characterized in that when the color membrane substrates and the array substrate group box,
The insulating layer is spaced between metal wire and the color membrane substrates in the array substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811521482.XA CN109491163A (en) | 2018-12-12 | 2018-12-12 | Array substrate renovation technique, array substrate and display panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811521482.XA CN109491163A (en) | 2018-12-12 | 2018-12-12 | Array substrate renovation technique, array substrate and display panel |
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| Publication Number | Publication Date |
|---|---|
| CN109491163A true CN109491163A (en) | 2019-03-19 |
Family
ID=65710022
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811521482.XA Pending CN109491163A (en) | 2018-12-12 | 2018-12-12 | Array substrate renovation technique, array substrate and display panel |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113345328A (en) * | 2021-05-28 | 2021-09-03 | Tcl华星光电技术有限公司 | Mura repairing method for display panel |
| CN113655647A (en) * | 2021-08-20 | 2021-11-16 | 深圳市华星光电半导体显示技术有限公司 | Method and device for repairing broken line of array substrate |
| CN114035384A (en) * | 2021-10-27 | 2022-02-11 | 滁州惠科光电科技有限公司 | Array substrate circuit repairing method and device and array substrate |
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Application publication date: 20190319 |