CN109443999B - Wireless passive sensor and manufacturing method thereof - Google Patents
Wireless passive sensor and manufacturing method thereof Download PDFInfo
- Publication number
- CN109443999B CN109443999B CN201811087497.XA CN201811087497A CN109443999B CN 109443999 B CN109443999 B CN 109443999B CN 201811087497 A CN201811087497 A CN 201811087497A CN 109443999 B CN109443999 B CN 109443999B
- Authority
- CN
- China
- Prior art keywords
- substrate
- inductance
- passive sensor
- particles
- wireless passive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 239000002245 particle Substances 0.000 claims abstract description 50
- 239000000758 substrate Substances 0.000 claims abstract description 39
- 238000001514 detection method Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000009471 action Effects 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 30
- 230000001939 inductive effect Effects 0.000 claims description 18
- 238000000151 deposition Methods 0.000 claims description 15
- 238000005530 etching Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 6
- 238000000576 coating method Methods 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 5
- 238000001259 photo etching Methods 0.000 claims description 3
- 238000010923 batch production Methods 0.000 abstract description 4
- 239000002609 medium Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 4
- 230000003071 parasitic effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003203 everyday effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000005065 mining Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2617—Measuring dielectric properties, e.g. constants
Landscapes
- Chemical & Material Sciences (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Analytical Chemistry (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Dispersion Chemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Measurement Of Resistance Or Impedance (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Abstract
The invention discloses a wireless passive sensor and a manufacturing method thereof. The method comprises the following steps: a substrate; an insulating dielectric layer provided on one side of the substrate in a thickness direction thereof; the fixing piece is arranged on one side, away from the substrate, of the insulating medium layer; the inductance assembly is connected with the fixing piece, the inductance assembly is suspended above the substrate, in addition, the inductance assembly deviates from one surface of the substrate and is used for bearing particles to be detected, so that mechanical resonance and electromagnetic resonance are generated under the action of the particles to be detected, and the detection of the quality and the dielectric constant of the particles to be detected is realized. The wireless passive sensor can utilize the characteristics of mechanical resonance and electromagnetic resonance of the inductance component, and can realize the simultaneous detection of the quality and the dielectric constant of particles. In addition, the device does not need leads or batteries for power supply, and can be applied to severe environments such as a closed environment or a rotating environment. The chip is an on-chip integrated structure, and has the advantages of small volume, low power consumption and batch production.
Description
Technical Field
The invention relates to the technical field of microelectronics, in particular to a wireless passive sensor and a manufacturing method thereof.
Background
Particulates are common in everyday life and industrial production, such as contaminating particles in the atmosphere and water body environment, foreign particles on industrial products and packaging, and the like. The particles are various in kind, and can be roughly classified into solid particles and liquid particles. It is necessary to detect the parameters such as the quality and the components of the particles.
For the detection of the particles, means such as microscopic observation or spectrometer analysis are often used to obtain characteristic information of the particles. Such characteristic information includes the size, number, color, composition, etc. of the particles. For example, a high-precision laser particle detector based on the principle of the photoresistance method is suitable for rapid measurement of the concentration of inhalable particles (PM10) in public places, detection of dust concentration in labor hygiene such as production sites of industrial and mining enterprises, and detection of the size and quantity of insoluble particles in a liquid with various transparent dispersion media. It can be seen that the detection of particles is currently mainly an optical method.
Besides optical methods, the extraction of mechanical and electrical properties of the particles requires the use of special mechanical and electrical instruments. These devices are bulky and expensive. Currently, no dedicated miniature sensor is available on the market that can wirelessly and passively detect mechanical and electrical parameters of particles.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art and provides a wireless passive sensor and a manufacturing method thereof.
In order to achieve the above object, a first aspect of the present invention provides a wireless passive sensor, comprising:
a substrate;
an insulating dielectric layer provided on one side of the substrate in a thickness direction thereof;
the fixing piece is arranged on one side, away from the substrate, of the insulating medium layer;
the inductance assembly is connected with the fixing piece, the inductance assembly is suspended above the substrate, in addition, the inductance assembly deviates from one surface of the substrate and is used for bearing particles to be detected, so that mechanical resonance and electromagnetic resonance are generated under the action of the particles to be detected, and the detection of the quality and the dielectric constant of the particles to be detected is realized.
Optionally, the inductance assembly comprises an inductance structure and a carrying structure; wherein the content of the first and second substances,
the inductance structure is connected with the fixing piece, and the inductance structure is suspended above the substrate;
the bearing structure is arranged on one side of the inductance structure, which is far away from the substrate, and the bearing structure is used for bearing the particles to be tested.
Optionally, the inductive structure comprises a body portion and a planar portion; wherein the content of the first and second substances,
the first end of the main body part is connected with the fixing part, and the second end of the main body part is connected with the flat plate part;
one side of the flat plate part, which is far away from the substrate, is provided with the bearing structure.
Optionally, the main body portion is wound from the first end to the second end to form a multi-turn structure.
Optionally, the size of the carrying structure is adapted to the size of the particles to be detected.
Optionally, the fixing member is a frame structure, and the inductance assembly is enclosed in the frame structure.
Optionally, the inductor structure includes a first metal film, a dielectric film, and a second metal film that are sequentially disposed, where the first metal film faces the substrate, the second metal film faces away from the substrate, and the first metal film and the second metal film form an LC resonant tank.
Optionally, the surface of the inductance structure is subjected to an adhesion promotion treatment.
In a second aspect of the present invention, there is provided a method for manufacturing a wireless passive sensor, the wireless passive sensor including the wireless passive sensor described above, the method comprising:
step S110, depositing an insulating medium layer on the surface of the substrate;
step S120, coating a sacrificial layer and etching;
step S130, depositing to form the inductance assembly;
step S140, coating a sacrificial layer and etching;
s150, depositing a dielectric layer and etching to form the fixing piece;
and S160, corroding the sacrificial layer and releasing the inductance component.
Optionally, step S130 specifically includes:
depositing a first metal layer, a dielectric layer and a second metal layer in sequence, photoetching and etching the first metal layer, the dielectric layer and the second metal layer to form the inductance structure, and performing surface adhesion treatment on the inductance structure;
and depositing a dielectric layer and etching to form the bearing structure.
The wireless passive sensor and the manufacturing method thereof can realize the simultaneous detection of the quality and the dielectric constant of the particles by utilizing the characteristics of mechanical resonance and electromagnetic resonance of the inductance component. In addition, the device does not need leads or batteries for power supply, and can be applied to severe environments such as a closed environment or a rotating environment. The chip is an on-chip integrated structure and has the advantages of small volume, low power consumption and batch production.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
fig. 1 is a schematic structural diagram of a wireless passive sensor according to a first embodiment of the present invention;
FIG. 2 is a cross-sectional view of the wireless passive sensor shown in FIG. 1 along direction AA;
fig. 3 is a flowchart of a method for manufacturing a wireless passive sensor according to a second embodiment of the invention.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
As shown in fig. 1 and 2, a first aspect of the present invention relates to a wireless passive sensor 100, where the wireless passive sensor 100 includes a substrate 110, an insulating medium layer 120, a fixing member 130, and an inductance component 140. Wherein, the insulating medium layer 120 is disposed on one side of the substrate 110 along the thickness direction thereof, as shown in fig. 2, the insulating medium layer 120 is disposed on the upper surface of the substrate 110. A fixing member 130 is disposed on a side of the insulating dielectric layer 120 facing away from the substrate 110, as shown in fig. 2, and the fixing member 130 is disposed on an upper surface of the insulating dielectric layer 120. The inductance component 140 is connected to the fixing member 130, the inductance component 140 is suspended above the substrate 110, and a surface of the inductance component 140 facing away from the substrate 110 is used for bearing particles to be detected (not shown in the figure), so as to generate mechanical resonance and electromagnetic resonance under the action of the particles to be detected, thereby realizing detection of the mass and the dielectric constant of the particles to be detected.
Specifically, the mechanical resonant frequency of the inductive component 140 is determined by its mass and spring rate. Therefore, after the particles to be measured are placed on the inductive element 140, the mechanical resonant frequency of the inductive element 140 will change. The mass of the particles can be calculated by measuring the variation of the mechanical resonance frequency. In addition, the electromagnetic resonant frequency of the inductive component 140 is determined by its inductance and parasitic capacitance. When the particles to be measured are placed, the parasitic capacitance of the inductive element 140 changes, and the electromagnetic resonant frequency of the inductive element 140 changes accordingly. The dielectric constant of the particles can be calculated by measuring the change of the electromagnetic resonance frequency.
More specifically, when particles to be measured are placed on the inductive element 140, the mass of the inductive element 140 increases. After the mass of the inductance component 140 is increased, the mechanical resonance frequency of the inductance component is reduced; at the same time, the parasitic capacitance of the inductive component 140 increases. The parasitic capacitance of the inductive component 140 increases, which will decrease its electromagnetic resonance frequency.
Before measurement, the mechanical resonance frequency of the wireless passive sensor 100 of the present embodiment may be calibrated by using a vibration meter, and a relationship between the mechanical resonance frequency and different particle masses is established. Meanwhile, the electromagnetic resonance frequency of the wireless passive sensor 100 of the present embodiment is calibrated by using the readout coil, and the relationship between the electromagnetic resonance frequency and the dielectric constants of different particles is established. Thus, during measurement, the vibration meter and the readout coil can be used to simultaneously read out the mechanical resonance frequency and the electromagnetic resonance frequency of the wireless passive sensor 100 of the embodiment, and the mechanical resonance frequency and the electromagnetic resonance frequency are compared with a calibration value, so that the quality and the dielectric constant of the particles to be measured can be obtained.
The wireless passive sensor 100 having the structure of the present embodiment can simultaneously detect the mass and the dielectric constant of the particles by using the characteristics of the mechanical resonance and the electromagnetic resonance of the inductance component 140. In addition, the wireless passive sensor 100 having the structure of the present embodiment can be applied to a severe environment such as a closed environment or a rotating environment without requiring a lead wire or a battery for power supply. The wireless passive sensor 100 with the structure of the embodiment is an on-chip integrated structure, and has the advantages of small volume, low power consumption and batch production.
As shown in fig. 1 and 2, in order to further improve the measurement accuracy, the inductance assembly 140 includes an inductance structure 141 and a bearing structure 142. The inductive structure 141 is connected to the fixing member 130, and the inductive structure 141 is suspended above the substrate 110. The carrying structure 142 is disposed on a side of the inductance structure 141 facing away from the substrate 110, and the carrying structure 142 is used for carrying the particles to be measured. That is to say, the inductance assembly 140 includes the bearing structure 142 for independently bearing the particles to be detected, so that the particles to be detected can directly contact the inductance structure 141, thereby avoiding the problems of pollution of the particles to be detected to the inductance structure 141, and the like, and effectively prolonging the service life of the inductance structure 141.
As shown in fig. 1, the inductance structure 141 includes a main body portion 141a and a flat plate portion 141 b; a first end of the main body portion 141a is connected to the fixing member 130, and a second end of the main body portion 141a is connected to the flat plate portion 141 b. The side of the flat plate portion 141b facing away from the substrate 110 is provided with the bearing structure 142. In this way, the flat plate portion 141b is provided to effectively support the supporting structure 142.
As shown in fig. 1, the main body portion 141a is wound from the first end to the second end to form a multi-turn structure. Thus, when the particles to be measured are placed on the supporting structure 142, the main body 141a has more significant effects of mechanical resonance and electromagnetic resonance, so that the accuracy of measuring the quality and the dielectric constant of the particles to be measured can be further improved.
