CN109454557B

CN109454557B - Polishing pad dresser and method of manufacturing the same

Info

Publication number: CN109454557B
Application number: CN201710796671.7A
Authority: CN
Inventors: 陈盈同
Original assignee: Ytdiamond Co ltd
Current assignee: Ytdiamond Co ltd
Priority date: 2017-09-06
Filing date: 2017-09-06
Publication date: 2020-11-24
Anticipated expiration: 2037-09-06
Also published as: CN109454557A

Abstract

The invention discloses a polishing pad dresser and a manufacturing method thereof. The method of manufacturing a pad dresser includes at least: providing a composite base, wherein the composite base comprises a base and at least one buffer solder layer, and the step of providing the composite base at least comprises a heating and curing treatment to form the buffer solder layer and the base. Before the step of forming the polishing portion on the composite base, a planarization step is performed to form a flat surface on one side of the composite base. The polishing portion is formed on the flat surface. Thus, the problem of overlarge height difference between the tips of the grinding part due to thermal deformation of the base can be solved.

Description

Polishing pad dresser and method of manufacturing the same

Technical Field

The present invention relates to a pad dresser for use in a chemical mechanical polishing process and a method of manufacturing the same, and more particularly, to a pad dresser suitable for dressing a pad and a method of manufacturing the same.

Background

Chemical mechanical polishing is one of the most common methods for planarizing the surface of a semiconductor wafer. In chemical mechanical polishing, a polishing pad is usually used in combination with a polishing liquid to polish the surface of a semiconductor wafer. In the chemical mechanical polishing process, a polishing pad conditioning device is used to condition the surface of the polishing pad, remove the waste material generated during polishing the wafer, and recover the roughness of the polishing pad to maintain the stability of the polishing quality.

Existing polishing pad conditioning devices typically include a substrate and a diamond polishing layer disposed on one side of the substrate. In a conventional process for fabricating a polishing pad conditioner, a solder layer is formed on a flat working surface of a substrate. Subsequently, the diamond particles are evenly dispersed on the solder layer, and the height difference between the tips of the diamond particles is less than 100 μm. Thereafter, a thermal Brazing (Brazing) process is applied at a temperature of about 1000 ℃ to secure the diamond particles to the working surface of the substrate via a layer of solder.

However, since the thermal expansion coefficients of the solder layer and the substrate are different, and the cooling speed of the center and the edge of the substrate is not uniform during the thermal brazing process, the substrate is deformed, and the height difference of the tips of the diamond particles is increased after the subsequent brazing. In detail, the substrate deformation may cause the originally flat working surface to become a convex surface protruding from the edge toward the center, or a concave surface recessed from the edge toward the center. The convex or concave working surface also causes the height difference (about 100 μm to 300 μm) between the tips of the plurality of diamond particles bonded to the working surface to be too large. If the height difference between the sharp points of these diamond particles is too large (greater than 50 μm), the flatness of the polishing pad surface may be degraded when the polishing pad is dressed, thereby affecting the polishing quality. As integrated circuit line widths have decreased, the requirements for pad dressers have increased. Furthermore, when performing a chemical mechanical polishing process on a wafer with a line width of less than 45nm, the polishing pad should have a higher flatness to avoid scratching (Micro-Scratches) the wafer or causing Dishing (Dishing) and Erosion (Erosion) of the metal lines.

In taiwan, published patent I530361, the substrate is initially provided with a curved working surface to compensate for the deformation of the substrate during the hardening heat treatment. However, the difficulty of processing the substrate having the arc-shaped working surface by processing is high, and the accuracy is difficult to control.

In addition, the amount of deformation and area per substrate heating may vary depending on the material density, solder layer material, heating temperature, cooling rate, and other parameters. Because the final deformation of the substrate is difficult to predict each time, the process parameters are difficult to control so that the height difference between the sharp points of the diamond particles can be matched with the expected result after each heating.

Disclosure of Invention

The invention aims to solve the technical problem of reducing the problem of overlarge height difference between a plurality of cutting tips on the surface of a polishing pad trimmer caused by thermal deformation of a base.

In order to solve the above technical problems, one of the technical solutions of the present invention is to provide a method for manufacturing a pad dresser and a pad dresser manufactured by using the same. The polishing pad dresser includes a composite base and a polishing portion. The composite base comprises a base and a buffer solder layer formed on the base. At least one surface of the base is a curved surface, and the buffer solder layer covers the curved surface. The grinding part is arranged on the composite base and comprises a bonding layer and a plurality of grinding particles which are dispersedly arranged in the bonding layer. The grinding particles are respectively provided with a plurality of cutting tips protruding out of one grinding surface of the combining layer, wherein the heating solidus temperature corresponding to the buffering solder layer is higher than the heating liquidus temperature corresponding to the combining layer.

Another aspect of the present invention is to provide a method of manufacturing a pad dresser. Firstly, a composite base is provided, the composite base comprises a base and a buffer solder layer formed on the base, wherein the base is provided with at least one curved surface, and the buffer solder layer covers the curved surface. Then, a planarization step is performed on the composite base to form a flat surface on one side of the composite base. Then, a grinding part is formed on the flat surface, wherein the grinding part comprises a bonding layer and a plurality of grinding particles which are dispersedly arranged in the bonding layer, and the plurality of grinding particles are respectively provided with a plurality of cutting tips which protrude out of a grinding surface of the bonding layer.

The polishing pad dresser and the manufacturing method thereof have the advantages that before the grinding part is formed, the composite base comprising the buffer solder layer and the base is provided, the base is deformed in advance to form a curved surface in the process of solidifying the buffer solder layer, and then the flat surface on one side of the composite base is formed through a processing and flattening step. When the grinding part is formed on the base, the deformation of the base is limited because the base is deformed in advance and the solidified buffer solder layer is combined with the base, so that the deformation of the base is greatly reduced when the heat brazing treatment is carried out. Therefore, the height difference of the cutting tips of the plurality of grinding particles in the grinding part is less influenced by the thermal deformation of the base, and the practical application requirements can be met.

For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.

Drawings

FIG. 1 is a flow chart of a method of manufacturing a pad dresser in accordance with one embodiment of the present invention.

FIG. 2A is a cross-sectional view of a pad dresser in accordance with one embodiment of the present invention shown in step S100 of FIG. 1.

Fig. 2B is a schematic cross-sectional view of a composite base according to an embodiment of the invention.

FIG. 2C is a cross-sectional view of a pad dresser in accordance with one embodiment of the present invention shown in step S200 of FIG. 1.

FIG. 2D is a cross-sectional view of a pad dresser in accordance with one embodiment of the present invention shown in step S300 of FIG. 1.

FIG. 2E is a schematic cross-sectional view of a pad dresser in accordance with another embodiment of the present invention at step S200 of FIG. 1.

FIG. 2F is a schematic cross-sectional view of a pad dresser in accordance with another embodiment of the present invention at step S300 of FIG. 1.

FIG. 3A is a schematic cross-sectional view of a pad dresser in accordance with another embodiment of the present invention at step S100 of FIG. 1.

Fig. 3B is a schematic cross-sectional view of a composite base according to another embodiment of the invention.

FIG. 3C is a schematic cross-sectional view of a pad dresser in accordance with another embodiment of the present invention at step S200 of FIG. 1.

FIG. 3D is a cross-sectional view of a pad dresser in accordance with another embodiment of the present invention shown in step S300 of FIG. 1.

FIG. 3E is a schematic cross-sectional view of a pad dresser in accordance with another embodiment of the present invention at step S200 of FIG. 1.

FIG. 3F is a schematic cross-sectional view of a pad dresser in accordance with yet another embodiment of the present invention at step S300 of FIG. 1.

Fig. 4A is a schematic cross-sectional view of a pad dresser in accordance with still another embodiment of the present invention in step S100 of fig. 1.

FIG. 4B is a schematic cross-sectional view of a pad dresser in accordance with still another embodiment of the present invention at step S200 of FIG. 1.

FIG. 4C is a schematic cross-sectional view of a pad dresser in accordance with still another embodiment of the present invention at step S300 of FIG. 1.

Fig. 5A is a schematic cross-sectional view of a pad dresser in accordance with another embodiment of the present invention in step S200 of fig. 1.

FIG. 5B is a cross-sectional view of a pad dresser in accordance with another embodiment of the present invention shown in step S300 of FIG. 1.

Detailed Description

Please refer to fig. 1, fig. 2A to fig. 2D. FIG. 1 is a flow chart of a method of manufacturing a pad dresser in accordance with one embodiment of the present invention. FIGS. 2A-2D are schematic cross-sectional views of a pad dresser in accordance with one embodiment of the present invention at various stages of FIG. 1.

As shown in fig. 1, in step S100, a composite base is provided, the composite base includes a base and a buffer solder layer formed on the base, wherein the base has at least one curved surface, and the buffer solder layer covers the curved surface.

Referring to fig. 2A and 2B, a process of providing a composite base is illustrated. Specifically, as shown in fig. 2A, a buffer solder 2 "is formed on an initial base 1".

The material of the initial susceptor 1 "may be iron, molybdenum, tungsten, stainless steel, invar or nickel-based superalloys. In one embodiment, the material of the initial base 1 "is stainless steel. In addition, the initial base 1 "has a top surface 1 a" and a bottom surface 1b "opposite to the top surface 1 a". In the present embodiment, the buffer solder 2 "is formed on the top surface 1 a" of the initial base 1 ". In other embodiments, however, the buffer solder 2 "may be formed on the bottom surface 1 b" of the initial base 1 ".

Note that, in fig. 2A, the buffer solder 2 "is formed on the initial base 1" first, and abrasive grains are not provided.

The buffer solder 2 "may be solder foil (foil), solder paste (paste), or a mixture of a paste (e.g., resin) and solder powder. The buffer solder 2 "may be formed on the initial base 1" by various technical means known at present for different implementation aspects, and the present invention is not limited thereto.

In one embodiment, when the buffer solder 2 "is a solder pad, the solder pad is fixed on the initial base 1" by spot welding or by using a glue material, such as liquid glue, spray glue or double-sided glue. When the solder pad is directly fixed on the initial base 1 ″ by the adhesive material, the solder pad may be warped from the side or corner to assume an arc shape in the subsequent high-temperature heat treatment. Therefore, in one embodiment, if the bonding pad is fixed on the initial base 1 "by glue, another piece of material, such as graphite block, can be used to apply a pressing force to the bonding pad during the thermal brazing process, so as to prevent the bonding pad from warping from the side or corner during the thermal curing process.

In another embodiment, the buffer solder 2 "is a mixture of solder powder and resin. In this embodiment, there are two ways in which the buffer solder 2 "may be formed on the initial base 1". One of them is to mix the welding powder and resin (or other sizing material) to make a cake-like welding cake, and then to stick the welding cake on one surface (top surface 1a ' or bottom surface 1b ') of the initial base 1 '. The other method is to coat the resin (or other sizing material) directly on the top surface 1a "or the bottom surface 1 b" of the initial base 1 "and then spray the welding powder on the resin. The glue material can be spray glue, liquid glue or double-sided glue. In addition, after the double-sided adhesive tape is attached, welding powder can be sprayed on the double-sided adhesive tape.

It should be noted that the melting point of the buffer solder 2 "cannot be lower than the process temperature for forming the polishing portion later. In one embodiment, the buffer solder 2 "may be selected to be suitable for soldering with the material of the initial base 1". In one embodiment, when the initial substrate 1 "is stainless steel, the buffer solder 2" may be an amorphous ni-based solder, wherein the melting point or corresponding solidus temperature of the amorphous ni-based solder may be between 883 ℃ and 1052 ℃. The aforementioned amorphous nickel-based solders are, for example, AWS BNi5a or AWS BNi5b, which have solidus temperatures of 1052 ℃ and 1030 ℃, respectively. In addition, in the present embodiment, the thickness of the buffer solder 2 ″ is between 25 to 500 μm.

Next, referring to fig. 2B, a thermal curing process is performed to melt the buffer solder 2 ″ and then cool it to form a buffer solder layer 2'. The initial susceptor 1 "is deformed after performing a heat curing process with the buffer layer 2 'to form the susceptor 1'. In other words, the susceptor 1 'is actually a deformed susceptor that is thermally deformed at a high temperature, and thus the top surface 1 a' (or the bottom surface 1b ') of the susceptor 1' is curved. The curved surface may be an upper curved surface or a lower curved surface. Accordingly, composite mount M1 "includes a base 1 'and a buffer solder layer 2'.

As described above, in the heat curing process, the initial susceptor 1 "and the buffer solder 2" are heated to a temperature equal to or higher than the liquidus line of the buffer solder 2 "and then cooled. In this process, the initial susceptor 1 "is deformed to form a susceptor 1' having a substantially arc-shaped body due to the difference between the thermal expansion coefficient of the initial susceptor 1" and the thermal expansion coefficient of the buffer solder 2 ", and the difference between the cooling rates of the initial susceptor 1" itself at the center and at the periphery. In the present embodiment, the central portion of the base 1 'protrudes from the edge portion, so that the top surface 1 a' and the bottom surface 1b 'of the base 1' form an upper arc surface.

In addition, the buffer solder 2 ″ is fixed on the base 1 'after being melted and cooled at a high temperature, thereby forming a buffer solder layer 2'. As shown in fig. 2B, the buffer solder layer 2 ' has an arc-shaped outer side surface 2S ' and an arc-shaped inner side surface in accordance with the deformation of the base 1 ', wherein the arc-shaped inner side surface is connected to the top surface 1a ' of the base 1 '.

Next, please refer to fig. 1, fig. 2B, and fig. 2E. In step S200, a planarization step is performed on the composite base to form a flat surface on one side of the composite base. The planarization step may be a single-side planarization step or a double-side planarization step. In one embodiment, the planarization step may be performed by a grinder, a cutter, or a grinding wheel.

Specifically, please refer to fig. 2B. In the embodiment of FIG. 2B, a double-side planarization step is performed on composite base M1 ″ along the dashed lines depicted in FIG. 2B, thereby forming planar surfaces on opposite sides of composite base M1.

Further, in the present embodiment, a portion of the solder buffer layer 2 'and a portion of the base 1' are removed, so that the outer side surface 2S of the solder buffer layer 2 and the bottom surface 1b of the base 1 are formed as flat surfaces. The outer surface 2S of the buffer solder layer 2 and the bottom surface 1b of the base 1 are substantially parallel to each other.

That is, in this step, the parallelism tolerance between the outer side surface 2S of the buffer solder layer 2' and the bottom surface 1b of the base 1 can be reduced by the double-side flattening step. In one embodiment, the parallelism tolerance between the outer side surface 2S of the buffer solder layer 2 and the bottom surface 1b of the base 1 is not more than 20 μm.

It is noted that the top surface 1 a' of the base 1 contacting the solder buffer layer 2 is still a curved surface, and the thickness of the solder buffer layer 2 matches the contour of the curved surface, gradually increases or decreases from the periphery of the solder buffer layer 2 toward the center. In the present embodiment, since the top surface 1 a' of the base 1 is an upward arc surface, the thickness of the buffer solder layer 2 gradually decreases from the periphery toward the center. In addition, after the double-side planarization step, the thickness of the susceptor 1 increases from the periphery toward the center.

Please refer to fig. 1. Next, in step S300, a polishing portion is formed on one of the flat surfaces, wherein the polishing portion includes a bonding layer and a plurality of polishing particles dispersed in the bonding layer, and each of the polishing particles has a plurality of cutting tips protruding beyond a polishing surface of the bonding layer.

Referring to fig. 2D, fig. 2D is a cross-sectional view of a pad dresser in step S300 of fig. 1 according to an embodiment of the present invention. As shown in fig. 2D, in the present embodiment, the polishing portion 3 is formed on the outer surface 2S of the buffer solder layer 2. In addition, the abrasive part 3 includes a bonding layer 30 and a plurality of abrasive grains 31 dispersedly disposed in the bonding layer 30. The abrasive particles 31 are, for example, diamond or boron nitride.

Further, the bonding layer 30 is located on the same side of the base 1 as the buffer solder layer 2, and the bonding layer 30 is located on a flat surface (i.e., the outer side surface 2S) constituted by the surface of the buffer solder layer 2. In addition, each of the abrasive particles 31 has a cutting tip 31t protruding beyond an abrasive surface 30S of the bonding layer 30.

In addition, the step of forming the polishing portion 3 on the composite base M1 may include: forming a bonding solder on one of the flat surfaces; disposing a plurality of abrasive particles on a base; and performing a thermal Brazing process (Brazing) to melt and solidify the bonding solder to form the polishing portion. The heat brazing temperature at which the heat brazing process is performed is not more than the heat curing temperature at which the heat curing process is performed.

In detail, the bonding solder may be a soldering chip, a soldering paste or a mixture of a glue and a soldering powder. In one embodiment, when the bonding solder is a solder pad, the solder pad is fixed on the flat surface (i.e. the outer surface 2S of the buffer material layer) by spot welding or glue. It should be noted that if the soldering lug is fixed on the flat surface by the adhesive material, another material, such as graphite block, can be used to apply a pressing force to the soldering lug during the heat brazing process, so as to prevent the soldering lug from warping from the side or corner during the heat brazing process.

In addition, when the abrasive grains 31 are scattered on the pad, the plurality of abrasive grains 31 may be fixed by another adhesive material. The adhesive material for fixing the plurality of abrasive particles 31 may be a double-sided adhesive tape or an adhesive layer formed on the bonding pad by spraying or coating.

In one embodiment, the thickness of the bonding solder is between 25 μm and 300 μm, which can be selected according to the size of the polishing particles 31. Further, the larger the size of the abrasive grains 31, the thicker the thickness of the bonding solder will be, but after the heat brazing process is performed and the bonding layer 30 is formed, the bonding layer 30 does not cover the cutting tips 31t of the abrasive grains 31.

It should be noted that, when the heat brazing process is performed, the heat brazing temperature is required to melt the bonding solder so that the plurality of abrasive grains 31 are fixed to the susceptor 1. However, the temperature of the solder heating is controlled so as to prevent the buffer solder layer from melting together with the bonding solder when the bonding solder melts. Therefore, in one embodiment, the heat brazing temperature at which the heat brazing process is performed is lower than the heat curing temperature at which the heat curing process is performed.

Based on the above, in the embodiment of the present invention, the melting point of the bonding solder may be lower than that of the buffer solder. Further, the liquidus temperature of the bonding solder is lower than the solidus temperature of the buffer solder. In addition, the difference between the solidus temperature corresponding to the buffering solder and the liquidus temperature corresponding to the bonding solder is at least greater than 20 ℃, or the liquidus temperature corresponding to the buffering solder is at least 100 ℃ higher than the liquidus temperature corresponding to the bonding solder, so that the buffering solder layer 2 is prevented from melting when the heating brazing treatment is performed.

For example, when the material of the buffer solder layer 2 is AWS BNi5a (corresponding to a solidus (solidus) temperature of 1052 ℃), the bonding solder may also be an amorphous nickel-based solder, such as: AWS BNi2 (corresponding to a liquidus (liquidus) temperature of 1024 ℃) or BNi6 (corresponding to a liquidus (liquidus) temperature of 921 ℃).

In this embodiment, the choice of the buffer solder and the bonding solder is not limited in the present invention as long as melting of the buffer solder layer 2 at the time of performing the heat brazing process can be avoided. Therefore, the cutting tips 31t of the plurality of abrasive grains 31 formed on the susceptor 1 do not have an excessively large height difference due to thermal deformation of the susceptor 1. That is, by the above-described manufacturing method, the cutting tips 31t of the plurality of abrasive grains 31 can fall substantially on the same horizontal plane.

As shown in fig. 2D, the pad dresser of the embodiment of the present invention includes a base 1, a buffer solder layer 2, and a polishing portion 3. In this embodiment, the top surface 1 a' of the base 1 is a curved surface, and the bottom surface 1b is a flat surface. The buffer solder layer 2 is disposed on the curved surface. In addition, in the present embodiment, the curved surface is an upper curved surface, and the thickness of the buffer solder layer 2 is gradually decreased from the periphery to the center in cooperation with the upper curved surface.

The polishing section 3 is provided on the base 1, and both the polishing section 3 and the buffer solder layer 2 are located on the same side of the base 1. That is, the buffer solder layer 2 is located between the bonding layer 30 and the curved surface (top surface 1 a').

The polishing portion 3 includes a bonding layer 30 and a plurality of abrasive grains 31 dispersedly disposed in the bonding layer 30. The abrasive particles 31 have cutting tips 31t protruding from an abrasive surface 30S of the bonding layer 30, respectively.

If the cutting tip 31t having the highest first three height positions among the plurality of cutting tips 31t is formed as a plane, the plane is defined as a reference plane. In the pad dresser P1 formed by the manufacturing method of the present embodiment, the vertical height difference between the plurality of cutting tips 31t of the grinding part 3 and the reference surface may not exceed 50 μm, in order to meet the requirement for polishing a semiconductor wafer having a line width of 45nm or less.

In another embodiment, the planarization step may also be a single-side planarization step. Please refer to fig. 2E and fig. 2F. In fig. 2E, a single-side planarization step is performed on composite base M ″ along the dashed line depicted in fig. 2E, thereby forming a planar surface on one side of composite base M1'.

Specifically, as shown in fig. 2E and fig. 2F, a portion of the buffer solder layer 2' is removed during the single-side planarization step. Therefore, as shown in fig. 2F, the outer side surface 2S of the solder buffer layer 2 is a flat surface, and the polishing portion 3 is formed on the flat surface (i.e., the outer side surface 2S) of the solder buffer layer 2.

Unlike the embodiment of fig. 2B, in this embodiment, the bottom surface 1B 'of the base 1' is still curved. Usually, the bottom surface 1b 'of the base 1' is provided with a plurality of screw holes as a locking surface. In this case, the flatness of the bottom surface 1 b' is not required to be high, and therefore the flattening step may be performed only on one side of the composite base M ″.

FIGS. 3A-3D are schematic cross-sectional views of a pad dresser in accordance with another embodiment of the present invention at various steps of FIG. 1. Parts of this embodiment that are the same as those of the previous embodiment are not described again, and the same elements have the same reference numerals.

Referring to fig. 3A, unlike the embodiment of fig. 2A, in the present embodiment, the buffer solder 2 "is formed on the bottom surface 1 b" of the initial base 1 ". Next, referring to fig. 3B, after performing a heat curing process to melt and cool the solder buffer 2 ″ to solidify, a composite base M2 ″ having a solder buffer layer 2 'and a base 1' is formed. The susceptor 1' of the present embodiment is deformed from the initial susceptor 1 "to be a substantially arc-shaped body.

However, in the present embodiment, both the top surface 1a 'and the bottom surface 1 b' of the base 1 'form a downward arc surface due to the difference in the thermal expansion coefficient of the buffer solder 2 ″ and the thermal expansion coefficient of the base 1'. In addition, the buffering solder layer 2 'has an arc-shaped outer side surface 2S and an arc-shaped inner side surface (not numbered) in accordance with the deformation of the base 1', wherein the arc-shaped inner side surface is connected to the bottom surface 1b 'of the base 1'.

Referring to fig. 3C, in the present embodiment, a double-sided planarization step is also performed on the composite base M2 ″ to form two flat surfaces respectively located on two opposite sides of the composite base M2, and the outer surface 2S of the buffer solder layer is a flat surface.

It should be noted that in the composite base M2 of the present embodiment, the bottom surface 1 b' of the base 1 contacting the buffer solder layer 2 is still a curved surface, and in the present embodiment, the curved surface is a downward curved surface. Accordingly, the thickness of the solder buffer layer 2 is gradually increased from the periphery of the solder buffer layer 2 toward the center in accordance with the profile of the bottom surface 1 b'. In addition, after a portion of the susceptor 1' is removed by the double-sided planarization step, the top surface 1a of the susceptor 1 is a flat surface, and the thickness of the susceptor 1 is gradually reduced from the periphery toward the center.

Next, referring to fig. 3D, a polishing portion 3 is formed on the base 1. In the present embodiment, the polishing portion 3 and the solder bump layer 2 are respectively located on two opposite sides of the base 1. The steps for forming the polishing portion 3 are similar to those of the previous embodiment, and are not described herein.

In this embodiment, the bonding solder is a soldering chip or a glue material containing solder powder. Since the base 1 has been deformed in the step of fig. 3B and the buffer solder layer 2 can suppress the deformation of the base, the deformation is not so great as to cause a height difference between the cutting tips of the abrasive grains 31 to be too large when the heat brazing process is performed even if the base 1 is slightly deformed.

Please refer to fig. 3E and 3F. In another embodiment, the planarization step may also be performed only on one of the surfaces of composite base M2 "(e.g., top surface 1a 'of base 1' or outer side surface 2S 'of buffer solder layer 2').

In the embodiment of fig. 3E, the planarization step is performed only on the top surface 1a 'of the susceptor 1'. Accordingly, as shown in fig. 3F, in the composite base M2', the top surface 1a of the base 1 is a flat surface, and the polishing portion 3 is formed on the flat surface. In this embodiment, the polishing portion 3 and the buffer solder layer 2' are respectively located on two opposite sides of the base 1. In addition, in the present embodiment, the buffer solder layer 2 'on the bottom surface 1 b' of the susceptor 1 can still restrict the deformation of the susceptor 1 when the heat brazing process is performed, thereby reducing the degree of deformation of the susceptor 1 at the time of the heat brazing process.

Referring to fig. 4A to 4C, a schematic cross-sectional view of a pad dresser according to another embodiment of the present invention at each step in fig. 1 is shown. In this embodiment, the composite base M3 ' further includes two buffer solder layers 2 ' respectively disposed on two opposite sides of the base 1 '.

In detail, in the step of providing the composite base, as shown in fig. 4A, a layer of buffer solder 2 "is formed on each of the top surface 1 a" and the bottom surface 1b "of the initial base 1". Next, as shown in fig. 4B, a thermal solidification process is performed to melt and cool the buffer solder 2 ″ to form two buffer solder layers 2 'on opposite sides of the base 1'. It should be noted that, in the present embodiment, the original base 1 ″ is deformed, so that the top surface 1a ' and the bottom surface 1b ' of the deformed base 1 ' are both convex.

Next, a leveling step is performed to make composite base M3 have at least one flat surface. In this embodiment, a double-side planarization step is performed so that the outer side surfaces 2S of the two buffer solder layers 2 on both sides of the base 1' are flat surfaces.

In another embodiment, a single-side planarization step may also be performed to planarize the outer side surface 2S ' of the buffered solder layer 2 ' on one side of the base 1 '.

Subsequently, as shown in fig. 4C, the polishing portion 30 is formed on the outer side surface 2S of one of the buffer solder layers 2. It should be noted that, when performing the heat brazing process, the two buffer solder layers 2 in the present embodiment can provide forces on both sides of the base 1 ' to further suppress the deformation of the base 1 ', thereby reducing the degree of deformation of the base 1 '. Accordingly, the problem of an excessive height difference between the cutting tips 31t of the plurality of abrasive grains 31 in the polishing section 3 due to thermal deformation of the susceptor 1' can be avoided.

Referring to fig. 5A and 5B, the steps of fig. 5A and 5B are continued from fig. 4A. That is, before the step of fig. 5A is performed, the buffer solders 2 "are formed on two opposite sides of the initial base 1", as shown in fig. 4A.

Unlike the embodiment of fig. 4B, after a thermal solidification process is performed to melt and cool the buffer solder 2 ″ for solidification, the original initial base 1 ″ is deformed, so that the top surface 1a ' and the bottom surface 1B ' of the deformed base 1 ' are both concave surfaces.

In addition, in the present embodiment, a single-side planarization step is performed on the composite base M4 ', so as to remove a portion of the buffer solder layer 2 ' on the top surface 1a '. Accordingly, after the single-side planarization step is performed, in composite mount M4, outer side surface 2S of solder buffer layer 2 located on top surface 1a 'is a flat surface, and outer side surface 2S' of solder buffer layer 2 'located on bottom surface 1 b' is a curved surface.

Subsequently, the grinding part 3 is formed on the composite base M4. In this embodiment, the polishing portion 3 is located on the buffer solder layer 2 of the top surface 1 a'. As described above, when the thermal brazing process is performed, the two buffer solder layers 2 and 2 'in the present embodiment can still provide forces on the two sides of the base 1' to further suppress the deformation of the base 1 ', so that the problem of excessive height difference between the cutting tips 31t of the plurality of polishing particles 31 of the polishing portion 3 due to the thermal deformation of the base 1' can be avoided.

The present invention has an advantageous effect in that, in the pad dressers P1, P2, P1 ', P2', P3 and P4 and the method for manufacturing the same according to the present invention, before the polishing portion 3 is formed, the composite base M1 ", M2", M3 'and M4' including the buffer solder layers 2 and 2 'and the base 1' are provided, and the base 1 'is deformed in advance to have a curved surface during the solidification of the buffer solder layers 2 and 2', and then a flat surface on one side of the composite base M1, M1 ', M2, M2', M3 and M4 is formed through a flattening step.

When the polishing unit 3 is formed on the composite pedestals M1, M1 ', M2, M2', M3, M4, since the pedestals 1, 1 'have been deformed in advance and the solidified buffer solder layers 2, 2' may also limit the amount of deformation of the pedestal 1 ', the amount of deformation of the pedestal 1' during the heat brazing process is greatly reduced. Therefore, the height difference of the cutting tips 31r of the plurality of abrasive grains 31 of the polishing portion 3 is less affected by the thermal deformation of the bases 1 and 1', and thus the requirement of practical application can be met.

The disclosure is only a preferred embodiment of the invention and is not intended to limit the scope of the invention as is defined by the appended claims.

Claims

1. A polishing pad dresser, comprising:

the composite base comprises a base and a buffer solder layer formed on the base, wherein at least one surface of the base is a curved surface, and the buffer solder layer covers the curved surface; and

a grinding part disposed on the composite base, wherein the grinding part comprises a bonding layer and a plurality of grinding particles dispersed in the bonding layer, wherein each grinding particle has a cutting tip protruding from a grinding surface of the bonding layer;

wherein the solidus temperature corresponding to the buffered solder layer is greater than the liquidus temperature corresponding to the bonding layer.

2. The pad dresser of claim 1, wherein the abrasive portion is disposed on the curved surface and the cushioned solder layer is located between the bonding layer and the curved surface.

3. A pad conditioner in accordance with claim 2 wherein said base further comprises another curved surface, and said another curved surface and said abrasive portion are located on opposite sides of said base.

4. A pad conditioner in accordance with claim 1 further comprising another solder buffer layer, said solder buffer layer and said another solder buffer layer being on opposite sides of said base, respectively.

5. The pad dresser of claim 1, wherein the curved surface is an upper curved surface or a lower curved surface, and the thickness of the solder buffer layer is gradually increased or decreased from the periphery of the solder buffer layer toward the center in accordance with the profile of the curved surface.

6. The pad conditioner of claim 1 wherein said buffered solder layer corresponds to a liquidus temperature at least 100 ℃ higher than the liquidus temperature of said bonding layer.

7. The pad dresser of claim 1, wherein the polishing portion and the solder buffer layer are located on opposite sides of the base, respectively, and the curved surface is located at the bottom of the base, and the surface of the solder buffer layer is curved or flat.

8. The pad conditioner of claim 1 wherein said base is made of iron, molybdenum, tungsten, stainless steel, invar, or a nickel-based superalloy.

9. A pad conditioner according to claim 1, wherein said buffered solder layer has a thickness of between 25 and 500 μm and said bonding layer has a thickness of between 25 and 300 μm.

10. A method of manufacturing a polishing pad dresser, the method comprising:

providing a composite base, wherein the composite base comprises a base and a buffer solder layer formed on the base, the base is provided with at least one curved surface, and the buffer solder layer covers the curved surface;

performing a flattening step on the composite base to form a flat surface on at least one side of the composite base;

forming a grinding part on the flat surface, wherein the grinding part comprises a bonding layer and a plurality of grinding particles which are dispersedly arranged in the bonding layer, and each grinding particle is provided with a cutting tip protruding out of a grinding surface of the bonding layer.

11. The method of manufacturing a pad dresser of claim 10, wherein the step of providing the composite base includes:

forming a buffer solder on an initial base; and

and performing a heating solidification process to melt and solidify the buffer solder to form the buffer solder layer, wherein the initial base is deformed to form the base after the heating solidification process is performed.

12. The method of claim 11, wherein the buffer solder is a tab, and the step of forming the buffer solder on the initial base is performed by fixing the tab to the initial base by spot welding or by gluing.

13. The method of claim 11, wherein the step of forming the polishing section on the base comprises at least:

forming a bonding solder on the flat surface;

disposing a plurality of the abrasive particles on the base, wherein the plurality of the abrasive particles are dispersedly disposed on the base by the bonding solder; and

and performing brazing heating treatment to melt and solidify the bonding solder to form the grinding part, wherein the heating brazing temperature for performing the heating brazing treatment is lower than the heating solidification temperature for performing the heating solidification treatment.

14. The method of claim 13, wherein the bonding solder and the buffer solder are solder pads, solder paste, or a mixture of a sizing material and solder powder.

15. The method of manufacturing a pad dresser of claim 13, wherein the bonding solder is a tab, and the step of forming the bonding solder on the flat surface is fixing the tab to the composite base by spot welding or gluing.

16. The method of claim 13, wherein the buffer solder has a solidus temperature greater than the liquidus temperature of the bonding solder, and the difference between the solidus temperature of the buffer solder and the liquidus temperature of the bonding solder is at least greater than 20 ℃.

17. The method of claim 10, wherein the planar surface is an outer surface of the buffered solder layer, the bonding layer is bonded to the planar surface, and the bonding layer and the buffered solder layer are on the same side of the base.

18. The method of claim 10, wherein the planar surface is a top surface or a bottom surface of the base, the bonding layer is bonded to the planar surface, and the bonding layer and the buffered solder layer are on opposite sides of the base, respectively.

19. The method of claim 10, wherein in the step of providing the composite base, the composite base further comprises another solder bump layer, and the solder bump layer and the another solder bump layer are on opposite sides of the base.