CN109467862A - A kind of high frequency resin composition and its application - Google Patents
A kind of high frequency resin composition and its application Download PDFInfo
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- CN109467862A CN109467862A CN201811336281.2A CN201811336281A CN109467862A CN 109467862 A CN109467862 A CN 109467862A CN 201811336281 A CN201811336281 A CN 201811336281A CN 109467862 A CN109467862 A CN 109467862A
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- high frequency
- polybutadiene
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L47/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention provides a kind of high frequency resin composition and its application, the component of composition includes: butadiene styrene resin, unsaturated polybutadiene, bismaleimide and initiator, wherein, bismaleimide is during semi-solid preparation, volatility is small, it is high with the double bond reactivity in polybutadiene and butadiene styrene resin, using prepreg prepared by the present invention, laminate, copper-clad plate and printed circuit board have dielectric loss small, dielectric constant is low, the high excellent performance of bending strength, it can satisfy the signal transmission of high frequency plate, the performance requirement of machining and mechanical support.
Description
Technical field
The present invention relates to high frequency material technical field more particularly to a kind of high frequency resin composition and its applications.
Background technique
In recent years, the communication apparatus such as computer and mobile phone develop to high performance, multifunction and the direction of networking,
In order to guarantee communication apparatus can high-speed transfer and processing large capacity information, operation signal also developing to high frequency direction,
Meanwhile needing a kind of high-performance electric insulating materials suitable for high frequency signal transmission characteristic.
In high-frequency circuit, the loss of electric signal transmission is indicated with the sum of dielectric loss, conductor losses and radiation loss,
The more high then dielectric loss of signal frequency, conductor losses and radiation loss are bigger.Transmission loss will lead to electric signal decaying, break
The reliability of bad electric signal, while the loss is likely to result in electronic failure from high frequency circuit radiation.Therefore must reduce
Dielectric loss, conductor losses and radiation loss.The dielectric loss angle of the insulator of the dielectric loss and formation circuit of electric signal is just
It cuts and the product of used signal frequency is directly proportional, it therefore, can be by selecting medium as the insulator for forming circuit
Loss tangent small insulating materials reduces dielectric loss.
The existing insulator filer content for forming circuit is higher, causes the peel strength of plate low, and bending strength is small, loss
It is high.
Summary of the invention
The present invention provides a kind of high frequency resin composition and its application, is contained with solving the existing insulator filler for forming circuit
Amount is high, causes the peel strength of plate low, bending strength is small, and high problem is lost.
In a first aspect, the present invention provides a kind of high frequency resin composition, comprising:
45-80 parts of butadiene styrene resin,
Unsaturated polybutadiene 10-50 parts,
3-40 parts of bismaleimide,
1-7 parts of initiator；
The bismaleimide has the following structure formula:
Wherein, R1For the fatty group or aromatic series base of m valence, Xa and Xb are from hydrogen atom, halogen atom and fatty group
The identical or different monovalent atom or organic group of selection, m are the integer greater than 1.
In one embodiment of the invention, the number-average molecular weight of the butadiene styrene resin is 1000-11000, and vinyl contains
Amount is 60-99%, styrene-content 30-60%.
In one embodiment of the invention, the number-average molecular weight of the unsaturated polybutadiene is 1000-
50000, contents of ethylene 60-99%.
In one embodiment of the invention, the unsaturated polybutadiene is selected from epoxy-modified polybutadiene tree
Rouge, maleic anhydride modified polybutadiene, acrylic acid modified polybutadiene, hydroxy-end capped polybutadiene, carboxylic
One of modified polybutadiene of the polybutadiene of base sealing end, amine or at least two mixing.
In one embodiment of the invention, the polar group and modified polybutadiene of the unsaturated polybutadiene
The grafting rate of polar group on strand is 5-15%.
In one embodiment of the invention, the 1min half life temperature of the initiator is 50-160 DEG C, is selected from a, a '-
Two (isopropylbenzene between tert-butyl hydroperoxide) benzene, cumyl peroxide, cumyl t-butyl peroxide, bis- (the tertiary hexyl mistakes of 1,1-
Oxidation) -3,3,5- trimethyl-cyclohexane, 2,5- dimethyl -2,5- two (t-butylperoxy) hex- 3- alkynes, octanoic acid ter-butyl ester, mistake
Aoxidize the mixing of one of t-butyl perbenzoate or at least two.
In one embodiment of the invention, the 1min half life temperature of the initiator is 160-300 DEG C, is selected from a,
A '-two (isopropylbenzene between tert-butyl hydroperoxide) benzene, benzoyl peroxide, cumyl peroxide, cumyl t-butyl peroxide,
Bis- (the tert-hexyl peroxide) -3,3,5- trimethyl-cyclohexanes of 1,1-, two (t-butylperoxy) hex- 3- of 2,5- dimethyl -2,5-
One of alkynes, octanoic acid ter-butyl ester, peroxidized t-butyl perbenzoate.
It in one embodiment of the invention, further include crosslinking agent, the crosslinking agent is selected from triallyl isocyanurate, gathers
Triallyl isocyanurate, triallyl cyanurate, diallyl phthalate, divinylbenzene, polyfunctionality propylene
One of acid esters or at least two mixing.
It in one embodiment of the invention, further include fire retardant, it is bis- that the fire retardant is selected from deca-BDE, ethyl-
(tetrabromo phthalimide), decabromodiphenylethane, three (2,6- 3,5-dimethylphenyl) phosphines, 10- (2,5- dihydroxy phenyl)-
9,10- dihydro-9-oxy -10- phosphine phenanthrene -10- oxide, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- phenyl -9,10-
One of dihydro-9-oxy -10- phosphine phenanthrene -10- oxide or at least two mixing.
Application of the above-mentioned high frequency resin composition in prepreg, laminate, copper-clad plate and printed circuit board.
High frequency resin composition provided by the invention, including butadiene styrene resin, unsaturated polybutadiene, bismaleimide
Amine and initiator, wherein for bismaleimide during semi-solid preparation, volatility is small, with polybutadiene and butylbenzene tree
Double bond reactivity on rouge is high, and the high frequency resin composition of preparation has dielectric loss small, and dielectric constant is low, and bending strength is high
Excellent performance, can satisfy high frequency plate signal transmission, machining and mechanical support performance requirement.
Specific embodiment
With embodiment, the invention will be further described below.
The embodiment of the present invention provides a kind of high frequency resin composition, including butadiene styrene resin, and unsaturated polybutadiene is double
Maleimide and initiator.
Bismaleimide has the following structure formula:
Wherein, R1For the fatty group or aromatic series base of m valence, Xa and Xb are from hydrogen atom, halogen atom and fatty group
The identical or different monovalent atom or organic group of selection, m are the integer greater than 1.
The number-average molecular weight of butadiene styrene resin is 1000-11000, contents of ethylene 60-99%, styrene-content 30-
60%.
The number-average molecular weight of unsaturated polybutadiene is 1000-50000, contents of ethylene 60-99%, unsaturation
Polybutadiene is selected from epoxy-modified polybutadiene, maleic anhydride modified polybutadiene, acrylic acid modified poly- fourth
In the modified polybutadiene of diene resin, hydroxy-end capped polybutadiene, the polybutadiene of carboxy blocking, amine
One kind or at least two mixing.
The polar group of unsaturated polybutadiene and the grafting rate of the polar group on modified polybutadiene strand
For 5-15%.
Initiator is selected from the combination of one or both of following two kinds of initiator.
The 1min half life temperature of the initiator of first seed type is 50-160 DEG C, is selected from a, (tert-butyl hydroperoxide of a '-two
Between isopropylbenzene) benzene, cumyl peroxide, cumyl t-butyl peroxide, bis- (the tert-hexyl peroxide) -3,3,5- front threes of 1,1-
Butylcyclohexane, 2,5- dimethyl -2,5- two (t-butylperoxy) hex- 3- alkynes, octanoic acid ter-butyl ester, peroxidized t-butyl perbenzoate
One of or at least two mixing.
The 1min half life temperature of the initiator of second of type is 160-300 DEG C, is selected from a, (t-butyl peroxy of a '-two
Isopropylbenzene between change) benzene, benzoyl peroxide, cumyl peroxide, cumyl t-butyl peroxide, bis- (the tertiary hexyl mistakes of 1,1-
Oxidation) -3,3,5- trimethyl-cyclohexane, 2,5- dimethyl -2,5- two (t-butylperoxy) hex- 3- alkynes, octanoic acid ter-butyl ester, mistake
Aoxidize one of t-butyl perbenzoate.
The embodiment of the invention also includes crosslinking agent, crosslinking agent is selected from triallyl isocyanurate, three allyl of poly- isocyanuric acid
One of ester, triallyl cyanurate, diallyl phthalate, divinylbenzene, polyfunctional acrylic ester or
The mixing of person at least two.
The embodiment of the invention also includes fire retardant, fire retardant is selected from bis- (tetrabromo-benzene two formyls of neighbour of deca-BDE, ethyl-
Imines), decabromodiphenylethane, three (2,6- 3,5-dimethylphenyl) phosphines, 10- (2,5- dihydroxy phenyl) -9,10- dihydro-9-oxy
Change -10- phosphine phenanthrene -10- oxide, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- phenyl -9,10- dihydro-9-oxy -
One of 10- phosphine phenanthrene -10- oxide or at least two mixing.
In addition, the embodiment of the present invention can also include filler, angle value is 0.5-20 μm in the partial size of filler, more preferably
Ground, angle value is 1-15 μm in the partial size of filler, and filler is selected from silica, titanium dioxide, boron nitride, aluminium nitride, silicon carbide, oxygen
Change aluminium, barium titanate, strontium titanates, magnesium titanate, calcium titanate, barium strontium titanate, calcium barium titanate, lead titanates, lead zirconate titanate, zirconium lanthanium titanate
Lead, lanthanium titanate barium, zirconia titanate barium, hafnium oxide, lead magnesio-niobate, barium magnesium niobate, lithium niobate, potassium niobate, tantalic acid aluminium strontium, tantalum niobate
Potassium, strontium barium niobate, lead bariun niobate, titanium niobate barium, bismuth tantalate strontium, bismuth titanates, barium titanate rubidium, copper titanate, lead titanates-lead magnesio-niobate
One of or at least two mixing.
In high frequency resin composition provided in an embodiment of the present invention, different molecular weight, different contents of ethylene and difference
The preparation method of the butadiene styrene resin of styrene-content includes:
4L dry hexamethylene and 0.05-0.48ml tetrahydrofurfuryl alcohol ethylether are put into four mouthfuls of glass that capacity is 4L to react
In bottle (being dried through overbaking), it is passed through drying nitrogen protection, 40-60 DEG C of constant temperature, is then added simultaneously in 60min following
Component: 25-200g styrene (S), the mix monomer of 30~210g butadiene (B), 0.02-0.1mL 0.4mol/L butyl
Then the cyclohexane solution of a chlorine trimethyl silane of 1.0-16.65mL 0.2mol/L is added in lithium, after reacting 30min, be added
Isopropanol terminates reaction and glue sample is precipitated, and filters, and with acetone extraction glue sample 12h, is put into the glue that 25 DEG C of baking ovens are dried in vacuo after extracting
Sample 12h, obtains white solid product, i.e. butadiene styrene resin, and the relevant parameter of butadiene styrene resin is as shown in table 1.
The butadiene styrene resin of 1 different molecular weight of table, different contents of ethylene and different styrene-contents
| Molecular weight | Contents of ethylene | Styrene-content | |
| PBS-1000 | 1000 | 60% | 30% |
| PBS-5000 | 5000 | 85% | 40% |
| PBS-7000 | 7000 | 90% | 50% |
| PBS-11000 | 11000 | 99% | 60% |
| PBS-1000-5 | 1000 | 60% | 5% |
| PBS-1000 | 1000 | 30% | 30% |
The preparation side of the polybutadiene of different molecular weight, different contents of ethylene and different maleic anhydride grafting ratios
Method includes:
By the hexamethylene that 16L is dry, 1600g dry butadiene, which is put into four mouthfuls of glass reaction bottles that capacity is 4L, (to be passed through
Baking is dried) in, it is passed through dry nitrogen protection, 40-80 DEG C of constant temperature, sequentially adds following catalytic component: 4-9ml tri-
The hexane of the hexane solution of [di-(2-ethylhexyl)phosphoric acid] iron (0.4-0.9mmol), 16-36ml triisobutyl aluminium (8mmol)
Solution, the hexane solution of 12-27ml triphenyl phosphate (1.2-2.7mmol), 17-38mmol tetrahydrofurfuryl alcohol ethylether,
PMDETA (pentamethyl-diethylenetriamine) 7-17mmol, is warming up to 65-90 DEG C, polymerization reaction 1-9h.Then ethyl alcohol end is added
Only glue sample is precipitated in reaction, filters, and with acetone extraction glue sample 12-18h, is put into 25 DEG C of baking oven vacuum drying 12h, obtains white solid
Product polybutadiene.
The above-mentioned polybutadiene of 1000g and 300ml dimethylbenzene are put into four mouthfuls of glass reaction bottles that capacity is 4L, constant temperature
65-75 DEG C, after polybutadiene is completely dissolved, be passed through drying nitrogen, be warming up to 85-95 DEG C, be slowly added into system containing
The xylene solution of 165-370g maleic anhydride and 48-110g antifebrin stirs 10-25min after being added dropwise, and will contain
The xylene solution of 24-56g BPO is slowly dropped in four mouthfuls of glass reaction bottles in 30min, and reactant is slowly warming up to
120 DEG C, the reaction was continued at a constant temperature, and 3-5h is depressured distillation after reaction, removes dimethylbenzene and unreacted maleic anhydride,
Product is poured out, dehydrated alcohol precipitating is added, sedimentation a period of time, filters, precipitates 12-18h with acetone extraction, it then will extracting
Precipitating afterwards is put into 25 DEG C of baking oven vacuum drying 12h, obtains white solid product, i.e. MA modified polybutadiene resin (maleic acid
Anhydride modification polybutadiene), the relevant parameter of MA modified polybutadiene resin is as shown in table 2.
The polybutadiene of 2 different molecular weight of table, different contents of ethylene and difference MA grafting rate
| Molecular weight | Contents of ethylene | MA grafting rate | |
| PB-5000(MA) | 5000 | 60% | 5 |
| PB-7000(MA) | 7000 | 85% | 7 |
| PB-50000(MA) | 50000 | 99% | 10 |
| PB-5000-15(MA) | 5000 | 60% | 15 |
The preparation method of high frequency resin composition provided in an embodiment of the present invention includes:
The butadiene styrene resin of above-mentioned preparation, maleic anhydride modified polybutadiene, bismaleimide and initiator is molten
Solution adds filler (separate embodiment), is mixed to get glue at room temperature in dimethylbenzene.It is impregnated using reinforcing material above-mentioned
Then glue toasts 5 minutes in 155 DEG C of baking oven and is cured as B-stage, obtains reinforcing material prepreg.
The prepreg of production is placed between copper foil, is laminated and solidifies in 210 DEG C in press, surveyed after obtaining solidfied material
Measure dielectric properties and bending strength.
Bending strength test is measured according to the DMA method of IPC-TM-650 2.4.24 defined.
Dielectric properties test is tested using SPDR (splite post dielectric resonator) method, is tested
Condition is A state, 10GHz.
