CN109461603A - Conductive component, button switch and electrically conductive feature fabrication process - Google Patents
Conductive component, button switch and electrically conductive feature fabrication process Download PDFInfo
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- CN109461603A CN109461603A CN201811606001.5A CN201811606001A CN109461603A CN 109461603 A CN109461603 A CN 109461603A CN 201811606001 A CN201811606001 A CN 201811606001A CN 109461603 A CN109461603 A CN 109461603A
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- silica gel
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- 239000000741 silica gel Substances 0.000 claims abstract description 107
- 229910002027 silica gel Inorganic materials 0.000 claims abstract description 107
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- 239000010931 gold Substances 0.000 claims abstract description 17
- 229910052737 gold Inorganic materials 0.000 claims abstract description 17
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/02—Contacts characterised by the material thereof
- H01H1/021—Composite material
- H01H1/029—Composite material comprising conducting material dispersed in an elastic support or binding material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H1/00—Contacts
- H01H1/06—Contacts characterised by the shape or structure of the contact-making surface, e.g. grooved
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H11/00—Apparatus or processes specially adapted for the manufacture of electric switches
- H01H11/04—Apparatus or processes specially adapted for the manufacture of electric switches of switch contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
- H01H13/00—Switches having rectilinearly-movable operating part or parts adapted for pushing or pulling in one direction only, e.g. push-button switch
- H01H13/02—Details
- H01H13/12—Movable parts; Contacts mounted thereon
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Composite Materials (AREA)
- Materials Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Contacts (AREA)
Abstract
The embodiment of the invention discloses a kind of conductive component, button switch and electrically conductive feature fabrication process, it is related to contacting circuit board technology field, the conductive component includes: layer of silica gel, it is set in turn in the metal layer, the first electroplated layer and the first nanometer layer of layer of silica gel side, the side surface of metal layer, the first electroplated layer and the first nanometer layer far from layer of silica gel includes multiple concave points or multiple salient points.A kind of conductive component, button switch and electrically conductive feature fabrication process provided in an embodiment of the present invention; the conductive particle for solving existing key switch is also easy to produce electric arc; surface is caused to be burnt and the problem of conductive particle failure easy to oxidize; short with the conducting response time, weatherability is strong, and surface forms protective film by nano-deposit; special softness material-structure; it is not intervened in layer gold by any substance, good conductivity, the good feature of salt fog resistance.
Description
Technical field
The present embodiments relate to contact circuit board technology field more particularly to a kind of conductive component, button switch and lead
Electrical components manufacturing method.
Background technique
Key switch is widely used in the fields such as automobile, aviation, electronics, and the conductive particle of existing automobile button switch is general
For coppr alloy-metal, 50-500 milliamperes of electric current, the voltage of 12-24 volt are born, when the conductive particle of key switch and the gold of pcb board
When finger is combined closely, conductive particle is also easy to produce electric arc, and surface is caused to burn and can not power off, and causes short trouble；Key
The surface contacts of the conductive particle of switch are easily destroyed not contacting for pcb board golden finger route, cause open circuit fault.
The metal surface of the conductive particle of key switch and cross section metal are easy to produce burning through high current
Coke, the phenomenon that be easy to causeing oxidation deactivation.
Summary of the invention
The embodiment of the present invention provides a kind of conductive component, button switch and electrically conductive feature fabrication process, with overcome it is existing by
It is easy to produce electric arc when the conductive particle work of key switch, causes surface to be burnt and the problem of conductive particle failure easy to oxidize.
To realize above-mentioned technical problem, the invention adopts the following technical scheme:
In a first aspect, the embodiment of the invention provides a kind of conductive components, comprising:
Layer of silica gel；
It is set in turn in the metal layer, the first electroplated layer and the first nanometer layer of the layer of silica gel side, the metal layer, institute
Stating the side surface of the first electroplated layer and first nanometer layer far from the layer of silica gel includes multiple concave points or multiple salient points.
Optionally, the conductive component further includes the second electricity being set in turn between the metal layer and the layer of silica gel
Coating and the second nanometer layer.
Optionally, first electroplated layer includes the first nickel coating and in the first gold-plated of the first nickel plating layer surface
Layer；
Second electroplated layer includes the second nickel coating and the second Gold plated Layer in the second nickel plating layer surface.
Optionally, the cross section of the conductive component is circle with multiple holes, ellipse, polygon or has
The figure of arc-shaped edges.
Optionally, along the layer of silica gel towards the direction of the metal layer, the layer of silica gel with a thickness of 0.3mm extremely
0.9mm, the metal layer with a thickness of 0.05mm to 0.1mm.
Optionally, the multiple concave points or multiple salient points of side of the metal layer far from the layer of silica gel are band
The contact of chamfering；
The chamfering of the contact is the angle R；
The contact is column, and cross sectional shape is circle, diamond shape, quadrangle, ellipse or irregular figure.
Optionally, along the layer of silica gel towards the direction of the metal layer, the height of the contact is 0.01-0.04mm.
Optionally, along the layer of silica gel towards the direction of the metal layer, the thickness of first electroplated layer and described the
The thickness of two electroplated layers is respectively 0.05um-0.6um.
Second aspect, the embodiment of the invention provides a kind of manufacturing methods of conductive component, comprising:
Multiple concave points or multiple salient points are formed in the one side of metal layer；
The one side for forming multiple concave points or multiple salient points on the metal layer forms the first electroplated layer；
Side on first electroplated layer far from the metal layer forms the first nanometer layer；
Layer of silica gel is incorporated into side of the metal layer far from multiple concave points or multiple salient points.
Optionally, multiple concave points or multiple salient points are formed in the one side of metal layer, comprising:
Metal base is provided；
The metal base is etched, multiple concave points or multiple salient points are formed；
It is activated the metal base, and toasts the metal base after being activated, when baking time is default
Between.
Optionally, the etching metal base, forms after multiple concave points or multiple salient points, also wraps
It includes:
Shaggy line is formed in the side far from multiple concave points or multiple salient points of the metal base
Road.
Optionally, the one side for forming multiple concave points or multiple salient points on the metal layer forms the first electroplated layer
Simultaneously, further includes:
The second electroplated layer is formed between the metal layer and the layer of silica gel.
While the side on first electroplated layer far from the metal layer forms nanometer layer, further includes:
Side on second electroplated layer far from the metal layer forms the second nanometer layer.
Optionally, described that layer of silica gel is incorporated into one of the metal layer far from multiple concave points or multiple salient points
Side, comprising:
Clean the metal layer after the first nanometer layer of the formation；
The spray deposit or the viscous connection agent of printing silica gel to cleaning, baking are described with the viscous connection agent of the silica gel
Metal layer；
The metal layer and the silica gel ground are molded；
High temperature oil pressure and high temperature once vulcanize the metal layer and the silica gel ground.
The third aspect, the embodiment of the invention provides a kind of button switches, including the described in any item conductions of first aspect
Component.
Conductive component disclosed by the embodiments of the present invention includes layer of silica gel, and is set in turn in the metal of layer of silica gel side
Layer, the first electroplated layer and the first nanometer layer, the side surface of metal layer, the first electroplated layer and the first nanometer layer far from layer of silica gel are equal
Including multiple concave points or multiple salient points.The conductive particle that conductive component provided in an embodiment of the present invention solves existing key switch is easy
Electric arc is generated, causes surface to be burnt and the problem of conductive particle failure easy to oxidize, surface forms protective film by nano-deposit,
Have the characteristics that strong oxidation resistance, good conductivity, salt fog resistance are good.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram for conductive component that the embodiment of the present invention one provides；
Fig. 2 is a kind of schematic diagram of the cross section for conductive component that the embodiment of the present invention one provides；
Fig. 3 is structural representation when there are foreign matter or a dust in a kind of contact for conductive component that the embodiment of the present invention one provides
Figure；
Fig. 4 is a kind of structural schematic diagram of conductive component provided by Embodiment 2 of the present invention；
Fig. 5 is the structural schematic diagram of another conductive component provided by Embodiment 2 of the present invention；
Fig. 6 is a kind of schematic diagram of the strike test experiments of conductive component provided by Embodiment 2 of the present invention；
Fig. 7 is the statistics of the resistance data of conductive component after a kind of different cycles provided by Embodiment 2 of the present invention
Table；
Fig. 8 is the broken line of the resistance data of conductive component after a kind of different cycles provided by Embodiment 2 of the present invention
Figure；
Fig. 9 is the resistance data statistical form of conductive component under different loading pressure provided by Embodiment 2 of the present invention；
Figure 10 is a kind of manufacturing method flow chart for conductive component that the embodiment of the present invention three provides；
Figure 11 is that a kind of conductive component that the embodiment of the present invention three provides forms multiple concave points or more in the one side of metal layer
The manufacturing method flow chart of a salient point；
Figure 12 be the embodiment of the present invention three provide another conductive component the one side of metal layer formed multiple concave points or
The manufacturing method flow chart of multiple salient points；
Figure 13 is that layer of silica gel is incorporated into metal layer far from multiple recessed by a kind of conductive component that the embodiment of the present invention three provides
The manufacturing method flow chart of the side of point or multiple salient points；
Figure 14 is a kind of manufacturing method flow chart for conductive component that the embodiment of the present invention four provides.
Specific embodiment
The present invention is described in further detail with reference to the accompanying drawings and examples.It is understood that this place is retouched
The specific embodiment stated is used only for explaining the present invention rather than limiting the invention.It also should be noted that in order to just
Only the parts related to the present invention are shown in description, attached drawing rather than entire infrastructure.
Embodiment one
Fig. 1 is a kind of structural schematic diagram for conductive component that the embodiment of the present invention one provides.Referring to Fig. 1, the present invention is implemented
Example provides a kind of conductive component 100, including layer of silica gel 1, is set in turn in metal layer 2, the first electroplated layer of 1 side of layer of silica gel
3 and first nanometer layer 4, the side surface of metal layer 2, the first electroplated layer 3 and the first nanometer layer 4 far from layer of silica gel includes multiple
Concave point or multiple salient points.
Specifically, the metal layer 2 of conductive component 100 be used for turning circuit plate route, conductive component 100 be include metal
The switch of layer 2 and the moving contact of layer of silica gel 1.In existing automobile button switch, conductive component 100 will generally be born
The electric current of 50mA-500mA or so and the voltage of 12V-24V, when the golden finger of conductive component 100 and pcb board is combined closely
It waits, electric arc can be generated, be easy to burn the surface of conductive component 100, and the edge of the metal layer 2 of conductive component 100 is easy
Oxidation causes conductive component 100 not to be detached from completely with the golden finger of pcb board, causes short trouble.In conductive component 100
The first electroplated layer 3 is formed on metal layer 2, can make 2 surfacing of metal layer, forms coat of metal, improves conductive component 100
Electric conductivity, reduce corrosion oxidation.Only has the first electroplated layer 3 on metal layer 2, the metal of 3 metal surface of the first electroplated layer is sudden and violent
Dew, in the case where there is high current to pass through, the metal of the first electroplated layer 3 is easy to generate oxidation reaction with oxygen, if after manufacture
Placement is not appropriate, is easy to generate oxide layer, leads to 100 poor flow of conductive component.The first electroplated layer 3 on metal layer 2
Side far from metal layer 2 forms the first nanometer layer 4, can form densification on the surface of first electroplated layer 3 on 2 surface of metal layer
Nanometer layer protective film, to the first electroplated layer 3 formed closure film protection, effectively the first electroplated layer 3 is kept apart with oxygen,
On the basis of not influencing the electric conductivity of the first electroplated layer 3, reach antioxidant effect, while guaranteeing that conductive component 100 is effectively led
It is logical.The first electroplated layer 3 and the first nanometer layer 4 on metal layer 2 effectively improve the oxidation resistance of conductive component 1.
Conductive component 100 be closed with pcb board golden finger be connected when, the surface of pcb board golden finger dust and different if it exists
Object little particle is easy to cause poor flow, or even is not turned on completely.The metal layer 2 of conductive component 100 selects partially soft metal
Material, multiple concave points or more that the side surface of metal layer 2, the first electroplated layer 3 and the first nanometer layer 4 far from layer of silica gel includes
When a salient point, multiple concave points or multiple salient points are used to have foreign matter intrusion when conductive component 100 is connected, guarantee conductive component 100
Well contacted with circuit board, at the same conductive component 100 combine closely with the golden finger of pcb board need to separate when, it is multiple
Concave point or multiple salient points are detached from convenient for conductive component 100 and golden finger.
Conductive component disclosed by the embodiments of the present invention includes layer of silica gel, and is set in turn in the metal of layer of silica gel side
Layer, the first electroplated layer and the first nanometer layer, the side surface of metal layer, the first electroplated layer and the first nanometer layer far from layer of silica gel are equal
Including multiple concave points or multiple salient points.The conductive particle that conductive component provided in an embodiment of the present invention solves existing key switch is easy
Electric arc is generated, causes surface to be burnt and the problem of conductive particle failure easy to oxidize, surface forms protective film by nano-deposit,
Have the characteristics that strong oxidation resistance, good conductivity, salt fog resistance are good.
Fig. 2 is a kind of schematic diagram of the top view for conductive component that the embodiment of the present invention one provides.In above-described embodiment
On the basis of, referring to fig. 2, the cross section of the conductive component 100 can for multiple holes circle, ellipse, polygon or
Person has the figure of arc-shaped edges.It should be noted that the section that Fig. 2 illustratively draws conductive component 100 is round situation.
Specifically, it is overlooked from a side surface of the separate layer of silica gel of conductive component 100, it can be seen that entire top view is the
One nanometer layer 4, and the first nanometer layer 4 has multiple concave points or multiple salient points 21 far from the side of layer of silica gel, according to practical need
The cross section for wanting conductive component 100 can be circle, ellipse, polygon or the figure with arc-shaped edges with multiple holes
Shape, multiple holes are multiple concave points that metal layer, the first electroplated layer and the first nanometer layer have far from the side of layer of silica gel or more
A salient point 21.It should be noted that Fig. 2 illustratively draws the metal layer of conductive component 100, the first electroplated layer and first nanometer
Layer has multiple salient points 21 far from the side of layer of silica gel, and multiple salient points 21 are columned situation.
Optionally, combined with Figure 1 and Figure 2, along layer of silica gel 1 towards the direction of metal layer 2, the thickness of layer of silica gel 1 can be
0.3mm to 0.9mm, the thickness of metal layer 2 can be 0.05mm to 0.1mm.
Optionally, the multiple concave points or multiple salient points 21 of side of the metal layer 2 far from layer of silica gel 1 can be the touching with chamfering
Point；The chamfering of contact can be the angle R, and contact can be column, and cross sectional shape can be circle, diamond shape, quadrangle, ellipse
Or irregular figure.It should be noted that the cross sectional shape that Fig. 2 illustratively draws contact is round situation.Optionally,
Along layer of silica gel 1 towards the direction of metal layer 2, the height of contact can be 0.01-0.04mm.
Specifically, the wedge angle of the surface contact of conductive component 100 or section edges out-of-flatness are easy to destroy the gold of pcb board
Finger route causes conducting stroke not contact completely, leads to short circuit or disconnected between conductive component 100 and the golden finger of pcb board
Road.When by different Current Voltages, the wedge angle physical property of the surface contact of conductive component 100 is easy to be broken
It is bad, so as to cause poor flow or the harm of burning, it is easy to cause the danger that conductive component 100 is not turned on completely due to oxidation
Danger.Multiple concave points or multiple salient point 21 of the metal layer 2 of conductive component 100 far from the side of layer of silica gel 1 can be the touching with the angle R
Point, multiple contacts are in the same size, the consistent well-regulated multiple concave points of height or 21 contact surface of multiple salient points, the angle R contact end
Structure design of the contact surface formed in conjunction with layer of silica gel is held, makes conductive component 100 that there is elasticity, the well-regulated angle R contact shape
At the contact surface that line surface state and the consistent multiple concave points of height or multiple salient points are formed, strike 500,000 times repeatedly can be carried
Without compressive deformation, durability should not reduce height stroke by force to improve the anti-pressure ability of conductive component 100, make conductive part
Part 100 can be by the test of impact experiment.21 numbers of surface salient point can be for 203982/㎡.The angle circle R contact surface
The height of the first electroplated layer 3 it is consistent, 4 height of the first nanometer layer is also consistent.The design of the angle R contact, can effectively avoid conductive component
100 damage golden fingers when being contacted with pcb board and the case where destroy circuit, the design of the angle R contact, surface contact is more mellow and fuller, can keep away
Exempt from the danger that contact edges wedge angle is easy to produce electric arc when being powered and burns conductive component 100.
Fig. 3 is structural representation when there are foreign matter or a dust in a kind of contact for conductive component that the embodiment of the present invention one provides
Figure.Referring to Fig. 3, even if when the golden finger surface of pcb board 8 has foreign matter or dust 8 to contact with the contact with the angle R, surface touching
The angle point R can avoid, and conductive component 100 is allow to completely attach to conducting, the adjacent angle R contact have it is soft, foreign matter or dust 8 into
The height for entering the angle R behind contact point can be avoided, and so as to inhibit the reduction of contact area, avoid conductive component 100 occurs contacting
Bad phenomenon.
Embodiment two
The present embodiment is a kind of optinal plan proposed on the basis of the above embodiments.Fig. 4 is the embodiment of the present invention two
A kind of structural schematic diagram of the conductive component provided.Referring to fig. 4, the conductive component 100 that the embodiment of the present invention proposes, can also wrap
Include the second electroplated layer 5 being set in turn between metal layer 2 and layer of silica gel 1 and the second nanometer layer 6.
Specifically, 2 edges of the metal layer of conductive component 100 are easy to oxidize, and metal layer 2 directly connects with layer of silica gel 1
The phenomenon that connecing, being easy to happen degumming forms the second electroplated layer 5 close to the side of layer of silica gel 1 in the metal layer 2 of conductive component 100,
It can make side surfacing of the metal layer 2 close to layer of silica gel 1, form coat of metal, reduce corrosion oxidation, improve metal layer
2 oxidation resistance.Only has the second electroplated layer 5 on metal layer 2, the metal exposure on the surface of the second electroplated layer 5 is having high current
In the case where, the metal of the second electroplated layer 5 is easy to generate oxidation reaction with oxygen, and generates oxide layer, leads to conductive part
100 poor flow of part.The second electroplated layer 5 on metal layer 2 forms the second nanometer layer 6 far from the side of metal layer 2, and second receives
Rice layer 6 can form fine and close nanometer layer protective film on the surface of the second side of the electroplated layer 5 far from metal layer 2, to the second electricity
Coating 5 forms the protection of closure film, effectively keeps apart the metal of the second electroplated layer 5 with oxygen, reaches antioxidant effect, together
When the second nanometer layer 6 be easier connect with silica gel, guarantee conductive component 100 layer of silica gel closely connect with metal layer 2, avoid out
The case where existing degumming.Conductive component 100 is set to the second electroplated layer 5 and the second nanometer layer 6 between metal layer 2 and layer of silica gel 1
It is not oxidized for guard metal layer 2, while the second nanometer layer 6 is for making being bonded between metal layer 2 and layer of silica gel 1.
Optionally, Fig. 5 is the structural schematic diagram of another conductive component provided by Embodiment 2 of the present invention.Referring to Fig. 5,
One electroplated layer 3 may include the first nickel coating 31 and the first Gold plated Layer 32 on 31 surface of the first nickel coating, and the second electroplated layer 5 can
To include the second nickel coating 51 and in second Gold plated Layer 52 on 51 surface of the second nickel coating.
Specifically, the first nickel coating 31 is in side of the metal layer 2 far from layer of silica gel 1, for metal layer 2 to be completely covered,
There is provided substrate for the first Gold plated Layer 32, the first Gold plated Layer 32 can be formed for fine and close 23K gold, the first Gold plated Layer 32 it is fine and close and
Uniform surface, convenient for forming the first nanometer layer 4 on the surface of the first Gold plated Layer 32.
Optionally, along layer of silica gel 1 towards the direction of metal layer 2, the thickness of the thickness of the first electroplated layer 3 and the second electroplated layer 5
Degree is respectively 0.05um-0.6um.
Optionally, system experimentation is carried out to conductive component, detects the functional reliability of conductive component.Fig. 6 is of the invention real
A kind of schematic diagram of the strike test experiments of conductive component of the offer of example two is provided.Referring to Fig. 6, the quality of modular pressure 10 is adjustable,
The voltage and current of power module 9 is adjustable, carries out contact experiment by control conductive component 100 and pcb board 7.Fig. 7 is the present invention
The statistical form of the resistance data of conductive component after a kind of different cycles that embodiment two provides.In conjunction with Fig. 6 and Fig. 7, will press
Power module 10 is set as the pressure that 200 grams of quality generates, and the voltage and current of power module 9 is respectively set to 12V/
1000mA, the repetition for carrying out different number of blows to conductive component are tested, and illustratively, carry out 0 time, 5 to conductive component respectively
Repetition experiment after ten thousand times, 100,000 times, 150,000 times, 200,000 times, 250,000 times and 300,000 times impacts, each number of blows carry out 10
It is secondary to repeat to test, after detecting different number of blows, record the contact resistance when conducting of conductive component 100 and pcb board 7.Fig. 8 is
The line chart of the resistance data of conductive component after a kind of different cycles provided by Embodiment 2 of the present invention.In conjunction with Fig. 7 and figure
8, the resistance data of conductive component after the different cycles test in Fig. 7 is depicted as line chart, referring to Fig. 8, is repeated several times
The contact resistance variation trend of experiment is consistent, and the conducting resistance of the conductive component after by different number of blows concentrates on
Between 0.16 Ω -0.46 Ω, the contact resistance of conductive component meets the requirement of anti-cycle experiment, and contact resistance is less than 0.5
Ω。
Fig. 9 is the resistance data statistical form of conductive component under different loading pressure provided by Embodiment 2 of the present invention.In conjunction with
The voltage and current of Fig. 6 and Fig. 9, power module 9 are respectively set to 12V/500mA, and the weight of different pressures is carried out to conductive component
Multiple experiment, the pressure that the quality that modular pressure 10 is set as 50 grams -500 grams is generated, illustratively, respectively by modular pressure 10
Quality settings be 50 grams, 100 grams, 150 grams, 200 grams, 250 grams, 300 grams, 350 grams, 400 grams and 500 grams, to conductive component
Pressure test is carried out, 10 repetitions is carried out and tests, record the contact resistance when conducting of conductive component 100 and pcb board 7 respectively
Value.Referring to Fig. 9, under the conditions of different loadings, the contact resistance of conductive component 100 is both less than 0.6 Ω, requires less than this field
Less than 1 Ω, load intensity is also above 200 grams -250 grams of the loading range that this field requires.The contact resistance of conductive component 100
Smaller, the conducting response time of conductive component 100 is faster, and the conducting response time of conductive component 100 is less than 0.5ms.
Conductive component provided in an embodiment of the present invention is easy to produce electricity when solving the conductive particle work of existing key switch
Arc, causes surface to be burnt and the problem of conductive particle failure easy to oxidize, meanwhile, conductive component is included in metal layer and layer of silica gel
Between the second electroplated layer and the second nanometer layer, surface by nanometer layer formed protective film, have the characteristics that oxidation resistance is strong,
The metal layer of conductive component can also be made to connect with layer of silica gel stronger, the conductive component that the embodiment of the present invention proposes has material
Softness, charge carrier are high, conduct electricity very well, and weatherability is strong, anti-oxidant and contamination resistance is strong and spy with long service life
Point, the consistent contact surface surfacing for having the angle R contact to be formed of the height of multiple rules, the conducting resistance of conductive component is steadily
Less than 0.05 Ω/cm, pressure-resistant range is 12V-24V, and resistant to flow range is 500mA-1000mA, and is discontinuously converted through low high current
Electric arc is not generated when contact, can directly control tail-off, and the response time is connected less than 0.5ms.
Embodiment three
Figure 10 is a kind of manufacturing method flow chart for conductive component that the embodiment of the present invention three provides.Referring to Figure 10, this hair
Bright embodiment provides a kind of manufacturing method of conductive component, comprising:
S100, multiple concave points or multiple salient points are formed in the one side of metal layer.
Specifically, the material of metal layer can be copper, nickel, aluminium or alloy, preferably pure iron metal substrate, by metal base plus
Work is at 145mmX215mm sheet material, and then metal base is handled through over etching or pressing mold, pre- using baking by being activated
If the time, multiple concave points or multiple salient points can be formed in the one side of metal layer by being cleaned with pure water.
S200, one side the first electroplated layer of formation for forming multiple concave points or multiple salient points on the metal layer.
Specifically, the metal layer of multiple concave points or multiple salient points will impregnates oil removing on one side, using electrolytic degreasing.To one
Face have the layer on surface of metal of multiple concave points or multiple salient points can gold-plated, nickel plating, plating tungsten, illustratively nickel preplating, then plating is precious
Pearl nickel, then it is gold-plated, form the first electroplated layer.
S300, the side on first electroplated layer far from the metal layer form the first nanometer layer.
Specifically, cleaning forms the metal layer after the first electroplated layer, far from metal layer on first electroplated layer
Side carries out plating nanometer layer processing, forms the first nanometer layer.
S400, layer of silica gel is incorporated into side of the metal layer far from multiple concave points or multiple salient points.
Specifically, cleaning forms the metal layer after the first nanometer layer, the spray deposit or printing silica gel to cleaning
Viscous connection agent, metal layer of the baking with the viscous connection agent of silica gel, is put into pretreated mold for metal layer and silica gel ground and closes
Mould, metal layer and silica gel ground once vulcanize by high temperature oil pressure and high temperature, and layer of silica gel is made to be incorporated into metal layer far from multiple recessed
The side of point or multiple salient points, and carry out punching press or cut, conductive component is made.
The manufacturing method of conductive component provided in an embodiment of the present invention, process flow is simple, no replacement is required mold, cost
Low, the side on the first electroplated layer far from metal layer carries out plating the first nanometer layer processing, forms layer protecting film for metal layer,
Avoiding chemical reaction from penetrating metal layer influences the contact conducting of conductive component, and the first nanometer layer can be with surfactant-tolerant, ammonia alcohol
Solution, sweat stain, cola, petroleum ether, ethyl alcohol, plastic cleaning agent, cockpit detergent, lubricating grease, lubricating oil, machine oil etc..This is led
Conductive component made from the manufacturing method of electrical components be connected the response time less than 0.5 millisecond, can effectively prevent foreign matter enter it is gold-plated
In layer, keep conductive component insensitive to dirty or dust, high reliablity can be realized when colliding with golden finger and directly be contacted, moreover it is possible to
Make the resistance stabilization of conductive component, contact resistance is unrelated with contact pressure.
Optionally, Figure 11 be the embodiment of the present invention three provide a kind of conductive component formed in the one side of metal layer it is multiple recessed
The manufacturing method flow chart of point or multiple salient points.Referring to Figure 11, multiple concave points or multiple convex S100, are formed in the one side of metal layer
Point may include:
S101, metal base is provided.
Specifically, selection has conductive metal base, and the material of metal base can be copper, nickel, aluminium, stainless steel or conjunction
Gold, the preferably metal base of pure nickel material, the thickness of metal base can be 0.02mm-1.5mm, size according to mold size,
The size of metal base illustratively can be cut into 70mmX70mm, 145mmX215mm by the adjustable size of structure.
S102, the etching metal base, form multiple concave points or multiple salient points.
Specifically, electrode fixing holes are beaten at the edge of metal base, preferentially makes a call to 6 diameters at the edge of metal base
The electrode fixing holes of 1.5mm, in case fixed metal base when plating.Then the spacing of setting, example the prefabricated film is made
Property, spacing can be optional for 0.01-1mm, and metal base is etched to the consistent well-regulated band of height by shining line stretch processing
The multiple concave points or multiple salient points of rounded corners, and rounded corners are the angle R, multiple concave points or multiple salient points are in the same size and high
Identical contact is spent, multiple concave points or multiple salient point ideals are 203982 Ge/㎡.
S103, it is activated the metal base, and toasts the metal base after being activated, baking time is pre-
If the time.
Specifically, the halftone being pre-designed is covered on the surface of metal base, on the halftone being pre-designed printing or
Person sprays chemical solvent, can be environmentally friendly turquoise oil chemical solvent illustratively, pre- using baking by being activated
If the time, preferably toasts 40 minutes, clean metal base with pure water, the metal of multiple concave points with the angle R or multiple salient points is made
Substrate.
Optionally, Figure 12 be the embodiment of the present invention three provide another conductive component formed in the one side of metal layer it is multiple
The manufacturing method flow chart of concave point or multiple salient points.It should be noted that the not technical detail of detailed description in the present embodiment
It can be found in above-mentioned any embodiment.Based on the above method, referring to Figure 12, S100, metal layer one side formed it is multiple
Concave point or multiple salient points may include:
S111, metal base is provided.
S112, the etching metal base, form multiple concave points or multiple salient points.
S113, the etching metal base, form after multiple concave points or multiple salient points, further includes: in institute
The side far from multiple concave points or multiple salient points for stating metal base forms shaggy lines.
Specifically, the sand paper of 100 mesh of the side by metal base far from multiple concave points or multiple salient points surface back and forth
Wiping, makes metal base form coarse lines far from the surface of the side of multiple concave points or multiple salient points, then clear up Metal Substrate
The surface of metal base is cleared up on the surface of material, illustratively, the pure industrial alcohol that can be 99.2% with concentration.Make metal base
The surface of side far from multiple concave points or multiple salient points forms coarse lines, for make metal layer securely with layer of silica gel knot
It is combined, conductive component is avoided to occur the phenomenon that metal layer and layer of silica gel disengaging in use.
S114, it is activated the metal base, and toasts the metal base after being activated, baking time is pre-
If the time.
Figure 13 is that layer of silica gel is incorporated into metal layer far from multiple recessed by a kind of conductive component that the embodiment of the present invention three provides
The manufacturing method flow chart of the side of point or multiple salient points.Referring to Figure 13, S400, that layer of silica gel is incorporated into the metal layer is separate
The side of multiple concave points or multiple salient points, comprising:
S401, the cleaning metal layer formed after the first nanometer layer.
Specifically, when cleaning the metal layer after forming the first nanometer layer, industrial alcohol washes can be used.
S402, the spray deposit or the viscous connection agent of printing silica gel to cleaning, baking is with the viscous connection agent of the silica gel
The metal layer.
Specifically, one layer of silicon is uniformly sprayed or printed far from the surface of the first nanometer layer side in the metal layer cleaned
Gluing joins agent, and the thickness of the viscous connection agent of silica gel can be 0.01mm-0.03mm, will spray or be printed with the metal layer of the viscous connection agent of silica gel
It is put into high temperature roaster and carries out baking preset time, the temperature setting of high temperature roaster is 100 DEG C -120 DEG C of constant temperature, and preset time can be with
For 1h-1.5h.
S403, the metal layer and the silica gel ground are molded.
Specifically, the cavity surface for a face mold of the mold of molding needs first to polish, and one layer of hard chrome is then electroplated,
Preventing microparticle from falling into cannot clear up in die cavity and lead to the surface scratches of metal layer or generate impression, another face mould of molding
The die cavity of tool can corrode as well-regulated multiple concave points, and one layer of hard chrome is then electroplated, one wheat flour of silica gel ground in molding
At well-regulated salient point, the shapes of multiple concave points of die cavity can be round, ellipse, quadrangle or irregular shape, excellent
Choosing is round, and allow silica gel ground is made well-regulated salient point on one side, and the very difficult stick to each other that contacts with each other forms silica gel ground
The cavity depth of mold can be 0.1mm-5mm, 6 positioning columns are formulated around the die cavity of mold, prevent that mold from entering when
Wait metal layer displacement.
The material of silica gel ground can be flexible rubber, can also be hardness and elongation is less than the other materials of metal
Material, rubber includes synthetic rubber, silicone rubber, polyurethane rubber etc..The thickness of silica gel ground can be 0.3mm-
The surface of 0.9mm, silica gel ground can smooth or out-of-flatnesses.It is preferred that the solid silicone of Japan SHIN-ETSU HANTOTAI KE-941, inside silica gel
Vulcanizing agent and color masterbatch is added, vulcanizing agent proportion is 0.8%, and solid silicone is kneaded uniformly, and mixing time is preferably 15 minutes, silica gel
Certain thickness laminar silica gel coiled strip is made, such as thickness can be 1.2mm, 0.5mm-0.6mm or 0.6mm-
0.7mm.The silica gel ground of specific dimensions is cut into cutting machine.
Metal layer and silica gel ground are superimposed together, is put into prefabricated mould cavity and is molded, the die cavity of mold
Depth can be according to requiring to select, and illustratively, cavity depth can be 0.1mm-5.0mm.Mold is mountable in injection molding machine, oil
In press, hydraulic press, forging press or equipment with pressure, pressure can be set to 10kg/cm-200kg/cm, the mould of molding
Tool can be heated or not heated, and the time of clamping pressure can be set as 1s-500s, carry out molding forging and stamping.
S404, high temperature oil pressure and high temperature once vulcanize the metal layer and the silica gel ground.
Specifically, after molding forging and stamping, high temperature oil pressure metal layer and unvulcanized silica gel ground make metal layer and non-sulphur
The silica gel ground of change forms, and silica gel ground is neatly placed on metal layer middle position, is put into inside the die cavity of mold and carries out high temperature one
Secondary vulcanization, upper mold temperature can be set to 195 DEG C, and lower die temperature can be set to 185 DEG C, and board pressure can be 180kg/
Cm, adding the sulphur time can be 180s, and the silica gel ground of 145mmX215mm and the complex of metal layer are made after depanning.Cleaning system
At silica gel ground and metal layer complex surface, then with 10 tons of vertical punching machine, be punched into the conductive part of 1.5mm-8mm
Part, due to unique mold design, the surface of the conductive component after punching and flush edge are without unfilled corner and burr.It needs to illustrate
It is that layer of silica gel can be greater than or equal to the size of metal layer, layer of silica gel can have multiple salient points or without multiple salient points.
Example IV
Figure 14 is a kind of manufacturing method flow chart for conductive component that the embodiment of the present invention four provides.It should be noted that
The technical detail of detailed description not can be found in above-mentioned any embodiment in the present embodiment.On the basis of the above embodiments, join
See Figure 14, the manufacturing method of conductive component may include:
S501, multiple concave points or multiple salient points are formed in the one side of metal layer.
S502, one side the first electroplated layer of formation for forming multiple concave points or multiple salient points on the metal layer.
It should be noted that the one side for forming multiple concave points or multiple salient points on the metal layer forms the first electroplated layer
Oil removing can be impregnated to metal base, then electrolytic degreasing is passed through to metal base, then there are multiple concave points or more to metal base
The one side of a salient point carries out nickel preplating, then plates pearl nickel, then plates 23K gold again, forms the first electroplated layer.
The first electroplated layer can also be formed by accurate electric plating method, it is specific as follows: preparatory molding, the bore dia of mold
For the diameter of conductive component, plating area, electroplating time and thickness of coating are arranged by computer programming, are only being punched to conduction
The first electroplated layer is formed on the metal layer of the position of component, can accomplish that Accurate Points are electroplated.It is multiple recessed without being had on whole surface
It is gold-plated on the metal base of point or multiple salient points, it avoids after punching molding, is plated on the extra leftover pieces except conductive component
Gold causes to waste, and can greatly reduce cost.
While S503, the one side for forming multiple concave points or multiple salient points on the metal layer form the first electroplated layer,
Further include: the second electroplated layer is formed between the metal layer and the layer of silica gel.
Specifically, while forming the one side of multiple concave points or multiple salient points on the metal layer and form the first electroplated layer,
The second electroplated layer is formed between metal layer and layer of silica gel, oil removing can be impregnated to metal base, then to metal base by being electrolysed
Oil removing fits a layer into metal on Electropolating hangers, and the pre- gold-plated pore electrod of 6 1.5mm can be used, then separate to metal base
The one side of multiple concave points or multiple salient points carries out nickel preplating, then plates pearl nickel, then plates 23K gold again, forms the second electroplated layer.
S504, the side on first electroplated layer far from the metal layer form the first nanometer layer.
S505, on first electroplated layer far from the metal layer side formed nanometer layer while, further includes:
Side on second electroplated layer far from the metal layer forms the second nanometer layer.
Specifically, cleaning forms the metal layer after the first electroplated layer and the second electroplated layer, separate on the second electroplated layer
The side of metal layer carries out plating nanometer layer processing, forms the second nanometer layer.
S506, layer of silica gel is incorporated into side of the metal layer far from multiple concave points or multiple salient points.
The manufacturing method of conductive component provided in an embodiment of the present invention forms multiple concave points or multiple salient points on the metal layer
One side formed the first electroplated layer while, the second electroplated layer is formed between metal layer and layer of silica gel, on the first electroplated layer
While side far from metal layer forms nanometer layer, the side on the second electroplated layer far from metal layer forms second nanometer
Layer does not need increase equipment, without more mold exchange, and simple process is easy to accomplish, lower production costs.It is led made from this method
All there are the first electroplated layer and the first nanometer layer, the second electroplated layer and the second nanometer layer in the two sides of the metal layer of electrical components respectively, leads
The conducting resistance of electrical components is small, it is not easy to generate electric arc, having nanometer layer to protect, the weatherability of conductive component is strong, conducting is good and anti-
Oxidability is strong.
Embodiment five
The embodiment of the invention provides a kind of button switch, the conductive component proposed including any of the above-described embodiment.This is pressed
The golden finger of the first nanometer layer and pcb board on the metal layer for the conductive component that button switch is proposed by any of the above-described embodiment into
Row contact, makes the good on or off of pcb board.
The conducting resistance of button switch conductive component provided in an embodiment of the present invention is small, it is not easy to generate electric arc, there is nanometer
The weatherability of layer protection conductive component is strong, conducting is good and oxidation resistance is strong.Button switch provided in an embodiment of the present invention is led
The beneficial effect for the conductive component that there is electrical components any of the above-described embodiment to provide.
Note that the above is only a better embodiment of the present invention and the applied technical principle.It will be appreciated by those skilled in the art that
The invention is not limited to the specific embodiments described herein, be able to carry out for a person skilled in the art it is various it is apparent variation,
It readjusts and substitutes without departing from protection scope of the present invention.Therefore, although being carried out by above embodiments to the present invention
It is described in further detail, but the present invention is not limited to the above embodiments only, without departing from the inventive concept, also
It may include more other equivalent embodiments, and the scope of the invention is determined by the scope of the appended claims.
Claims (14)
1. a kind of conductive component characterized by comprising
Layer of silica gel；
It is set in turn in the metal layer, the first electroplated layer and the first nanometer layer of the layer of silica gel side, the metal layer, described
The side surface of one electroplated layer and first nanometer layer far from the layer of silica gel includes multiple concave points or multiple salient points.
2. conductive component according to claim 1, which is characterized in that further include being set in turn in the metal layer and described
The second electroplated layer and the second nanometer layer between layer of silica gel.
3. conductive component according to claim 2, which is characterized in that
First electroplated layer includes the first nickel coating and the first Gold plated Layer in the first nickel plating layer surface；
Second electroplated layer includes the second nickel coating and the second Gold plated Layer in the second nickel plating layer surface.
4. conductive component according to claim 1, which is characterized in that
The cross section of the conductive component is circle, ellipse, polygon or the figure with arc-shaped edges with multiple holes
Shape.
5. conductive component according to claim 1, which is characterized in that
Along the layer of silica gel towards the direction of the metal layer, the layer of silica gel with a thickness of 0.3mm to 0.9mm, the metal
Layer with a thickness of 0.05mm to 0.1mm.
6. conductive component according to claim 1, which is characterized in that
The multiple concave points or multiple salient points of side of the metal layer far from the layer of silica gel are the contact with chamfering；
The chamfering of the contact is the angle R；
The contact is column, and cross sectional shape is circle, diamond shape, quadrangle, ellipse or irregular figure.
7. conductive component according to claim 1, which is characterized in that
Along the layer of silica gel towards the direction of the metal layer, the height of the contact is 0.01-0.04mm.
8. conductive component according to claim 2, which is characterized in that
Along the layer of silica gel towards the direction of the metal layer, the thickness of the thickness of first electroplated layer and second electroplated layer
Degree is respectively 0.05um-0.6um.
9. a kind of manufacturing method of conductive component characterized by comprising
Multiple concave points or multiple salient points are formed in the one side of metal layer；
The one side for forming multiple concave points or multiple salient points on the metal layer forms the first electroplated layer；
Side on first electroplated layer far from the metal layer forms the first nanometer layer；
Layer of silica gel is incorporated into side of the metal layer far from multiple concave points or multiple salient points.
10. the manufacturing method of conductive component according to claim 9, which is characterized in that formed in the one side of metal layer more
A concave point or multiple salient points, comprising:
Metal base is provided；
The metal base is etched, multiple concave points or multiple salient points are formed；
It is activated the metal base, and toasts the metal base after being activated, baking time is preset time.
11. the manufacturing method of conductive component according to claim 10, which is characterized in that the etching Metal Substrate
Material is formed after multiple concave points or multiple salient points, further includes:
Shaggy lines is formed in the side far from multiple concave points or multiple salient points of the metal base.
12. the manufacturing method of conductive component according to claim 9, which is characterized in that
While one side first electroplated layer of formation for forming multiple concave points or multiple salient points on the metal layer, also wrap
It includes:
The second electroplated layer is formed between the metal layer and the layer of silica gel.
While the side on first electroplated layer far from the metal layer forms nanometer layer, further includes:
Side on second electroplated layer far from the metal layer forms the second nanometer layer.
13. the manufacturing method of conductive component according to claim 9, which is characterized in that described that layer of silica gel is incorporated into institute
State side of the metal layer far from multiple concave points or multiple salient points, comprising:
Clean the metal layer after the first nanometer layer of the formation；
The spray deposit or the viscous connection agent of printing silica gel to cleaning, the metal of the baking with the viscous connection agent of the silica gel
Layer；
The metal layer and the silica gel ground are molded；
High temperature oil pressure and high temperature once vulcanize the metal layer and the silica gel ground.
14. a kind of button switch, which is characterized in that including the described in any item conductive components of claim 1-8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201811606001.5A CN109461603A (en) | 2018-12-25 | 2018-12-25 | Conductive component, button switch and electrically conductive feature fabrication process |
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| CN201811606001.5A CN109461603A (en) | 2018-12-25 | 2018-12-25 | Conductive component, button switch and electrically conductive feature fabrication process |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111029181A (en) * | 2019-12-20 | 2020-04-17 | 南通万德科技有限公司 | Electric contact for local plating |
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