CN109445041A - The processing technology of 25G optical module - Google Patents
The processing technology of 25G optical module Download PDFInfo
- Publication number
- CN109445041A CN109445041A CN201811258201.6A CN201811258201A CN109445041A CN 109445041 A CN109445041 A CN 109445041A CN 201811258201 A CN201811258201 A CN 201811258201A CN 109445041 A CN109445041 A CN 109445041A
- Authority
- CN
- China
- Prior art keywords
- affixed
- shell
- optical module
- processing technology
- motion bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2262—Oxides; Hydroxides of metals of manganese
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2268—Ferrous oxide (FeO)
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Optical Couplings Of Light Guides (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
Description
Group | Emissivity | Appearance features |
Group 1 | 0.88 | Plurality of grooves structure |
Group 2 | 0.93 | Plurality of grooves structure |
Group 3 | 0.87 | Plurality of grooves structure |
Group 4 | 0.87 | Plurality of grooves structure |
Group 5 | 0.82 | Plurality of grooves structure |
Group 6 | 0.85 | Plurality of grooves structure |
Group 7 | 0.83 | Plurality of grooves structure |
Group 8 | 0.85 | Plurality of grooves structure |
Group 9 | 0.82 | Plurality of grooves structure |
Group 10 | 0.76 | Plurality of grooves structure |
Control group 1 | 0.70 | Part recess structure |
Control group 2 | 0.76 | A small amount of groove structure |
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811258201.6A CN109445041B (en) | 2018-10-26 | 2018-10-26 | Processing technology of 25G optical module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811258201.6A CN109445041B (en) | 2018-10-26 | 2018-10-26 | Processing technology of 25G optical module |
Publications (2)
Publication Number | Publication Date |
---|---|
CN109445041A true CN109445041A (en) | 2019-03-08 |
CN109445041B CN109445041B (en) | 2020-04-24 |
Family
ID=65548482
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811258201.6A Active CN109445041B (en) | 2018-10-26 | 2018-10-26 | Processing technology of 25G optical module |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109445041B (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2458750Y (en) * | 2000-07-25 | 2001-11-07 | 富士康(昆山)电脑接插件有限公司 | Socket electric connector |
JP3146030U (en) * | 2008-08-21 | 2008-10-30 | 奇宏電子深▲しん▼有限公司 | Heat dissipation fin structure and heat dissipation module using the heat dissipation fin |
CN205728532U (en) * | 2016-06-30 | 2016-11-30 | 孔兵 | A kind of luggage case anti-skidding device |
CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
CN207037164U (en) * | 2017-07-28 | 2018-02-23 | 安费诺电子装配(厦门)有限公司 | A kind of optic communication transceiver |
CN207675989U (en) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | Novel heat dissipation structure for high-speed long-distance optical module |
-
2018
- 2018-10-26 CN CN201811258201.6A patent/CN109445041B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2458750Y (en) * | 2000-07-25 | 2001-11-07 | 富士康(昆山)电脑接插件有限公司 | Socket electric connector |
JP3146030U (en) * | 2008-08-21 | 2008-10-30 | 奇宏電子深▲しん▼有限公司 | Heat dissipation fin structure and heat dissipation module using the heat dissipation fin |
CN205728532U (en) * | 2016-06-30 | 2016-11-30 | 孔兵 | A kind of luggage case anti-skidding device |
CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
CN207037164U (en) * | 2017-07-28 | 2018-02-23 | 安费诺电子装配(厦门)有限公司 | A kind of optic communication transceiver |
CN207675989U (en) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | Novel heat dissipation structure for high-speed long-distance optical module |
Also Published As
Publication number | Publication date |
---|---|
CN109445041B (en) | 2020-04-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Processing technology of 25g optical module Effective date of registration: 20220724 Granted publication date: 20200424 Pledgee: Huangshan Tunxi sub branch of Huishang Bank Co.,Ltd. Pledgor: HUANGSHAN GUANGRUI COMMUNICATION CO.,LTD. Registration number: Y2022980011166 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230810 Granted publication date: 20200424 Pledgee: Huangshan Tunxi sub branch of Huishang Bank Co.,Ltd. Pledgor: HUANGSHAN GUANGRUI COMMUNICATION CO.,LTD. Registration number: Y2022980011166 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Processing Technology of 25G Optical Module Effective date of registration: 20230817 Granted publication date: 20200424 Pledgee: Huangshan Tunxi sub branch of Huishang Bank Co.,Ltd. Pledgor: HUANGSHAN GUANGRUI COMMUNICATION CO.,LTD. Registration number: Y2023980052583 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |