CN109425814B - Probe assembly and probe structure thereof - Google Patents
Probe assembly and probe structure thereof Download PDFInfo
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- CN109425814B CN109425814B CN201710779658.0A CN201710779658A CN109425814B CN 109425814 B CN109425814 B CN 109425814B CN 201710779658 A CN201710779658 A CN 201710779658A CN 109425814 B CN109425814 B CN 109425814B
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- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
Abstract
The invention discloses a probe assembly and a probe structure thereof. The probe structure includes a metal main body, a coating structure layer and an insulating layer. The metal main body part is provided with a first end part, a second end part corresponding to the first end part, a connecting part connected between the first end part and the second end part, and a surrounding surface surrounding the first end part, the second end part and the connecting part. The coating structure layer comprises a first coating layer arranged on the surrounding surface of the first end part, a second coating layer arranged on the surrounding surface of the second end part and a third coating layer arranged on the surrounding surface of the connecting part. The insulating layer is disposed on the third cladding layer to expose the first cladding layer and the second cladding layer. Therefore, the invention can avoid the short circuit phenomenon caused by the electrical contact between the adjacent probe structures.
Description
Technical Field
The present invention relates to a probe assembly and a probe structure thereof, and more particularly, to a probe assembly and a probe structure thereof for a wafer probe card.
Background
First, the existing main circular test probes and Micro Electro Mechanical Systems (MEMS) rectangular test probes have problems of poor mechanical properties or poor current resistance, and the poor characteristics of the probes can reduce the yield and test accuracy of semiconductor processes. In the prior art, the test probes of the conventional wafer probe card are affected by the ambient temperature, mechanical actuation and current resistance in the measurement life, and the test probes with a single structure cannot overcome the measurement errors caused by the above effects.
In addition, when the conventional test probe is used for testing a chip, the probe card provides a pressure to make the test probe break the oxide layer on the surface of the solder ball so as to achieve the purpose of testing. However, the hardness of the conventional test probe is still insufficient, and mechanical fatigue is easily caused by continuous mechanical actuation, so that the test probe cannot return to the original needle shape after being bent. In addition, the conventional test probe is also prone to damage of the metal probe due to the continuous bending action and joule heat generated after the current is applied. Moreover, when the test probes press and break the oxide layer on the surface of the solder ball, the test probes arranged in the array can be bent at the same time, but because the number of the probes in the unit array is large, the short circuit phenomenon of the test probes during the operation can be caused to influence the measurement and even damage the circuit function.
Moreover, since the size of the object to be tested is gradually reduced, but the main material of the existing test probes is a metal material, when the distance between each test probe is too close, the test probes will be short-circuited when bent, so that the reliability of the probe card is poor. Meanwhile, the heat dissipation, the electrical conductivity and the mechanical properties of the conventional test probe cannot be simultaneously achieved. Therefore, it is an important issue to be solved by those skilled in the art to provide a probe assembly and a probe structure thereof that can improve reliability, electrical conductivity, heat dissipation and/or mechanical strength to overcome the above-mentioned drawbacks.
Disclosure of Invention
The present invention provides a probe assembly and a probe structure thereof, which are directed to overcome the disadvantages of the prior art.
In order to solve the above technical problems, an embodiment of the present invention provides a probe structure, which includes a metal main body, a coating structure layer, and an insulating layer. The metal body portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first end portion and the second end portion, and a surrounding surface surrounding the first end portion, the second end portion, and the connecting portion. The coating structure layer comprises a first coating layer arranged on the surrounding surface of the first end part, a second coating layer arranged on the surrounding surface of the second end part and a third coating layer arranged on the surrounding surface of the connecting part. The insulating layer is arranged on the third cladding layer to expose the first cladding layer and the second cladding layer.
Further, the insulating layer has a resistivity of 10 or more8Ωm。
Further, the metal body portion is electrically conductive and has a resistivity of less than 5 × 102Ωm。
Furthermore, the first coating layer, the second coating layer or the third coating layer is a strengthening layer, an oxidation-resistant layer, a heat dissipation layer or a graphene layer, respectively, wherein the young modulus of the strengthening layer is more than 100GPa, the oxidation-reduction potential of the oxidation-resistant layer is greater than or equal to-1.66V, and the thermal conductivity of the heat dissipation layer is greater than 200W/mK.
Furthermore, the first coating layer, the second coating layer or the third coating layer are respectively a multilayer structure formed by more than two of a strengthening layer, an oxidation resistant layer, a heat dissipation layer and a graphene layer, wherein the Young modulus of the strengthening layer is more than 100GPa, the oxidation-reduction potential of the oxidation resistant layer is more than or equal to-1.66V, and the heat conductivity of the heat dissipation layer is more than 200W/mK.
Furthermore, two of the first, second and third cladding layers have different structures.
Further, the first cladding layer includes a reinforcing layer disposed on the surrounding surface on the first end, wherein the young's modulus of the reinforcing layer of the first cladding layer is 100GPa or more.
Furthermore, the first coating layer further comprises a graphene layer, and the graphene layer of the first coating layer is disposed on an outer surface of the strengthening layer of the first coating layer.
Further, the second cladding layer includes a reinforcing layer disposed on the surrounding surface on the second end portion, wherein the young's modulus of the reinforcing layer of the second cladding layer is 100GPa or more.
Furthermore, the second coating layer further comprises an anti-oxidation layer, the anti-oxidation layer is arranged on an outer surface of the strengthening layer of the second coating layer, and the oxidation-reduction potential of the anti-oxidation layer is greater than or equal to-1.66V.
Furthermore, the second coating layer further comprises a heat dissipation layer, the heat dissipation layer is arranged on an outer surface of the oxidation resistant layer of the second coating layer, and the heat dissipation layer of the second coating layer has a thermal conductivity greater than 200W/mK.
Furthermore, the second coating layer further includes a graphene layer, and the graphene layer of the second coating layer is disposed between the strengthening layer of the second coating layer and the anti-oxidation layer of the second coating layer.
Further, the third cladding layer includes a reinforcing layer, and the reinforcing layer of the third cladding layer is disposed on the surrounding surface on the connecting portion, wherein the young's modulus of the reinforcing layer of the third cladding layer is 100GPa or more.
Furthermore, the third cladding layer further includes a heat dissipation layer, and the heat dissipation layer of the third cladding layer is disposed on an outer surface of the strengthening layer of the third cladding layer.
Furthermore, the third coating layer further includes a graphene layer, the graphene layer of the third coating layer is disposed between the strengthening layer of the third coating layer and the heat dissipation layer of the third coating layer, and the insulating layer is disposed on an outer surface of the heat dissipation layer.
In another aspect, the present invention provides a probe assembly, which includes a carrier and a plurality of probe structures. The plurality of probe structures are arranged on the bearing seat, and each probe structure comprises a metal main body part, a coating structure layer and an insulating layer. The metal main body part is provided with a first end part, a second end part corresponding to the first end part, a connecting part connected between the first end part and the second end part, and a surrounding surface surrounding the first end part, the second end part and the connecting part. The coating structure layer comprises a first coating layer arranged on the surrounding surface of the first end part, a second coating layer arranged on the surrounding surface of the second end part and a third coating layer arranged on the surrounding surface of the connecting part. The insulating layer is disposed on the third cladding layer to expose the first cladding layer and the second cladding layer.
Further, the insulating layer has a resistivity of 10 or more8Ωm。
Further, the metal body portion is electrically conductive and has a resistivity of less than 5 × 102Ωm。
Furthermore, the first coating layer, the second coating layer or the third coating layer is a strengthening layer, an oxidation-resistant layer, a heat dissipation layer or a graphene layer, respectively, wherein the young modulus of the strengthening layer is more than 100GPa, the oxidation-reduction potential of the oxidation-resistant layer is greater than or equal to-1.66V, and the thermal conductivity of the heat dissipation layer is greater than 200W/mK.
Furthermore, the first coating layer, the second coating layer or the third coating layer are respectively a multilayer structure formed by more than two of a strengthening layer, an oxidation resistant layer, a heat dissipation layer and a graphene layer, wherein the Young modulus of the strengthening layer is more than 100GPa, the oxidation-reduction potential of the oxidation resistant layer is more than or equal to-1.66V, and the heat conductivity of the heat dissipation layer is more than 200W/mK.
Furthermore, two of the first, second and third cladding layers have different structures.
One of the advantages of the probe assembly and the probe structure thereof according to the embodiments of the invention is that the technical solutions that the coating structure layer includes a first coating layer disposed on the surrounding surface of the first end portion, a second coating layer disposed on the surrounding surface of the second end portion, and a third coating layer disposed on the surrounding surface of the connecting portion, and the insulating layer is disposed on the third coating layer to expose the first coating layer and the second coating layer can be utilized to improve the reliability, the electrical conductivity, the heat dissipation property, and/or the mechanical strength of the probe structure.
For a better understanding of the features and technical content of the present invention, reference should be made to the following detailed description of the invention and accompanying drawings, which are provided for purposes of illustration and description only and are not intended to limit the invention.
Drawings
Fig. 1A is a schematic perspective view of a probe structure according to a first embodiment of the invention.
Fig. 1B is another perspective view of the probe structure according to the first embodiment of the invention.
