CN109460693A - Optical fingerprint sensor and terminal device - Google Patents
Optical fingerprint sensor and terminal device Download PDFInfo
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- CN109460693A CN109460693A CN201710796562.5A CN201710796562A CN109460693A CN 109460693 A CN109460693 A CN 109460693A CN 201710796562 A CN201710796562 A CN 201710796562A CN 109460693 A CN109460693 A CN 109460693A
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- fingerprint sensor
- optical fingerprint
- layer
- photoinduction
- glass substrate
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The present invention relates to optical fingerprint sensor technical fields, more particularly to a kind of optical fingerprint sensor and terminal device, the optical fingerprint sensor is installed on terminal device, the optical fingerprint sensor includes glass substrate and photoinduction pixel layer, the photoinduction pixel layer fitting is set to the side of glass substrate, photoinduction pixel layer is for converting optical signals to electric signal, photoinduction image is obtained to be sent to the master chip of the optical fingerprint sensor, the glass substrate is uniformly equipped with glue relative between the side of photoinduction pixel layer place side and the glass cover-plate of the terminal device, the optical fingerprint sensor is fixed on the terminal device.Since the glass substrate is that smoothly, therefore, which can tile relative to the glue where photoinduction pixel layer between the one side and glass cover-plate of side relative to the one side of side where photoinduction pixel layer, will not generate bubble.
Description
Technical field
The present invention relates to optical fingerprint sensor technical fields, in particular to a kind of optical fingerprint sensor
And terminal device.
Background technique
In existing optical fingerprint sensor, since the side of glass substrate, and light is arranged in COF flexible circuit board
Inducing pixel layer and other hierarchical structures are set to the same side of glass substrate, and COF flexible circuit board and photoinduction pixel
Layer and other hierarchical structures there are the differences in height of 50um, so when the glass substrate setting COF flexible circuit board side with
When the glass cover-plate of terminal device is fit together using glue, the binding face out-of-flatness of glue and bubble can be generated, influence light
The realization of formula fingerprint sensor effect.Therefore it provides a kind of new optical fingerprint sensor is very necessary.
Summary of the invention
The purpose of the present invention is to provide a kind of optical fingerprint sensor, to realize so that optical fingerprint sensor with
Glue binding face between the glass cover-plate of terminal device is smooth, does not generate bubble.
Another object of the present invention is to provide a kind of terminal devices, to realize optical fingerprint sensor and terminal device
Glass cover-plate between glue binding face it is smooth, do not generate bubble.
To achieve the goals above, technical solution used in the embodiment of the present invention is as follows:
In a first aspect, the embodiment of the invention provides a kind of optical fingerprint sensor, the optical fingerprint sensor
It is set to terminal device, the optical fingerprint sensor includes glass substrate and photoinduction pixel layer, the photoinduction picture
Plain layer fitting is set to the side of the glass substrate, and the photoinduction pixel layer is used to convert optical signals to electric signal, with
The master chip for being sent to the optical fingerprint sensor obtains photoinduction image, and the glass substrate is relative to the photoinduction picture
It is uniformly equipped with glue between the side of side and the glass cover-plate of the terminal device where plain layer, the optical profile type is referred to
Line sensor is fixed on the terminal device.
Further, the optical fingerprint sensor further includes TFT pixel circuit switching layer, the TFT pixel circuit
Switching layer is set on the photoinduction pixel layer, and the photoinduction pixel layer is used to the optical signal sensed being converted to telecommunications
Number and the master chip of the optical fingerprint sensor is sent to through the TFT pixel circuit switching layer.
Further, the optical fingerprint sensor further includes protective layer, and the protective layer is set to the TFT pixel
It is described protective layer used in the protection TFT pixel circuit switching layer and the photoinduction pixel layer on circuit switch layer.
Further, the optical fingerprint sensor further includes COF flexible circuit board, and the COF flexible circuit board is set
It is placed in the glass substrate, the COF flexible circuit board is used to receive the electric signal of the TFT pixel circuit switching layer transmission simultaneously
The electric signal is sent to the master chip of the optical fingerprint sensor.
Further, the optical fingerprint sensor further includes anisotropic conductive adhesive paste, the anisotropic conductive adhesive paste setting
Between the COF flexible circuit board and the glass substrate, the anisotropic conductive adhesive paste is different types of for connecting other
Circuit board.
Further, the optical fingerprint sensor further includes circuit interface, and the circuit interface is set to described different
Between side's property conducting resinl and the glass substrate, the circuit interface is for connecting other variety classes circuits.
Second aspect is equipped with optical profile type on the terminal device the embodiment of the invention also provides a kind of terminal device
Fingerprint sensor, the optical fingerprint sensor include glass substrate and photoinduction pixel layer, the photoinduction pixel layer
Fitting is set to the side of the glass substrate, and the photoinduction pixel layer is for converting optical signals to electric signal, to send
Master chip to the optical fingerprint sensor obtains photoinduction image, and the glass substrate is relative to the photoinduction pixel layer
It is uniformly equipped with glue between the side of place side and the glass cover-plate of the terminal device, the optical fingerprint is passed
Sensor is fixed on the terminal device.
Further, the optical fingerprint sensor further includes TFT pixel circuit switching layer, the TFT pixel circuit
Switching layer is set on the photoinduction pixel layer, and the photoinduction pixel layer is used to the optical signal sensed being converted to telecommunications
Number and the master chip of the optical fingerprint sensor is sent to through the TFT pixel circuit switching layer.
Further, the optical fingerprint sensor further includes protective layer, and the protective layer is set to the TFT pixel
It is described protective layer used in the protection TFT pixel circuit switching layer and the photoinduction pixel layer on circuit switch layer.
Further, the optical fingerprint sensor further includes COF flexible circuit board, and the COF flexible circuit board is set
It is placed in the glass substrate, the COF flexible circuit board is used to receive the electric signal of the TFT pixel circuit switching layer transmission simultaneously
The electric signal is sent to the master chip of the optical fingerprint sensor.
A kind of optical fingerprint sensor and terminal device provided in an embodiment of the present invention, optical fingerprint sensor peace
Loaded on terminal device, which includes glass substrate and photoinduction pixel layer, the photoinduction pixel layer
Fitting is set to the side of glass substrate, and photoinduction pixel layer is for converting optical signals to electric signal, to be sent to the light
The master chip of formula fingerprint sensor obtains photoinduction image, and the glass substrate is relative to side where the photoinduction pixel layer
It is uniformly equipped with glue between the side in face and the glass cover-plate of the terminal device, the optical fingerprint sensor is consolidated
Due to the terminal device.Due to, the glass substrate relative to the one side of side where photoinduction pixel layer be it is smooth, because
This, which can tile relative to the glue where photoinduction pixel layer between the one side and glass cover-plate of side, no
Bubble can be generated.
To enable the above objects, features and advantages of the present invention to be clearer and more comprehensible, preferred embodiment is cited below particularly, and cooperate
Appended attached drawing, is described in detail below.
Detailed description of the invention
In order to illustrate the technical solution of the embodiments of the present invention more clearly, below will be to needed in the embodiment attached
Figure is briefly described, it should be understood that the following drawings illustrates only certain embodiments of the present invention, therefore is not construed as pair
The restriction of range for those of ordinary skill in the art without creative efforts, can also be according to this
A little attached drawings obtain other relevant attached drawings.
Fig. 1 shows the structural schematic diagram of optical fingerprint sensor in the prior art.
Fig. 2 shows the application environment schematic diagrames of optical fingerprint sensor in the prior art.
Fig. 3 shows a kind of structural schematic diagram of optical fingerprint sensor provided in an embodiment of the present invention.
Fig. 4 shows a kind of application environment schematic diagram of optical fingerprint sensor provided in an embodiment of the present invention.
Diagram: 10- optical fingerprint sensor；110- glass substrate；120- photoinduction pixel layer；130-TFT pixel electricity
Way switch layer；140- protective layer；150- circuit interface；160- anisotropic conductive adhesive paste；170-COF flexible circuit board；180- glass
Cover board；20- optical fingerprint sensor；210- glass substrate；220- photoinduction pixel layer；230-TFT pixel circuit switching layer；
240- protective layer；250- circuit interface；260- anisotropic conductive adhesive paste；270-COF flexible circuit board；280- glass cover-plate；200-
Glue.
Specific embodiment
Below in conjunction with attached drawing in the embodiment of the present invention, technical solution in the embodiment of the present invention carries out clear, complete
Ground description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Usually exist
The component of the embodiment of the present invention described and illustrated in attached drawing can be arranged and be designed with a variety of different configurations herein.Cause
This, is not intended to limit claimed invention to the detailed description of the embodiment of the present invention provided in the accompanying drawings below
Range, but it is merely representative of selected embodiment of the invention.Based on the embodiment of the present invention, those skilled in the art are not doing
Every other embodiment obtained under the premise of creative work out, shall fall within the protection scope of the present invention.
It should also be noted that similar label and letter indicate similar terms in following attached drawing, therefore, once a certain Xiang Yi
It is defined in a attached drawing, does not then need that it is further defined and explained in subsequent attached drawing.Meanwhile of the invention
In description, term " first ", " second " etc. are only used for distinguishing description, are not understood to indicate or imply relative importance.
Optical fingerprint sensor 20 provided in an embodiment of the present invention is installed on terminal device (not shown), the optics
Formula fingerprint sensor 20 is mountable to the position of the front lower section of terminal device, such as the position of the home key of iPhone, the light
Formula fingerprint sensor 20 can also be installed on the back position of terminal device, it is readily appreciated that, the optical fingerprint sensor
20 positions for being installed on terminal device can be configured as needed.In embodiments of the present invention, which can be, but
It is not limited to, other mobile electronic devices such as mobile phone, tablet computer.
Fig. 1 is please referred to, is that the structure of optical fingerprint sensor 10 in the prior art provided in an embodiment of the present invention is shown
It is intended to.The optical fingerprint sensor 10 includes glass substrate 110, photoinduction pixel layer 120, thin film transistor (TFT) (Thin Film
Transistor, TFT) pixel circuit switching layer 130, protective layer 140.
In the prior art, 110 side of glass substrate fitting is provided with TFT pixel circuit switching layer 130, in TFT picture
It is provided with photoinduction pixel layer 120 on plain circuit switch layer 130, matcoveredn 140 is set on photoinduction pixel layer 120.
The optical fingerprint sensor 10 further includes circuit interface 150, anisotropic conductive adhesive paste 160 and flip chip
(ChipOnFlex, or, ChipOnFilm, COF) flexible circuit board 170.
It is additionally provided with circuit interface 150 in the same side that TFT pixel circuit switching layer 130 is arranged in glass substrate 110, it should
COF flexible circuit board 170 is set on circuit interface 150 by anisotropic conductive adhesive paste 160.The COF flexible circuit board 170 is opposite
There is certain height in protective layer 140.
Referring to figure 2., be the prior art provided in an embodiment of the present invention optical fingerprint sensor 10 application environment
Schematic diagram.
In actual use, which is provided with to side and the terminal device of TFT pixel circuit switching layer 130
Glass cover-plate 180 between be laid with glue 200 so that the optical fingerprint sensor 10 is fixed on terminal device.Due to glass
Glass substrate 110 is provided with setting on the side of TFT pixel circuit switching layer 130, and there are many circuit elements, such as COF flexible circuit board
170 etc., cause glass substrate 110 to be provided with and is laid between the side and glass cover-plate 180 of TFT pixel circuit switching layer 130
Glue 200 is uneven, bubble is easy to produce, so that the working effect of optical fingerprint sensor 10 is bad.
It referring to figure 3., is a kind of structural schematic diagram of optical fingerprint sensor 20 provided in an embodiment of the present invention.The light
Formula fingerprint sensor 20 includes glass substrate 210, photoinduction pixel layer 220, TFT pixel circuit switching layer 230, protective layer
240。
The photoinduction pixel layer 220 is bonded the side for being set to glass substrate 210, which sets
It is placed on photoinduction pixel layer 220.The photoinduction pixel layer 220 converts optical signals to telecommunications for receiving optical signal
TFT pixel circuit switching layer 230 is sent to after number.The protective layer 240 is set on TFT pixel circuit switching layer 230, for protecting
Protect TFT pixel circuit switching layer 230 and photoinduction pixel layer 220.
The optical fingerprint sensor 20 further includes circuit interface 250, anisotropic conductive adhesive paste 260 and COF flexible circuit
Plate 270.
The circuit interface 250 is set to the side that photoinduction pixel layer 220 is arranged in glass substrate 210, and the anisotropy is conductive
Glue 260 is set on circuit interface 250, which is set on anisotropic conductive adhesive paste 260.TFT pixel electricity
The electric signal received is sent to COF flexible circuit board 270 by way switch layer 230, by COF flexible circuit board 270 by electric signal
It is sent to the master chip (not shown) of optical fingerprint sensor 20, and then the master chip will obtain after electric signal analysis processing
To bearing member, image.
It referring to figure 4., is that the actual application environment of optical fingerprint sensor 20 provided in an embodiment of the present invention a kind of is shown
It is intended to.
When actually using the optical fingerprint sensor 20, by glass substrate 210 relative to setting photoinduction pixel layer
Tile glue 200 between 220 side and the glass cover-plate 280 of terminal device, so that the optical fingerprint sensor 20 is solid
Due to terminal device.Since the glass substrate 210 is smooth relative to the side of setting photoinduction pixel layer 220, glass base
The glue 200 that plate 210 is laid between the side and glass cover-plate 280 relative to setting photoinduction pixel layer 220 can be smooth, does not have
Bubble, so that the imaging effect of the optical fingerprint sensor 20 is more preferable.
The specific preferably imaging effect implementation are as follows: due in optical fingerprint sensor 20 provided by the invention
Photoinduction pixel layer 220 and TFT pixel circuit switching layer 230 exchange setting, therefore, the photoinduction pixel layer 220 is in glass
When the side of the not set photoinduction pixel layer 220 of substrate 210 is laid with glue 200, user can be received in time and press terminal device
The reflection light of glass cover-plate 280, with timely communicating optical signals.Simultaneously as the glass substrate 210 and glass cover-plate 280 it
Between glue 200 it is smooth, without bubble, then the light of user's finger reflection is not susceptible to other optical effects such as diffusing reflection, makes
The optical signal that receives of photoinduction pixel layer 220 is more accurate, with further such that optical fingerprint sensor 20 main core
The imaging effect of piece is more preferable.
In conclusion a kind of optical fingerprint sensor and terminal device, which is installed on terminal
Equipment, the optical fingerprint sensor include glass substrate and photoinduction pixel layer, the photoinduction pixel layer fitting setting
In the side of glass substrate, photoinduction pixel layer is for converting optical signals to electric signal, to be sent to the optical fingerprint
The master chip of sensor obtains photoinduction image, side of the glass substrate relative to side where the photoinduction pixel layer
It is uniformly equipped with glue between the glass cover-plate of the terminal device, the optical fingerprint sensor is fixed on described
Terminal device.Due to, the glass substrate relative to the one side of side where photoinduction pixel layer be it is smooth, therefore, the glass
Substrate can tile relative to the glue where photoinduction pixel layer between the one side and glass cover-plate of side, will not generate gas
Bubble.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions, the element limited by sentence "including a ...", it is not excluded that
There is also other identical elements in process, method, article or equipment including the element.
The foregoing is only a preferred embodiment of the present invention, is not intended to restrict the invention, for the skill of this field
For art personnel, the invention may be variously modified and varied.All within the spirits and principles of the present invention, made any to repair
Change, equivalent replacement, improvement etc., should all be included in the protection scope of the present invention.It should also be noted that similar label and letter exist
Similar terms are indicated in following attached drawing, therefore, once being defined in a certain Xiang Yi attached drawing, are then not required in subsequent attached drawing
It is further defined and explained.
Claims (10)
1. a kind of optical fingerprint sensor, the optical fingerprint sensor is set to terminal device, which is characterized in that described
Optical fingerprint sensor includes glass substrate and photoinduction pixel layer, and the photoinduction pixel layer fitting is set to the glass
The side of glass substrate, the photoinduction pixel layer is for converting optical signals to electric signal, to be sent to the optical fingerprint
The master chip of sensor obtains photoinduction image, side of the glass substrate relative to side where the photoinduction pixel layer
It is uniformly equipped with glue between the glass cover-plate of the terminal device, the optical fingerprint sensor is fixed on described
Terminal device.
2. optical fingerprint sensor as described in claim 1, which is characterized in that the optical fingerprint sensor further includes
TFT pixel circuit switching layer, the TFT pixel circuit switching layer are set on the photoinduction pixel layer, the photoinduction picture
Plain layer is for being converted to electric signal for the optical signal sensed and being sent to the optical profile type through the TFT pixel circuit switching layer
The master chip of fingerprint sensor.
3. optical fingerprint sensor as claimed in claim 2, which is characterized in that the optical fingerprint sensor further includes
Protective layer, the protective layer are set on the TFT pixel circuit switching layer, described protective layer used in the protection TFT pixel
Circuit switch layer and the photoinduction pixel layer.
4. optical fingerprint sensor as claimed in claim 2, which is characterized in that the optical fingerprint sensor further includes
COF flexible circuit board, the COF flexible circuit board are set to the glass substrate, and the COF flexible circuit board is for receiving institute
It states the electric signal of TFT pixel circuit switching layer transmission and the electric signal is sent to the main core of the optical fingerprint sensor
Piece.
5. optical fingerprint sensor as claimed in claim 4, which is characterized in that the optical fingerprint sensor further includes
Anisotropic conductive adhesive paste, the anisotropic conductive adhesive paste is set between the COF flexible circuit board and the glass substrate, described different
Property conducting resinl in side's is for connecting other different types of circuit boards.
6. optical fingerprint sensor as claimed in claim 5, which is characterized in that the optical fingerprint sensor further includes
Circuit interface, the circuit interface are set between the anisotropic conductive adhesive paste and the glass substrate, and the circuit interface is used
In other variety classes circuits of connection.
7. a kind of terminal device, which is characterized in that be equipped with optical fingerprint sensor, the optical profile type on the terminal device
Fingerprint sensor includes glass substrate and photoinduction pixel layer, and the photoinduction pixel layer fitting is set to the glass substrate
Side, the photoinduction pixel layer is for converting optical signals to electric signal, to be sent to the optical fingerprint sensor
Master chip obtains photoinduction image, and the glass substrate is relative to the side of side and the end where the photoinduction pixel layer
It is uniformly equipped with glue between the glass cover-plate of end equipment, the optical fingerprint sensor is fixed on the terminal and is set
It is standby.
8. terminal device as claimed in claim 7, which is characterized in that the optical fingerprint sensor further includes TFT pixel
Circuit switch layer, the TFT pixel circuit switching layer are set on the photoinduction pixel layer, and the photoinduction pixel layer is used for
The optical signal sensed is converted to electric signal and is sent to the optical fingerprint through the TFT pixel circuit switching layer and is sensed
The master chip of device.
9. terminal device as claimed in claim 8, which is characterized in that the optical fingerprint sensor further includes protective layer,
The protective layer is set on the TFT pixel circuit switching layer, described protective layer used in the protection TFT pixel circuit switch
Layer and the photoinduction pixel layer.
10. terminal device as claimed in claim 8, which is characterized in that the optical fingerprint sensor further includes COF soft
Circuit board, the COF flexible circuit board are set to the glass substrate, and the COF flexible circuit board is for receiving the TFT picture
The electric signal of plain circuit switch layer transmission and the master chip that the electric signal is sent to the optical fingerprint sensor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710796562.5A CN109460693A (en) | 2017-09-06 | 2017-09-06 | Optical fingerprint sensor and terminal device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710796562.5A CN109460693A (en) | 2017-09-06 | 2017-09-06 | Optical fingerprint sensor and terminal device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109460693A true CN109460693A (en) | 2019-03-12 |
Family
ID=65605999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710796562.5A Pending CN109460693A (en) | 2017-09-06 | 2017-09-06 | Optical fingerprint sensor and terminal device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109460693A (en) |
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| CN204331746U (en) * | 2014-11-27 | 2015-05-13 | 比亚迪股份有限公司 | Fingerprint identification device and electronic equipment |
| CN104794428A (en) * | 2015-03-06 | 2015-07-22 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen and terminal equipment |
| CN105787421A (en) * | 2014-12-19 | 2016-07-20 | 上海箩箕技术有限公司 | Fingerprint identification system |
| CN205486158U (en) * | 2015-12-31 | 2016-08-17 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN106383549A (en) * | 2015-08-05 | 2017-02-08 | 上海箩箕技术有限公司 | Electronic product |
| CN106874853A (en) * | 2017-01-16 | 2017-06-20 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation |
| CN106886753A (en) * | 2017-01-16 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device application its electronic installation |
| CN107077616A (en) * | 2017-01-20 | 2017-08-18 | 深圳市汇顶科技股份有限公司 | fingerprint device and terminal device |
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2017
- 2017-09-06 CN CN201710796562.5A patent/CN109460693A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204331746U (en) * | 2014-11-27 | 2015-05-13 | 比亚迪股份有限公司 | Fingerprint identification device and electronic equipment |
| CN105787421A (en) * | 2014-12-19 | 2016-07-20 | 上海箩箕技术有限公司 | Fingerprint identification system |
| CN104794428A (en) * | 2015-03-06 | 2015-07-22 | 南昌欧菲生物识别技术有限公司 | Fingerprint recognition device, touch screen and terminal equipment |
| CN106383549A (en) * | 2015-08-05 | 2017-02-08 | 上海箩箕技术有限公司 | Electronic product |
| CN205486158U (en) * | 2015-12-31 | 2016-08-17 | 深圳市汇顶科技股份有限公司 | Fingerprint identification device and mobile terminal |
| CN106874853A (en) * | 2017-01-16 | 2017-06-20 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device and preparation method thereof and apply its electronic installation |
| CN106886753A (en) * | 2017-01-16 | 2017-06-23 | 麦克思商务咨询(深圳)有限公司 | Sound wave type fingerprint identification device application its electronic installation |
| CN107077616A (en) * | 2017-01-20 | 2017-08-18 | 深圳市汇顶科技股份有限公司 | fingerprint device and terminal device |
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