CN109414849B - Light cleaning processing device - Google Patents
Light cleaning processing device Download PDFInfo
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- CN109414849B CN109414849B CN201780041541.0A CN201780041541A CN109414849B CN 109414849 B CN109414849 B CN 109414849B CN 201780041541 A CN201780041541 A CN 201780041541A CN 109414849 B CN109414849 B CN 109414849B
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- template
- window member
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- infrared
- cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/70—Maintenance
- B29C33/72—Cleaning
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
- B08B7/0057—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like by ultraviolet radiation
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/002—Component parts, details or accessories; Auxiliary operations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/02—Surface shaping of articles, e.g. embossing; Apparatus therefor by mechanical means, e.g. pressing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Cleaning In General (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Shaping Of Tube Ends By Bending Or Straightening (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The invention aims to provide a light cleaning processing device which can execute the cleaning processing of the surface of a template made of quartz glass in a short time. The optical cleaning apparatus of the present invention is an optical cleaning apparatus for cleaning a surface of a template made of quartz glass used for nanoimprinting by ultraviolet rays, the optical cleaning apparatus including: a processing chamber forming member configured to form a processing chamber to which a processing gas is supplied, the processing chamber forming member being provided with a template to be processed; a housing having a window member that is provided opposite to the template disposed in the processing chamber with a gap therebetween and transmits ultraviolet rays; an ultraviolet light source disposed in the housing and configured to irradiate ultraviolet light to the template through the window member; and a heating unit for heating the template.
Description
Technical Field
The present invention relates to a light cleaning apparatus for cleaning a surface of a template made of quartz glass used for nanoimprinting with ultraviolet light.
Background
In recent years, in the manufacture of semiconductor chips and biochips, the optical nanoimprint technology has attracted attention as a method that can be manufactured at a lower cost than conventional patterning methods using photolithography and etching.
In the pattern forming method using the optical nanoimprint technology, if foreign matter such as resist residue is present on the surface of the template made of quartz glass used, a defect occurs in the obtained pattern, and therefore, it is necessary to perform cleaning treatment on the surface of the template.
Conventionally, as a method of cleaning the surface of the template, there has been proposed a light cleaning apparatus for irradiating the surface of the template with ultraviolet rays to decompose and remove foreign substances adhering to the surface of the template (see patent document 1).
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2011-155160
Disclosure of Invention
Problems to be solved by the invention
However, in the above-described optical cleaning apparatus, a considerable time is required to sufficiently perform the cleaning process on the surface of the template, and as a result, there is a problem that productivity is lowered in the manufacture of semiconductor chips and the like.
Accordingly, an object of the present invention is to provide a light cleaning apparatus capable of performing a cleaning process of a surface of a template made of quartz glass in a short time.
Means for solving the problems
The optical cleaning apparatus of the present invention is an optical cleaning apparatus for cleaning a surface of a template made of quartz glass used for nanoimprinting by ultraviolet rays, the optical cleaning apparatus including: a processing chamber forming member configured to form a processing chamber to which a processing gas is supplied, the processing chamber forming member being provided with a template to be processed; a housing having a window member that is provided opposite to the template disposed in the processing chamber with a gap therebetween and transmits ultraviolet rays; an ultraviolet light source disposed in the housing and configured to irradiate ultraviolet light to the template through the window member; and a heating unit that heats the template.
In the optical cleaning apparatus of the present invention, it is preferable that the heating unit is disposed in the processing chamber.
The processing chamber forming member may have an infrared-transmitting window member provided to face the window member, and the heating unit may be disposed to face an outer surface of the infrared-transmitting window member.
Preferably, the heating means is constituted by a carbon heater or a halogen heater which irradiates infrared rays.
In the optical cleaning apparatus of the present invention, the heating unit may be a heating element that is provided in the window member and generates heat by resistance heating.
Effects of the invention
According to the optical cleaning apparatus of the present invention, since the template can be heated by the heating unit, foreign substances such as resist residue adhering to the surface of the template are heated through the template. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template is promoted, and as a result, the cleaning treatment of the surface of the template can be performed in a short time.
Drawings
Fig. 1 is a sectional view for explaining the configuration of a light cleaning apparatus according to a first embodiment of the present invention.
FIG. 2 is a perspective view of an excimer lamp of the optical cleaning apparatus shown in FIG. 1.
Fig. 3 is a sectional view for explaining the excimer lamp shown in fig. 2.
Fig. 4 is a sectional view for explaining the configuration of a light cleaning apparatus according to a second embodiment of the present invention.
Fig. 5 is a sectional view for explaining the configuration of a light cleaning apparatus according to a third embodiment of the present invention.
Fig. 6 is a cross-sectional view for explaining the configuration of a light cleaning apparatus according to a fourth embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail.
Fig. 1 is a sectional view for explaining the configuration of a light cleaning apparatus according to a first embodiment of the present invention. The light cleaning apparatus shown in fig. 1 is used for performing light cleaning processing on the surface of a template used in nanoimprinting. The template to be processed is made of, for example, quartz glass.
The optical cleaning processing apparatus has a rectangular parallelepiped box-shaped processing chamber forming member 10 in which a processing chamber 11 in which a template 1 to be processed is disposed is formed. In the light cleaning process of the template 1, ozone is generated in the processing chamber 11, and therefore, as a material constituting the processing chamber forming member 10, a material having ultraviolet resistance and ozone resistance is preferably used. Specific examples of the material constituting the chamber forming member 10 include stainless steel and aluminum treated with hard alumite.
An opening 12 is formed in a bottom wall portion of the chamber forming member 10, and a light source unit 20 is disposed so as to close the opening 12. Further, a holding member (not shown) for holding four corners of the mask 1 is fixed to an inner surface of the bottom wall or the upper wall of the chamber forming member 10. The chamber forming member 10 is provided with a gas supply port (not shown) for supplying a processing gas into the processing chamber 11 and a gas discharge port (not shown) for discharging the gas from the processing chamber 11.
The light source unit 20 has a box-shaped housing 21 having a rectangular parallelepiped shape. As a material constituting the case 21, a material having ultraviolet resistance is preferably used, and specific examples thereof include aluminum subjected to hard alumite treatment and the like.
An excimer lamp 25 is disposed as an ultraviolet light source in the housing 21. A window member 22 through which ultraviolet rays from the excimer lamp 25 pass is fixed to the upper surface of the housing 21 by a frame-shaped fixing plate 23. As a material constituting the window member 22, for example, synthetic quartz glass can be used. Further, the casing 21 is provided with a purge gas supply pipe (not shown) for supplying a purge gas such as nitrogen gas into the casing 21.
The light source unit 20 is disposed so that the window member 22 faces the template 1 disposed in the processing chamber 11 with a gap therebetween. The separation distance between the outer surface of the window member 22 and the pattern surface of the template 1 is, for example, 0.3 to 10.0 mm.
The excimer lamp 25 is disposed in the housing 21 so as to irradiate the template 1 with ultraviolet rays through the window member 22.
Fig. 2 is a perspective view of the excimer lamp 25, and fig. 3 is a sectional view for explaining the excimer lamp 25 shown in fig. 2. The excimer lamp 25 has a discharge vessel 26 of a generally flat plate shape in which a discharge space S is formed. At both ends of the discharge vessel 26, lamp bases 29 are provided. In addition, an excimer gas is hermetically sealed in the discharge space S of the discharge vessel 26. A mesh-like high-voltage side electrode 27 is disposed on one surface of the discharge vessel 26, and a mesh-like ground side electrode 28 is disposed on the other surface of the discharge vessel 26. The high-voltage side electrode 27 and the ground side electrode 28 are electrically connected to a high-frequency power supply (not shown), respectively. The excimer lamp 25 is disposed such that the surface of the discharge vessel 26 on which the high-voltage side electrode 27 is disposed faces the window member 22 of the housing 21.