The concrete composition of high frequency resin composition provided in an embodiment of the present invention is as shown in table 3.
3 Example formulations of table and test result
The concrete composition for the resin combination that comparative example provides is as shown in table 4.
4 comparative example formula of table and test result
In table 3 and table 4, BPO is benzoyl peroxide, and DCP is cumyl peroxide.
From the comparison of embodiment and comparative example as can be seen that plate prepared by embodiment 1-5, dielectric properties and bending are strong
The comprehensive performance of degree is preferable.
Content in comparative example 1 using bismaleimide is less than 3 parts, compared with Example 1, the bending strength of plate
Small, this is primarily due to plate crosslink density deficiency, causes mechanical strength inadequate, bending strength is caused to reduce.
It is greater than 40 parts, compared with Example 3, the bending strength of plate using the content of bismaleimide in comparative example 2
Small, it is excessive that this is primarily due to crosslink density, and plate brittleness is caused to increase, and bending strength reduces.
Content in comparative example 3 using butadiene styrene resin is less than 45 parts, and compared with Example 1, the bending strength of plate is small, this
It is primarily due to the reduction of panel stiffness group, causes mechanical strength inadequate, bending strength is caused to reduce.
It is greater than 8 parts using the content of butadiene styrene resin in comparative example 4, compared with Example 3, the bending strength of plate is small, this
It is excessive to be primarily due to rigid radical, plate brittleness is caused to increase, bending strength reduces.
Comparative example 5 is using the content of polybutadiene less than 10 parts, and compared with Example 1, the bending strength of plate is small,
This is primarily due to plate crosslink density deficiency, causes mechanical strength inadequate, bending strength is caused to reduce.
Comparative example 6 is greater than 50 parts using the content of polybutadiene, and compared with Example 3, the bending strength of plate is small,
It is excessive that this is primarily due to crosslink density, and plate brittleness is caused to increase, and bending strength reduces.
Comparative example 7 does not use bismaleimide, and compared with Example 4, the bending strength of plate is small, this is primarily due to
This is primarily due to plate crosslink density deficiency, causes mechanical strength inadequate, bending strength is caused to reduce.
In summary result is it is found that high frequency resin composition provided in an embodiment of the present invention, has bending strength height, dielectric
Excellent performance small, that dielectric constant is low is lost, can satisfy the performance requirement of high frequency plate.
The restriction of the specific embodiment of invention described above and not pairs of enough the scope of the present invention.
Claims (10)
1. a kind of high frequency resin composition characterized by comprising
45-80 parts of butadiene styrene resin,
Unsaturated polybutadiene 10-50 parts,
3-40 parts of bismaleimide,
1-7 parts of initiator；
The bismaleimide has the following structure formula:
Wherein, R1For the fatty group or aromatic series base of m valence, Xa and Xb are selected from hydrogen atom, halogen atom and fatty group
Identical or different monovalent atom or organic group, m are the integer greater than 1.
2. high frequency resin composition according to claim 1, which is characterized in that the number-average molecular weight of the butadiene styrene resin is
1000-11000, contents of ethylene 60-99%, styrene-content 30-60%.
3. high frequency resin composition according to claim 1, which is characterized in that the number of the unsaturation polybutadiene
Average molecular weight is 1000-50000, contents of ethylene 60-99%.
4. high frequency resin composition according to claim 3, which is characterized in that the unsaturation polybutadiene is selected from
It is epoxy-modified polybutadiene, maleic anhydride modified polybutadiene, acrylic acid modified polybutadiene, hydroxy-end capped
Polybutadiene, one of the modified polybutadiene of the polybutadiene of carboxy blocking, amine or at least two
Mixing.
5. high frequency resin composition according to claim 4, which is characterized in that the pole of the unsaturation polybutadiene
Property group and the polar group on modified polybutadiene strand grafting rate be 5-15%.
6. high frequency resin composition according to claim 1, which is characterized in that the 1min half life temperature of the initiator
It is 50-160 DEG C, is selected from a, a '-two (isopropylbenzene between tert-butyl hydroperoxide) benzene, cumyl peroxide, tert-butyl hydroperoxide are different
Bis- (the tert-hexyl peroxide) -3,3,5- trimethyl-cyclohexanes of propyl benzene, 1,1-, 2,5- dimethyl -2,5- two (t-butylperoxy)
One of hex- 3- alkynes, octanoic acid ter-butyl ester, peroxidized t-butyl perbenzoate or at least two mixing.
7. high frequency resin composition according to claim 1, which is characterized in that the 1min half life temperature of the initiator
It is 160-300 DEG C, is selected from a, a '-two (isopropylbenzene between tert-butyl hydroperoxide) benzene, benzoyl peroxide, cumyl peroxide, uncle
Bis- (the tert-hexyl peroxide) -3,3,5- trimethyl-cyclohexanes of butyl peroxy isopropylbenzene, 1,1-, two (uncle of 2,5- dimethyl -2,5-
Butyl peroxy) hex- 3- alkynes, octanoic acid ter-butyl ester, one of peroxidized t-butyl perbenzoate.
8. high frequency resin composition according to claim 1, which is characterized in that it further include crosslinking agent, the crosslinking agent choosing
From triallyl isocyanurate, poly- triallyl isocyanurate, triallyl cyanurate, diallyl phthalate, two
One of vinyl benzene, polyfunctional acrylic ester or at least two mixing.
9. high frequency resin composition according to claim 1, which is characterized in that it further include fire retardant, the fire retardant choosing
From deca-BDE, ethyl-bis- (tetrabromo phthalimides), decabromodiphenylethane, three (2,6- 3,5-dimethylphenyl) phosphines,
10- (2,5- dihydroxy phenyl) -9,10- dihydro-9-oxy -10- phosphine phenanthrene -10- oxide, 2,6- bis- (2,6- 3,5-dimethylphenyl)
One of phosphino- benzene, 10- phenyl -9,10- dihydro-9-oxy -10- phosphine phenanthrene -10- oxide or at least two mixing.
10. the described in any item high frequency resin compositions of claim 1-9 are in prepreg, laminate, copper-clad plate and printing electricity
Application in the plate of road.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110922705A (en) * | 2019-12-13 | 2020-03-27 | 陕西易莱德新材料科技有限公司 | High-heat-resistance conductive composite material and preparation method thereof |
| WO2021012619A1 (en) * | 2019-07-22 | 2021-01-28 | 南亚新材料科技股份有限公司 | High-frequency resin composition and use thereof |
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| US20160160008A1 (en) * | 2014-12-05 | 2016-06-09 | Elite Electronic Material (Kunshan) Co., Ltd. | Aromatic tetrafunctional vinylbenzyl resin composition and use thereof |
| CN106280178A (en) * | 2016-08-29 | 2017-01-04 | 陕西生益科技有限公司 | A kind of resin combination and application thereof |
| CN106280179A (en) * | 2016-08-29 | 2017-01-04 | 陕西生益科技有限公司 | A kind of high frequency resin composition and application thereof |
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| US20160160008A1 (en) * | 2014-12-05 | 2016-06-09 | Elite Electronic Material (Kunshan) Co., Ltd. | Aromatic tetrafunctional vinylbenzyl resin composition and use thereof |
| CN104725857A (en) * | 2015-03-05 | 2015-06-24 | 广东生益科技股份有限公司 | Resin composition, prepreg using resin composition and laminate |
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| WO2021012619A1 (en) * | 2019-07-22 | 2021-01-28 | 南亚新材料科技股份有限公司 | High-frequency resin composition and use thereof |
| CN110922705A (en) * | 2019-12-13 | 2020-03-27 | 陕西易莱德新材料科技有限公司 | High-heat-resistance conductive composite material and preparation method thereof |
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Application publication date: 20190315 |