CN109471010A - The RTA reliability test assembly being powered based on high temperature - Google Patents
The RTA reliability test assembly being powered based on high temperature Download PDFInfo
- Publication number
- CN109471010A CN109471010A CN201811381326.8A CN201811381326A CN109471010A CN 109471010 A CN109471010 A CN 109471010A CN 201811381326 A CN201811381326 A CN 201811381326A CN 109471010 A CN109471010 A CN 109471010A
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- CN
- China
- Prior art keywords
- switching device
- tube socket
- circuit board
- reliability test
- high temperature
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention discloses a kind of RTA reliability test assemblies being powered based on high temperature, described device includes circuit board, several TO tube sockets being packaged on circuit board and switching device and the power supply being connected with circuit board, the power supply is for providing the voltage and or current of reliability test, the TO tube socket is connected in parallel on power supply, switching device is connected between TO tube socket and power supply, switching device and TO tube socket are arranged in a one-to-one correspondence, and each switching device is used to control the on-off of corresponding TO tube socket.The present invention can be realized the reliability test being powered based on high temperature, the on-off of each TO tube socket be controlled by each switching device, to carry out the reliability test of photodetector.
Description
Technical field
The present invention relates to luminescent semiconductor device the field of test technology, more particularly to a kind of reliability being powered based on high temperature
Test device.
Background technique
Photoelectric device influences follow-up system measurement and application since the presence of noise can be such that its output signal is distorted.However
Since it lasts a long time high stability, the Long-term evolution regularity of its noise can not be obtained in a short time, or used ring
Border limitation can not remove measurement noise, this just needs to use accelerated aging tests and goes using laboratory environment come artificial analog photoelectricity device
Part long-time use process or extreme external environment, to obtain the situation of change of noise.
It is unable to monitor the yield of TO tube socket in traditional test process, can only be tested one by one, be obtained after test
To test result be right censorship value, can not accurately capture the out-of-service time of TO, will cause the error of reliability test result.
It is tested in addition, pulling up photodetector to another piece of circuit board, is easy to cause electrostatic damage to device during plug
(ESD) and other physical damnifications.
Therefore, in view of the above technical problems, it is necessary to which a kind of RTA reliability test assembly being powered based on high temperature is provided.
Summary of the invention
In view of this, the purpose of the present invention is to provide a kind of RTA reliability test assemblies being powered based on high temperature.
To achieve the goals above, the technical solution that one embodiment of the invention provides is as follows:
A kind of RTA reliability test assembly being powered based on high temperature, described device are included circuit board, are packaged on circuit board
Several TO tube sockets and switching device and the power supply being connected with circuit board, the power supply is for providing the voltage of reliability test
And/or electric current, the TO tube socket are connected in parallel on power supply, switching device is connected between TO tube socket and power supply, switching device
It is arranged in a one-to-one correspondence with TO tube socket, each switching device is used to control the on-off of corresponding TO tube socket.
As a further improvement of the present invention, the TO tube socket and switching device are packaged on the same circuit board, TO pipe
Seat and switching device are electrically connected by the line layer on circuit board.
As a further improvement of the present invention, the TO tube socket is packaged on first circuit board, and switching device is packaged in
On two circuit boards, TO tube socket and switching device are electrically connected by the line layer on first circuit board and second circuit board.
As a further improvement of the present invention, the TO tube socket includes the first pin, the Yi Jiyu being connected with positive pole
The second connected pin of power cathode.
As a further improvement of the present invention, the TO tube socket is the four foot sockets based on TO-46 standard.
As a further improvement of the present invention, the switching device be connected to the first pin of TO tube socket, the second pin and
Between positive pole, cathode.
As a further improvement of the present invention, the switching device is six foot self-lock switch.
As a further improvement of the present invention, the circuit board, TO tube socket and switching device are prepared using heat-resisting material
It obtains.
The beneficial effects of the present invention are:
The present invention can be realized the reliability test being powered based on high temperature, control each TO tube socket by each switching device
On-off, to carry out the reliability test of photodetector；
Short time power process will not damage photodetector, will not generate error to reliability test, mention
High test accuracy；
Without carrying out the plug of photodetector, the electrostatic damage and other physical damnifications of photodetector are avoided.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in invention, for those of ordinary skill in the art, without creative efforts,
It is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of RTA reliability test assembly in the embodiment of the present invention 1；
Fig. 2 a, 2b, 2c are respectively facing structure, side view structure and the principle signal of switching device in the embodiment of the present invention 1
Figure；
Fig. 3 is the structural schematic diagram of RTA reliability test assembly in the embodiment of the present invention 2.
Specific embodiment
Technical solution in order to enable those skilled in the art to better understand the present invention, below in conjunction with of the invention real
The attached drawing in example is applied, technical scheme in the embodiment of the invention is clearly and completely described, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work, all should belong to protection of the present invention
Range.
The invention discloses a kind of RTA reliability test assemblies being powered based on high temperature, including circuit board, are packaged in circuit board
On several TO tube sockets and switching device and the power supply being connected with circuit board, power supply is for providing the voltage of reliability test
And/or electric current, TO tube socket are connected in parallel on power supply, switching device is connected between TO tube socket and power supply, switching device and TO
Tube socket is arranged in a one-to-one correspondence, and each switching device is used to control the on-off of corresponding TO tube socket.
It elaborates below in conjunction with specific embodiment to the present invention.
Embodiment 1:
Join Fig. 1 shown in, in the present embodiment based on high temperature be powered RTA reliability test assembly include circuit board, TO tube socket,
Switching device and power supply.
Wherein, circuit board includes the first circuit board 11 and second circuit board 12 being independently arranged, and is sealed on first circuit board 11
Equipped with several TO tube sockets 20, several switching devices 30 are packaged on second circuit board 12, TO tube socket 20 and switching device 30 pass through
12 line layer is electrically connected on first circuit board 11 and second circuit board.
Power supply 40 uses source table, for providing the voltage and or current of reliability test, including anode and cathode.Source table
It is more stable to provide voltage, while conveniently can accurately carry out follow-up test.
TO tube socket 20 is connected in parallel on power supply 40 in the present embodiment, and switching device 30 is connected to TO tube socket 20 and power supply 40
Between, switching device 30 and TO tube socket 20 are arranged in a one-to-one correspondence, and each switching device 30 is for controlling corresponding TO tube socket 20
On-off.
Preferably, TO tube socket 20 is the four foot sockets based on TO-46 standard, and TO tube socket 20 includes being connected with 40 anode of power supply
The first pin and the second pin for being connected with 40 cathode of power supply, other two pin be not shown in Fig. 1 without connection.It opens
Device 30 is closed to be connected between the first pin, the second pin and positive pole, cathode of TO tube socket 20.
It need to be convenient for subsequent test according to the positive and negative anodes pin of the fixed each TO tube socket of certain rule on first circuit board 11
Operation.
In conjunction with shown in Fig. 2 a-2c, the switching device 30 in the present embodiment is six foot self-lock switch, is carried out by switching cutter head
Switching, the pin of left and right two realize selection.Six foot self-lock switch be a kind of button switch, button for the first time on time, switch connects
Lead to and keep, i.e., it is self-locking, button for the second time on time, switch disconnects, and the pop-up of Simultaneous Switching button comes.
First circuit board is placed in baking oven in the present embodiment, and baking oven provides hot conditions, during the test switching device
Fully open, voltage parallel is added on each TO tube socket (being plugged with photodetector), and the reliability for carrying out high temperature energization is surveyed
Examination.
Second circuit board is placed in outside baking oven, control switch device on-off, some can be monitored by only connecting single switch device
The power process of the quality of photodetector, short time will not damage photodetector, will not be to reliability test
Generate error.
Photoelectric device reliability high temperature energizing test needs the hot operation at 150 DEG C/175 DEG C, therefore the resistance to height of component
Warm nature can be just extremely important.First circuit board, second circuit board, TO tube socket and switching device use high temperature resistant material in the present embodiment
Material is prepared, and can be realized resistance to 200 DEG C of high temperature.
Embodiment 2:
Join Fig. 3 shown in, in the present embodiment based on high temperature be powered RTA reliability test assembly include circuit board, TO tube socket,
Switching device and power supply.
Wherein, several TO tube sockets 20 and switching device 30 are packaged on circuit board 10, TO tube socket 20 and switching device 30 are logical
10 line layer is electrically connected on oversampling circuit plate.
Power supply 40 uses source table, for providing the voltage and or current of reliability test, including anode and cathode.Source table
It is more stable to provide voltage, while conveniently can accurately carry out follow-up test.
TO tube socket 20 is connected in parallel on power supply 40 in the present embodiment, and switching device 30 is connected to TO tube socket 20 and power supply 40
Between, switching device 30 and TO tube socket 20 are arranged in a one-to-one correspondence, and each switching device 30 is for controlling corresponding TO tube socket 20
On-off.
Since TO tube socket and switching device are packaged on same circuit board, circuit board is taken out from baking oven after completing test,
It is tested after cooling.First all turn off the switch device, when one TO tube socket (being plugged with photodetector) of every test opens corresponding
Switch carries out the reliability test of photodetector, and the switch is closed after the completion of test.
Circuit board, TO tube socket and switching device are prepared using heat-resisting material in the present embodiment, can be realized resistance to 200
DEG C high temperature.
TO tube socket and switching device in the present embodiment is identical with embodiment 1, is no longer repeated herein.
As can be seen from the above technical solutions, the invention has the following beneficial effects:
The present invention can be realized the reliability test being powered based on high temperature, control each TO tube socket by each switching device
On-off, to carry out the reliability test of photodetector；
Short time power process will not damage photodetector, will not generate error to reliability test, mention
High test accuracy；
Without carrying out the plug of photodetector, the electrostatic damage and other physical damnifications of photodetector are avoided.
It is obvious to a person skilled in the art that invention is not limited to the details of the above exemplary embodiments, Er Qie
In the case where without departing substantially from spirit or essential attributes of the invention, the present invention can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the present invention is by appended power
Benefit requires rather than above description limits, it is intended that all by what is fallen within the meaning and scope of the equivalent elements of the claims
Variation is included within the present invention.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (8)
1. a kind of RTA reliability test assembly being powered based on high temperature, which is characterized in that described device includes circuit board, is packaged in electricity
Several TO tube sockets and switching device on the plate of road and the power supply being connected with circuit board, the power supply is for providing reliability examination
The voltage and or current tested, the TO tube socket are connected in parallel on power supply, and switching device is connected between TO tube socket and power supply,
Switching device and TO tube socket are arranged in a one-to-one correspondence, and each switching device is used to control the on-off of corresponding TO tube socket.
2. it is according to claim 1 based on high temperature be powered RTA reliability test assembly, which is characterized in that the TO tube socket and
Switching device is packaged on the same circuit board, and TO tube socket and switching device are electrically connected by the line layer on circuit board.
3. the RTA reliability test assembly according to claim 1 being powered based on high temperature, which is characterized in that the TO tube socket envelope
Loaded on first circuit board, switching device is packaged on second circuit board, TO tube socket and switching device by first circuit board and
Line layer on second circuit board is electrically connected.
4. the RTA reliability test assembly according to any one of claim 1-3 being powered based on high temperature, which is characterized in that institute
Stating TO tube socket includes the first pin being connected with positive pole and the second pin being connected with power cathode.
5. the RTA reliability test assembly according to claim 4 being powered based on high temperature, which is characterized in that the TO tube socket is
The four foot sockets based on TO-46 standard.
6. the RTA reliability test assembly according to claim 4 being powered based on high temperature, which is characterized in that the switching device
It is connected between the first pin, the second pin and positive pole, cathode of TO tube socket.
7. the RTA reliability test assembly according to claim 6 being powered based on high temperature, which is characterized in that the switching device
For six foot self-lock switch.
8. the RTA reliability test assembly according to claim 1 being powered based on high temperature, which is characterized in that the circuit board,
TO tube socket and switching device are prepared using heat-resisting material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811381326.8A CN109471010A (en) | 2018-11-20 | 2018-11-20 | The RTA reliability test assembly being powered based on high temperature |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811381326.8A CN109471010A (en) | 2018-11-20 | 2018-11-20 | The RTA reliability test assembly being powered based on high temperature |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109471010A true CN109471010A (en) | 2019-03-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811381326.8A Pending CN109471010A (en) | 2018-11-20 | 2018-11-20 | The RTA reliability test assembly being powered based on high temperature |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111880071A (en) * | 2020-08-24 | 2020-11-03 | 武汉博畅通信设备有限责任公司 | Detect detection frock of PIN diode reverse bias current |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466882A (en) * | 1990-07-06 | 1992-03-03 | Advantest Corp | Thermostat apparatus for testing ic |
| CN202649399U (en) * | 2012-06-18 | 2013-01-02 | 常州佳讯光电产业发展有限公司 | Diode voltage aging test stand |
| CN203824949U (en) * | 2014-03-10 | 2014-09-10 | 中国科学院微电子研究所 | TO-3 (transistor outline-3) packaging power semiconductor device thermal resistance testing device |
| CN105203940A (en) * | 2015-09-28 | 2015-12-30 | 中国科学院上海硅酸盐研究所 | System and method for evaluating reliability of thermoelectric element |
| CN205643618U (en) * | 2016-04-25 | 2016-10-12 | 常州银河世纪微电子有限公司 | Many functional test seat |
-
2018
- 2018-11-20 CN CN201811381326.8A patent/CN109471010A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0466882A (en) * | 1990-07-06 | 1992-03-03 | Advantest Corp | Thermostat apparatus for testing ic |
| CN202649399U (en) * | 2012-06-18 | 2013-01-02 | 常州佳讯光电产业发展有限公司 | Diode voltage aging test stand |
| CN203824949U (en) * | 2014-03-10 | 2014-09-10 | 中国科学院微电子研究所 | TO-3 (transistor outline-3) packaging power semiconductor device thermal resistance testing device |
| CN105203940A (en) * | 2015-09-28 | 2015-12-30 | 中国科学院上海硅酸盐研究所 | System and method for evaluating reliability of thermoelectric element |
| CN205643618U (en) * | 2016-04-25 | 2016-10-12 | 常州银河世纪微电子有限公司 | Many functional test seat |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111880071A (en) * | 2020-08-24 | 2020-11-03 | 武汉博畅通信设备有限责任公司 | Detect detection frock of PIN diode reverse bias current |
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Application publication date: 20190315 |
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