CN109462938A - Circuit board assembly, photovoltaic inverter and air conditioning system - Google Patents
Circuit board assembly, photovoltaic inverter and air conditioning system Download PDFInfo
- Publication number
- CN109462938A CN109462938A CN201811378041.9A CN201811378041A CN109462938A CN 109462938 A CN109462938 A CN 109462938A CN 201811378041 A CN201811378041 A CN 201811378041A CN 109462938 A CN109462938 A CN 109462938A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- electrical part
- part module
- board assemblies
- air duct
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004378 air conditioning Methods 0.000 title claims abstract description 9
- 230000000712 assembly Effects 0.000 claims description 50
- 238000000429 assembly Methods 0.000 claims description 50
- 239000003990 capacitor Substances 0.000 claims description 4
- 238000005070 sampling Methods 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 206010020843 Hyperthermia Diseases 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000036031 hyperthermia Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/184—Components including terminals inserted in holes through the printed circuit board and connected to printed contacts on the walls of the holes or at the edges thereof or protruding over or into the holes
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/56—Power conversion systems, e.g. maximum power point trackers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Inverter Devices (AREA)
Abstract
The invention discloses a circuit board assembly, a photovoltaic inverter and an air conditioning system, wherein the circuit board assembly comprises: the PCB is provided with a plug interface; the electric device module is provided with a contact pin, and the contact pin is inserted into the contact hole to electrically connect the electric device module with the PCB. The technical scheme of the invention can effectively solve the problems that the circuit board assembly in the prior art generates high heat, and the service life of each device and the use efficiency and the working reliability of equipment are influenced.
Description
Technical field
The present invention relates to circuit board technology fields, in particular to a kind of circuit board assemblies, photovoltaic DC-to-AC converter and air-conditioning
System.
Background technique
In the prior art, usually pass through between the other functions device such as circuit board (main power amplifier board) and control panel, driving plate
Conducting wire is directly connected to.When the work of said combination device, in addition to each device itself, conducting wire can also generate heat, especially exist
In the case that number of conductors is more, the whole heat of assembling device will increase, to influence the service life of each device and answer
With the service efficiency and functional reliability of the equipment of the assembling device.
Summary of the invention
A kind of circuit board assemblies, photovoltaic DC-to-AC converter and air-conditioning system are provided in the embodiment of the present invention, to solve the prior art
In circuit board assemblies generate that heat is higher, influence the service life of each device and the service efficiency of equipment and functional reliability
Problem.
To achieve the above object, the present invention provides a kind of circuit board assemblies, comprising: pcb board is provided on pcb board slotting
Interface；Electrical part module, is provided with contact pin in electrical part module, and contact pin is inserted into interface with by electrical part module and PCB
Plate electrical connection.
Further, electrical part module is multiple, multiple electrical part modular spacing settings.
Further, there is major loop cabling, circuit board assemblies further include major loop device, major loop device on pcb board
It is welded on pcb board, major loop device and electrical part modular spacing are arranged.
Further, electrical part module includes subsidiary loop device.
Further, major loop device is multiple, the setting of multiple major loop devices interval.
Further, circuit board assemblies further include the fan of fixed setting, and fan is towards pcb board connecting circuit part module
Side forms the first air duct between two adjacent electrical part modules.
Further, circuit board assemblies further include the fan of fixed setting, and fan is towards pcb board connecting circuit part module
Side, major loop device are one, form the first air duct between two adjacent electrical part modules, adjacent electrical part module and
The second air duct is formed between major loop device, the first air duct is connected to the second air duct.
Further, circuit board assemblies further include the fan of fixed setting, and fan is towards pcb board connecting circuit part module
Side forms the first air duct, shape between adjacent electrical part module and major loop device between two adjacent electrical part modules
At the second air duct, third air duct, the first air duct, the second air duct and third air duct are formed between two adjacent major loop devices
It is interconnected.
Further, major loop device includes one in AC relay, IGBT module, bus capacitor and filter inductance
It is a.
Further, subsidiary loop device includes one in sampling plate, control panel, driving plate and accessory power supply plate.
According to another aspect of the present invention, a kind of photovoltaic DC-to-AC converter is provided, including cabinet and setting are in cabinet
Circuit board assemblies, circuit board assemblies be above-mentioned circuit board assemblies.
According to another aspect of the present invention, a kind of air-conditioning system, including photovoltaic DC-to-AC converter are provided, photovoltaic DC-to-AC converter is
Above-mentioned photovoltaic DC-to-AC converter.
It applies the technical scheme of the present invention, electrical part module includes the electrical part for needing to connect with pcb board, the electrical part mould
Be provided with contact pin on block, be provided with interface on pcb board, by the mating realization electrical part module of contact pin and interface with
The electrical connection of pcb board.Above structure does not need to connect using conducting wire, so as to reduce the heat that circuit board assemblies integrally generate
Amount, and then improve the service life of each device and the service efficiency and functional reliability of the equipment using the circuit board assemblies.
In addition, the inserting mode of above-mentioned electrical part module and pcb board, easily facilitates according to practical service environment and requires replacement electrical part
Module, use are more flexible.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the circuit board assemblies of the embodiment of the present invention；
Fig. 2 is the structural schematic diagram of the electrical part module of the circuit board assemblies of Fig. 1；
Fig. 3 is the structural schematic diagram of another angle of the circuit board assemblies of Fig. 1；And
Fig. 4 is the pcb board of the circuit board assemblies of Fig. 1, electrical part module, major loop device and the structural representation in air duct
Figure.
Description of symbols:
10, pcb board；11, major loop cabling；20, electrical part module；21, contact pin；30, major loop device；40, fan；
50, the first air duct；60, the second air duct；70, third air duct.
Specific embodiment
Present invention is further described in detail in the following with reference to the drawings and specific embodiments, but not as to limit of the invention
It is fixed.
As shown in Figures 1 to 4, the circuit board assemblies of the present embodiment include pcb board 10 and electrical part module 20.Wherein, PCB
Interface is provided on plate 10.Electrical part module 20 is formed by electric device package.Contact pin 21 is provided in electrical part module 20.It inserts
Needle 21 is inserted into interface so that electrical part module 20 to be electrically connected with pcb board 10.
Using the circuit board assemblies of the present embodiment, the electric device package for needing to connect with pcb board 10 is formed into electrical part mould
Block 20 is provided with contact pin 21 in the electrical part module 20, is provided with interface on pcb board 10, passes through contact pin 21 and interface
Mating realization electrical part module 20 is electrically connected with pcb board 10.Above structure does not need to connect using conducting wire, so as to
The heat that circuit board assemblies integrally generate is reduced, and then improves the service life of each device and setting for the application circuit board assemblies
Standby service efficiency and functional reliability.In addition, the inserting mode of above-mentioned electrical part module 20 and pcb board 10, easily facilitates root
According to practical service environment and replacement electrical part module 20 is required, use is more flexible.
As shown in Fig. 1, Fig. 3 and Fig. 4, in the circuit board assemblies of the present embodiment, there is major loop cabling on pcb board 10
11, the major loop cabling 11 is for being passed through forceful electric power high current.Circuit board assemblies further include major loop device 30.10 conduct of pcb board
The carrier of major loop device 30 and electrical part module 20.Wherein, the volume of major loop device 30 is big, voltage is high, electric current is big, will lead
Circuit device 30 is welded on pcb board 10, and is electrically connected with major loop cabling 11.It is main for different use environment and requirement
Circuit device 30 does not have to replacement generally, therefore, by major loop device 30 by being welded to connect, can effectively guarantee major loop device
The connection reliability of part 30.Above-mentioned major loop device 30 can be AC relay, IGBT module, bus capacitor, filter inductance
Deng the device for needing to connect, be passed through with major loop cabling 11 forceful electric power.
In addition, electrical part module 20 is encapsulated by subsidiary loop device, which can return for above-mentioned master
Other devices other than road device 30, for example, sampling plate, control panel, driving plate, accessory power supply plate etc. are passed through the device of light current.
