CN109448776A - A kind of NAND FLASH class chip test system - Google Patents
A kind of NAND FLASH class chip test system Download PDFInfo
- Publication number
- CN109448776A CN109448776A CN201811068329.6A CN201811068329A CN109448776A CN 109448776 A CN109448776 A CN 109448776A CN 201811068329 A CN201811068329 A CN 201811068329A CN 109448776 A CN109448776 A CN 109448776A
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- chip
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- nand flash
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- test system
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/003—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation in serial memories
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
- G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
- G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
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Abstract
The invention discloses a kind of NAND FLASH class chip test systems, including master cpu, TTL interface module, display module, function selecting module, OS parametric testing module, ICC test module, FLASH functional test module, level switch module and NAND FLASH chip；Master cpu is for realizing the control to whole system all functional modules；Display module is for realizing the chip relevant information detected in the display NAND FLASH class chip test system course of work.A kind of NAND FLASH class chip test system of the present invention, it is made of various small modules and robotic equipment, overall cost is relatively low, in actual production process, solves the deficiency that general purpose test equipment own vol is big, control program is cumbersome, at high cost etc., improve the flexibility of chip test system production test, it is entire at low cost and easy to operate, it is with short production cycle, production efficiency is greatly improved, better prospect of the application is brought.
Description
Technical field
The present invention relates to fire-fighting domain, in particular to a kind of NAND FLASH class chip test system.
Background technique
NAND FLASH class chip is a kind of chip of large capacity low cost, also can under conditions of the supply of no electric current
Data are muchly saved, are the conventional chips of modern people, the demand of NAND FLASH class chip also constantly expands, and NAND
FLASH class chip is tested accordingly in production link needs, and existing NAND FLASH class chip testing generallys use greatly
Type general purpose test equipment aptitude test, and general large test equipment volume is big, price, high production cost, and general big
Type instrumentation system is complicated, inconvenient, and the production cycle from exploitation to investment is longer, is unsatisfactory for the requirement of people,
For this purpose, it is proposed that a kind of NAND FLASH class chip test system.
Summary of the invention
The main purpose of the present invention is to provide a kind of NAND FLASH class chip test systems, can effectively solve background
The problems in technology.
To achieve the above object, the technical scheme adopted by the invention is as follows:
A kind of NAND FLASH class chip test system, including the choosing of master cpu, TTL interface module, display module, function
Select module, OS parametric testing module, ICC test module, FLASH functional test module, level switch module and NAND FLASH
Chip；
Master cpu is for realizing the control to whole system all functional modules；
Display module is for realizing the chip phase detected in the display NAND FLASH class chip test system course of work
Close information；
Function selecting module is for realizing the test of NAND FLASH class chip test system, tune in actual test production process
Examination and control；
TTL interface module is for realizing between NAND FLASH class chip test system and manipulator or sorting machine equipment
Information connection；
System power supply module provides work for realizing modules all in NAND FLASH class chip test system detection process
Supply voltage needed for making；
Whether the protection diode that OS parametric testing module is used to test on NAND FLASH class chip IC pin is intact；
ICC test module is for being exactly the real work size of current for testing NAND FLASH class chip；
FLASH functional test module is for testing the functions such as the operation of NAND FLASH class chip interior, read-write；
Level switch module can be compatible with the NAND FLASH chip type of different voltages standard for realizing this system.
Preferably, the master cpu uses XILINX FPGA XC7A75F484 chip, and XC7A75F484 chip uses
FBGA484 encapsulation, the I/O resource quantity of chip are 285.
Preferably, the display module uses serial port liquid crystal TFT display module GPU28, and the display module passes through serial
Communication interface is connect with master cpu.
Preferably, the function selecting module includes mode setting key, START/PAUSE key, STOP key and point
Survey key.
Preferably, the TTL interface module using 74245 electrical level transferring chips, TLP281 signal isolation opto-coupler chip and
UN2803 enhances signal driving chip.
Preferably, the OS parametric testing module uses CD4051 chip, LM358 chip, ADS1118 modulus conversion chip
With DAC7311 analog-digital chip, ADS1118 chip is the modulus conversion chip of 16 bit resolutions, and DAC7311 chip is 12
The analog-digital chip of resolution ratio.
Preferably, the ICC test module uses 74LVC8T245 electrical level transferring chip, and the 74LVC8T245 level turns
The voltage range for changing chip is 1.65--5.5V.
Preferably, the NAND FLASH class chip test system further includes system power supply module, and system power supply module is adopted
It is all module for power supply with linear power supply AS1117 series.
Preferably, the linear power supply AS1117 that the system power supply module uses powers for the modules of system.
Compared with prior art, the invention has the following beneficial effects:
A kind of NAND FLASH class chip test system, entire NAND FLASH class chip measuring system is by various small-sized
Module and robotic equipment composition, overall cost is relatively low, in actual production process, solves universal test and sets
The deficiency that standby own vol is big, control program is cumbersome, at high cost etc., improves the flexible of chip test system production test
Property, it is entire at low cost and easy to operate, it is with short production cycle, production efficiency is greatly improved, the requirement of people is met,
It is more practical, entire NAND FLASH class chip test system it is relatively simple for structure and easy to operate, using effect is opposite
It is more preferable in traditional approach.
Detailed description of the invention
Fig. 1 is a kind of whole hardware block diagram of NAND FLASH class chip test system of the present invention；
Fig. 2-4 is the partial circuit diagram of master cpu in a kind of NAND FLASH class chip test system of the present invention；
Fig. 5 is the partial circuit diagram of function selecting module in a kind of NAND FLASH class chip test system of the present invention；
Fig. 6 is the partial circuit diagram of TTL interface module in a kind of NAND FLASH class chip test system of the present invention；
Fig. 7-8 is the partial circuit of OS parametric testing module in a kind of NAND FLASH class chip test system of the present invention
Figure；
Fig. 9 is the partial circuit diagram of ICC test module in a kind of NAND FLASH class chip test system of the present invention；
Figure 10 is the partial circuit diagram of system power supply module in a kind of NAND FLASH class chip test system of the present invention.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
Embodiment 1
As Figure 1-10 shows, a kind of NAND FLASH class chip test system, including it is master cpu, TTL interface module, aobvious
Show module, function selecting module, OS parametric testing module and NAND FLASH chip；
Master cpu uses XILINX FPGA for realizing the control to whole system all functional modules, master cpu
XC7A75F484 chip, XC7A75F484 chip are encapsulated using FBGA484, and the I/O resource quantity of chip is 285, have speed
Fastly, I/O resource is abundant, flexible in programming, it is low in energy consumption the features such as, realize all test functions of NAND FLASH chip；
Display module is for realizing the chip phase detected in the display NAND FLASH class chip test system course of work
Information is closed, display module uses serial port liquid crystal TFT display module GPU28, and the display module passes through serial communication interface and master
Control CPU connection；
Function selecting module is for realizing the test of NAND FLASH class chip test system, tune in actual test production process
Examination and control, function selecting module include mode setting key, START/PAUSE key, STOP key and put survey key, wherein
Mode setting key can mainly have test mould with the mode of switch test system, the mode of NAND FLASH class chip test system
Formula and debugging mode, START/PAUSE press the pause and beginning of the equipment during key control test macro testing product, STOP
Key terminates the detection of chip, and point, which surveys key, can allow whole system to carry out individual event test, and manipulator after test to chip
It will not run；
TTL interface module is for realizing between NAND FLASH class chip test system and manipulator or sorting machine equipment
Information connection, TTL interface module is using 74245 electrical level transferring chips, TLP281 signal isolation opto-coupler chip and UN2803 enhancing
Signal driving chip, opto-coupler chip are able to carry out signal isolation, and enhancing signal driving chip makes entirely to pass through process more stable
Reliably, and by the interface module, NAND FLASH class chip test system is connect with automation equipments such as manipulators, it can
To realize the batch testing of chip；
System power supply module provides work for realizing modules all in NAND FLASH class chip test system detection process
Supply voltage needed for making, the linear power supply AS1117 that system power supply module uses power for the modules of system；
Whether the protection diode that OS parametric testing module is used to test on NAND FLASH class chip IC pin is intact, OS
Parametric testing module uses CD4051 chip, LM358 chip, ADS1118 modulus conversion chip and DAC7311 digital-to-analogue conversion core
Piece, ADS1118 chip are the modulus conversion chip of 16 bit resolutions, and DAC7311 chip is the digital-to-analogue conversion core of 12 bit resolutions
Piece.
OS parametric testing module tests whether the protection diode that chip is tested on IC pin is intact, and the principle of test is
Apply the voltage between testing current protection diode to NAND FLASH class chip to judge whether protection diode is intact, has
The test philosophy of body is as shown in Figure 5.
Embodiment 2
As Figure 1-10 shows, a kind of NAND FLASH class chip test system includes master cpu, TTL interface module, display
Module, function selecting module, ICC test module and NAND FLASH chip；
Master cpu uses XILINX FPGA for realizing the control to whole system all functional modules, master cpu
XC7A75F484 chip, XC7A75F484 chip are encapsulated using FBGA484, and the I/O resource quantity of chip is 285, have speed
Fastly, I/O resource is abundant, flexible in programming, it is low in energy consumption the features such as, realize all test functions of NAND FLASH chip；
Display module is for realizing the chip phase detected in the display NAND FLASH class chip test system course of work
Information is closed, display module uses serial port liquid crystal TFT display module GPU28, and the display module passes through serial communication interface and master
Control CPU connection；
Function selecting module is for realizing the test of NAND FLASH class chip test system, tune in actual test production process
Examination and control, function selecting module include that mode setting key, START/PAUSE key, STOP key and point survey key；
TTL interface module is for realizing between NAND FLASH class chip test system and manipulator or sorting machine equipment
Information connection, TTL interface module is using 74245 electrical level transferring chips, TLP281 signal isolation opto-coupler chip and UN2803 enhancing
Signal driving chip, opto-coupler chip are able to carry out signal isolation, and enhancing signal driving chip makes entirely to pass through process more stable
Reliably, and by the interface module, NAND FLASH class chip test system is connect with automation equipments such as manipulators, it can
To realize the batch testing of chip；
System power supply module provides work for realizing modules all in NAND FLASH class chip test system detection process
Supply voltage needed for making, the linear power supply AS1117 that system power supply module uses power for the modules of system；
ICC test module is for being exactly the real work size of current for testing NAND FLASH class chip, ICC test mould
Block uses 74LVC8T245 electrical level transferring chip, and the voltage range of the 74LVC8T245 electrical level transferring chip is 1.65--
5.5V。
It is exactly the real work size of current for testing NAND FLASH class chip that ICC test module, which tests chip,.For commenting
Estimate power loss when chip operation, the test philosophy of ICC test module is to be powered to NAND FLASH class chip, is tested
The operating current of chip, specific test philosophy are as shown in Figure 6.
Embodiment 3
As Figure 1-10 shows, a kind of NAND FLASH class chip test system, including it is master cpu, TTL interface module, aobvious
Show module, function selecting module, FLASH functional test module, level switch module and NAND FLASH chip；
Master cpu uses XILINX FPGA for realizing the control to whole system all functional modules, master cpu
XC7A75F484 chip, XC7A75F484 chip are encapsulated using FBGA484, and the I/O resource quantity of chip is 285, have speed
Fastly, I/O resource is abundant, flexible in programming, it is low in energy consumption the features such as, realize all test functions of NAND FLASH chip；
Display module is for realizing the chip phase detected in the display NAND FLASH class chip test system course of work
Information is closed, display module uses serial port liquid crystal TFT display module GPU28, and the display module passes through serial communication interface and master
Control CPU connection；
Function selecting module is for realizing the test of NAND FLASH class chip test system, tune in actual test production process
Examination and control, function selecting module include that mode setting key, START/PAUSE key, STOP key and point survey key；
TTL interface module is for realizing between NAND FLASH class chip test system and manipulator or sorting machine equipment
Information connection, TTL interface module is using 74245 electrical level transferring chips, TLP281 signal isolation opto-coupler chip and UN2803 enhancing
Signal driving chip, opto-coupler chip are able to carry out signal isolation, and enhancing signal driving chip makes entirely to pass through process more stable
Reliably, and by the interface module, NAND FLASH class chip test system is connect with automation equipments such as manipulators, it can
To realize the batch testing of chip；
System power supply module provides work for realizing modules all in NAND FLASH class chip test system detection process
Supply voltage needed for making, the linear power supply AS1117 that system power supply module uses power for the modules of system；
Level switch module can be compatible with the NAND FLASH chip type of different voltages standard for realizing this system, use
For 74LVC8T245 chip as level conversion, 74LVC8T245 chip is a 8 tunnel electrical level transferring chip, has wider voltage
Range, voltage range 1.65--5.5V, the chip support high speed data transfer.
FLASH functional test module mainly passes through for testing the functions such as the operation of NAND FLASH class chip interior, read-write
Software algorithm inside FPGA realizes that mainly test chip id, chip erasing function and time, chip empty check function are timely
Between, chip read-write capability and time, chip verifying function and time, ECC functional test, bad block management etc., test cooperation electricity
Flat conversion module is realized.
It should be noted that the present invention is a kind of NAND FLASH class chip test system, before test, each mould is first connected
Route between block starts NAND FLASH class chip test system, passes through the mode in function selecting module after system energization
Setting button controls the interlock circuit parameter of the modules of entire chip test system and initialize, and initialization is completed
Afterwards, NAND FLASH class chip is placed into position and the installation of test by TTL interface module control manipulator by master cpu
It is good, OS test is carried out to chip by OS parametric testing module first and judges its test result, if NAND FLASH class
Chip then carries out ICC test by OS test, if tested not over OS, manipulator takes out chip, and test terminates, and is put into
The chip not detected detects again, FLASH functional test is carried out if testing by ICC in fruit chip, if surveyed not over ICC
Examination, manipulator take out chip, and test terminates, and are put into the chip weight OS test not detected and start to detect, as fruit chip passes through
FLASH functional test, then chip is intact chip, as fruit chip has a test not over then chip is problematic, NAND
During the test, the detection parameters of chip are shown FLASH class chip by display module, and in chip testing process
People can be by being controlled the operation of whole system, in entire detection process by key connection master cpu in function selecting module
System power supply module is that the modules of whole system are powered, and in NAND FLASH class chip detection process, are connect by TTL
Whole system connect with automation equipment and manipulator and voluntarily tests chip by mouth mold block, and the batch of chip may be implemented
Test, can be according to reality Optional assembling, as long as NAND FLASH class chip by each structural module of whole system
Chip by three tests can proofing chip be it is intact, be each independently of the others between three tests, the sequence of test can be with
Any to change, chip can only once carry out a test in test, cannot detect simultaneously.
Entire NAND FLASH class chip test system is made of various small modules and robotic equipment, whole
Cost is relatively low, in actual production process, solves that general purpose test equipment own vol is big, control program is cumbersome, at high cost
Etc. deficiency, greatly improve the flexibility of production test and concurrent testing SITE number, have it is at low cost, it is high-efficient, behaviour
Facilitate, it is with short production cycle the advantages that.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the above embodiments and description only describe this
The principle of invention, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appended claims and its
Equivalent thereof.
Claims (8)
1. a kind of NAND FLASH class chip test system, which is characterized in that including master cpu, TTL interface module, display mould
Block, function selecting module, OS parametric testing module, ICC test module, FLASH functional test module, level switch module and
NAND FLASH chip；
Master cpu is for realizing the control to whole system all functional modules；
Display module is for realizing the chip correlation letter detected in the display NAND FLASH class chip test system course of work
Breath；
Function selecting module for realizing in actual test production process NAND FLASH class chip test system test, debugging and
Control；
TTL interface module is for realizing NAND FLASH class chip test system and manipulator or the letter between sorting machine equipment
Breath connection；
System power supply module provides work institute for realizing modules all in NAND FLASH class chip test system detection process
The supply voltage needed；
Whether the protection diode that OS parametric testing module is used to test on NAND FLASH class chip IC pin is intact；
ICC test module is for being exactly the real work size of current for testing NAND FLASH class chip；
FLASH functional test module is for testing the functions such as the operation of NAND FLASH class chip interior, read-write；
Level switch module can be compatible with the NAND FLASH chip type of different voltages standard for realizing this system.
2. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the master cpu
Using XILINX FPGA XC7A75F484 chip, XC7A75F484 chip is encapsulated using FBGA484, the I/O resource quantity of chip
It is 285.
3. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the display module
Using serial port liquid crystal TFT display module GPU28, the display module is connect by serial communication interface with master cpu.
4. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the function selection
Module includes that mode setting key, START/PAUSE key, STOP key and point survey key.
5. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the TTL interface
Module enhances signal driving chip using 74245 electrical level transferring chips, TLP281 signal isolation opto-coupler chip and UN2803.
6. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the OS parameter is surveyed
Die trial block uses CD4051 chip, LM358 chip, ADS1118 modulus conversion chip and DAC7311 analog-digital chip,
ADS1118 chip is the modulus conversion chip of 16 bit resolutions, and DAC7311 chip is the analog-digital chip of 12 bit resolutions.
7. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the ICC test
Module uses 74LVC8T245 electrical level transferring chip, and the voltage range of the 74LVC8T245 electrical level transferring chip is 1.65--
5.5V。
8. a kind of NAND FLASH class chip test system according to claim 1, it is characterised in that: the system power supply
The linear power supply AS1117 that module uses powers for the modules of system.
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| CN201811068329.6A CN109448776A (en) | 2018-09-13 | 2018-09-13 | A kind of NAND FLASH class chip test system |
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| CN201811068329.6A CN109448776A (en) | 2018-09-13 | 2018-09-13 | A kind of NAND FLASH class chip test system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116719724A (en) * | 2023-06-05 | 2023-09-08 | 珠海妙存科技有限公司 | eMMC multi-platform testing method and device and electronic equipment |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204837A (en) * | 1990-08-16 | 1993-04-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having test mode |
| US5956350A (en) * | 1997-10-27 | 1999-09-21 | Lsi Logic Corporation | Built in self repair for DRAMs using on-chip temperature sensing and heating |
| JP2000036200A (en) * | 1998-07-02 | 2000-02-02 | Internatl Business Mach Corp <Ibm> | Integrated circuit chip, its operating method and dram |
| US20030226076A1 (en) * | 2002-05-30 | 2003-12-04 | Jong-Gu Kang | PC and ATE integrated chip test equipment |
| CN102354537A (en) * | 2011-07-06 | 2012-02-15 | 华中科技大学 | Method and system for testing chip of phase change memory |
| CN104485135A (en) * | 2014-12-04 | 2015-04-01 | 中国科学院微电子研究所 | Multi-mode SRAM single-particle test method and device |
| CN204832267U (en) * | 2015-08-14 | 2015-12-02 | 万高(杭州)科技有限公司 | Chip test platform |
-
2018
- 2018-09-13 CN CN201811068329.6A patent/CN109448776A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5204837A (en) * | 1990-08-16 | 1993-04-20 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having test mode |
| US5956350A (en) * | 1997-10-27 | 1999-09-21 | Lsi Logic Corporation | Built in self repair for DRAMs using on-chip temperature sensing and heating |
| JP2000036200A (en) * | 1998-07-02 | 2000-02-02 | Internatl Business Mach Corp <Ibm> | Integrated circuit chip, its operating method and dram |
| US20030226076A1 (en) * | 2002-05-30 | 2003-12-04 | Jong-Gu Kang | PC and ATE integrated chip test equipment |
| CN102354537A (en) * | 2011-07-06 | 2012-02-15 | 华中科技大学 | Method and system for testing chip of phase change memory |
| CN104485135A (en) * | 2014-12-04 | 2015-04-01 | 中国科学院微电子研究所 | Multi-mode SRAM single-particle test method and device |
| CN204832267U (en) * | 2015-08-14 | 2015-12-02 | 万高(杭州)科技有限公司 | Chip test platform |
Non-Patent Citations (1)
| Title |
|---|
| 刘子政等: "《电子电路基础与应用》", 31 December 2016 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116719724A (en) * | 2023-06-05 | 2023-09-08 | 珠海妙存科技有限公司 | eMMC multi-platform testing method and device and electronic equipment |
| CN116719724B (en) * | 2023-06-05 | 2024-06-04 | 珠海妙存科技有限公司 | EMMC multi-platform testing method and device and electronic equipment |
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