CN109473498B - Packaging integrated backboard and preparation method thereof - Google Patents

Packaging integrated backboard and preparation method thereof Download PDF

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Publication number
CN109473498B
CN109473498B CN201811360015.3A CN201811360015A CN109473498B CN 109473498 B CN109473498 B CN 109473498B CN 201811360015 A CN201811360015 A CN 201811360015A CN 109473498 B CN109473498 B CN 109473498B
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parts
layer
weather
package
mixture
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CN109473498A (en
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韩晓航
陈洪野
赵正柏
夏修旸
吴小平
宇野敬一
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Zhejiang Saiwu Application Technology Co ltd
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Suzhou Cybrid Application Technology Co ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
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Abstract

The invention provides a packaging integrated back plate and a preparation method thereof. The packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from top to bottom, wherein the weather-resistant layer is a weather-resistant material layer, the framework layer is a modified polyolefin material layer, and the connecting layer is a TPO particle material layer. The packaging integrated backboard has good water resistance, good bonding force with a solar cell, no photo-thermal aging phenomenon after long-term use, no corrosion, good weather resistance and no yellowing after long-term use; the preparation method of the packaging integrated back plate adopts a three-layer co-extrusion or film coating process, is formed at one time, does not use glue, does not have organic solvent pollution, does not need a coating and drying process, and has relatively low processing cost.

Description

Packaging integrated backboard and preparation method thereof
Technical Field
The invention belongs to the technical field of packaging materials, and relates to a packaging integrated back plate and a preparation method thereof.
Background
The conventional single-glass assembly structure of the solar cell is glass/adhesive film/cell piece/adhesive film/photovoltaic back plate, the photovoltaic back plate is an important packaging material in the photovoltaic assembly and has a supporting effect on the cell piece, and meanwhile, the photovoltaic back plate is directly contacted with the external environment in a large area, and the excellent insulativity, barrier property and weather resistance of the photovoltaic back plate are important factors for ensuring that the photovoltaic assembly can be stably used for a long time.
CN202977464U discloses a composite backboard for solar cell with high resistance and water vapor resistance, the composite backboard is of a layered structure and sequentially comprises a weather-resistant layer, a high barrier layer and a bonding layer from top to bottom, the high barrier layer is a PET film, and one side of the PET film is plated with SiO2A layer having a plated side bonded to the weathering layer. The back plate is made of SiO2One-side coated PET film as high barrier layer coated with SiO2One side is bonded with the weather-resistant layer. The bonding layer is directly made of cross-linking EVA; layer(s)When the battery piece is pressed, the battery piece is directly sealed, the use is convenient, the water vapor barrier property is good, and the purpose of prolonging the service life of the assembly can be achieved. However, the composite back plate adopts PET as a framework layer, the water resistance is insufficient, a water resistance layer needs to be additionally coated to achieve higher water resistance, and the hydrolysis resistance of the PET material is poor; the EVA is used as the bonding layer, the solar cell module can be tested by various environments such as light, heat, moisture and the like in the use process, the EVA with the sealing function can age gradually due to the influence of severe environment, and the aging effect of the EVA is greatly influenced by the existence of the moisture; because the various auxiliary agents can be lost due to hydrolysis and the like, the EVA can be hydrolyzed, and the acetic acid generated after hydrolysis can accelerate the aging process and corrode metal parts such as welding strips of battery pieces and the like, and the service life of the assembly is seriously shortened, the EVA can generate acidic substances in the photo-thermal aging process, so that the product is corrosive and needs additional treatment.
CN107749428A discloses a composite packaging integrated functional solar cell backboard, the photovoltaic backboard is sequentially provided with a weather-resistant layer, an adhesive layer, a PET layer, an adhesive layer and a functional layer from outside to inside, the functional layer comprises an integrally formed opal layer and a transparent layer, the opal layer is of a single-layer or multi-layer structure, the total thickness is 20-200 mu m, the opal layer comprises 3-20 parts of modified inorganic filler, 70-92 parts of modified resin, 0.3-9 parts of ultraviolet absorbent and 0.3-8 parts of antioxidant, the transparent layer is attached to a cell, the single-layer or multi-layer structure is adopted, the total thickness is 200-800 mu m, and the photovoltaic backboard comprises 90-98 parts of modified resin, 0.3-9 parts of ultraviolet absorbent and 0.3-8 parts of antioxidant. The invention adopts an integrated functional layer to replace the traditional adhesive film, not only has high weather resistance, high reflection, high insulation and low water permeability, but also has the function of increasing the power of the component while protecting the component for 25 years of service life. However, the solar cell back plate adopts a coating process during processing, and the produced product needs an adhesive and is not environment-friendly.
Disclosure of Invention
Aiming at the defects of the prior art, one of the purposes of the invention is to provide a packaging integrated backboard, which has good water resistance, good bonding force with a solar cell, no corrosion to the cell, no use of an adhesive, good environmental protection, easy recovery, good weather resistance and no yellowing after long-term use.
In order to achieve the purpose, the invention adopts the following technical scheme:
the packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from top to bottom, wherein the weather-resistant layer is a weather-resistant material layer, the framework layer is a modified polyolefin material layer, and the connecting layer is a TPO particle material layer.
According to the packaging integrated back plate, the framework layer adopts the modified polyolefin material to replace PET, the water resistance of the material is excellent, and the hydrolysis resistance of the material is better than that of the PET material; the TPO particle material is adopted to replace an EVA material in the connecting layer, so that the cell product cannot be corroded due to acidic substances generated by photo-thermal aging. The packaging integrated backboard has good water resistance, good bonding force with a solar cell, no corrosion, good weather resistance and no yellowing after long-term use; no adhesive is used, so that no organic pollution exists, and the environmental protection property is good.
In the invention, the modified polyolefin material layer is composed of modified polyolefin materials, and the modified polyolefin materials comprise the following components in parts by weight:
Figure GDA0002703649640000031
specifically, the modified polyolefin material comprises the following components in parts by weight:
70-100 parts of modified polyolefin, for example, 70 parts, 71 parts, 72 parts, 73 parts, 74 parts, 75 parts, 76 parts, 77 parts, 78 parts, 79 parts, 80 parts, 81 parts, 82 parts, 83 parts, 84 parts, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 parts, 91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts, 99 parts and 100 parts of modified polyolefin.
0-30 parts of toughening agent, for example, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts and 30 parts of toughening agent.
0.1 to 0.3 part of ultraviolet absorbent, for example, 0.1 part, 0.15 part, 0.2 part, 0.25 part and 0.3 part by weight of ultraviolet absorbent.
0.3-0.8 part of antioxidant, for example, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part and 0.8 part of antioxidant.
In the invention, the TPO particle material layer consists of TPO particle materials, and the TPO particle materials comprise the following components in parts by weight:
Figure GDA0002703649640000032
Figure GDA0002703649640000041
specifically, the TPO particle material comprises the following components in parts by weight:
60-100 parts of POE resin, for example, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, 66 parts, 67 parts, 68 parts, 69 parts, 70 parts, 71 parts, 72 parts, 73 parts, 74 parts, 75 parts, 76 parts, 77 parts, 78 parts, 79 parts, 80 parts, 81 parts, 82 parts, 83 parts, 84 parts, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 parts, 91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts, 99 parts and 100 parts of POE resin.
0 to 40 parts of OBC resin, for example, the parts by weight of the OBC resin are 0 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts and 40 parts.
0.05 to 0.2 part of peroxide crosslinking agent, for example, 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, 0.11 part, 0.12 part, 0.13 part, 0.14 part, 0.15 part, 0.16 part, 0.17 part, 0.18 part, 0.19 part and 0.2 part of peroxide crosslinking agent.
1 to 3 parts of a silane coupling agent, for example, 1 part, 1.1 part, 1.2 parts, 1.3 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.7 parts, 1.8 parts, 1.9 parts, 2 parts, 2.1 parts, 2.2 parts, 2.3 parts, 2.4 parts, 2.5 parts, 2.6 parts, 2.7 parts, 2.8 parts, 2.9 parts, 3 parts by weight of the silane coupling agent.
0.1 to 0.5 part of ultraviolet absorbent, for example, 0.1 part, 0.15 part, 0.2 part, 0.25 part, 0.3 part, 0.35 part, 0.4 part, 0.45 part and 0.5 part by weight of ultraviolet absorbent.
0.3 to 0.8 part of light stabilizer, for example, 0.3 part, 0.35 part, 0.4 part, 0.45 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part by weight of light stabilizer.
0.05 to 0.3 part of antioxidant, for example, 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, 0.11 part, 0.12 part, 0.13 part, 0.14 part, 0.15 part, 0.16 part, 0.17 part, 0.18 part, 0.19 part, 0.2 part, 0.21 part, 0.22 part, 0.23 part, 0.24 part, 0.25 part, 0.26 part, 0.27 part, 0.28 part, 0.29 part and 0.3 part of antioxidant.
In the invention, the weather-resistant layer is composed of weather-resistant materials, and the weather-resistant materials comprise the following components in parts by weight:
Figure GDA0002703649640000051
specifically, the weather-resistant material comprises the following components in parts by weight:
20-40 parts of modified polyethylene, for example, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts and 40 parts of modified polyethylene.
50-70 parts of modified polypropylene, for example, 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts, 56 parts, 57 parts, 58 parts, 59 parts, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, 66 parts, 67 parts, 68 parts, 69 parts and 70 parts of modified polypropylene.