Preferably, the size of the supporting structure 142 is adapted to the size of the particles to be detected.
As shown in fig. 1, the fixing member 130 is a frame structure, and the inductance component 140 is enclosed in the frame structure.
As shown in fig. 1 and fig. 2, the inductance structure 141 includes a first metal film 141c, a dielectric film 141d, and a second metal film 141e, which are sequentially disposed, the first metal film 141c faces the substrate 110, the second metal film 141e faces away from the substrate 110, and the first metal film 141c and the second metal film 141e form an LC resonant tank.
Optionally, the surface of the inductance structure 141 is subjected to an adhesion promotion process, so that the reliability of the supporting structure 142 fixing the inductance structure 141 can be effectively improved.
In a second aspect of the present invention, as shown in fig. 3, a method S100 for manufacturing a wireless passive sensor is provided, where the wireless passive sensor includes the wireless passive sensor described above, and the specific structure of the wireless passive sensor may refer to the related descriptions above, and is not described herein again. The manufacturing method S100 includes:
step S110, depositing an insulating medium layer on the surface of the substrate;
step S120, coating a sacrificial layer and etching;
step S130, depositing to form the inductance assembly;
step S140, coating a sacrificial layer and etching;
s150, depositing a dielectric layer and etching to form the fixing piece;
and S160, corroding the sacrificial layer and releasing the inductance component.
The method for manufacturing the wireless passive sensor with the structure of the embodiment can realize simultaneous detection of the mass and the dielectric constant of the particles by using the characteristics of mechanical resonance and electromagnetic resonance of the inductance component 140. In addition, the device does not need leads or batteries for power supply, and can be applied to severe environments such as a closed environment or a rotating environment. The manufactured wireless passive sensor is of an on-chip integrated structure and has the advantages of small volume, low power consumption and batch production.
Optionally, step S130 specifically includes:
depositing a first metal layer, a dielectric layer and a second metal layer in sequence, photoetching and etching the first metal layer, the dielectric layer and the second metal layer to form the inductance structure, and performing surface adhesion treatment on the inductance structure;
and depositing a dielectric layer and etching to form the bearing structure.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
1. A wireless passive sensor, comprising:
a substrate;
an insulating dielectric layer provided on one side of the substrate in a thickness direction thereof;
the fixing piece is arranged on one side, away from the substrate, of the insulating medium layer;
the inductance assembly is connected with the fixing piece, the inductance assembly is suspended above the substrate, in addition, the inductance assembly deviates from one surface of the substrate and is used for bearing particles to be detected, so that mechanical resonance and electromagnetic resonance are generated under the action of the particles to be detected, and the detection of the quality and the dielectric constant of the particles to be detected is realized.
2. The wireless passive sensor of claim 1, wherein the inductive component comprises an inductive structure and a load-bearing structure; wherein the content of the first and second substances,
the inductance structure is connected with the fixing piece, and the inductance structure is suspended above the substrate;
the bearing structure is arranged on one side of the inductance structure, which is far away from the substrate, and the bearing structure is used for bearing the particles to be tested.
3. The wireless passive sensor of claim 2, wherein the inductive structure comprises a body portion and a plate portion; wherein the content of the first and second substances,
the first end of the main body part is connected with the fixing part, and the second end of the main body part is connected with the flat plate part;
one side of the flat plate part, which is far away from the substrate, is provided with the bearing structure.
4. The wireless passive sensor of claim 3, wherein the body portion is wrapped around from the first end to the second end to form a multi-turn structure.
5. A wireless passive sensor according to claim 2, wherein the size of the carrying structure is adapted to the size of the particles to be measured.
6. A wireless passive sensor according to any of claims 1 to 5, wherein the mount is a frame structure, the inductive component being enclosed within the frame structure.
7. The wireless passive sensor according to any one of claims 2 to 5, wherein the inductance structure comprises a first metal film, a dielectric film and a second metal film which are arranged in sequence, the first metal film faces the substrate, the second metal film faces away from the substrate, and the first metal film and the second metal film form an LC resonant loop.
8. A wireless passive sensor according to any of claims 2 to 5, wherein the surface of the inductive structure is treated for adhesion promotion.
9. A method of manufacturing a wireless passive sensor, the wireless passive sensor comprising the wireless passive sensor of any one of claims 1 to 8, the method comprising:
step S110, depositing an insulating medium layer on the surface of the substrate;
step S120, coating a sacrificial layer and etching;
step S130, depositing to form the inductance assembly;
step S140, coating a sacrificial layer and etching;
s150, depositing a dielectric layer and etching to form the fixing piece;
and S160, corroding the sacrificial layer and releasing the inductance component.
10. The manufacturing method according to claim 9, wherein step S130 specifically includes:
depositing a first metal layer, a dielectric layer and a second metal layer in sequence, photoetching and etching the first metal layer, the dielectric layer and the second metal layer to form an inductance structure, and performing surface adhesion-increasing treatment on the inductance structure;
and depositing a dielectric layer and etching to form a bearing structure.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811087497.XA CN109443999B (en) | 2018-09-18 | 2018-09-18 | Wireless passive sensor and manufacturing method thereof |
| PCT/CN2019/079132 WO2020057079A1 (en) | 2018-09-18 | 2019-03-21 | Wireless passive sensor and manufacturing method therefor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811087497.XA CN109443999B (en) | 2018-09-18 | 2018-09-18 | Wireless passive sensor and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109443999A CN109443999A (en) | 2019-03-08 |
| CN109443999B true CN109443999B (en) | 2021-03-30 |
Family
ID=65532845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811087497.XA Active CN109443999B (en) | 2018-09-18 | 2018-09-18 | Wireless passive sensor and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109443999B (en) |
| WO (1) | WO2020057079A1 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443999B (en) * | 2018-09-18 | 2021-03-30 | 东南大学 | Wireless passive sensor and manufacturing method thereof |
| CN113418969B (en) * | 2021-06-07 | 2023-04-25 | 武汉大学 | High-sensitivity millimeter wave dielectric resonance sensor for biomedical detection |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202057398U (en) * | 2011-05-18 | 2011-11-30 | 大连理工大学 | Micro-mass sensor based on groove type cantilever beam structure |
| CN104407232A (en) * | 2014-11-26 | 2015-03-11 | 电子科技大学 | System and method for testing microwave complex permittivity of dielectric material |
| CN105938021A (en) * | 2016-06-30 | 2016-09-14 | 东南大学 | Multi-layer inductor passive wireless LC temperature sensor |
| CN107576821A (en) * | 2017-09-27 | 2018-01-12 | 东南大学 | Inductance cantilever beam wireless and passive acceleration transducer |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102269615B (en) * | 2011-05-07 | 2012-11-14 | 大连理工大学 | Micro mass sensor based on groove-shaped cantilever beam structure |
| US9291586B2 (en) * | 2012-05-05 | 2016-03-22 | Board Of Regents, The University Of Texas System | Passive wireless self-resonant sensor |
| CN103940711A (en) * | 2014-04-14 | 2014-07-23 | 北京理工大学 | Device for detecting PM2.5 particulate matters based on disc micro-machine resonator |
| CN105241795B (en) * | 2015-09-30 | 2018-12-07 | 江苏苏净集团有限公司 | A kind of detection device and detection method of airborne particulate concentration |
| US10466287B2 (en) * | 2016-05-13 | 2019-11-05 | The Board Of Trustees Of Western Michigan University | Printed wireless inductive-capacitive (LC) sensor for heavy metal detection |
| CN107782472A (en) * | 2017-09-27 | 2018-03-09 | 东南大学 | Inductance two-end fixed beam wireless and passive strain gauge |
| CN109443999B (en) * | 2018-09-18 | 2021-03-30 | 东南大学 | Wireless passive sensor and manufacturing method thereof |
-
2018
- 2018-09-18 CN CN201811087497.XA patent/CN109443999B/en active Active
-
2019
- 2019-03-21 WO PCT/CN2019/079132 patent/WO2020057079A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202057398U (en) * | 2011-05-18 | 2011-11-30 | 大连理工大学 | Micro-mass sensor based on groove type cantilever beam structure |
| CN104407232A (en) * | 2014-11-26 | 2015-03-11 | 电子科技大学 | System and method for testing microwave complex permittivity of dielectric material |
| CN105938021A (en) * | 2016-06-30 | 2016-09-14 | 东南大学 | Multi-layer inductor passive wireless LC temperature sensor |
| CN107576821A (en) * | 2017-09-27 | 2018-01-12 | 东南大学 | Inductance cantilever beam wireless and passive acceleration transducer |
Non-Patent Citations (2)
| Title |
|---|
| LC Passive Wireless Sensors Toward a Wireless Sensing Platform: Status, Prospects, and Challenges;Qing-An Huang 等;《JOURNAL OF MICROELECTROMECHANICAL SYSTEMS》;20161031;第25卷(第5期);第822-841页 * |
| 微量质量传感器的研究;蒙成;《中国优秀硕士学位论文全文数据库 信息科技辑》;20130415(第04期);第1-55页 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109443999A (en) | 2019-03-08 |
| WO2020057079A1 (en) | 2020-03-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| RU2629901C2 (en) | Systems and methods of impedance measurement for determining components of solid and fluid objects | |
| CN109443999B (en) | Wireless passive sensor and manufacturing method thereof | |
| CN106404849B (en) | The method of sensor detection gas based on nano material | |
| JP2009534641A (en) | Magnetic particle measuring device and method | |
| Zargar et al. | A thin film porous alumina-based cross-capacitive humidity sensor | |
| CN111044583B (en) | Humidity sensor chip | |
| US4272986A (en) | Method and means for measuring moisture content of hermetic semiconductor devices | |
| JP2000356619A (en) | Ph sensor and ph measurement method using it | |
| Adib et al. | A highly sensitive and stable rGO: MoS2-based chemiresistive humidity sensor directly insertable to transformer insulating oil analyzed by customized electronic sensor interface | |
| CN104198320A (en) | Handheld fast reaction iron content monitor | |
| CN101452020A (en) | In-situ measurement material surface resistivity method under vacuum environment | |
| CN103217228B (en) | Temperature sensor based on capacitive micromachined ultrasonic transducer (CMUT) and preparation and application method of temperature sensor | |
| CN105004633A (en) | Nanowire vertical array based fluid viscosity detection device and detection method | |
| US20220003711A1 (en) | Field-effect transistor for sensing target molecules | |
| CN107290392B (en) | QCM humidity sensor for high-stability low-humidity detection and preparation method thereof | |
| CN209486025U (en) | A kind of dew point hygrometer | |
| Liang et al. | Flow-injection-based miniaturized quartz crystal microbalance | |
| CN103499272A (en) | Wide-range magnetic thickness measuring device for non-magnetic coating of ferromagnetic component and detection method of wide-range magnetic thickness measuring device | |
| CN109632831B (en) | Detection method using sensor | |
| JP2005530173A (en) | Method and apparatus for sensing permanent state deviation | |
| RU2679458C1 (en) | Gas uhf sensor | |
| EP1077367B1 (en) | Capacitive force gauge | |
| CN109406576A (en) | A kind of dew point hygrometer and dew-point measuring method | |
| CN106153733B (en) | Sample clamping device for measuring natural frequency at high temperature and application method thereof | |
| CN110207737A (en) | Microstrip antenna sensing system, sensor, detection and the preparation method of linear array structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |