CN109445041A - The processing technology of 25G optical module - Google Patents
The processing technology of 25G optical module Download PDFInfo
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- CN109445041A CN109445041A CN201811258201.6A CN201811258201A CN109445041A CN 109445041 A CN109445041 A CN 109445041A CN 201811258201 A CN201811258201 A CN 201811258201A CN 109445041 A CN109445041 A CN 109445041A
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4266—Thermal aspects, temperature control or temperature monitoring
- G02B6/4268—Cooling
- G02B6/4269—Cooling with heat sinks or radiation fins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/70—Additives characterised by shape, e.g. fibres, flakes or microspheres
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4256—Details of housings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
- H05K7/20427—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing having radiation enhancing surface treatment, e.g. black coating
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2248—Oxides; Hydroxides of metals of copper
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2262—Oxides; Hydroxides of metals of manganese
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2265—Oxides; Hydroxides of metals of iron
- C08K2003/2268—Ferrous oxide (FeO)
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- Materials Engineering (AREA)
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- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Optical Couplings Of Light Guides (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention belongs to electronics fields, and in particular to a kind of processing technology of 25G optical module.The specific technical proposal is: a kind of processing technology of 25G optical module, specific steps are as follows: prepare optical mode block main body and shell, inwardly process cavity in the open at one end of shell, and along opening；Shell at least side side wall and it is corresponding at the top of installation passage is set, elastomeric element is installed in installation passage bottom, in the affixed movable block of the elastomeric element other end, elastomeric element in the raw when, movable block outer end stretches out installation passage and enters cavity；In the affixed pull rope in movable block inner end, pull rope passes through the preset through-hole of case top and the first motion bar pole face is affixed, affixed fin and is hinged on case top on the first motion bar, case top setting fin slot；To select the angle between the tangent line and fin on the transversal disc of the first motion bar be 90 °~180 ° for pull rope affixed.The processing technology advantages of simple that the present invention is arranged can effectively meet the daily process requirements of optical module.
Description
Technical field
The invention belongs to electronics fields, and in particular to a kind of processing technology of 25G optical module.
Background technique
As the bandwidth of optical communication field constantly raises speed, optical module bandwidth also upgrades therewith.It is response market to high bandwidth
The demand of high speed data transfers, module design increasingly develop toward miniaturization, highdensity direction.The raising of optical module rate
Generally all along with the raising of power, as optical module power increases, volumetric thermal density also increases, and leads to optical module operating temperature
It increases, thermally sensitive electric light/photoelectric conversion component and chip performance will be greatly reduced in optical module, even result in whole
A module can not work normally or fail.In addition, the 25G optical module with high-efficiency heat radiation structure is often more multiple there is also processing
The problems such as unreasonable is arranged in miscellaneous, processing technology.Accordingly, it is desirable to provide a kind of processing technology of more efficient radiator structure and optimization
To solve the problems, such as this.
Summary of the invention
The object of the present invention is to provide a kind of processing technologys of 25G optical module that heat dissipation performance is excellent.
For achieving the above object, the technical scheme adopted by the invention is that: a kind of processing technology of 25G optical module,
Specific processing technology step are as follows:
(1) optical mode block main body and shell are prepared, inwardly processes confession in the open at one end of the shell, and along the opening
The cavity of optical mode block main body disengaging；
(2) installation passage is set on at least side side wall of the shell, is arranged in the case top logical with installation
The through-hole of road connection；
(3) elastomeric element is installed in the installation passage bottom, in the affixed movable block of the other end of the elastomeric element, institute
When stating elastomeric element in the raw, installation passage is stretched out in the outer end of the movable block, into cavity；
(4) pull rope is put into from the through hole of the case top, protruded into installation passage, by pull rope and the activity
The inner end of block is affixed；It is solid that the pull rope stays in the pole face near the case top surface portion and the first activity rod end surface
It connects, affixed fin on first motion bar, and first motion bar is hinged on case top, the case top correspondence is set
Set fin slot；
The specific connection processing method of the pull rope and the first motion bar are as follows: the affixed point of the pull rope is described
Angle is 90 °~180 ° between tangent line and the fin on the transversal disc of one motion bar；
After being provided with, the 25G optical module is completed the process.
Preferably, the specific processing connection type of the movable block and elastomeric element and pull rope is as follows:
(1) installation passage is along inclined direction processed, then by the work in the inner end and installation passage of the movable block
Motion block stretch rod is affixed；
(2) again that the movable block stretch rod and connecting rod outer end is affixed, the connecting rod edge is parallel to side wall depth side
To setting；
(3) again by the middle part of the connecting rod and the affixed elastomeric element of movable block stretch rod opposite direction；
(4) finally that the connecting rod inner end and the pull rope is affixed, that is, complete the processing of this part-structure.
Preferably, the movable block chamber portion is protruded into be processed as passing in and out the cambered surface that direction extends along optical mode block main body.
Preferably, first motion bar is connected at least one second motion bar, and second motion bar is hinged
In radiating part upper surface, and affixed fin；Second motion bar is parallel to the first motion bar.
Preferably, the radiating part outer surface and/or the fin are equipped with thermal dispersant coatings.
Preferably, the formula of the thermal dispersant coatings are as follows: in parts by weight, 20~25 parts of FeO powder, MnO2Powder 20~25
Part, 8~10 parts of CuO powder, 50~60 parts of hollow glass microbead, 100~160 parts of bisphenol A type epoxy resin, deionized water 2000
Part；Powder diameter≤0.5 μm of each metal oxide, partial size≤5 μm of the hollow glass microbead.
Preferably, the formula of the thermal dispersant coatings are as follows: in parts by weight, 25 parts of FeO powder, MnO220 parts of powder, CuO powder
Last 8 parts, 55 parts of hollow glass microbead, 135 parts of bisphenol A type epoxy resin, 2000 parts of deionized water.
Preferably, the preparation method of the thermal dispersant coatings includes the following steps:
(1) by MnO2It after powder, CuO powder, hollow glass microbead mix, is added in bisphenol A type epoxy resin, mixes
Afterwards, FeO powder and deionized water are added, ultrasound mixes, and obtains heat radiation coating；
(2) heat radiation coating is evenly coated in radiating part outer surface and/or the fin surface, is subsequently placed at electricity
In, 120~130V/cm is handled 5 minutes；
In entire galvanization, while applying uniform externally-applied magnetic field；The direction of the externally-applied magnetic field is applied perpendicular to coating
Cloth direction；Magnetic field strength is 0.5T, magnetic field 20~25mm of spacing；
(3) then 165~175 DEG C are being placed in, under ar gas environment, are keeping the temperature 2h；After natural cooling, clean 2~3 times；
(4) again under 450~550 DEG C, ar gas environment, 2h is kept the temperature；0.5h is kept the temperature at 750~800 DEG C again；Natural cooling
Afterwards, thermal dispersant coatings are formed.
Preferably, the other end upper and lower surface of the optical module insertion shell installs the first heat sink and the second heat dissipation respectively
Plate, first heat sink, the second heat sink are connected on shell by fastening bolt.
Preferably, several heat release holes are additionally provided on first heat sink.
The invention has the following advantages:
1, for optical mode block main body when entering in shell, heat production is more and heat dissipation is difficult.Setting through the invention, optical module master
After body enters, shell top wall radiating fin is automatically opened, increasing heat radiation area, meanwhile, the opening of fin keeps shell thinning, optical mode
Block main body and extraneous hypotelorism, further increase radiating efficiency.In addition, being formed during the work time, between fin and fin logical
Road, the air of external world's flowing can form flow channel therebetween, and heat is taken away in help.
After optical mode block main body leaves shell, the fin on shell is closed automatically, avoid fin when being in erected state by
It collides with and damages or hurt staff.
2, the radiator portion of shell is also correspondingly arranged thermal dispersant coatings, further helps to radiate.Shell is metal material, in electricity
When deposition, after bisphenol A type epoxy resin contacts with shell, it is possible to create gas generates groove in coating surface.In addition, FeO exists
Coating surface is floated under magnetic fields, and part is removed, be further formed groove in coating surface, increase coating radiating surface
Product, effectively increases the heat-sinking capability of thermal dispersant coatings.
3, the present invention also provides the processing technology of the 25G optical module, procedure of processing is optimized, saves and is processed into
This.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of one embodiment of the present invention in an inactive state；
Fig. 2 be in Fig. 1 the A-A of shell in an inactive state to sectional view；
Fig. 3 is installation passage internal structure and fin positional diagram in Fig. 2；
Fig. 4 be in Fig. 1 A-A of the shell in working condition to sectional view；
Fig. 5 is installation passage internal structure and fin positional diagram in Fig. 4；
Fig. 6 is the enlarged drawing of a kind of embodiment in the portion A in an inactive state in Fig. 2；
Fig. 7 is enlarged drawing of a kind of embodiment in the portion A in working condition in Fig. 4；
Fig. 8 is the enlarged drawing of the portion A another embodiment in an inactive state in Fig. 2；
Fig. 9 is the mode enlarged drawing that the portion A another kind implements in working condition in Fig. 4；
Figure 10 is the schematic diagram of a kind of embodiment in working condition that is connected in Fig. 2；
Figure 11 is schematic diagram of the another embodiment in working condition that be connected in Fig. 2；
Figure 12 is structural schematic diagram of the another embodiment of the invention in working condition.
Specific embodiment
In each attached drawing, shell 20 is inserted into optical mode block main body 10 and is in working condition, shell is not inserted into optical mode block main body 10
20 be non-working condition.
It is as shown in Figure 1, a kind of 25G optical module, including optical mode block main body 10 and it is open at one end, inserted for optical mode block main body 10
The shell 20 entered, the optical mode block main body 10 can be socketed on inside shell 20, can not also be socketed, individually placed.
As shown in Figure 2-5, the shell 20 includes the base portion 21 that there is cavity in inside, and the cavity is for optical mode block main body
10 disengaging.Radiating part 22 is equipped with above the base portion 21.Base portion 21 and radiating part 22 are really an entirety, are intended merely to conveniently
Description is divided into two parts.
The base portion 21, which is open, is nearby at least arranged installation passage on the side wall of side.Equipped with activity inside the installation passage
Block 31 is preferably symmetrical arranged installation passage in two sidewalls, and installation passage internal structure is also accordingly symmetrical arranged and (only shows in figure
The structure of one side wall).
Elastomeric element 34 is arranged in 31 outer end of movable block between free end, inner end and the installation passage bottom, described
Elastomeric element 34 is preferably the strong spring of elastic recovery capability.When the optical mode block main body 10 is separated with shell 20, the activity
The cavity is protruded into 31 free end of block.31 inner end of movable block connects pull rope 35.
The preferred connection type of the movable block 31 and elastomeric element 34 and pull rope 35 is as follows: the installation passage inclination
Arrangement, described 31 one end of movable block are free end, and the other end and the movable block stretch rod 32 in installation passage are affixed, the activity
Block stretch rod 32 and 33 outer end of connecting rod for being parallel to side wall longitudinal direction are affixed, the middle part of the connecting rod 33 and movable block
The affixed elastomeric element 34 of 32 opposite direction of stretch rod, 33 inner end of connecting rod and the pull rope 35 are affixed, the drawing
Stretch the preferably wirerope of rope 35.
Preferred scheme is, when the optical mode block main body 10 does not enter, one side that movable block 31 is connect with connecting rod 33
It is located just at the opening of opened cavity on side wall, and the opening parallel in the face and cavity；The optical mode block main body 10 completely into
After entering shell 20, movable block 31 is completely into cavity inside.
The other end of the pull rope 35 protrudes into radiating part 22, and affixed with the pole face near 361 end face of the first motion bar,
First motion bar 361 is articulated with 22 upper surface of radiating part, affixed fin 37 on the first motion bar 361；The radiating part 22
On be correspondingly arranged fin slot 38, make fin 37 in the closure state, be located just in fin slot 38.
The connection type of the pull rope 35 and the first motion bar 361 are as follows: the affixed point 350 of the pull rope 35 is described
Angle is 90 °~180 ° between tangent line and the fin 37 on the transversal disc of first motion bar 361.When angle is 180 °, non-work
Make specific connection type when state as shown in fig. 6, when working condition is as shown in Figure 7.When angle is 90 °, when off working state, has
Body connection type is as shown in figure 8, (the mode corresponding diagram 10 being connected shown in Fig. 6~9 as shown in Figure 9 when working condition
Connection type).
It is preferably to pass in and out the cambered surface that direction extends along optical mode block main body 10 that the movable block 31, which protrudes into chamber portion,.With convenient
When optical mode block main body 10 enters shell 20,10 ground of optical mode block main body can not be damaged easily, movable block 31 is pressed into side wall
Portion.Described 31 one end of movable block is free end, and when no optical mode block main body 10 enters, protrusion side wall enters cavity.
It should be noted that the positional relationship illustrated in figure is intended merely to facilitate observation and elaboration, 31 He of movable block
The fin 37 certain displacement difference of physical presence in the longitudinal direction of shell 20.The movable block 31 is located at opening for shell 20
Mouth inlet.The fin 37 is located at the other end end surface of 20 open end of shell, is preferably located at optical mode block main body 10 and inserts
After entering, be inserted into bosom position corresponding to surface on the housing 20；That is, after optical mode block main body 10 is inserted into, insert end
Top, 20 corresponding position of shell, be arranged fin 37.
More optimal solution are as follows: at least one second motion bar 362 of first motion bar 361 is connected, and described second
Motion bar 362 is articulated with 22 upper surface of radiating part, and affixed fin 37.Second motion bar 362 is parallel to the first motion bar
361。
Described be connected can be as shown in Figure 10, and the pull rope 35 is extended to form linkage rope 351.The linkage rope
351 surround first motion bar 361 at least after a week, are bonded relationship with first motion bar 361 formation, then prolong
Length is simultaneously looped around on the second motion bar 362 in the same way.In order to make linkage rope 351 and each motion bar form the side of being bonded
Formula can also accordingly slot on each motion bar, linkage rope 351 is fixed in slot.Pull rope 35 moves up and down, and pulls linkage
It restricts 351 side-to-side movements, and then drives each linkage of fin 37 folding.
Described be connected can also be as shown in figure 11, in the hinged setting interlocking bar 352 in each 37 outside of fin.It is described
22 upper surface of radiating part is corresponding to open up the slot for placing interlocking bar 352.The pull rope 35 moves up and down, and drives the first motion bar
Fin 37 on 361 opens and closes, and then the linkage folding of each fin 37 is used under the action of interlocking bar 352.Figure 10, do not show in 11
Meaning fin slot 38.
The operation principle of the present invention is that: when optical mode block main body 10 does not enter, elastomeric element 34 in the raw, movable block
31 protrusion side walls, are located inside shell 20, each fin 37 is in closed state.Optical mode block main body 10 from 20 opening of shell into
Enter, push movable block 31 move to 20 interior of shell, depths, thus make elastomeric element 34 push, drive pull rope 35 to
Lower movement to drive the rotation of the first motion bar 361, and drives each fin 37 to open under linkage structure.Optical mode block main body 10
After exiting shell 20, elastomeric element 34 restores nature, pushes and moves outside movable block 31, while pull rope 35 moves upwards, respectively
Fin 37 is closed.
More optimal solution are as follows: 22 outer surface of radiating part and/or the fin 37 are equipped with thermal dispersant coatings and (do not show in figure
Out).
The thermal dispersant coatings the preparation method is as follows:
1, it is formulated: in parts by weight, 20~25 parts of FeO powder, MnO220~25 parts of powder, 8~10 parts of CuO powder, in
50~60 parts of empty glass microballoon, 100~160 parts of bisphenol A type epoxy resin, 2000 parts of deionized water.Each metal oxide
Powder diameter≤0.5 μm, partial size≤5 μm of the hollow glass microbead.
2, preparation method:
(1) by MnO2It after powder, CuO powder, hollow glass microbead mix, is added in bisphenol A type epoxy resin, mixes
Afterwards, FeO powder and deionized water are added, ultrasound mixes to get heat radiation coating.
(2) heat radiation coating is evenly coated in clean to coating surface.The heat radiation coating 1g can be coated with to be plated
The area of layer is 100~200cm2.By be coated with after coating it is to be plated be placed in electric field, provided using 600 type electrophoresis apparatus of JY straight
Galvanic electricity source applies the steady electric field of 120~130V/cm between electrode, is powered 5 minutes.
In entire galvanization, while treating coating and applying uniform externally-applied magnetic field.It hangs down in the direction of the externally-applied magnetic field
Directly in the coating coating direction on coating；Magnetic field strength is 0.5T, magnetic field 20~25mm of spacing.
(3) by step (2) treated it is to be plated be placed on 165~175 DEG C, under ar gas environment, keep the temperature 2h.Natural cooling
Afterwards, it is cleaned by ultrasonic using deionized water to coating 2~3 times, washes away the metal oxide of coating surface, is formed with uniform pores
Coating.
(4) again under 450~550 DEG C, ar gas environment, 2h is kept the temperature；0.5h is kept the temperature at 750~800 DEG C again, removes bis-phenol
A type epoxy resin.After natural cooling, thermal dispersant coatings are formed.
The preparation of thermal dispersant coatings is further described below with reference to specific experiment.
10 groups of thermal dispersant coatings are prepared according to the above method, wherein the design parameter of each group is as shown in table 1, and each group is divided into table
Parts by weight.Not add FeO as control group 1, not add externally-applied magnetic field as control group 2.
1 each group design parameter table of table
Emissivity is the basic parameter of hot physical property, and the transmitting of each thermal dispersant coatings is measured using infrared thermal emissivity analyzer
Rate, and Electronic Speculum observes thermal dispersant coatings appearance features, the results are shown in Table 2.
2 each group effect of table shows table
| Group | Emissivity | Appearance features |
| Group 1 | 0.88 | Plurality of grooves structure |
| Group 2 | 0.93 | Plurality of grooves structure |
| Group 3 | 0.87 | Plurality of grooves structure |
| Group 4 | 0.87 | Plurality of grooves structure |
| Group 5 | 0.82 | Plurality of grooves structure |
| Group 6 | 0.85 | Plurality of grooves structure |
| Group 7 | 0.83 | Plurality of grooves structure |
| Group 8 | 0.85 | Plurality of grooves structure |
| Group 9 | 0.82 | Plurality of grooves structure |
| Group 10 | 0.76 | Plurality of grooves structure |
| Control group 1 | 0.70 | Part recess structure |
| Control group 2 | 0.76 | A small amount of groove structure |
More optimal solution are as follows: the other end upper and lower surface that the optical mode block main body 10 is inserted into shell 20 is also respectively set first
Heat sink 41 and the second heat sink 42 are additionally provided with several heat release holes 411 on first heat sink 41.Each heat sink is
The good metal material of heat dissipation performance, such as metallic aluminium.First heat sink 41, the second heat sink 42 pass through fastening bolt 50
It is connected on shell 20.To ensure that the first heat sink 41 and the second heat sink 42 are tightly attached in optical mode block main body 10, the fastening
Clamping reed 51 is additionally provided between bolt 50 and the second heat sink 42.
Claims (10)
1. a kind of processing technology of 25G optical module, it is characterised in that: specific processing technology step are as follows:
(1) optical mode block main body (10) and shell (20) are prepared, in the open at one end of the shell (20), and it is inside along the opening
Process the cavity for optical mode block main body (10) disengaging；
(2) installation passage is set on at least side side wall of the shell (20), setting and peace at the top of the shell (20)
Fill the through-hole of channel connection；
(3) elastomeric element (34) are installed in the installation passage bottom, in the affixed activity of the other end of the elastomeric element (34)
Block (31), the elastomeric element (34) in the raw when, installation passage is stretched out in the outer end of the movable block (31), into sky
Chamber；
(4) be put into pull rope (35) from the through hole at the top of the shell (20), protrude into installation passage, by pull rope (35) with
The inner end of the movable block (31) is affixed；The pull rope (35) stays in the shell (20) top surface portion and the first activity
Pole face near bar (361) end face is affixed, affixed fin (37) on first motion bar (361), and first motion bar
It is hinged at the top of shell (20), is correspondingly arranged fin slot (38) at the top of the shell (20)；
The specific connection processing method of the pull rope (35) and the first motion bar (361) are as follows: the pull rope (35) it is affixed
Selecting the angle between the tangent line and the fin (37) on the transversal disc of first motion bar (361) is 90 °~180 °；
After being provided with, the 25G optical module is completed the process.
2. the processing technology of 25G optical module according to claim 1, it is characterised in that: the movable block (31) and elasticity
The specific processing connection type of component (34) and pull rope (35) is as follows:
(1) installation passage is along inclined direction processed, then by the work in the inner end and installation passage of the movable block (31)
Motion block stretch rod (32) is affixed；
(2) again that the movable block stretch rod (32) and connecting rod (33) outer end is affixed, connecting rod (33) edge is parallel to side
The setting of wall longitudinal direction；
(3) again by the middle part of the connecting rod (33) and the affixed elastomeric element of movable block stretch rod (32) opposite direction
(34)；
(4) finally that the connecting rod (33) inner end and the pull rope (35) is affixed, that is, complete the processing of this part-structure.
3. the processing technology of 25G optical module according to claim 1, it is characterised in that: protrude into the movable block (31)
Chamber portion is processed as passing in and out the cambered surface that direction extends along optical mode block main body (10).
4. the processing technology of 25G optical module according to claim 1, it is characterised in that: by first motion bar (361)
It being connected at least one second motion bar (362), second motion bar (362) is articulated with radiating part (22) upper surface,
And affixed fin (37)；And set parallel with the first motion bar (361) for second motion bar (362).
5. the processing technology of 25G optical module according to claim 1, it is characterised in that: in the base portion (21) outer surface
And/or thermal dispersant coatings are set on radiating part (22) outer surface and/or the fin (37).
6. the processing technology of 25G optical module according to claim 5, it is characterised in that: the formula of the thermal dispersant coatings are as follows:
In parts by weight, 20~25 parts of FeO powder, MnO220~25 parts of powder, 8~10 parts of CuO powder, hollow glass microbead 50~60
Part, 100~160 parts of bisphenol A type epoxy resin, 2000 parts of deionized water；The powder diameter of each metal oxide≤0.5 μ
M, partial size≤5 μm of the hollow glass microbead.
7. the processing technology of 25G optical module according to claim 6, it is characterised in that: the formula of the thermal dispersant coatings are as follows:
In parts by weight, 25 parts of FeO powder, MnO220 parts of powder, 8 parts of CuO powder, 55 parts of hollow glass microbead, bisphenol type epoxy tree
135 parts of rouge, 2000 parts of deionized water.
8. the processing technology of 25G optical module according to claim 6 or 7, it is characterised in that: the preparation of the thermal dispersant coatings
Method includes the following steps:
(1) by MnO2After powder, CuO powder, hollow glass microbead mix, it is added in bisphenol A type epoxy resin, after mixing, then plus
Enter FeO powder and deionized water, ultrasound mixes, and obtains heat radiation coating；
(2) heat radiation coating is evenly coated in the base portion (21) outer surface and/or radiating part (22) outer surface and/or described
Fin (37) surface, is subsequently placed in electric field, and 120~130V/cm is handled 5 minutes；
In entire galvanization, while applying uniform externally-applied magnetic field；The direction of the externally-applied magnetic field is perpendicular to coating coating side
To；Magnetic field strength is 0.5T, magnetic field 20~25mm of spacing；
(3) then 165~175 DEG C are being placed in, under ar gas environment, are keeping the temperature 2h；After natural cooling, clean 2~3 times；
(4) again under 450~550 DEG C, ar gas environment, 2h is kept the temperature；0.5h is kept the temperature at 750~800 DEG C again；After natural cooling,
Form thermal dispersant coatings.
9. the processing technology of 25G optical module according to claim 1, it is characterised in that: in the optical mode block main body (10)
The other end upper and lower surface of insertion shell (20) installs the first heat sink (41) and the second heat sink (42) respectively, and described first dissipates
Hot plate (41), the second heat sink (42) are connected on shell (20) by fastening bolt (50).
10. the processing technology of 25G optical module according to claim 9, it is characterised in that: in first heat sink (41)
The upper several heat release holes (411) of setting.
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| JP3146030U (en) * | 2008-08-21 | 2008-10-30 | 奇宏電子深▲しん▼有限公司 | Heat dissipation fin structure and heat dissipation module using the heat dissipation fin |
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| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
| CN207037164U (en) * | 2017-07-28 | 2018-02-23 | 安费诺电子装配（厦门）有限公司 | A kind of optic communication transceiver |
| CN207675989U (en) * | 2018-01-09 | 2018-07-31 | 武汉铭之光科技有限公司 | Novel heat dissipation structure for high-speed long-distance optical module |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2458750Y (en) * | 2000-07-25 | 2001-11-07 | 富士康(昆山)电脑接插件有限公司 | Socket electric connector |
| JP3146030U (en) * | 2008-08-21 | 2008-10-30 | 奇宏電子深▲しん▼有限公司 | Heat dissipation fin structure and heat dissipation module using the heat dissipation fin |
| CN205728532U (en) * | 2016-06-30 | 2016-11-30 | 孔兵 | A kind of luggage case anti-skidding device |
| CN106443913A (en) * | 2016-12-20 | 2017-02-22 | 中航海信光电技术有限公司 | Optical module packaging structure and optical module |
| CN207037164U (en) * | 2017-07-28 | 2018-02-23 | 安费诺电子装配（厦门）有限公司 | A kind of optic communication transceiver |
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