For different use environments and requirement (such as different voltage forms), same class subsidiary loop device generally require selection with
The most matched parameter of the use environment.Therefore, the electrical part module 20 for being packaged with same class subsidiary loop device is made into has
Multiple specifications of different parameters, the shape of the electrical part module 20 of each specification, volume, contact pin 21 are identical, reserve on pcb board 10
The interface of suitable position corresponding with the type electrical part module 20 can when use environment (such as voltage form) changes
To select the electrical part module 20 of suitable parameters specification to carry out grafting or the electrical part module 20 of original connection be changed to conjunction
The electrical part module 20 of suitable parameter specification, use is more flexible and convenient.In the present embodiment, electrical part module 20 is uniformly fabricated to
Rectangular parallelepiped structure, bottom are matched with the interface reserved on pcb board 10 there are contact pin 21, on the one hand can transmit signal, and one
Aspect can fix support.Pcb board can be used as the main power amplifier board of general version, match the electrical part module 20 of different parameters,
It can be adapted for different use environments (such as voltage form), realize Modularized splice.Wherein, it is packaged with variety classes auxiliary
The volume of the electrical part module 20 of circuit device can be designed as different size, in this way can be convenient for differentiation.
As shown in Fig. 1, Fig. 3 and Fig. 4, in the circuit board assemblies of the present embodiment, electrical part module 20 and major loop device
Part 30 is multiple.The setting of multiple intervals of electrical part module 20, the setting of multiple intervals of major loop device 30, and major loop device
30 are arranged with electrical part module 20 and interval.Above structure distribution setting can make any part (electrical part on pcb board 10
Module 20, major loop device 30) between all have gap, be more favorable for radiating in this way.In the present embodiment, electrical part module 20
It is four, major loop device 30 is also four, and four electrical part modules 20 are respectively by sampling plate, control panel, driving plate, auxiliary
Power panel encapsulates, and four major loop devices 30 are respectively AC relay, IGBT module, bus capacitor, filter inductance.
It should be noted that the quantity and arrangement mode of electrical part module 20 and major loop device 30 are without being limited thereto, scheming
In in unshowned other embodiments, the quantity and arrangement mode of electrical part module and major loop device can according to need into
Row selection, but it is the need to ensure that between any two adjacent components that there is gap.In addition, in the present embodiment, major loop device
Part 30 is welded on pcb board 10, but in other embodiments, if some major loop device is also required to later period replacement,
It can equally be packaged and form electrical part module, pass through plug connection on pcb board.
As shown in Fig. 1, Fig. 3 and Fig. 4, in the circuit board assemblies of the present embodiment, circuit board assemblies further include that fixation is set
The fan 40 set.Side air draught or exhausting of the fan 40 towards 10 connecting circuit part module 20 of pcb board.As shown in figure 4, adjacent
The first air duct 50 is formed between two electrical part modules 20, and is formed between adjacent electrical part module 20 and major loop device 30
Two air ducts 60, form third air duct 70 between two adjacent major loop devices 30, the first air duct 50, the second air duct 60 and the
Three air ducts 70 are interconnected.It can accelerate air-flow in the first air duct 50, the second air duct 60 and third wind by said fans 40
It is flowed in road 70, so that generation the case where be distributed even heat, avoid localized hyperthermia, makes circuit board assemblies realize balance heat dissipation
Purpose.It should be noted that wanting emphasis to consider the design in air duct during 10 fabric swatch of pcb board.Specifically, each major loop
The position of the reserved interface of the welding position of device 30 and each electrical part module 20 should reserve the space of air-flow flowing
For radiating, and should be compared with for the major loop device 30 or electrical part module 20, the space that surrounding reserves generated more than heat
(i.e. the radial dimension in air duct is larger) greatly easily facilitates the flowing of heat in this way and is uniformly distributed.The design of major loop cabling 11
Consider the position of the welding position of above-mentioned each major loop device 30 and the reserved interface of each electrical part module 20, and
And the factors such as loop, current-carrying are considered simultaneously.In the present embodiment, fan 40 is two, and two fans 40 are connected by screw respectively
It connects at the top of corresponding electrical part module 20 and major loop device 30.Due to being directed to one species, the electrical part of each specification
Shape, the volume of module 20 are identical, even if needing replacing the electrical part module 20 for suitable parameters specification, electrical part after replacement
Link position between module 20 and fan 40 will not change, more convenient operation.
Certainly, the specific distribution mode in air duct is not limited to distribution mode shown in Fig. 4, in other realities not shown in the figure
It applies in mode, can be designed according to the actual situation.For example, multiple electrical part modules are only connected on pcb board, adjacent two
The first air duct is formed between a electrical part module, is interconnected between multiple first air ducts；Alternatively, major loop device is one,
Electrical part module be it is multiple, form the first air duct between two adjacent electrical part modules, adjacent electrical part module and lead back
The second air duct is formed between the device of road, the first air duct is connected to the second air duct；Alternatively, major loop device and electrical part module are
It is multiple, the first air duct, shape between adjacent electrical part module and major loop device are formed between two adjacent electrical part modules
At the second air duct, third air duct, the first air duct, the second air duct and third air duct are formed between two adjacent major loop devices
It is interconnected.