FIG. 2 is a schematic side sectional view of the section line II-II of FIG. 1A.
FIG. 3 is a schematic side cross-sectional view of the III-III cross-section of FIG. 1A.
FIG. 4 is a side cross-sectional view of the cross-section line IV-IV of FIG. 1A.
FIG. 5 is a schematic side cross-sectional view of the section line V-V of FIG. 1A.
Fig. 6 is a partially enlarged schematic view of one embodiment of a section VI of fig. 3.
Fig. 7 is a partially enlarged schematic view of another embodiment of a VI portion of fig. 3.
Fig. 8 is a partially enlarged schematic view of one embodiment of section VIII of fig. 4.
Fig. 9 is a partially enlarged schematic view of another embodiment of a portion VIII of fig. 4.
Fig. 10 is a partially enlarged schematic view of a further embodiment of a portion VIII of fig. 4.
FIG. 11 is a schematic diagram of a partial enlargement of one embodiment of section XI of FIG. 5.
Fig. 12 is a partially enlarged schematic view of another embodiment of a portion XI of fig. 5.
FIG. 13 is a schematic view of a probe assembly according to a second embodiment of the present invention.
Detailed Description
The following is a description of the embodiments of the present disclosure relating to the probe assembly and the probe structure thereof by specific examples, and those skilled in the art can understand the advantages and effects of the present disclosure from the disclosure of the present disclosure. The invention is capable of other and different embodiments and its several details are capable of modification in various other respects, all without departing from the spirit and scope of the present invention. The drawings of the present invention are for illustrative purposes only and are not drawn to scale. The following embodiments will further explain the technical contents related to the present invention in detail, but the disclosure is not intended to limit the technical scope of the present invention.
It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals, etc., these elements or signals should not be limited by these terms. These terms are used to distinguish one element from another element, or from one signal to another signal. In addition, as used herein, the term "or" may include all combinations of any one or more of the associated listed items as appropriate.
First embodiment
First, referring to fig. 1A, fig. 1B and fig. 12, fig. 1A and fig. 1B are respectively a schematic perspective view of a probe structure according to an embodiment of the invention, and fig. 12 is a schematic view of a probe assembly according to an embodiment of the invention. The present invention provides a probe assembly M and a probe structure U thereof, wherein the main technical features of the probe structure U of the present invention will be described in the first embodiment, and the probe assembly M will be described in the second embodiment. It should be noted that the shape of the probe structure U may be a rectangular column as shown in fig. 1A, or a circular column as shown in fig. 1B, but the invention is not limited thereto, and the embodiment in which the probe structure U has a rectangular cross section will be exemplified below.
Referring to fig. 1A and 1B and fig. 2, fig. 2 is a schematic side sectional view of the sectional line II-II of fig. 1A. The probe structure U may include a metal body 1, a coating structure layer 2 and an insulating layer 3. The metal body 1 may have a first end 11, a second end 12 corresponding to the first end 11, a connecting portion 13 connected between the first end 11 and the second end 12, and a surrounding surface S surrounding the first end 11, the second end 12 and the connecting portion 13, i.e., the surrounding surface S is an outer surface of the metal body 1. For example, the first end portion 11 of the metal main body 1 may be in a shape of a pointed needle to cut an oxide layer on a surface of a solder ball of the device under test, and the second end portion 12 may be a tail of the probe structure U for connecting with a contact end of the adapter interface board.
As shown in fig. 2 and fig. 3 to 5, the coating structure layer 2 may include a first coating layer 21 disposed on the surrounding surface S of the first end portion 11, a second coating layer 22 disposed on the surrounding surface S of the second end portion 12, and a third coating layer 23 disposed on the surrounding surface S of the connecting portion 13. In addition, the insulating layer 3 may be disposed only on the third cladding layer 23 to expose the first cladding layer 21 and the second cladding layer 22, but the invention is not limited thereto. In other words, the probe structure U can be divided into a first region Z1 (i.e., a tip), a second region Z2 (i.e., a tail), and a third region Z3 located between the first region Z1 and the second region Z2, the first region Z1 of the probe structure U can have the first end 11 and the first cladding layer 21 thereon, the second region Z2 can have the second end 12 and the second cladding layer 22 thereon, and the third region Z3 can have the connecting portion 13 and the third cladding layer 23 thereon.
In view of the above, in the embodiment of the present invention, the first coating layer 21 may preferably completely surround (or completely cover) the metal body 1 as shown in fig. 3, the second coating layer 22 may preferably completely surround the metal body 1 as shown in fig. 4, the third coating layer 23 may preferably completely surround the metal body 1 as shown in fig. 5, and the insulating layer 3 may preferably also completely surround the third coating layer 23. Further, for example, the first cladding layer 21, the second cladding layer 22, the third cladding layer 23 and the insulating layer 3 may be disposed on the metal body 1 by Deposition (Deposition), but the invention is not limited thereto.
As described above, referring to fig. 2 to 5, for example, the metal body 1 may be made of a conductive material to have conductivity, and the Resistivity (Resistivity) of the metal body 1 may be less than 5 × 102Ω m (ohm meter), the material of the metal body part 1 may be for example but not limited to: gold (Au), silver (Ag), copper (Cu), nickel (Ni)(Ni), cobalt (Co) or an alloy thereof, and preferably, the material of the metal main body portion 1 may be copper or a nickel-cobalt alloy. In addition, the resistivity of the insulating layer 3 may be 10 or more8Ω m, preferably, the resistivity of the insulating layer 3 may be greater than or equal to 109Omega m. In addition, the material of the insulating layer 3 may be, for example, but not limited to: a polymer material, a ceramic material or a parylene polymer (Poly-p-phenylene), and preferably, alumina (or aluminum oxide, Al) is used2O3) Is preferred. Further, the metal body 1 may have a predetermined width 1t between 10 μm (Micrometer) and 80 μm, and the insulating layer 3 may have a predetermined thickness 3t between 10nm (nanometer) and 10 μm, and preferably, the predetermined thickness 3t of the insulating layer 3 may have two preferred ranges, respectively, 10nm and 100nm and 0.5 μm and 5 μm, although the present invention is not limited to the above-mentioned dimensions.
In view of the above, referring to fig. 2 again, according to an embodiment of the present invention, the first coating layer 21, the second coating layer 22, or the third coating layer 23 may be a single-layer structure selected from one of a strengthening layer, an anti-oxidation layer, a heat dissipation layer, or a graphene layer. In other embodiments, the first coating layer 21, the second coating layer 22, or the third coating layer 23 may be a multi-layer structure formed by two or more layers selected from a strengthening layer, an anti-oxidation layer, a heat dissipation layer, and a Graphene layer with Graphene (Graphene), but the invention is not limited thereto. Further, preferably, the young's modulus of the reinforcing layer may be 100GPa or more. In particular, the term "Oxidation-resistant layer" refers to a layer of material having a surface that is not reactive, has a Redox potential (or Oxidation-reduction potential) greater than or equal to-1.66V, and is not susceptible to reaction with oxygen to form an oxide. The oxidation resistant layer may be, for example, a corrosion resistant metal (Noble metal), and the material of the oxidation resistant layer may be, for example, but not limited to, gold, silver, palladium, or platinum. In addition, the heat dissipation layer may have a thermal conductivity greater than 200W/mK, for example, the material of the heat dissipation layer may be alumina, silicon nitride, copper-aluminum alloy, ceramic or diamond film, etc. It should be noted that, in a preferred embodiment, two of the first cladding layer 21, the second cladding layer 22 and the third cladding layer 23 have different structures. In other words, the first coating layer 21, the second coating layer 22, or the third coating layer 23 with different characteristics can cover the first end portion 11, the second end portion 12, and the connecting portion 13 of the metal body 1, respectively, so as to provide a single-layer or multi-layer structure with different characteristics according to the requirements of each portion.
Next, referring to fig. 3, fig. 6 and fig. 7, the features of the first cladding layer 21 disposed on the surrounding surface S of the first end portion 11 will be described, in addition, fig. 3 is a side sectional view of a section line III-III of fig. 1A, and fig. 6 and fig. 7 are partial enlarged views of a VI portion of fig. 3, however, it should be noted that fig. 6 and fig. 7 are not actual partial enlarged views of the VI portion of fig. 3, and fig. 6 and fig. 7 are mainly for illustrating a cross-sectional configuration of the first end portion 11 of the probe structure U in different embodiments.
Referring to fig. 6, according to an embodiment of the present invention, the first cladding layer 21 may include a reinforcing layer a, the reinforcing layer a of the first cladding layer 21 may be disposed on the surrounding surface S on the first end portion 11, and the young' S modulus of the reinforcing layer a of the first cladding layer 21 is greater than 100 GPa. In addition, AS shown in fig. 7, the first coating layer 21 may further include a graphene layer C, and the graphene layer C of the first coating layer 21 is disposed on and surrounds an outer surface AS of the strengthening layer a of the first coating layer 21. It should be noted that the strengthening layer a may be a material with high mechanical strength to increase the overall hardness and rigidity of the probe structure U. The strengthening layer may, for example, be a material having a high Young's modulus, for example, the Young's modulus of the strengthening layer a may be above 100 GPa. In addition, the material of the strengthening layer a may be an alloy material, silicide or diamond film, for example, rhodium (Rh), platinum (Pt), iridium (Ir), palladium (Pd), nickel, cobalt or their alloys, preferably, the material of the strengthening layer a may be palladium-nickel alloy or nickel-cobalt alloy, but the invention is not limited thereto. Therefore, the hardness and rigidity can be improved through the arrangement of the strengthening layer A and/or the graphene layer C, and the overall conductivity, heat dissipation and mechanical characteristics of the probe structure U are improved. For example, the strengthening layer a may have a predetermined thickness At between 100nm and 10 μm, the graphene layer C may generally refer to about 1 to 10 layers, the graphene layer C may have a predetermined thickness Ct between 0.34nm and 5nm, and preferably, the predetermined thickness Ct of the graphene layer C may be less than 1nm, but the invention is not limited thereto. Although the first cladding layer 21 has the strengthening layer a and/or the graphene layer C as an illustration, in other embodiments, the first cladding layer 21 may be a multi-layer structure composed of two or more layers selected from a strengthening layer, an anti-oxidation layer, a heat dissipation layer and a graphene layer.
Next, please refer to fig. 4 and 8 to 10, which will be described below to describe features of the second cladding layer 22 disposed on the surrounding surface S of the second end portion 12, in addition, fig. 4 is a side sectional view of a section line IV-IV of fig. 1A, and fig. 8 to 10 are enlarged partial views of a portion VIII of fig. 4, however, it should be noted that fig. 8 to 10 are not actual enlarged partial views of the portion VIII of fig. 4, and fig. 8 to 10 are mainly used to describe cross-sectional configurations of the second end portion 12 of the probe structure U in different embodiments.
In view of the above, referring to fig. 8, the second coating layer 22 may include a strengthening layer a and an oxidation-resistant layer B, the strengthening layer a of the second coating layer 22 may be disposed on the surrounding surface S on the second end portion 12, and the oxidation-resistant layer B of the second coating layer 22 may be disposed on an outer surface AS of the strengthening layer a of the second coating layer 22. In addition, the young's modulus of the strengthening layer a of the second cladding layer 22 is above 100GPa, and the material surface of the oxidation-resistant layer B of the second cladding layer 22 has no activity, and the oxidation-reduction potential thereof is greater than or equal to-1.66V, and is not easy to react with oxygen to generate oxide, for example, the oxidation-resistant layer B may be a corrosion-resistant metal (Noble metal), for example, the oxidation-resistant layer B may be made of, but not limited to, gold, silver, palladium or platinum. It should be noted that the characteristics of the reinforcing layer a of the second cladding layer 22 are similar to those of the reinforcing layer a of the first cladding layer 21, and the description thereof is omitted here.
Next, referring to fig. 9, as can be seen from a comparison between fig. 9 and fig. 8, in other embodiments, the second cladding layer 22 may further include a heat dissipation layer D, the heat dissipation layer D of the second cladding layer 22 may be disposed on an outer surface BS of the anti-oxidation layer B of the second cladding layer 22, and the heat dissipation layer D of the second cladding layer 22 has a thermal conductivity greater than 200W/mK, for example, the heat dissipation layer D may be made of aluminum oxide, silicon nitride, copper-aluminum alloy, ceramic, diamond film, or the like, but the invention is not limited thereto.
Next, referring to fig. 10 again, AS can be seen from a comparison between fig. 10 and fig. 9, in other embodiments, the second coating layer 22 may further include a graphene layer C, and the graphene layer C of the second coating layer may be disposed between the strengthened layer a of the second coating layer 22 and the anti-oxidation layer B of the second coating layer 22, that is, the graphene layer C may be disposed on the outer surface AS of the strengthened layer a of the second coating layer 22 and the anti-oxidation layer B is disposed on the outer surface CS of the graphene layer C of the second coating layer 22, but the invention is not limited thereto. For example, in other embodiments, the graphene layer C may be disposed between the heat dissipation layer D of the second coating layer 22 and the anti-oxidation layer B of the second coating layer 22, or disposed at other positions.
It should be noted that although the second coating layer 22 has the reinforced layer a, the oxidation resistant layer B, the graphene layer C and/or the heat dissipation layer D as an illustration, in other embodiments, the second coating layer 22 may be a multi-layer structure composed of two or more selected from the reinforced layer a, the oxidation resistant layer B, the heat dissipation layer D and the graphene layer C, and the arrangement order of the reinforced layer a, the oxidation resistant layer B, the heat dissipation layer D and the graphene layer C may be adjusted as required.
Therefore, the hardness and the rigidity can be improved through the arrangement of the strengthening layer A, the oxidation resisting layer B, the graphene layer C and/or the heat dissipation layer D, and the overall reliability, the electric conductivity, the heat dissipation performance and the mechanical property of the probe structure U are improved. Further, since the second end portion 12 is used for connecting with the contact end of the adapter interface board, the anti-oxidation layer B can reduce the contact resistance and prolong the service life. Also, for example, the strengthening layer A may have a predetermined thickness At between 100nm and 10 μm; the graphene layer C may have a predetermined thickness Ct between 0.34nm and 5nm, and preferably, the predetermined thickness Ct of the graphene layer C may be less than 1 nm; the antioxidation layer B may have a predetermined thickness Bt between 100nm and 10 μm; the heat dissipation layer D may have a predetermined thickness Dt between 10nm and 5 μm, but the present invention is not limited to the above dimensions.
Next, please refer to fig. 5, 11 and 12, which will be described below to describe features of the third cladding layer 23 disposed on the surrounding surface S of the connecting portion 13, in addition, fig. 5 is a side sectional view of a cross section line V-V of fig. 1A, fig. 11 and 12 are partially enlarged views of a portion XI of fig. 5, however, it should be noted that fig. 11 and 12 are not actual partially enlarged views of the portion XI of fig. 5, and fig. 11 and 12 are mainly for illustrating a cross section of the connecting portion 13 of the probe structure U in different embodiments.
Next, referring to fig. 11 again, the third cladding layer 23 may include a reinforcing layer a, the reinforcing layer a of the third cladding layer 23 is disposed on the surrounding surface S on the connecting portion 13, and the young' S modulus of the reinforcing layer a of the third cladding layer 23 is above 100 GPa. In addition, the third cladding layer 23 may further include a heat dissipation layer D, and the heat dissipation layer D of the third cladding layer 23 is disposed on an outer surface AS of the strengthening layer a of the third cladding layer 23 and surrounds the outer surface AS. Further, the insulating layer 3 may be disposed on an outer surface DS of the heat dissipation layer D.
Next, referring to fig. 12, AS can be seen from a comparison between fig. 12 and fig. 11, in other embodiments, the third coating layer 23 may further include a graphene layer C, the graphene layer C of the third coating layer 23 may be disposed between the strengthening layer a of the third coating layer 23 and the heat dissipation layer D of the third coating layer 23, that is, the graphene layer C may be disposed on the outer surface AS of the strengthening layer a, and the heat dissipation layer D may be disposed on the outer surface CS of the graphene layer C. In addition, the insulating layer 3 may be disposed on an outer surface DS of the heat dissipation layer D of the third cladding layer 23 and surround the outer surface DS of the heat dissipation layer D.
It should be noted that although the third coating layer 23 is described as having the strengthening layer a, the graphene layer C and/or the heat dissipation layer D, in other embodiments, the third coating layer 23 may be a multi-layer structure composed of two or more selected from a strengthening layer a, an anti-oxidation layer B, a heat dissipation layer D and a graphene layer C, and the arrangement order of the strengthening layer a, the anti-oxidation layer B, the heat dissipation layer D and the graphene layer C may be adjusted according to the requirement.
Therefore, the hardness and the rigidity can be improved through the arrangement of the strengthening layer A, the graphene layer C and/or the heat dissipation layer D, and the overall reliability, the electric conductivity, the heat dissipation performance and the mechanical property of the probe structure U are improved. Furthermore, the arrangement of the reinforcing layer A can enhance the restoring capability of the probe structure U after being stressed and bent, and meanwhile, the heat accumulation is mainly concentrated on the connecting part 13 of the probe structure U, so that the heat dissipation performance of the probe structure U can be improved through the arrangement of the heat dissipation layer D. Also, for example, the strengthening layer A may have a predetermined thickness At between 100nm and 10 μm; the graphene layer C may have a predetermined thickness Ct between 0.34nm and 5nm, and preferably, the predetermined thickness Ct of the graphene layer C may be less than 1 nm; the heat dissipation layer D may have a predetermined thickness Dt between 10nm and 5 μm, but the present invention is not limited to the above dimensions.
It should be noted that, in a preferred embodiment, the first coating layer 21 on the first region Z1 may have a strengthening layer a and a graphene layer C as shown in fig. 7, the second coating layer 22 on the second region Z2 may have a strengthening layer a, a graphene layer C, an anti-oxidation layer B and a heat dissipation layer D as shown in fig. 10, and the third coating layer 23 on the third region Z3 may have a strengthening layer a, a graphene layer C and a heat dissipation layer D as shown in fig. 12. However, in other embodiments, the first region Z1, the second region Z2, and the third region Z3 may not have the graphene layer C, and the invention is not limited thereto.
Second embodiment
First, referring to fig. 13 and fig. 2 to 5, fig. 13 is a schematic view of a probe assembly according to a second embodiment of the present invention. A second embodiment of the present invention provides a probe assembly M, which includes a supporting base T and a plurality of probe structures U. The plurality of probe structures U may be disposed on the carrier T according to a measurement array design of the probe card.
Further, referring to fig. 2 to 5, each probe structure U may include a metal main body 1, a coating structure layer 2 and an insulating layer 3. The metal body 1 has a first end 11, a second end 12 corresponding to the first end 11, a connecting portion 13 connected between the first end 11 and the second end 12, and a surrounding surface S surrounding the first end 11, the second end 12 and the connecting portion 13. In addition, the coating structure layer 2 includes a first coating layer 21 disposed on the surrounding surface S of the first end portion 11, a second coating layer 22 disposed on the surrounding surface S of the second end portion 12, and a third coating layer 23 disposed on the surrounding surface S of the connecting portion 13. The insulating layer 3 is disposed on the third cladding layer 23 to expose the first cladding layer 21 and the second cladding layer 22. Therefore, the insulating layer 3 is located on the outermost layer of the probe structures U, so that a short circuit phenomenon caused by electrical contact between adjacent probe structures U can be avoided.
In view of the above, it should be noted that the characteristics of the metal main body 1, the coating structure layer 2 and the insulating layer 3 provided in the second embodiment are similar to those of the previous embodiments, and are not repeated herein. In other words, the first coating layer 21, the second coating layer 22 and the third coating layer 23 provided in the second embodiment may also be selectively provided with the strengthening layer a, the oxidation resistant layer B, the graphene layer C and/or the heat dissipation layer D as described in the previous embodiments.
Advantageous effects of the embodiments
One of the advantages of the probe assembly M and the probe structure U thereof according to the embodiment of the invention is that the coating structure layer 2 includes a first coating layer 21 disposed on the surrounding surface S of the first end portion 11, a second coating layer 22 disposed on the surrounding surface S of the second end portion 12, a third coating layer 23 disposed on the surrounding surface S of the connecting portion 13, and the insulating layer 3 is disposed on the third coating layer 23 to expose the first coating layer 21 and the second coating layer 22, so as to improve reliability, conductivity, heat dissipation and/or mechanical strength of the probe structure U. In other words, the sectional design can be utilized to make each position (the first region Z1, the second region Z2, and the third region Z3) in the probe structure U overcome the current-proof, mechanical characteristics, heat dissipation, and insulation problems, so as to enhance the mechanical strength, heat dissipation effect, and probe performance and lifetime of the probe structure U. In addition, the insulating layer 3 can be used to prevent the short circuit phenomenon caused by the electrical contact between the adjacent probe structures U in the probe assembly M.
The disclosure is only a preferred embodiment of the invention, and is not intended to limit the scope of the claims, so that all technical equivalents and modifications using the contents of the specification and drawings are included in the scope of the claims.
Claims (14)
1. A probe structure, comprising:
a metal body portion having a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first end portion and the second end portion, and a surrounding surface surrounding the first end portion, the second end portion, and the connecting portion;
a coating structure layer, said coating structure layer including a first coating layer disposed on said surrounding surface of said first end portion and completely surrounding said metal body portion, a second coating layer disposed on said surrounding surface of said second end portion and completely surrounding said metal body portion, and a third coating layer disposed on said surrounding surface of said connecting portion and completely surrounding said metal body portion; and
the insulating layer is arranged on the third coating layer to expose the first coating layer and the second coating layer;
wherein the first, second and third coatings are respectively a strengthening layer and one or more of an oxidation resistant layer, a heat dissipation layer and a graphene layer disposed on an outer surface of the strengthening layer, and the strengthening layers of the first, second and third coatings are respectively disposed on the surrounding surfaces of the first, second and connection portions;
the Young modulus of the strengthening layer is more than 100GPa, the oxidation-reduction potential of the oxidation-resistant layer is more than or equal to-1.66V, and the thermal conductivity of the heat dissipation layer is more than 200W/mK.
2. The probe structure of claim 1, wherein the insulating layer has a resistivity greater than or equal to 108Ωm。
3. The probe structure according to claim 1 or 2, wherein the metal body portion has electrical conductivity and has a resistivity of less than 5 x 102Ωm。
4. The probe structure of claim 1, wherein two of the first, second, and third cladding layers are structurally different.
5. The probe structure of claim 1, wherein the first coating layer is comprised of the strengthening layer and the graphene layer, the graphene layer of the first coating layer being disposed on the outer surface of the strengthening layer of the first coating layer.
6. The probe structure of claim 1, wherein the second cladding layer is composed of the strengthening layer and the oxidation resistant layer, the oxidation resistant layer of the second cladding layer being disposed on the outer surface of the strengthening layer of the second cladding layer.
7. The probe structure of claim 1, wherein the second cladding layer is composed of the strengthening layer, the oxidation-resistant layer and the heat dissipation layer, the oxidation-resistant layer of the second cladding layer is disposed on the outer surface of the strengthening layer of the second cladding layer, and the heat dissipation layer of the second cladding layer is disposed on an outer surface of the oxidation-resistant layer of the second cladding layer.
8. The probe structure of claim 1, wherein the second coating layer is composed of the strengthening layer, the graphene layer, the oxidation resistant layer and the heat dissipation layer, the graphene layer of the second coating layer is disposed on the outer surface of the strengthening layer of the second coating layer, the oxidation resistant layer of the second coating layer is disposed on an outer surface of the graphene layer of the second coating layer, and the heat dissipation layer of the second coating layer is disposed on an outer surface of the oxidation resistant layer of the second coating layer.
9. The probe structure of claim 1, wherein the third cladding layer is composed of the strengthening layer and the heat sink layer, the heat sink layer of the third cladding layer being disposed on the outer surface of the strengthening layer of the third cladding layer.
10. The probe structure of claim 1, wherein the third coating layer is composed of the strengthening layer, the graphene layer and the heat dissipation layer, the graphene layer of the third coating layer is disposed on the outer surface of the strengthening layer of the third coating layer, the heat dissipation layer of the third coating layer is disposed on an outer surface of the graphene layer of the third coating layer, and the insulating layer is disposed on an outer surface of the heat dissipation layer.
11. A probe assembly, comprising:
a bearing seat; and
the probe structures are arranged on the bearing seat, and each probe structure comprises a metal main body part, a coating structure layer and an insulating layer;
wherein the metal body portion has a first end portion, a second end portion corresponding to the first end portion, a connecting portion connected between the first end portion and the second end portion, and a surrounding surface surrounding the first end portion, the second end portion, and the connecting portion;
wherein the coating structure layer comprises a first coating layer disposed on the surrounding surface of the first end portion and completely surrounding the metal main body portion, a second coating layer disposed on the surrounding surface of the second end portion and completely surrounding the metal main body portion, and a third coating layer disposed on the surrounding surface of the connecting portion and completely surrounding the metal main body portion;
the insulating layer is arranged on the third cladding layer to expose the first cladding layer and the second cladding layer;
wherein the first, second and third coatings are respectively a strengthening layer and one or more of an oxidation resistant layer, a heat dissipation layer and a graphene layer disposed on an outer surface of the strengthening layer, and the strengthening layers of the first, second and third coatings are respectively disposed on the surrounding surfaces of the first, second and connection portions;
the Young modulus of the strengthening layer is more than 100GPa, the oxidation-reduction potential of the oxidation-resistant layer is more than or equal to-1.66V, and the thermal conductivity of the heat dissipation layer is more than 200W/mK.
12. The probe assembly of claim 11, wherein the insulating layer has a resistivity greater than or equal to 108Ωm。
13. The probe assembly of claim 11 or 12, wherein the metallic body portion is electrically conductiveAnd the resistivity of the metal main body part is less than 5 multiplied by 102Ωm。
14. The probe assembly of claim 11, wherein two of the first, second, and third coatings are structurally different.
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| CN201710779658.0A CN109425814B (en) | 2017-09-01 | 2017-09-01 | Probe assembly and probe structure thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685104A (en) * | 2008-09-27 | 2010-03-31 | 京元电子股份有限公司 | Test probe and manufacturing method thereof |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
| TW201629493A (en) * | 2014-12-30 | 2016-08-16 | 技術探測股份有限公司 | Contact probe for testing head |
| CN106546780A (en) * | 2015-09-21 | 2017-03-29 | 旺矽科技股份有限公司 | Probe structure and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FI123205B (en) * | 2008-05-12 | 2012-12-31 | Imbera Electronics Oy | A circuit module and a method for manufacturing a circuit module |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101685104A (en) * | 2008-09-27 | 2010-03-31 | 京元电子股份有限公司 | Test probe and manufacturing method thereof |
| CN104049116A (en) * | 2013-03-15 | 2014-09-17 | 稳懋半导体股份有限公司 | Probe card, probe structure and manufacturing method thereof |
| TW201629493A (en) * | 2014-12-30 | 2016-08-16 | 技術探測股份有限公司 | Contact probe for testing head |
| CN106546780A (en) * | 2015-09-21 | 2017-03-29 | 旺矽科技股份有限公司 | Probe structure and manufacturing method thereof |
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| CN109425814A (en) | 2019-03-05 |
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