0.2-0.5 part of antioxidant, for example, 0.2 part, 0.25 part, 0.3 part, 0.35 part, 0.4 part, 0.45 part and 0.5 part by weight of antioxidant.
0.3 to 0.8 part of ultraviolet absorbent, for example, 0.3 part, 0.35 part, 0.4 part, 0.45 part, 0.5 part, 0.55 part, 0.6 part, 0.65 part, 0.7 part, 0.75 part and 0.8 part by weight of ultraviolet absorbent.
10-30 parts of titanium dioxide, for example, the weight parts of the titanium dioxide are 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts and 30 parts.
In the invention, the connecting layer also comprises titanium dioxide.
Preferably, the connecting layer comprises the following components in parts by weight:
80-100 parts of TPO particle material
0-20 parts of titanium dioxide.
Specifically, the connecting layer comprises the following components in parts by weight:
80 to 100 parts of TPO particle material, for example, the parts by weight of TPO particle material are 80 parts, 81 parts, 82 parts, 83 parts, 84 parts, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 parts, 91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts, 99 parts and 100 parts.
0 to 20 parts of titanium dioxide, for example, the weight parts of titanium dioxide are 0 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts and 20 parts.
The ultraviolet absorbent is one or a mixture of at least two of a p-benzophenone ultraviolet absorbent, a benzotriazole ultraviolet absorbent, a salicylate ultraviolet absorbent, a substituted acrylonitrile ultraviolet absorbent and a triazine ultraviolet absorbent, for example, the mixture is a mixture of the p-benzophenone ultraviolet absorbent and the benzotriazole ultraviolet absorbent, a mixture of the p-benzophenone ultraviolet absorbent and the salicylate ultraviolet absorbent, a mixture of the p-benzophenone ultraviolet absorbent and the substituted acrylonitrile ultraviolet absorbent, a mixture of the p-benzophenone ultraviolet absorbent and the triazine ultraviolet absorbent, a mixture of the benzotriazole ultraviolet absorbent and the salicylate ultraviolet absorbent, a mixture of the benzotriazole ultraviolet absorbent and the substituted acrylonitrile ultraviolet absorbent, a mixture of the benzotriazole ultraviolet absorbent and the triazine ultraviolet absorbent, the mixture of salicylate ultraviolet absorbent and substituted acrylonitrile ultraviolet absorbent, the mixture of salicylate ultraviolet absorbent and triazine ultraviolet absorbent, and the mixture of substituted acrylonitrile ultraviolet absorbent and triazine ultraviolet absorbent; the mixture can also be a mixture of a p-benzol ultraviolet absorbent, a benzotriazole ultraviolet absorbent and a salicylate ultraviolet absorbent, a mixture of a p-benzol ultraviolet absorbent, a benzotriazole ultraviolet absorbent and a substituted acrylonitrile ultraviolet absorbent, a mixture of a p-benzol ultraviolet absorbent, a benzotriazole ultraviolet absorbent and a triazine ultraviolet absorbent, a mixture of a p-benzol ultraviolet absorbent, a salicylate ultraviolet absorbent and a substituted acrylonitrile ultraviolet absorbent, a mixture of a p-benzol ultraviolet absorbent, a salicylate ultraviolet absorbent and a triazine ultraviolet absorbent, a mixture of a p-benzol ultraviolet absorbent, a substituted acrylonitrile ultraviolet absorbent and a triazine ultraviolet absorbent, a mixture of a benzotriazole ultraviolet absorbent, a salicylate ultraviolet absorbent and a substituted acrylonitrile ultraviolet absorbent, the ultraviolet absorber comprises a mixture of a benzotriazole ultraviolet absorber, a salicylate ultraviolet absorber and a triazine ultraviolet absorber, a mixture of a benzotriazole ultraviolet absorber, a substituted acrylonitrile ultraviolet absorber and a triazine ultraviolet absorber, and a mixture of a salicylate ultraviolet absorber, a substituted acrylonitrile ultraviolet absorber and a triazine ultraviolet absorber; the mixture can also be a mixture of a p-benzophenone ultraviolet absorbent, a benzotriazole ultraviolet absorbent, a salicylate ultraviolet absorbent and a substituted acrylonitrile ultraviolet absorbent, a mixture of a p-benzophenone ultraviolet absorbent, a benzotriazole ultraviolet absorbent, a salicylate ultraviolet absorbent and a triazine ultraviolet absorbent, and a mixture of a benzotriazole ultraviolet absorbent, a salicylate ultraviolet absorbent, a substituted acrylonitrile ultraviolet absorbent and a triazine ultraviolet absorbent; the mixture can also be a mixture of a p-benzophenone ultraviolet absorbent, a benzotriazole ultraviolet absorbent, a salicylate ultraviolet absorbent, a substituted acrylonitrile ultraviolet absorbent and a triazine ultraviolet absorbent.
The antioxidant is one or a mixture of at least two of phenolic antioxidant, phosphite antioxidant and hindered amine antioxidant. For example, the mixture may be a mixture of a phenolic antioxidant and a phosphite antioxidant, a mixture of a phenolic antioxidant and a hindered amine antioxidant, a mixture of a phosphite antioxidant and a hindered amine antioxidant, or a mixture of a phenolic antioxidant, a phosphite antioxidant and a hindered amine antioxidant.
The light stabilizer is one or a mixture of at least two of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate, polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidylethanol) ester, and poly- { [6- [ (1,1,3, 3-tetramethylbutyl) -imino ] -1,3, 5-triazine-2, 4-diyl ] [2- (2,2,6, 6-tetramethylpiperidyl) -nitrogen ] -hexamethylene- [4- (2,2,6, 6-tetramethylpiperidyl) -amino ] }.
The modified polyethylene is one or a mixture of at least two of high-density polyethylene, low-density polyethylene, linear low-density polyethylene and ultrahigh molecular weight polyethylene, for example, the mixture is a mixture of high-density polyethylene and low-density polyethylene, a mixture of high-density polyethylene and linear low-density polyethylene, a mixture of high-density polyethylene and ultrahigh molecular weight polyethylene, a mixture of low-density polyethylene and linear low-density polyethylene, a mixture of low-density polyethylene and ultrahigh molecular weight polyethylene, and a mixture of linear low-density polyethylene and ultrahigh molecular weight polyethylene; the mixture can also be a mixture of high density polyethylene, low density polyethylene and linear low density polyethylene, a mixture of high density polyethylene, low density polyethylene and ultrahigh molecular weight polyethylene, and a mixture of low density polyethylene, linear low density polyethylene and ultrahigh molecular weight polyethylene; the mixture may also be a mixture of high density polyethylene, low density polyethylene, linear low density polyethylene and ultra high molecular weight polyethylene.
The modified polypropylene is one or a mixture of at least two of homo-polypropylene, co-polypropylene and random polypropylene, such as a mixture of homo-polypropylene and co-polypropylene, a mixture of homo-polypropylene and random polypropylene, and a mixture of co-polypropylene and random polypropylene; the mixture may also be a mixture of homo-polypropylene, co-polypropylene and random polypropylene. The homopolymerization polypropylene provides rigidity, hardness and heat resistance of the material, meanwhile, the weather-resistant layer is prevented from generating cloth marks in the laminating process, the copolymerization polypropylene and the random polypropylene are matched to provide toughness required by the material, and the three materials can ensure excellent water vapor barrier property.
The modified polyolefin is one or a mixture of two of modified polypropylene and modified polyethylene.
The thickness of the weather-resistant layer is 20-80 μm, for example, the thickness of the weather-resistant layer is 20 μm, 25 μm, 30 μm, 35 μm, 40 μm, 45 μm, 50 μm, 55 μm, 60 μm, 65 μm, 70 μm, 75 μm, 80 μm.
Preferably, the thickness of the skeleton layer is 150-400 μm, for example, the thickness of the skeleton layer is 150 μm, 160 μm, 170 μm, 180 μm, 190 μm, 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm.
Preferably, the thickness of the connection layer is 200 to 600 μm, for example, the thickness of the connection layer is 200 μm, 210 μm, 220 μm, 230 μm, 240 μm, 250 μm, 260 μm, 270 μm, 280 μm, 290 μm, 300 μm, 310 μm, 320 μm, 330 μm, 340 μm, 350 μm, 360 μm, 370 μm, 380 μm, 390 μm, 400 μm, 500 μm, 510 μm, 520 μm, 530 μm, 540 μm, 550 μm, 560 μm, 570 μm, 580 μm, 590 μm, 600 μm.
The invention also aims to provide a preparation method of the packaging integrated back plate, which adopts a three-layer co-extrusion or film coating process, is formed in one step, does not use glue so that organic solvent pollution does not exist, does not need a coating and drying process, and has relatively low processing cost, and the preparation method comprises the following steps: placing the weather-resistant material, the modified polyolefin material and the TPO particle material into an extruder, heating and melting, and co-extruding the three layers to obtain a packaging integrated backboard with a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from top to bottom; or
The preparation method comprises the following steps: placing the weather-resistant material and the modified polyolefin material into an extruder, heating and melting, and extruding to form a film; and simultaneously, putting the TPO particle material into an extruder, heating and melting, laminating on the extruded framework layer, and then cooling and shaping to obtain the packaging integrated backboard.
Wherein, during extrusion, the temperature of the weather-resistant material and the modified polyolefin material is 180-240 ℃, for example, the temperature of the weather-resistant material and the modified polyolefin material is 180 ℃, 190 ℃, 200 ℃, 210 ℃, 220 ℃, 230 ℃ and 240 ℃; the temperature of the TPO particle material is 120 to 180 ℃, for example, the temperature of the TPO particle material is 120 ℃, 130 ℃, 140 ℃, 150 ℃, 160 ℃, 170 ℃ and 180 ℃.
Preferably, the three-layer co-extrusion process further comprises a step of rapidly cooling the connecting layer. Because the connecting layer has lower melting temperature relative to the framework layer and the weather-resistant layer, the connecting layer needs to be in contact with the surface of the steel roller for rapid cooling, so that the roller sticking is prevented. And (3) after the product is discharged from the die head, shaping the product by two rubber rollers, and rapidly cooling the product by a steel roller, wherein the temperature of the rubber rollers is 10-15 ℃, and the temperature of the steel roller is 5-10 ℃.
Compared with the prior art, the invention has the beneficial effects that:
(1) according to the packaging integrated backboard, the middle layer framework layer adopts the modified polyolefin material to replace PET, the material has excellent water resistance, and the water vapor transmission rate of the 230-micron PET film is generally 2.2g/m2Day or more and a water vapor transmission rate of 0.9g/m in a 230 μm thick polyolefin film2Within day, the hydrolysis resistance is better than that of PET material; the innermost connecting layer adopts TPO particle material to replace EVA, so that acidic substances generated by photo-thermal aging cannot corrode the cell product; the package of the invention is integratedThe back plate and the solar cell piece have excellent bonding force, and the bonding force is more than 60N/cm; the effective insulation thickness of the 1000v system voltage assembly DTI test packaging integrated back plate is more than 150 μm, and the effective insulation thickness of the 1500v system voltage assembly DTI test packaging integrated back plate is more than 300 μm, so that the requirements of the IEC61730-1 second part are met; the packaging integrated backboard has good weather resistance and no yellowing after long-term use.
(2) The preparation method of the packaging integrated back plate adopts a three-layer co-extrusion or film coating process, is formed at one time, does not use glue, does not have organic solvent pollution, does not need a coating and drying process, and has relatively low processing cost.
Detailed Description
The technical solution of the present invention is further explained by the following embodiments.
Unless otherwise specified, various starting materials of the present invention are commercially available or prepared according to conventional methods in the art.
The preparation method of the packaging integrated backboard comprises the following steps: placing the weather-resistant material, the modified polyolefin material and the TPO particle material into an extruder, heating and melting, and co-extruding the three layers to obtain the packaging integrated backboard with the weather-resistant layer, the framework layer and the connecting layer which are sequentially arranged from top to bottom; or
The preparation method comprises the following steps: placing the weather-resistant material and the modified polyolefin material into an extruder, heating and melting, and extruding to form a film; and simultaneously, putting the TPO particle material into an extruder, heating and melting, laminating on the extruded framework layer, and then cooling and shaping to obtain the packaging integrated backboard.
Example 1
The packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 95 parts of TPO particle material, 5 parts of titanium dioxide, and the thickness of the TPO particle material is 350 mu m;
the framework layer comprises the following components in parts by weight: 90 parts of modified polypropylene, 10 parts of toughening agent, 0.1 part of p-benzophenones ultraviolet absorbent and 0.5 part of phosphite ester antioxidant, wherein the thickness is 150 mu m;
the weather-resistant layer comprises the following components in parts by weight: 50 parts of homopolymerized polypropylene, 40 parts of linear low-density polyethylene, 15 parts of titanium dioxide, 0.5 part of substituted acrylonitrile ultraviolet absorbent, 0.2 part of phosphite ester antioxidant and 50 mu m in thickness;
wherein, the TPO particle material comprises the following components:
Figure GDA0002703649640000111
Figure GDA0002703649640000121
wherein the ultraviolet absorbent is a mixture of 0.3 part of p-benzophenones ultraviolet absorbent, 0.1 part of benzotriazole ultraviolet absorbent and 0.1 part of salicylic acid esters ultraviolet absorbent; the light stabilizer is poly (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) succinate.
In the embodiment, a sample is prepared for a 1000V backboard standard, titanium dioxide is added to a connecting layer to improve the reflectivity of a product, and the performance of the backboard prepared in the embodiment is tested, wherein the bonding force test method is performed according to an ASTM D903 standard, and the effective insulation thickness of the DTI test backboard is performed according to an IEC61730-1 standard.
The bonding strength between the integrated packaging backboard and the battery piece prepared in the embodiment is greater than 50N/cm, and the bonding strength between the integrated packaging backboard and the upper EVA of the battery piece (wherein, the basic structure of the conventional solar battery module is glass, upper EVA, battery piece, lower EVA and backboard in sequence from top to bottom, and the lower EVA and the backboard are extruded and molded at one time during extrusion to form a whole, the lower EVA and the backboard are replaced by the integrated backboard with the weather-resistant layer, the framework layer and the connecting layer, and the bonding strength mentioned here refers to the bonding strength between the integrated backboard and the upper EVA of the module), which is greater than 100N/cm, the effective insulation thickness of the integrated packaging backboard tested and tested by DTI is greater than 150 μm, and the water vapor permeability is 1.3g/m2Day, no obvious streaks and craters after lamination.
Example 2
The packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 100 parts of TPO particle material with the thickness of 350 mu m;
the framework layer comprises the following components in parts by weight: 70 parts of modified polypropylene, 30 parts of toughening agent, 0.1 part of salicylate ultraviolet absorbent and 0.5 part of phosphite antioxidant, wherein the thickness is 150 mu m;
the weather-resistant layer comprises the following components in parts by weight: 50 parts of modified polypropylene, 30 parts of modified polyethylene, 20 parts of titanium dioxide, 0.6 part of triazine ultraviolet absorbent and 0.2 part of phosphite antioxidant, wherein the thickness is 50 mu m;
wherein, the TPO particle material comprises the following components:
Figure GDA0002703649640000131
wherein the light stabilizer is bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate.
In the embodiment, a sample is prepared according to a 1000V backboard standard, titanium dioxide is not added, the performance of the backboard prepared in the embodiment is tested, the bonding force between the backboard and a battery piece is more than 60N/cm, the bonding force between the backboard and EVA on the upper layer of the battery piece is more than 120N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is more than 150 mu m, and the water vapor transmittance is 1.1g/m2Day, no obvious streaks and craters after lamination.
Example 3
The packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 85 parts of TPO particle material, 15 parts of titanium dioxide, and the thickness of the TPO particle material is 350 mu m;
the framework layer comprises the following components in parts by weight: 70 parts of modified polypropylene, 30 parts of toughening agent, 0.3 part of benzotriazole ultraviolet absorbent and 0.5 part of phenolic antioxidant, wherein the thickness is 300 mu m;
the weather-resistant layer comprises the following components in parts by weight: 50 parts of modified polypropylene, 20 parts of linear low-density polyethylene, 30 parts of titanium dioxide, 0.3 part of p-benzophenones ultraviolet absorbent, 0.2 part of phenol antioxidant and 0.2 part of phosphite antioxidant, wherein the thickness is 50 mu m;
wherein, the TPO particle material comprises the following components:
Figure GDA0002703649640000141
wherein the antioxidant is a mixture of 0.1 part of phenolic antioxidant, 0.1 part of phosphite antioxidant and 0.1 part of hindered amine antioxidant; the light stabilizer is a mixture of 0.3 part of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate and 0.5 part of polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol).
The embodiment is that a sample is prepared for 1500V backboard standard, titanium dioxide is added into a connecting layer to improve the reflectivity of a product, the performance of the backboard prepared in the embodiment is tested, the bonding force of the backboard and a battery piece is more than 50N/cm, the bonding force of the backboard and EVA on the upper layer of the battery piece is more than 100N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is more than 300 mu m, and the water vapor transmittance is 0.8g/m2Day, no obvious streaks and craters after lamination.
Example 4
The packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 100 parts of TPO particle material with the thickness of 350 mu m;
the framework layer comprises the following components in parts by weight: 80 parts of modified polypropylene, 20 parts of toughening agent, 0.2 part of salicylate ultraviolet absorbent and 0.4 part of hindered amine antioxidant, wherein the thickness is 300 mu m;
the weather-resistant layer comprises the following components in parts by weight: 50 parts of atactic polypropylene, 40 parts of low-density polyethylene, 20 parts of titanium dioxide, 0.3 part of substituted acrylonitrile ultraviolet absorbent, 0.5 part of phosphite ester antioxidant and 50 mu m in thickness;
wherein, the TPO particle material comprises the following components:
Figure GDA0002703649640000151
wherein the light stabilizer is poly- { [6- [ (1,1,3, 3-tetramethylbutyl) -imino ] -1,3, 5-triazine-2, 4-diyl ] [2- (2,2,6, 6-tetramethylpiperidyl) -nitryl ] -hexylidene- [4- (2,2,6, 6-tetramethylpiperidyl) -amino ] }.
In the embodiment, a sample is prepared according to a 1500V backboard standard, titanium dioxide is not added, the performance of the backboard prepared in the embodiment is tested, the bonding force between the backboard and a battery piece is more than 60N/cm, the bonding force between the backboard and EVA on the upper layer of the battery piece is more than 120N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is more than 300 mu m, and the water vapor transmittance is 0.6g/m2Day, no obvious streaks and craters after lamination.
Comparative example 1
The packaging integrated backboard of the comparative example comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 100 parts of EVA particles with the thickness of 350 mu m;
the framework layer comprises the following components in parts by weight: 70 parts of modified polypropylene, 30 parts of toughening agent, 0.1 part of salicylate ultraviolet absorbent and 0.5 part of phosphite antioxidant, wherein the thickness is 150 mu m;
the weather-resistant layer comprises the following components in parts by weight: 60 parts of modified polypropylene, 40 parts of modified polyethylene, 0.6 part of triazine ultraviolet absorbent and 0.2 part of phosphite antioxidant, wherein the thickness is 50 mu m;
the comparative example is a 1000V backboard standard prepared sample, titanium dioxide is not added, the performance of the backboard prepared by the comparative example is tested, the bonding force of the backboard and the battery piece is more than 60N/cm, the bonding force of the backboard and the upper EVA of the battery piece is more than 120N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is more than 150 mu m, the water vapor transmittance is 1.3g/m2Day, the water-blocking performance is slightly reduced, and no obvious cloth marks and pits are formed after lamination; yellowing resistance of the backsheet prepared in this comparative example and the weatherable layer of the integrated backsheet prepared in example 2The properties were tested as shown in table 1. When the delta b is less than 3 and the delta Y is less than 5, no obvious yellowing phenomenon exists, and as can be seen from the table 1, the delta b of the weather-resistant layer of the integrated back plate is less than 2.5, the delta Y is less than 4.5, no obvious yellowing phenomenon exists, and the back plate of the comparative example 1 has poor ageing resistance of EVA, and the sample has obvious yellowing phenomenon after UV accelerated ageing for 300 kwh.
TABLE 1
Figure GDA0002703649640000161
Comparative example 2
The packaging integrated backboard of the comparative example comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 100 parts of TPO particle material with the thickness of 350 mu m;
the framework layer comprises the following components in parts by weight: 60 parts of modified polypropylene, 20 parts of PET resin, 20 parts of toughening agent, 0.3 part of ultraviolet absorbent, 0.2 part of antioxidant and 150 mu m in thickness;
the weather-resistant layer comprises the following components in parts by weight: 25 parts of modified polypropylene, 55 parts of modified polyethylene, 20 parts of titanium dioxide, 0.3 part of ultraviolet absorbent, 0.4 part of antioxidant and 50 mu m in thickness;
the comparative example is a 1000V backboard standard preparation sample, the performance of the backboard prepared by the comparative example is tested, the bonding force of the backboard and the battery piece is more than 60N/cm, the bonding force of the backboard and the upper EVA of the battery piece is more than 120N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is more than 150 mu m, and the water vapor transmittance is 2g/m2Day, the water blocking ability is significantly reduced, with no significant cloth marks and pits after lamination.
Comparative example 3
The packaging integrated backboard of the comparative example comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 100 parts of TPO particle material with the thickness of 350 mu m;
the framework layer comprises the following components in parts by weight: 40 parts of copolymerized polypropylene, 30 parts of atactic polypropylene, 30 parts of modified polyethylene, 0.1 part of ultraviolet absorbent and 0.5 part of antioxidant, wherein the thickness is 300 mu m;
the weather-resistant layer comprises the following components in parts by weight: 30 parts of polypropylene, 70 parts of polyethylene, 0.6 part of ultraviolet absorbent, 0.3 part of antioxidant and 50 mu m in thickness;
the comparative example is a 1500V backboard standard preparation sample, the performance of the backboard prepared by the comparative example is tested, the bonding force of the backboard and the battery piece is more than 60N/cm, the bonding force of the backboard and the upper EVA of the battery piece is more than 120N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is less than 300 mu m, the use requirement of the assembly cannot be met, and the water vapor transmittance is 0.6g/m2Day, slight drape after lamination.
Comparative example 4
The packaging integrated backboard of the comparative example comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from outside to inside, wherein each layer comprises the following components:
the connecting layer comprises the following components in parts by weight: 100 parts of TPO particle material with the thickness of 350 mu m;
the framework layer comprises the following components in parts by weight: 90 parts of modified polypropylene, 10 parts of modified polyethylene, 0.1 part of ultraviolet absorbent, 0.2 part of antioxidant and 300 mu m in thickness;
the weather-resistant layer comprises the following components in parts by weight: 70 parts of modified polyethylene, 30 parts of titanium dioxide, 0.4 part of ultraviolet absorbent, 0.25 part of antioxidant and 50 mu m in thickness;
the comparative example is a 1500V backboard standard preparation sample, the performance of the backboard prepared by the comparative example is tested, the bonding force of the backboard and the battery piece is more than 60N/cm, the bonding force of the backboard and the upper EVA of the battery piece is more than 120N/cm, the effective insulation thickness of the DTI test packaging integrated backboard is more than 300 mu m, and the water vapor transmittance is 0.65g/m2Day, the weatherable layer after lamination showed significant deformation and significant stringing, with an unacceptable appearance.
Comparative example 5
Patent CN 204271104U is common coating type backplate, and patent CN 103038060A is common coating type integration backplate, and the two all need use glue, unable one shot forming, and the processing cost is heightened, all uses fluororesin to be weather resistant layer simultaneously, can't retrieve.
The present invention is illustrated by the above-mentioned examples, but the present invention is not limited to the above-mentioned detailed process equipment and process flow, i.e. it is not meant to imply that the present invention must rely on the above-mentioned detailed process equipment and process flow to be practiced. It should be understood by those skilled in the art that any modification of the present invention, equivalent substitutions of the raw materials of the product of the present invention, addition of auxiliary components, selection of specific modes, etc., are within the scope and disclosure of the present invention.

Claims (17)

1. A packaging integrated backboard comprises a weather-resistant layer, a framework layer and a connecting layer which are sequentially arranged from top to bottom, and is characterized in that the weather-resistant layer is a weather-resistant material layer, the framework layer is a modified polyolefin material layer, and the connecting layer is a TPO particle material layer;
the TPO particle material layer consists of TPO particle materials, and the TPO particle materials comprise the following components in parts by weight:
Figure FDA0002703649630000011
2. the package-integrated back sheet of claim 1, wherein the modified polyolefin material layer is composed of a modified polyolefin material comprising the following components in parts by weight:
Figure FDA0002703649630000012
3. the package-integrated backsheet according to claim 1, wherein the weatherable layer is composed of weatherable materials comprising, in parts by weight:
Figure FDA0002703649630000013
Figure FDA0002703649630000021
4. the package integrated back sheet of claim 3, wherein the connection layer further comprises titanium dioxide.
5. The package integrated back plate of claim 4, wherein the connection layer comprises the following components in parts by weight:
80-100 parts of TPO particle material
0-20 parts of titanium dioxide.
6. The package-integrated back sheet according to claim 1 or 3, wherein the UV absorber is one or a mixture of at least two of a p-benzophenone UV absorber, a benzotriazole UV absorber, a salicylate UV absorber, a substituted acrylonitrile UV absorber, and a triazine UV absorber.
7. The package-integrated back sheet according to claim 1 or 3, wherein the antioxidant is one or a mixture of at least two of phenolic antioxidant, phosphite antioxidant and hindered amine antioxidant.
8. The package-in-place backsheet according to claim 1 or 3, wherein the light stabilizer is one or a mixture of at least two of bis (2,2,6, 6-tetramethyl-4-piperidyl) sebacate, polysuccinic acid (4-hydroxy-2, 2,6, 6-tetramethyl-1-piperidineethanol) ester, poly- { [6- [ (1,1,3, 3-tetramethylbutyl) -imino ] -1,3, 5-triazine-2, 4-diyl ] [2- (2,2,6, 6-tetramethylpiperidyl) -azenyl ] -hexylidene- [4- (2,2,6, 6-tetramethylpiperidyl) -amino ] }.
9. The package-integrated back sheet of claim 3, wherein the modified polyethylene is one or a mixture of at least two of high density polyethylene, low density polyethylene, linear low density polyethylene and ultra-high molecular weight polyethylene.
10. The package-integrated back sheet of claim 3, wherein the modified polypropylene is one or a mixture of at least two of homo-polypropylene, co-polypropylene and random polypropylene.
11. The package integrated back sheet of claim 2, wherein the modified polyolefin is one or a mixture of two of modified polypropylene and modified polyethylene.
12. The package-integrated back sheet according to claim 1, wherein the weather-resistant layer has a thickness of 20 to 80 μm.
13. The package-integrated back plate according to claim 1, wherein the skeleton layer has a thickness of 150-400 μm.
14. The package integrated back plate according to claim 1, wherein the thickness of the connection layer is 200 to 600 μm.
15. The method for preparing a package integrated back sheet according to any one of claims 1 to 14, wherein the method comprises the following steps: placing the weather-resistant material, the modified polyolefin material and the TPO particle material into an extruder, heating and melting, and co-extruding the three layers to obtain the packaging integrated backboard with the weather-resistant layer, the framework layer and the connecting layer which are sequentially arranged from top to bottom; or
The preparation method comprises the following steps: placing the weather-resistant material and the modified polyolefin material into an extruder, heating and melting, and extruding to form a film; and simultaneously, putting the TPO particle material into an extruder, heating and melting, laminating on the extruded framework layer, and then cooling and shaping to obtain the packaging integrated backboard.
16. The method according to claim 15, wherein the temperature of the weather-resistant material and the modified polyolefin material is 180 to 240 ℃ and the temperature of the TPO particle material is 120 to 180 ℃ during the extrusion.
17. The method of claim 15, wherein the three-layer co-extrusion further comprises a step of rapidly cooling the tie layer.
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CN110861376A (en) * 2019-12-02 2020-03-06 上海紫江彩印包装有限公司 Polyolefin film for transparent back plate film and preparation method thereof
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CN115820146A (en) * 2021-12-31 2023-03-21 浙江中聚材料有限公司 High-barrier photovoltaic back plate and preparation method and application thereof

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