Existing plastic-aluminum cabinet (such as cabinet of photovoltaic DC-to-AC converter) heat dissipation mainly uses two kinds of structures: one is force wind
It is cold, heat release hole is offered on cabinet, and the heat of box house is extracted by outside using fan；Another kind is calm fan structure, is used
The heat of box house is directly scattered to the external world by preferable heat sink material, heat-dissipating structure.In terms of radiating efficiency and ease,
Better, but fan blade and air duct need to clear up air blast cooling mode in use for some time, to occupy manpower object for a long time
It tries hard to keep and demonstrate,proves after-sale service, be not suitable for and installed in remote districts.And the heat dissipation effect of calm fan structure is bad, is difficult to play effectively
Heat dissipation.
Present invention also provides a kind of photovoltaic DC-to-AC converter, the embodiment according to the photovoltaic DC-to-AC converter of the application include cabinet with
And setting, in the intracorporal circuit board assemblies of case, circuit board assemblies are above-mentioned circuit board assemblies.Since foregoing circuit plate does not need
Connected using conducting wire, so as to reduce the heat that circuit board assemblies integrally generate, and then improve the service life of each device with
And the service efficiency and functional reliability of photovoltaic DC-to-AC converter.Due to the design of fan 40 and air duct, it is distributed even heat, avoided
The case where localized hyperthermia, occurs, and improves internal heat circulation.Further, since the intracorporal circuit board assemblies of case heat reduce and
Even heat distribution, thus can not the aperture on cabinet, only radiated by Temperature fall in cabinet, heat dissipation effect
Preferably, this makes it possible to increase cabinet air-tightness, the degree of protection of cabinet is improved, so that the versatility of photovoltaic DC-to-AC converter is improved,
Expand sales region.
In addition, the embodiment according to the air-conditioning system of the application includes photovoltaic present invention also provides a kind of air-conditioning system
Inverter, photovoltaic DC-to-AC converter are above-mentioned photovoltaic DC-to-AC converter.
It should be noted that term used herein above is merely to describe specific embodiment, and be not intended to restricted root
According to the illustrative embodiments of the application.As used herein, unless the context clearly indicates otherwise, otherwise singular
Also it is intended to include plural form, additionally, it should be understood that, when in the present specification using term "comprising" and/or " packet
Include " when, indicate existing characteristics, step, work, device, component and/or their combination.
It should be noted that the description and claims of this application and term " first " in above-mentioned attached drawing, "
Two " etc. be to be used to distinguish similar objects, without being used to describe a particular order or precedence order.It should be understood that using in this way
Data be interchangeable under appropriate circumstances, so that presently filed embodiment described herein can be in addition to illustrating herein
Or the sequence other than those of description is implemented.
It certainly, is the preferred embodiment of the present invention above.It should be pointed out that for those skilled in the art
For, without departing from the basic principles of the invention, several improvements and modifications can also be made, these improvements and modifications
It is considered as protection scope of the present invention.
Claims (12)
1. a kind of circuit board assemblies characterized by comprising
Pcb board (10) is provided with interface on the pcb board (10)；
Electrical part module (20) is provided with contact pin (21) on the electrical part module (20), and the contact pin (21) is inserted into described
The electrical part module (20) to be electrically connected with the pcb board (10) in interface.
2. circuit board assemblies according to claim 1, which is characterized in that the electrical part module (20) be it is multiple, it is multiple
Electrical part module (20) interval setting.
3. circuit board assemblies according to claim 2, which is characterized in that have major loop cabling on the pcb board (10)
(11), the circuit board assemblies further include major loop device (30), and the major loop device (30) is welded on the pcb board (10)
On, the major loop device (30) and the electrical part module (20) interval are arranged.
4. circuit board assemblies according to claim 3, which is characterized in that the electrical part module (20) includes subsidiary loop
Device.
5. circuit board assemblies according to claim 3 or 4, which is characterized in that the major loop device (30) be it is multiple, it is more
A major loop device (30) interval setting.
6. circuit board assemblies according to claim 2, which is characterized in that the circuit board assemblies further include fixed setting
Fan (40), the fan (40) connect the side of the electrical part module (20) towards the pcb board (10), and adjacent two
The first air duct (50) are formed between the electrical part module (20).
7. circuit board assemblies according to claim 3 or 4, which is characterized in that the circuit board assemblies further include that fixation is set
The fan (40) set, the fan (40) connect the side of the electrical part module (20), the master towards the pcb board (10)
Circuit device (30) is one, is formed the first air duct (50) between the electrical part module (20) of adjacent two, adjacent institute
It states and is formed between electrical part module (20) and the major loop device (30) the second air duct (60), first air duct (50) and institute
State the second air duct (60) connection.
8. circuit board assemblies according to claim 5, which is characterized in that the circuit board assemblies further include fixed setting
Fan (40), the fan (40) connect the side of the electrical part module (20) towards the pcb board (10), and adjacent two
It is formed the first air duct (50) between the electrical part module (20), the adjacent electrical part module (20) and the major loop device
It is formed between part (30) the second air duct (60), forms third air duct (70) between the major loop device (30) of adjacent two,
First air duct (50), second air duct (60) and the third air duct (70) are interconnected.
9. circuit board assemblies according to claim 3, which is characterized in that the major loop device (30) includes exchange relay
One in device, IGBT module, bus capacitor and filter inductance.
10. circuit board assemblies according to claim 4, which is characterized in that the subsidiary loop device includes sampling plate, control
One in making sheet, driving plate and accessory power supply plate.
11. a kind of photovoltaic DC-to-AC converter, including cabinet and setting are in the intracorporal circuit board assemblies of the case, which is characterized in that institute
Stating circuit board assemblies is circuit board assemblies described in any one of claims 1 to 10.
12. a kind of air-conditioning system, including photovoltaic DC-to-AC converter, which is characterized in that the photovoltaic DC-to-AC converter is described in claim 11
Photovoltaic DC-to-AC converter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811378041.9A CN109462938A (en) | 2018-11-19 | 2018-11-19 | Circuit board assembly, photovoltaic inverter and air conditioning system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811378041.9A CN109462938A (en) | 2018-11-19 | 2018-11-19 | Circuit board assembly, photovoltaic inverter and air conditioning system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109462938A true CN109462938A (en) | 2019-03-12 |
Family
ID=65610926
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811378041.9A Pending CN109462938A (en) | 2018-11-19 | 2018-11-19 | Circuit board assembly, photovoltaic inverter and air conditioning system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109462938A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010073669A (en) * | 2000-01-19 | 2001-08-01 | 구자홍 | One module system for electric and electronic products |
| CN102176642A (en) * | 2011-01-25 | 2011-09-07 | 无锡风光新能源科技有限公司 | Detachable structure of bus electrolytic capacitor of photovoltaic inverter |
| CN205356166U (en) * | 2016-01-05 | 2016-06-29 | 中兴通讯股份有限公司 | Be applied to photovoltaic inverter's heat radiation structure |
| CN105828586A (en) * | 2016-06-08 | 2016-08-03 | 苏州欧姆尼克新能源科技有限公司 | Low-power photovoltaic inverter |
| CN209472837U (en) * | 2018-11-19 | 2019-10-08 | 珠海格力电器股份有限公司 | Circuit board assembly, photovoltaic inverter and air conditioning system |
-
2018
- 2018-11-19 CN CN201811378041.9A patent/CN109462938A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010073669A (en) * | 2000-01-19 | 2001-08-01 | 구자홍 | One module system for electric and electronic products |
| CN102176642A (en) * | 2011-01-25 | 2011-09-07 | 无锡风光新能源科技有限公司 | Detachable structure of bus electrolytic capacitor of photovoltaic inverter |
| CN205356166U (en) * | 2016-01-05 | 2016-06-29 | 中兴通讯股份有限公司 | Be applied to photovoltaic inverter's heat radiation structure |
| CN105828586A (en) * | 2016-06-08 | 2016-08-03 | 苏州欧姆尼克新能源科技有限公司 | Low-power photovoltaic inverter |
| CN209472837U (en) * | 2018-11-19 | 2019-10-08 | 珠海格力电器股份有限公司 | Circuit board assembly, photovoltaic inverter and air conditioning system |
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