CN109462900B - High-temperature graphene heating plate and preparation method thereof - Google Patents
High-temperature graphene heating plate and preparation method thereof Download PDFInfo
- Publication number
- CN109462900B CN109462900B CN201811444357.3A CN201811444357A CN109462900B CN 109462900 B CN109462900 B CN 109462900B CN 201811444357 A CN201811444357 A CN 201811444357A CN 109462900 B CN109462900 B CN 109462900B
- Authority
- CN
- China
- Prior art keywords
- mica insulation
- graphene
- temperature
- protective layer
- graphene heating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
Abstract
The invention relates to the field of heating devices, in particular to a high-temperature graphene heating plate and a preparation method thereof, wherein the high-temperature graphene heating plate comprises a high-temperature graphene heating body, a mica insulation plate frame, a lead and a housing, wherein the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate arranged on the mica insulation groove and forms an internal cavity; the high-temperature graphene heating body is positioned in the inner cavity and consists of a first protective layer, a graphene film layer and a second protective layer which are sequentially arranged from top to bottom, and metal current carrying strips are arranged on two sides of the second protective layer; one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply; the housing is wrapped on the outer side of the mica insulation plate frame. The invention is suitable for being used as a heating part on household appliances and various machines and equipment, and has the advantages of uniform heating, good thermal stability, long service life and high temperature resistance.
Description
Technical Field
The invention relates to the field of heating devices, in particular to a high-temperature graphene heating plate and a preparation method thereof.
Background
At present, heaters mainly comprise two major types, namely quartz heating pipes, low-temperature radiation heating films and the like, wherein the high-temperature heaters are widely applied to heating parts on household appliances and various machines and equipment and various industrial and agricultural heating occasions, and have the characteristics of uniform heating, good thermal stability, long service life and high temperature resistance.
The invention with the authorization notice number of CN101998709B discloses a quartz heating tube, which comprises a quartz tube body, wherein an inner tube is in a straight shape and is positioned in a bottom transverse tube of a middle tube, a nickel-chromium electrothermal alloy wire is arranged in the inner tube along the axial direction, and an electrode is connected with the nickel-chromium electrothermal alloy wire; the middle pipe is Z-shaped, the bottom transverse pipe of the middle pipe is a heating area, the middle vertical pipe of the middle pipe is a heat transfer area, the upper transverse pipe of the middle pipe is a cooling area, and the pipe diameter of the upper transverse pipe of the Z-shaped middle pipe is smaller than that of the rest parts of the middle pipe. The quartz heating pipe adopts a nickel-chromium electric heating alloy wire, has the problems of low resistivity, low electric heating conversion efficiency, low heating rate, poor heating uniformity, poor thermal stability and the like, and has the problems of easy damage, light pollution, short service life, poor heating effect and the like of the conventional quartz heating pipe.
Disclosure of Invention
Therefore, aiming at the above, the invention provides a high-temperature graphene heating plate and a preparation method thereof, which solve the problems of easy damage, light pollution, short service life, poor heating effect and the like of the existing quartz heating tube.
In order to achieve the purpose, the invention is realized by the following technical scheme:
a high-temperature graphene heating plate comprises a high-temperature graphene heating body, a mica insulation plate frame, a lead and a housing, wherein the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate arranged on the mica insulation groove to form an inner cavity; the high-temperature graphene heating body is positioned in the inner cavity and consists of a first protective layer, a graphene film layer and a second protective layer which are sequentially arranged from top to bottom, and metal current carrying strips are arranged on two sides of the second protective layer; one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply; the housing is wrapped on the outer side of the mica insulation plate frame.
The further improvement is that: the first protective layer and the second protective layer are made of one or two of aluminum nitride and titanium diboride beryllium oxide which are composite materials in any ratio.
The further improvement is that: the preparation method of the graphene film layer comprises the following steps:
(1) weighing 5 parts by weight of graphene, 60-70 parts by weight of water and 10-15 parts by weight of ethylene glycol diacetate, fully mixing and stirring, pouring into a high-speed shearing machine, shearing at a high speed for 1-2h, adding into an ultrasonic dispersion machine, adding 1-3 parts by weight of alkylphenol ethoxylates, and carrying out ultrasonic treatment for 4-6h to obtain a graphene dispersion liquid;
(2) adding 5-10 parts by weight of rosin resin, 20-30 parts by weight of silver-plated glass beads and 1-3 parts by weight of sodium methylenedinaphthalene sulfonate into the graphene dispersion liquid, stirring and mixing for 30-40min to obtain graphene conductive slurry, spraying the graphene conductive slurry on a substrate, carrying out ultrasonic oscillation on the substrate while spraying, continuing the ultrasonic oscillation for 10-20min after the spraying is finished, and finally drying to obtain the graphene film.
The invention also provides a preparation method of the high-temperature graphene heating plate, which comprises the following steps:
(1) a synthesis procedure: under a helium protection environment, the graphene film layer is bonded with the metal current carrying strip through heat conducting glue, the first protective layer, the graphene film layer and the second protective layer are bonded through bonding glue layers, and then the graphene film layer and the second protective layer are pressed through a laminating machine to form a high-temperature graphene heating body;
wherein the parameters of the laminating machine are set to be 0.50-0.60Mpa, and the temperature is 240-260 ℃ for 5-8 min; then the pressure is increased to 1.4-1.6Mpa, and the pressing is carried out for 15-20 min;
(3) a compounding procedure: the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate, a plurality of small grooves are formed in two sides of the mica insulation groove, the size of the groove in the middle of the mica insulation groove is matched with that of the high-temperature graphene heating body, protrusions corresponding to the small grooves in the mica insulation groove are formed in two sides of the mica insulation cover plate, and the protrusions in the mica insulation cover plate are inserted into the small grooves in the mica insulation groove during installation;
(3) the processing procedure comprises the following steps: one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply.
By adopting the technical scheme, the invention has the beneficial effects that:
1. adopt high temperature graphite alkene heat-generating body generates heat, and electric heat conversion efficiency is high, and electromagnetic radiation is little and harmless to the human body, and effective heating area is big, and thermal uniformity is good with thermal comfort, and the stable performance power change is little, long service life, and thickness is thin flexible good not fragile, and occupation space hardly has directly generated heat and has saved traditional built-in components and parts that generate heat.
2. The invention can resist high temperature of 600 ℃, and meets the requirements of stability and safety of a heating system.
3. The invention adopts a mica insulation board frame, is safe and reliable, has the insulation resistance of more than or equal to 100 MOmega and the withstand voltage of 1500V/min.
4. The heating plate is convenient to install, the heating plate can be customized according to the requirements of customers, the size and the power density are customized, and the use requirements of different occasions are met.
5. The method has wide application range, and is suitable for household appliances (electric rice cookers, microwave ovens, electronic disinfection cabinets, electric hair dryers, electric irons and the like), heating parts (laminator, duplicators, printers, fax machines and the like) on various machine equipment and various industrial and agricultural heating occasions (such as mold heating, plastic machines and other heating and drying devices).
6. The preparation method has the advantages that the Van der Waals force among graphene molecules is large, the agglomeration phenomenon is easy to form, alkylphenol polyoxyethylene ether surfactant is added into the aqueous solution, and the surfactant molecules are adsorbed on the surface of the graphene, so that the graphene is uniformly dispersed. The graphene film prepared by spraying and drying the graphene dispersion liquid with good and stable dispersibility has high conductivity.
Drawings
Fig. 1 is a schematic cross-sectional view of a medium-high temperature graphene heating plate according to an embodiment of the present invention;
fig. 2 is a schematic external view of a medium-high temperature graphene heating plate according to an embodiment of the present invention;
fig. 3 is a structural diagram of a medium-high temperature graphene heating element according to an embodiment of the present invention.
Detailed Description
The following detailed description will be provided for the embodiments of the present invention with reference to specific embodiments, so that how to apply the technical means to solve the technical problems and achieve the technical effects can be fully understood and implemented.
Unless otherwise indicated, the techniques employed in the examples are conventional and well known to those skilled in the art, and the reagents and products employed are also commercially available. The source, trade name and if necessary the constituents of the reagents used are indicated at the first appearance.
Example one
Referring to fig. 1 to 3, a high-temperature graphene heating plate includes a high-temperature graphene heating element 1, a mica insulating plate frame 2, a lead 3 and a cover 4, wherein the mica insulating plate frame 2 is formed by combining a mica insulating groove 21 and a mica insulating cover plate 22 arranged on the mica insulating groove and forms an inner cavity; the high-temperature graphene heating body 1 is positioned in the inner cavity and consists of a first protective layer 11, a graphene film layer 12 and a second protective layer 14 which are sequentially arranged from top to bottom, and metal current carrying strips 13 are arranged on two sides of the second protective layer 14; one end of the lead 3 is connected with the high-temperature graphene heating body, and the other end of the lead passes through the mica insulation frame and the housing to be connected with an external power supply; the housing 4 is wrapped outside the mica insulation board frame 2.
The preparation method of the graphene film layer comprises the following steps:
(1) weighing 5 parts by weight of graphene, 60 parts by weight of water and 10 parts by weight of ethylene glycol diacetate, fully mixing and stirring, pouring into a high-speed shearing machine, shearing at a high speed for 1h, adding into an ultrasonic dispersion machine, adding 1 part by weight of alkylphenol ethoxylates, and carrying out ultrasonic treatment for 4h to obtain a graphene dispersion liquid;
(2) adding 5 parts by weight of rosin resin, 20 parts by weight of silver-plated glass beads and 1 part by weight of sodium methylenedinaphthalene sulfonate into the graphene dispersion liquid, stirring and mixing for 30min to obtain graphene conductive slurry, spraying the graphene conductive slurry on a substrate, carrying out ultrasonic oscillation on the substrate while spraying, continuing the ultrasonic oscillation for 10min after the spraying is finished, and finally drying to obtain the graphene film.
The preparation steps of the high-temperature graphene heating plate are as follows:
(1) a synthesis procedure: under a helium protection environment, the graphene film layer is bonded with the metal current carrying strip through heat conducting glue, the first protective layer, the graphene film layer and the second protective layer are bonded through bonding glue layers, and then the graphene film layer and the second protective layer are pressed through a laminating machine to form a high-temperature graphene heating body;
wherein the parameters of the laminator are set to 0.50Mpa, and the laminating is carried out for 5min at 240 ℃; then the pressure is increased to 1.4Mpa, and the pressing is carried out for 15 min;
(2) a compounding procedure: the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate, a plurality of small grooves are formed in two sides of the mica insulation groove, the size of the groove in the middle of the mica insulation groove is matched with that of the high-temperature graphene heating body, protrusions corresponding to the small grooves in the mica insulation groove are formed in two sides of the mica insulation cover plate, and the protrusions in the mica insulation cover plate are inserted into the small grooves in the mica insulation groove during installation;
(3) the processing procedure comprises the following steps: one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply.
Example two
The structure of the high-temperature graphene heating plate is consistent with that of the embodiment, and the preparation method of the graphene film layer comprises the following steps:
(1) weighing 5 parts by weight of graphene, 65 parts by weight of water and 12 parts by weight of ethylene glycol diacetate, fully mixing and stirring, pouring into a high-speed shearing machine, shearing at a high speed for 1.5h, adding into an ultrasonic dispersion machine, adding 2 parts by weight of alkylphenol ethoxylates, and carrying out ultrasonic treatment for 5h to obtain a graphene dispersion liquid;
(2) adding 7 parts by weight of rosin resin, 25 parts by weight of silver-plated glass beads and 2 parts by weight of sodium methylenedinaphthalene sulfonate into the graphene dispersion liquid, stirring and mixing for 35min to obtain graphene conductive slurry, spraying the graphene conductive slurry on a substrate, carrying out ultrasonic oscillation on the substrate while spraying, continuing the ultrasonic oscillation for 15min after spraying is finished, and finally drying to obtain the graphene film.
The preparation steps of the high-temperature graphene heating plate are as follows:
(1) a synthesis procedure: under a helium protection environment, the graphene film layer is bonded with the metal current carrying strip through heat conducting glue, the first protective layer, the graphene film layer and the second protective layer are bonded through bonding glue layers, and then the graphene film layer and the second protective layer are pressed through a laminating machine to form a high-temperature graphene heating body;
wherein the parameters of the laminator are set to 0.55Mpa, and the temperature is 250 ℃ for 7 min; then the pressure is increased to 1.5Mpa, and the pressing is carried out for 18 min;
(2) a compounding procedure: the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate, a plurality of small grooves are formed in two sides of the mica insulation groove, the size of the groove in the middle of the mica insulation groove is matched with that of the high-temperature graphene heating body, protrusions corresponding to the small grooves in the mica insulation groove are formed in two sides of the mica insulation cover plate, and the protrusions in the mica insulation cover plate are inserted into the small grooves in the mica insulation groove during installation;
(3) the processing procedure comprises the following steps: one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply.
EXAMPLE III
The structure of the high-temperature graphene heating plate is consistent with that of the embodiment, and the preparation method of the graphene film layer comprises the following steps:
(1) weighing 5 parts by weight of graphene, 70 parts by weight of water and 15 parts by weight of ethylene glycol diacetate, fully mixing and stirring, pouring into a high-speed shearing machine, shearing at a high speed for 2 hours, adding into an ultrasonic dispersion machine, adding 3 parts by weight of alkylphenol ethoxylates, and carrying out ultrasonic treatment for 6 hours to obtain a graphene dispersion liquid;
(2) adding 10 parts by weight of rosin resin, 30 parts by weight of silver-plated glass beads and 3 parts by weight of sodium methylenedinaphthalene sulfonate into the graphene dispersion liquid, stirring and mixing for 40min to obtain graphene conductive slurry, spraying the graphene conductive slurry on a substrate, carrying out ultrasonic oscillation on the substrate while spraying, continuing the ultrasonic oscillation for 20min after spraying is finished, and finally drying to obtain the graphene film.
The preparation steps of the high-temperature graphene heating plate are as follows:
(1) a synthesis procedure: under a helium protection environment, the graphene film layer is bonded with the metal current carrying strip through heat conducting glue, the first protective layer, the graphene film layer and the second protective layer are bonded through bonding glue layers, and then the graphene film layer and the second protective layer are pressed through a laminating machine to form a high-temperature graphene heating body;
wherein the parameters of the laminating machine are set as 0.60Mpa, and the laminating is carried out for 8min at the temperature of 260 ℃; then the pressure is increased to 1.6Mpa, and the pressing is carried out for 20 min;
(2) a compounding procedure: the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate, a plurality of small grooves are formed in two sides of the mica insulation groove, the size of the groove in the middle of the mica insulation groove is matched with that of the high-temperature graphene heating body, protrusions corresponding to the small grooves in the mica insulation groove are formed in two sides of the mica insulation cover plate, and the protrusions in the mica insulation cover plate are inserted into the small grooves in the mica insulation groove during installation;
(3) the processing procedure comprises the following steps: one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply.
The above description is only an embodiment utilizing the technical content of the present disclosure, and any modification and variation made by those skilled in the art can be covered by the claims of the present disclosure, and not limited to the embodiments disclosed.
Claims (3)
1. The utility model provides a high temperature graphite alkene hot plate which characterized in that: the mica insulation board frame is formed by combining a mica insulation groove and a mica insulation cover plate arranged on the mica insulation groove and forms an internal cavity; the high-temperature graphene heating body is positioned in the inner cavity and consists of a first protective layer, a graphene film layer and a second protective layer which are sequentially arranged from top to bottom, and metal current carrying strips are arranged on two sides of the second protective layer; one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply; the housing wraps the outer side of the mica insulating plate frame, and the high-temperature graphene heating plate is prepared by the following steps:
(1) a synthesis procedure: under a helium protection environment, the graphene film layer is bonded with the metal current carrying strip through heat conducting glue, the first protective layer, the graphene film layer and the second protective layer are bonded through bonding glue layers, and then the graphene film layer and the second protective layer are pressed through a laminating machine to form a high-temperature graphene heating body;
wherein the parameters of the laminating machine are set to be 0.50-0.60Mpa, and the temperature is 240-260 ℃ for 5-8 min; then the pressure is increased to 1.4-1.6Mpa, and the pressing is carried out for 15-20 min;
(2) a compounding procedure: the mica insulation plate frame is formed by combining a mica insulation groove and a mica insulation cover plate, a plurality of small grooves are formed in two sides of the mica insulation groove, the size of the groove in the middle of the mica insulation groove is matched with that of the high-temperature graphene heating body, protrusions corresponding to the small grooves in the mica insulation groove are formed in two sides of the mica insulation cover plate, and the protrusions in the mica insulation cover plate are inserted into the small grooves in the mica insulation groove during installation;
(3) the processing procedure comprises the following steps: one end of the lead is connected with the high-temperature graphene heating body, and the other end of the lead penetrates through the mica insulation frame and the housing to be connected with an external power supply.
2. A high temperature graphene heating plate according to claim 1, wherein: the first protective layer and the second protective layer are made of one or two of aluminum nitride and titanium diboride beryllium oxide which are combined in any ratio.
3. A high temperature graphene heating plate according to claim 1, wherein: the preparation method of the graphene film layer comprises the following steps:
(1) weighing 5 parts by weight of graphene, 60-70 parts by weight of water and 10-15 parts by weight of ethylene glycol diacetate, fully mixing and stirring, pouring into a high-speed shearing machine, shearing at a high speed for 1-2h, adding into an ultrasonic dispersion machine, adding 1-3 parts by weight of alkylphenol ethoxylates, and carrying out ultrasonic treatment for 4-6h to obtain a graphene dispersion liquid;
(2) adding 5-10 parts by weight of rosin resin, 20-30 parts by weight of silver-plated glass beads and 1-3 parts by weight of sodium methylenedinaphthalene sulfonate into the graphene dispersion liquid, stirring and mixing for 30-40min to obtain graphene conductive slurry, spraying the graphene conductive slurry on a substrate, carrying out ultrasonic oscillation on the substrate while spraying, continuing the ultrasonic oscillation for 10-20min after the spraying is finished, and finally drying to obtain the graphene film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811444357.3A CN109462900B (en) | 2018-11-29 | 2018-11-29 | High-temperature graphene heating plate and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811444357.3A CN109462900B (en) | 2018-11-29 | 2018-11-29 | High-temperature graphene heating plate and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109462900A CN109462900A (en) | 2019-03-12 |
| CN109462900B true CN109462900B (en) | 2021-07-13 |
Family
ID=65611910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811444357.3A Active CN109462900B (en) | 2018-11-29 | 2018-11-29 | High-temperature graphene heating plate and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109462900B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111479342B (en) * | 2020-04-10 | 2022-07-26 | 北京倚天凌云科技股份有限公司 | Carbon crystal plate with mica insulation layer |
| CN113286386B (en) * | 2021-05-24 | 2024-01-16 | 广东温道百镒健康科技有限公司 | Mica high-temperature-resistant electrothermal film and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02278688A (en) * | 1989-04-19 | 1990-11-14 | Fujii Kinzoku Kako Kk | Heat insulating board or heating board |
| CN105752963A (en) * | 2016-01-25 | 2016-07-13 | 浙江碳谷上希材料科技有限公司 | Foldable electrothermal film device based on graphene |
| CN107298924A (en) * | 2017-07-06 | 2017-10-27 | 深圳市国创珈伟石墨烯科技有限公司 | A kind of graphene conductive slurry and preparation method thereof, application process |
| CN207350430U (en) * | 2017-08-27 | 2018-05-11 | 山东泰安亿美达能源科技有限公司 | A kind of graphene heating pad wall warm plate |
-
2018
- 2018-11-29 CN CN201811444357.3A patent/CN109462900B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02278688A (en) * | 1989-04-19 | 1990-11-14 | Fujii Kinzoku Kako Kk | Heat insulating board or heating board |
| CN105752963A (en) * | 2016-01-25 | 2016-07-13 | 浙江碳谷上希材料科技有限公司 | Foldable electrothermal film device based on graphene |
| CN107298924A (en) * | 2017-07-06 | 2017-10-27 | 深圳市国创珈伟石墨烯科技有限公司 | A kind of graphene conductive slurry and preparation method thereof, application process |
| CN207350430U (en) * | 2017-08-27 | 2018-05-11 | 山东泰安亿美达能源科技有限公司 | A kind of graphene heating pad wall warm plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109462900A (en) | 2019-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109462900B (en) | High-temperature graphene heating plate and preparation method thereof | |
| CN107592685B (en) | A method of preparing double heating layer graphene Electric radiant Heating Films | |
| KR101808898B1 (en) | Electro magnetic wave shielding sheet having heat relese fuction, and the preparation method for the same | |
| CN107124778A (en) | Far-infrared electrothermal film, the manufacture craft of far-infrared electrothermal film and electric heater | |
| CN208479967U (en) | Safety electric film and electric hot plate | |
| CN103171207A (en) | Heat sink material and preparation method thereof | |
| CN108289344A (en) | A kind of graphene superconductive far infrared Electric radiant Heating Film | |
| CN107360639A (en) | A kind of high temperature resistant graphene far-infrared electrothermal film and its preparation technology | |
| CN202143232U (en) | High-efficient carbon crystal heating sheet of firewall floor heating system | |
| JP6301558B2 (en) | Thick film heating element with high thermal conductivity on both sides | |
| CN207039924U (en) | A kind of high temperature resistant graphene far-infrared electrothermal film | |
| CN108289347A (en) | Electric radiant Heating Film, preparation method and applications | |
| CN204721629U (en) | A kind of graphite electric heating plate | |
| CN203884121U (en) | Radiating fin | |
| CN111473400A (en) | Preparation method of graphene electrothermal picture | |
| CN109673067A (en) | A kind of Metal Substrate graphene high temperature resistant far-infrared heating tube and preparation method thereof, heat-resisting material | |
| CN211670998U (en) | Electrothermal film | |
| CN204578803U (en) | Graphite flake electric heating components and parts | |
| CN210617720U (en) | Heat accumulating type graphene heating mural | |
| CN208424819U (en) | A kind of graphene far-infrared electrothermal film | |
| CN207775101U (en) | Power electronic device AlN ceramic bonded copper base | |
| CN202551383U (en) | Compound heating type electric hot tray | |
| CN111002688A (en) | Preparation method of flexible foldable insulating heat dissipation material | |
| CN202445835U (en) | Heating chassis and electric kettle | |
| CN217770398U (en) | Graphite alkene far infrared microcrystalline glass hot plate |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Dabo Inventor after: Yang Yueren Inventor after: Chen Xinjun Inventor after: Meng Jianwu Inventor before: Chen Xinjun Inventor before: Meng Jianwu |
|
| CB03 | Change of inventor or designer information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A high temperature graphene heating plate and its preparation method Effective date of registration: 20230207 Granted publication date: 20210713 Pledgee: China Co. truction Bank Corp Jinhua branch Pledgor: NEW MORE GRAPHENE APPLICATION TECHNOLOGY Co.,Ltd. Registration number: Y2023330000319 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |