CN109429452A - Shell, the production method of the shell and the electronic device with the shell - Google Patents
Shell, the production method of the shell and the electronic device with the shell Download PDFInfo
- Publication number
- CN109429452A CN109429452A CN201710786414.5A CN201710786414A CN109429452A CN 109429452 A CN109429452 A CN 109429452A CN 201710786414 A CN201710786414 A CN 201710786414A CN 109429452 A CN109429452 A CN 109429452A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- shell
- holding part
- hole
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
- H05K5/0243—Mechanical details of casings for decorative purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0247—Electrical details of casings, e.g. terminals, passages for cables or wiring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Details Of Aerials (AREA)
Abstract
A kind of shell, the shell includes at least the first ceramic substrate, at least one second ceramic substrate and third ceramic substrate, at least one second ceramic substrate is set between first ceramic substrate and the third ceramic substrate, at least one second ceramic substrate is provided with holding part, to accommodate electronic component, it is provided with through hole corresponding with the holding part on the third ceramic substrate, is provided with corresponding connector in the through hole, is connect to realize with the electronic component.The shell not only has ceramic appearance, also ensures signal transfer functions and saves inner space.The present invention also provides the production method of the shell and the electronic device with the shell.
Description
Technical field
The present invention relates to a kind of shell, the production method of the shell and with the electronic device of the shell.
Background technique
Currently, in order to attract the attention of consumer, improve the sales volume of the electronic devices such as mobile phone, the electronic devices such as mobile phone back
Lid usually requires that diversified appearance and feel is presented, while also to guarantee reception and the transfer function of signal, gives
Good user experience.In addition, the design of electronic device back-cover must also cater to the development of electronic device court " clear frivolous narrow " instantly
Trend.It would therefore be highly desirable to which those skilled in the art carry out exploitation design.
Summary of the invention
In view of this, it is necessary to provide the shells that one kind can save the inner space of the electronic devices such as mobile phone.
The present invention also provides a kind of production method of shell and the electronic device with the shell.
A kind of shell, the shell include at least the first ceramic substrate, at least one second ceramic substrate and third ceramic base
Plate, at least one second ceramic substrate are set between first ceramic substrate and the third ceramic substrate, it is described extremely
Few one second ceramic substrate is provided with holding part, accommodating electronic component, be provided on the third ceramic substrate with it is described
Holding part corresponding through hole is provided with corresponding connector in the through hole, to realize and the electronic component connects
It connects.
A kind of electronic device, the electronic device include electronic component, and the electronic device further includes shell, the electronics
Element is placed in the holding part.
A kind of production method of shell comprising following steps:
Slurry is simultaneously made in mixed raw material, wherein the raw material includes for zirconium oxide, plasticizer, binder and dispersing agent；
Tape casting is carried out using the slurry, the first ceramic substrate, at least one second ceramic substrate and third pottery is made
Porcelain substrate, wherein first ceramic substrate, at least thickness of one second ceramic substrate and third ceramic substrate are 0.5mm；
By machining in holding part is arranged on second ceramic substrate；
By machining in setting through hole corresponding with the holding part on the third ceramic substrate；
Electronic component is set to the holding part, wherein the electronic component is circuit or chip；
By the first ceramic substrate, after at least one second ceramic substrate and third ceramic substrate stack gradually, press table is used
It is pressed together molding；
Ceramic substrate after being pressed together is sintered；
Connector is set in the through hole.
A kind of production method of shell comprising following steps:
Simultaneously slurry is made in mixed raw material, wherein the raw material includes zirconium oxide, plasticizer, binder and dispersing agent；
Tape casting is carried out using the slurry, the first ceramic substrate, at least one second ceramic substrate and third pottery is made
Porcelain substrate, wherein first ceramic substrate, at least thickness of one second ceramic substrate and third ceramic substrate are 0.5mm；
By machining in holding part is arranged on second ceramic substrate；
By machining in setting through hole corresponding with the holding part and filling on the third ceramic substrate
Hole；
By the first ceramic substrate, after at least one second ceramic substrate and third ceramic substrate stack gradually, press table is used
It is pressed together molding；
Metal paste, which is filled, by the filling hole forms antenna in the holding part, and in the holding part；
Will filling treated that ceramic substrate is sintered；
Connector is set in the through hole.
In conclusion the shell can be applied to the electronic devices such as mobile phone.The electronic device passes through will at least three layers pottery
Porcelain substrate is stacked, to obtain the shell with ceramic appearance.Simultaneously as the shell is made of ceramic material,
Also ensure the signal transfer functions of electronic device.In addition, the ceramic substrate for being located at middle layer is provided with holding part, built-in day
The electronic components such as line, circuit, chip, to save the inner space of electronic device.
Detailed description of the invention
Fig. 1 is a preferred embodiment of the present invention the electronic device with shell.
Fig. 2 is the exploded view of electronic device shown in Fig. 1.
Fig. 3 is partial sectional view of the electronic device shown in Fig. 1 along I-I.
Main element symbol description
| Shell | 10 |
| First ceramic substrate | 102a |
| Second ceramic substrate | 102b |
| Third ceramic substrate | 102c |
| Electronic component | 104 |
| Holding part | 106 |
| Fill hole | 107 |
| Through hole | 108 |
| Electronic device | 100 |
The present invention that the following detailed description will be further explained with reference to the above drawings.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description.Obviously, the described embodiment is only a part of the embodiment of the present invention, instead of all the embodiments.Based on this
Embodiment in invention, every other reality obtained by those of ordinary skill in the art without making creative efforts
Example is applied, shall fall within the protection scope of the present invention.
Unless otherwise defined, all technical and scientific terms used herein and belong to technical field of the invention
The normally understood meaning of technical staff is identical.Term as used herein in the specification of the present invention is intended merely to description tool
The purpose of the embodiment of body, it is not intended that the limitation present invention.
With reference to the accompanying drawing, it elaborates to some embodiments of the present invention.In the absence of conflict, following
Feature in embodiment and embodiment can be combined with each other.
Fig. 1 is please referred to, the present invention provides the electronic devices 100 of a preferred embodiment.The electronic device 100 can be
Mobile phone, tablet computer etc..
Referring to Figure 2 together, the electronic device 100 includes shell 10.The built-in electronic component 104 of the shell 10,
Such as antenna, circuit, chip etc., to save the inner space of the electronic device 100.
The shell 10 has ceramic appearance.The shell 10 includes at least three layers of ceramic substrate.Each layer of ceramic substrate
Thickness is about 0.5mm.The ceramic substrate is made of zirconium oxide, plasticizer, binder and dispersant.Preferably,
In the present embodiment, the ceramic substrate is by 70% Zirconium oxide powder, 5% plasticizer, 2% binder, 3% dispersing agent
Solvent with 20% is mixed.It should be noted that the raw material proportioning for preparing the ceramic substrate is mass percent.
In the present embodiment, the shell 10 includes three layers of ceramic substrate.For the convenience of description, by three layers of ceramic base
Plate is respectively labeled as the first ceramic substrate 102a, the second ceramic substrate 102b and third ceramic substrate 102c.
Together with the first ceramic substrate 102a, the second ceramic substrate 102b are stacked gradually with third ceramic substrate 102c
Form the shell 10.Wherein, outer surface of the first ceramic substrate 102a as the shell 10.The third ceramic base
Inner surface of the plate 102c as the shell 10.Middle layer of the second ceramic substrate 102b as the shell 10.This
Two ceramic substrate 102b are located between the first ceramic substrate 102a and the third ceramic substrate 102c.
Certainly, in other embodiments, the quantity of the second ceramic substrate 102b can be adjusted according to the actual situation.Example
Such as: the shell 10 includes two, three, four or multiple second ceramic substrate 102b.
Several holding parts 106 are offered on the second ceramic substrate 102b.The holding part 106 penetrates through described second
Ceramic substrate 102b.In this way, when the second ceramic substrate 102b is located in the first ceramic substrate 102a and the third
When between ceramic substrate 102c, the first ceramic substrate 102a and the third ceramic substrate 102c can pass through the holding part
106 is mutually visible.In the present embodiment, the holding part 106 is accommodating the electronic component 104, for example, antenna, circuit,
Chip etc., to save the inner space of electronic device 100.
In the present embodiment, holding part 106 there are two being opened up on the second ceramic substrate 102b.Described two holding parts
106 are respectively arranged at the both ends of the second ceramic substrate 102b, to accommodate a corresponding electronic component 104 respectively.It is described
Shape, size and the holding part 106 of electronic component 104 are unanimously.
Refering to Fig. 3, it will be understood that in the present embodiment, the electronic component 104 is an antenna.When the electronic component
104 be an antenna when, the electronic component 104 can be formed by metal paste.Correspondingly, on the third ceramic substrate 102c
Offer filling hole 107 corresponding with the holding part 106.The filling hole 107 penetrates through the third ceramic substrate 102c.
In this way, being filled in metal paste to the holding part 106 with facilitating by the filling hole 107, to form the electronics member
Part 104.
In other embodiments, when the electronic component 104 is the in non-built antennas such as circuit, chip, it is only necessary to directly will
The electronic component 104 is directly placed in the holding part 106, described without opening up on the third ceramic substrate 102c
Hole 107 is filled, that is, omits the filling hole 107.
It is appreciated that the quantity of the holding part 106 can be adjusted as the case may be.Such as the holding part 106
Quantity can for one, three or more etc..
In the present embodiment, pass through corresponding with the holding part 106 is also provided on the third ceramic substrate 102c
Perforation 108.The through hole 108 penetrates through the third ceramic substrate 102c.
In the present embodiment, the shell 10 further includes connector (not shown).The connector can be hard contact.It should
Connector is set in through hole 108, to realize electronic component 104 and the electronic device 100 in the holding part 106
The electrical connection of interior other elements, and then realize the transmission and reception of signal.
The present invention provides a kind of production methods of shell 10 comprising following steps:
Step 1: the raw material for preparing the ceramic substrate is mixed and slurry is made.
Specifically, raw material needed for preparing the ceramic substrate is zirconium oxide, plasticizer, binder and dispersing agent.At this
In embodiment, the proportion that a preferred embodiment prepares the ceramic substrate raw material, the proportion are as follows: 70% zirconia powder are provided
End, 5% plasticizer, 2% binder, 3% dispersing agent and 20% solvent.It should be noted that preparing the ceramics
The raw material proportioning of substrate is mass percent.
Step 2: using above-mentioned slurry by tape casting, the ceramic substrate is made.
In the present embodiment, it is illustrated for three layers of ceramic substrate are prepared by tape casting.Each layer of pottery
The thickness of porcelain substrate is about 0.5mm.For the convenience of description, three layers of ceramic substrate is respectively labeled as the first ceramic substrate
102a, the second ceramic substrate 102b and third ceramic substrate 102c.Wherein, the second ceramic substrate 102b is located in first pottery
Between porcelain substrate 102a and the third ceramic substrate 102c.
Certainly, in other embodiments, the quantity of the second ceramic substrate 102b can be adjusted according to the actual situation.Example
Such as: the shell 10 includes two, three, four or multiple second ceramic substrate 102b.
Step 3: by being machined the second ceramic substrate 102b, in shape on the second ceramic substrate 102b
At an at least holding part 106.
The holding part 106 penetrates through the second ceramic substrate 102b, for accommodating the electronics member of the electronic device 100
Part 104, such as antenna, circuit, chip etc., to save the inner space of electronic device 100.Wherein, the holding part 106
Size and shape is adjusted according to the concrete shape of the electronic component 104, size.
Step 4: by being machined the third ceramic substrate 102c, in shape on the third ceramic substrate 102c
At filling hole 107.The filling hole 107 penetrates through the third ceramic substrate 102c.
Step 5: by being machined the third ceramic substrate 102c, in shape on the third ceramic substrate 102c
At through hole 108 corresponding with the holding part 106.The through hole 108 penetrates through the third ceramic substrate 102c.
Step 6: successively by the first ceramic substrate 102a, the second ceramic substrate 102b and third ceramic substrate 102c
Heap poststack is pressed together molding with press table.
Step 7: being that 60% copper powder, 10% silica and 30% organic carrier mix by mass percent
And metal paste is made.
Step 8: it is filled in the metal paste to the holding part 106 by the filling hole 107, in the appearance
It sets and forms corresponding electronic component 104, such as antenna in portion 106.
Step 9: the ceramic substrate of internal injection metal paste is sintered, to obtain the shell 10.
In the present embodiment, sintering temperature control is at 1500 DEG C, time 36h, the thickness of the sintered shell 10
About 1.1mm.
Step 10: the first ceramic substrate 102a and the third ceramic substrate 102c are ground, so that described
The first ceramic substrate 102a and third ceramic substrate 102c is thinned, to obtain a frivolous shell 10.The shell 10
With a thickness of 0.6mm.
Step 11: the first ceramic substrate 102a is processed by shot blasting, so that the shell 10 obtains beauty
Appearance.
Certainly, in other embodiments, PVD processing is carried out to the burnishing surface of the first ceramic substrate 102a, in institute
State formation anti-fingerprint coating on the burnishing surface of the first ceramic substrate 102a.
Step 12: the corresponding connector (not shown) of setting in Yu Suoshu through hole 108, to realize the holding part
The electrical connection of electronic component 104 in 106 and the other elements in the electronic device 100, so realize signal transmission with
It receives.
In the present embodiment, the connector (not shown) is hard contact.
It is appreciated that in other embodiments, when the electronic component 104 is the in non-built antennas such as circuit, chip, step
Rapid four, seven, eight can omit, but will be described directly in the way of welding, bonding or printing etc. between step 5 and step 6
Electronic component 104 is set in the holding part 106, then without opening up the filling hole on the third ceramic substrate 102c
107, that is, omit the filling hole 107.
In conclusion the shell 10 can be applied to the electronic devices such as mobile phone 100.The electronic device 100 passes through near
Few three layers of ceramic substrate are stacked, to obtain the shell 10 with ceramic appearance.Simultaneously as the shell 10 is by making pottery
Ceramic material is constituted, and also ensures the signal transfer functions of electronic device 100.In addition, the ceramic substrate for being located at middle layer is provided with
Holding part 106, the electronic components such as built-in antenna, circuit, chip, to save the inner space of electronic device 100.
The above examples are only used to illustrate the technical scheme of the present invention and are not limiting, although referring to preferred embodiment to this hair
It is bright to be described in detail, those skilled in the art should understand that, technical solution of the present invention can be repaired
Change or equivalent replacement, without departing from the spirit of the technical scheme of the invention and essence.
Claims (10)
1. a kind of shell, it is characterised in that: the shell includes at least the first ceramic substrate, at least one second ceramic substrate and the
Three ceramic substrates, at least one second ceramic substrate be set to first ceramic substrate and the third ceramic substrate it
Between, at least one second ceramic substrate is provided with holding part, to accommodate electronic component, is arranged on the third ceramic substrate
There is through hole corresponding with the holding part, be provided with corresponding connector in the through hole, to realize and the electricity
The connection of subcomponent.
2. shell according to claim 1, it is characterised in that: the electronic component is an antenna, and the antenna is set to
In the holding part.
3. shell according to claim 2, it is characterised in that: the connector be contact, the contact to the day
Line is electrically connected.
4. shell according to claim 2, it is characterised in that: be also provided with filling hole, institute on the third ceramic substrate
It states filling hole and corresponds to the holding part setting, filled metal paste to the holding part by the filling hole, in institute
It states and forms the antenna in holding part.
5. shell according to claim 1, it is characterised in that: the shell with a thickness of 0.6mm.
6. a kind of electronic device, the electronic device includes electronic component, it is characterised in that: the electronic device further includes right
It is required that shell described in 1-5, the electronic component is placed in the holding part.
7. a kind of production method of shell, feature include the following steps:
Slurry is simultaneously made in mixed raw material, wherein the raw material includes for zirconium oxide, plasticizer, binder and dispersing agent；
Tape casting is carried out using the slurry, the first ceramic substrate, at least one second ceramic substrate and third ceramic base is made
Plate, wherein first ceramic substrate, at least thickness of one second ceramic substrate and third ceramic substrate are 0.5mm；
By machining in holding part is arranged on second ceramic substrate；
By machining in setting through hole corresponding with the holding part on the third ceramic substrate；
Electronic component is set to the holding part, wherein the electronic component is circuit or chip；
By the first ceramic substrate, after at least one second ceramic substrate and third ceramic substrate stack gradually, pressed with press table
Processing molding；
Ceramic substrate after being pressed together is sintered；
Connector is set in the through hole.
8. the production method of shell according to claim 7, it is characterised in that: the production method of the shell further includes burning
After tying ceramic substrate, the sintered ceramic substrate is ground, so that the shell is thinned.
9. a kind of production method of shell, feature include the following steps:
Simultaneously slurry is made in mixed raw material, wherein the raw material includes zirconium oxide, plasticizer, binder and dispersing agent；
Tape casting is carried out using the slurry, the first ceramic substrate, at least one second ceramic substrate and third ceramic base is made
Plate, wherein first ceramic substrate, at least thickness of one second ceramic substrate and third ceramic substrate are 0.5mm；
By machining in holding part is arranged on second ceramic substrate；
By machining in setting through hole corresponding with the holding part on the third ceramic substrate and filling hole；
By the first ceramic substrate, after at least one second ceramic substrate and third ceramic substrate stack gradually, pressed with press table
Processing molding；
Metal paste, which is filled, by the filling hole forms antenna in the holding part, and in the holding part；
Will filling treated that ceramic substrate is sintered；
Connector is set in the through hole.
10. the production method of shell according to claim 9, it is characterised in that: the production method of the shell further include
After sintered ceramic substrate, the sintered ceramic substrate is ground, so that the shell is thinned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710786414.5A CN109429452A (en) | 2017-09-04 | 2017-09-04 | Shell, the production method of the shell and the electronic device with the shell |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710786414.5A CN109429452A (en) | 2017-09-04 | 2017-09-04 | Shell, the production method of the shell and the electronic device with the shell |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109429452A true CN109429452A (en) | 2019-03-05 |
Family
ID=65513602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710786414.5A Withdrawn CN109429452A (en) | 2017-09-04 | 2017-09-04 | Shell, the production method of the shell and the electronic device with the shell |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109429452A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114643758A (en) * | 2020-12-18 | 2022-06-21 | 财团法人金属工业研究发展中心 | Composite laminated board, shell and mobile communication device |
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| TWM260968U (en) * | 2004-07-02 | 2005-04-01 | Merry Electronics Co Ltd | Capacitance type ceramic substrate transmitter |
| JP2006117448A (en) * | 2004-10-19 | 2006-05-11 | Ngk Spark Plug Co Ltd | Dielectric ceramic composition and electronic component using the same |
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Application publication date: 20190305 |
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