As a material constituting the discharge vessel 26, a material that transmits vacuum ultraviolet rays well, specifically, silica glass such as synthetic quartz glass, sapphire glass, or the like can be used.
As a material constituting the high-voltage side electrode 27 and the ground side electrode 28, a metal material such as aluminum, nickel, or gold can be used. The high-voltage-side electrode 27 and the ground-side electrode 28 can also be formed by screen printing a conductive paste containing the metal material, or by vacuum vapor deposition of the metal material.
As the excimer gas sealed in the discharge space S of the discharge vessel 26, a gas capable of generating an excimer gas emitting vacuum ultraviolet rays can be used, and specifically, a rare gas such as xenon, argon, or krypton, or a mixed gas in which a rare gas and a halogen gas such as bromine, chlorine, iodine, or fluorine are mixed can be used. When a specific example of the excimer gas is expressed together with the wavelength of the ultraviolet light emitted, the wavelength is 172nm in the case of xenon, 191nm in the case of a mixed gas of argon and iodine, and 193nm in the case of a mixed gas of argon and fluorine.
The sealing pressure of the excimer gas is, for example, 10 to 100 kPa.
In the optical cleaning processing apparatus of the first embodiment, an infrared ray transmitting window member 13 that transmits infrared rays is provided on the upper wall portion of the processing chamber forming member 10. Outside the chamber forming member 10, as heating means for heating the template 1, a lamp heater 30 for irradiating infrared rays to the template 1 through an infrared ray transmitting window member 13 is disposed to face the infrared ray transmitting window member 13.
As a material constituting the infrared transmitting window member 13, a material having heat resistance and not transmitting vacuum ultraviolet rays is preferably used. When the infrared transmitting window member 13 is made of a material that transmits vacuum ultraviolet rays, the vacuum ultraviolet rays from the excimer lamp 25 are transmitted through the infrared transmitting window member 13, and ozone is generated outside the chamber forming member 10, which is not preferable. Specific examples of the material constituting the infrared transmitting window member 13 include heat-resistant glass such as Pyrex (registered trademark) glass and Tempax glass (registered trademark), fused silica glass, germanium, silicon, and the like.
When the distance between the window member 22 and the infrared transmitting window member 13 is sufficiently long, the vacuum ultraviolet rays are absorbed by the atmosphere in the processing chamber 11 and do not reach the infrared transmitting window member 13, and therefore the infrared transmitting window member 13 may be made of a material that transmits the vacuum ultraviolet rays. In this case, as a specific example of the material constituting the infrared transmitting window member 13, a material that transmits vacuum ultraviolet rays, such as sapphire, calcium fluoride, barium fluoride, or the like, can be used.
As the lamp heater 30, for example, a device emitting infrared rays having a wavelength of 0.8 to 1000 μm can be used. Specific examples of the lamp heater 30 include a halogen heater and a carbon heater. Among these, a halogen heater is preferable.
As the halogen heater, a single-ended type heater with a mirror, a double-ended type heater, or the like can be used.
Further, the lamp heater 30 may be provided with a mirror for condensing infrared rays on the template 1.
The wavelength range of infrared rays emitted from the lamp heater 30 such as a halogen heater can be selected according to the type of material of the infrared transmission window member 13.
For example, when infrared rays in the near infrared region are irradiated to the template 1, specific examples of the material of the infrared transmitting window member 13 include heat-resistant glass such as pyrex (registered trademark) glass and Tempax glass (registered trademark), and fused silica glass.
When infrared rays in the middle infrared region are irradiated from the near infrared region to the template 1, sapphire is a specific example of a material of the infrared transmitting window member 13.
When infrared rays in the far infrared region are irradiated from the near infrared region to the template 1, specific examples of the material of the infrared transmitting window member 13 include germanium, silicon, calcium fluoride, and barium fluoride.
In addition, when the template 1 itself may be heated to a high temperature, the template 1 itself is heated, and foreign substances such as resist residues adhering to the surface of the template 1 are also heated, so that the efficiency is further improved. It is preferable to select whether the infrared ray transmission window member 13 is a member for transmitting far infrared rays or a member for absorbing far infrared rays, depending on whether the template 1 itself is heated.
In the above-described optical cleaning processing apparatus, first, the template 1 to be processed is held by a holding member (not shown) provided in the processing chamber forming member 10. In this state, the lamp heater 30 is turned on, and a process gas is supplied into the process chamber 11 from a gas supply port (not shown) formed in the process chamber forming member 10. As a result, infrared rays from the lamp heater 30 are irradiated to foreign substances such as resist residue adhering to the surface of the template 1 through the infrared transmission window member 13 and the template 1, thereby heating the foreign substances. The processing chamber 11 is replaced with a processing gas.
Here, when a material that absorbs far infrared rays is selected as a material of the infrared transmitting window member 13, near infrared rays having a wavelength of 0.8 to 2 μm among infrared rays emitted from the lamp heater 30 are transmitted through the infrared transmitting window member 13 and the template 1, respectively, and irradiated and absorbed to foreign substances adhering to the surface of the template 1, and as a result, the foreign substances are heated. On the other hand, far infrared rays having a wavelength of 4 to 1000 μm are absorbed by the infrared transmitting window member 13.
In addition, when a material that transmits far infrared rays is selected as the material of the infrared transmitting window member 13, the far infrared rays are irradiated to and absorbed by the template 1 and foreign matter adhering to the surface of the template 1, and as a result, the template 1 itself can be heated together with the foreign matter.
In this state, the excimer lamp 25 is turned on in the light source unit 20, and thereby ultraviolet rays from the excimer lamp 25 are irradiated to the surface of the template 1 through the window member 22, and the light cleaning process of the template 1 is performed.
Thereafter, the excimer lamp 25 and the lamp heater 30 are turned off, and in this state, the processing gas is continuously supplied, whereby the template 1 is air-cooled, and ozone and the like generated in the processing chamber 11 are discharged from a gas outlet (not shown).
As described above, the light cleaning process of the template 1 is performed, and thereafter the template 1 is taken out from the process chamber 11.
As described above, as the processing gas, a gas containing oxygen such as clean and dry air, nitrogen, or a mixed gas of clean and dry air and nitrogen gas can be used.
The flow rate of the processing gas supplied to the processing chamber 11 is, for example, 0 to 100L/min.
The preheating time from the turning on of the lamp heater 30 to the start of the optical cleaning process (the turning on of the excimer lamp 25) is, for example, 5 to 60 seconds.
In the photo-cleaning process, the temperature of the foreign matter adhering to the surface of the template 1 is, for example, 50 to 200 ℃.
The treatment time of the optical cleaning treatment, i.e., the irradiation time of the ultraviolet ray is, for example, 3 to 600 seconds.
According to the above-described optical cleaning apparatus, since the template 1 can be heated by the lamp heater 30, foreign substances such as resist residues adhering to the surface of the template 1 are heated via the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning treatment of the surface of the template 1 can be performed in a short time.
Fig. 4 is a sectional view for explaining the configuration of a light cleaning apparatus according to a second embodiment of the present invention. The optical cleaning apparatus shown in fig. 4 is used for optical cleaning of the surface of a template used for nanoimprinting.
In the optical cleaning apparatus of the second embodiment, the lamp heater 30 is disposed behind the excimer lamp 25 in the housing 21 of the light source unit 20. The window member 22 is made of a material that transmits infrared rays. Since the high-voltage side electrode 27 and the ground side electrode 28 of the excimer lamp 25 are respectively formed in a mesh shape (see fig. 2 and 3), the portion of the discharge vessel 26 where the high-voltage side electrode 27 and the ground side electrode 28 are not formed serves as an infrared ray transmitting portion for transmitting infrared rays from the lamp heater 30.
The optical cleaning apparatus of the second embodiment is otherwise the same as the optical cleaning apparatus of the first embodiment except that the infrared-transmitting window member is not provided in the chamber forming member 11.
In the above-described optical cleaning processing apparatus, in a state where the template 1 is held by a holding member (not shown) provided in the chamber forming member 10, the lamp heater 30 is turned on, and the processing gas is supplied to the processing chamber 11 from a gas supply port (not shown) formed in the chamber forming member 10. As a result, infrared rays from the lamp heater 30 are irradiated to foreign substances such as resist residues adhering to the surface of the template 1 through the discharge vessel 26 of the excimer lamp 25 and the window member 22, thereby heating the foreign substances. The processing chamber 11 is replaced with a processing gas.
Here, near infrared rays among the infrared rays emitted from the lamp heater 30 are transmitted through the infrared ray transmitting portion of the excimer lamp 25, that is, the portion of the discharge vessel 26 where the high voltage side electrode 27 and the ground side electrode 28 are not formed, and the window member 22, and are irradiated and absorbed by foreign matter adhering to the surface of the template 1, and as a result, the foreign matter is heated. On the other hand, the far infrared rays are absorbed by the discharge vessel 26 or the window member 22.
Then, as in the case of the light cleaning processing apparatus of the first embodiment, the light cleaning processing of the mask 1 is performed, and the mask 1 is taken out from the processing chamber 11.
As described above, the warm-up time of the lamp heater 30 and other optical cleaning conditions are the same as those of the optical cleaning apparatus according to the first embodiment.
According to the above-described optical cleaning apparatus, since the template 1 can be heated by the lamp heater 30, foreign substances such as resist residues adhering to the surface of the template 1 are heated via the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning treatment of the surface of the template 1 can be performed in a short time.
Fig. 5 is a sectional view for explaining the configuration of a light cleaning apparatus according to a third embodiment of the present invention. The light cleaning apparatus shown in fig. 5 is used for performing light cleaning processing on the surface of a template used in nanoimprinting.
In the optical cleaning apparatus according to the third embodiment, a heating element 35 formed of a strip-shaped film that generates heat by resistance heating is provided as a heating means on the inner surface of the window member 22 of the light source unit 20. Such a heating element 35 can be formed by printing and firing a conductive paste on the window member 22. The heating element 35 generates a heat amount of, for example, 0.5 to 10 kW.
The optical cleaning processing apparatus of the third embodiment is the same as the optical cleaning processing apparatus of the second embodiment except that the lamp heater 30 is not provided.
In the above-described optical cleaning processing apparatus, the heating element 35 is energized and the processing gas is supplied to the processing chamber 11 from the gas supply port (not shown) formed in the processing chamber forming member 10 in a state where the mask 1 is held by the holding member (not shown) provided in the processing chamber forming member 10. As a result, the heating element 35 generates heat by resistance heating, and the radiant heat heats foreign matter such as resist residue adhering to the surface of the template 1. The processing chamber 11 is replaced with a processing gas.
Then, as in the case of the light cleaning processing apparatus of the first embodiment, the light cleaning processing of the template 1 is performed, and the template 1 is taken out from the processing chamber 11.
As described above, the preheating time from the energization of the heating element 35 to the start of the optical cleaning process (the lighting of the excimer lamp 25) is, for example, 5 to 60 seconds. The other conditions of the optical cleaning process are the same as those of the optical cleaning process apparatus according to the first embodiment.
According to the above-described optical cleaning apparatus, since the template 1 can be heated by the heating element 35, foreign substances such as resist residues adhering to the surface of the template 1 are heated via the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning treatment of the surface of the template 1 can be performed in a short time.
Fig. 6 is a cross-sectional view for explaining the configuration of a light cleaning apparatus according to a fourth embodiment of the present invention. The optical cleaning apparatus shown in fig. 6 is used for optical cleaning of the surface of a template used for nanoimprinting.
In the optical cleaning processing apparatus of the fourth embodiment, in the processing chamber 11, as a heating means for heating the mask 1, a lamp heater 30 for irradiating infrared rays to the mask 1 is disposed to face the back surface of the mask 1.
The optical cleaning processing apparatus of the fourth embodiment has the same configuration as the optical cleaning processing apparatus of the second embodiment except that the lamp heater 30 is not provided behind the excimer lamp 25 in the housing 21.
As the lamp heater 30, a carbon heater is preferably used.
The carbon heater is formed by disposing a heating element made of carbon fiber in a quartz tube in which an inert gas is sealed. The infrared ray emitted from the carbon heater has a peak in a region of a mid-infrared ray having a wavelength of 2.0 to 4.0 μm, for example. The intermediate infrared rays are absorbed by the quartz glass constituting the template 1, and therefore the template 1 can be efficiently heated.
In the above-described optical cleaning processing apparatus, the lamp heater 30 is turned on and the processing gas is supplied to the processing chamber 11 from the gas supply port (not shown) formed in the processing chamber forming member 10 in a state where the mask 1 is held by the holding member (not shown) provided in the processing chamber forming member 10. As a result, foreign matter such as resist residue adhering to the surface of the template 1 is irradiated with infrared rays from the lamp heater 30, thereby heating the foreign matter. The processing chamber 11 is replaced with a processing gas.
Here, near infrared rays among infrared rays emitted from the lamp heater 30 are transmitted through the template 1, irradiated and absorbed on foreign substances adhering to the surface of the template 1, and as a result, the foreign substances are heated. On the other hand, the intermediate infrared rays and the far infrared rays are absorbed by the template 1, and as a result, the template 1 is heated and conducts heat to the foreign matter.
Then, as in the case of the light cleaning processing apparatus of the first embodiment, the light cleaning processing of the mask 1 is performed, and the mask 1 is taken out from the processing chamber 11.
As described above, the warm-up time of the lamp heater 30 and other optical cleaning conditions are the same as those of the optical cleaning apparatus of the first embodiment.
According to the above-described optical cleaning apparatus, since the template 1 can be heated by the lamp heater 30, foreign substances such as resist residues adhering to the surface of the template 1 are heated via the template 1. Therefore, the decomposition reaction of the foreign matter adhering to the surface of the template 1 is promoted, and as a result, the cleaning treatment of the surface of the template 1 can be performed in a short time.
While the embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made.
(1) As the heating means, a device for heating the process gas supplied to the process chamber may be used instead of the lamp heater 30 and the heating element 35.
In the optical cleaning processing apparatus having such a heating unit, the lamp heater 30 is turned on in a state of being held by a holding member (not shown) provided in the processing chamber forming member 10, and the processing chamber 11 is replaced with the heated processing gas by supplying the heated processing gas to the processing chamber 11 from a gas supply port (not shown) formed in the processing chamber forming member 10.
Then, as in the case of the light cleaning processing apparatus of the first embodiment, the light cleaning processing of the mask 1 is performed, and the mask 1 is taken out from the processing chamber 11.
The temperature of the heated treatment gas is, for example, 50 to 200 ℃.
According to the above-described optical cleaning apparatus, since the processing gas is heated by the heating means, foreign matter such as resist residue adhering to the surface of the template 1 is heated by the processing gas to promote decomposition reaction of the foreign matter, and as a result, the cleaning process of the surface of the template 1 can be performed in a short time.
(2) In the optical cleaning apparatus according to the third embodiment, the heating element 35 may be provided on the outer surface of the window member 22 (the surface facing the mask 1). However, in such a configuration, the heating element 22 is exposed in the processing chamber 11, and dust caused by the material constituting the heating element 35 may be mixed into the processing chamber 11, and therefore, the heating element 35 is preferably provided on the inner surface of the window member 22.
Examples
EXAMPLE 1
The ultraviolet treatment apparatus was manufactured according to the structure shown in fig. 6. The specification of the ultraviolet treatment apparatus is as follows. Making it an ultraviolet treatment apparatus [ 1 ].
Lamp heater: carbon heater
Electric power of carbon heater: 3kW
Size of carbon heater: 100mm x 200mm
Diameter of carbon heater: 5mm
Distance from the lower surface of the carbon heater to the upper surface of the die plate: 50mm
The object to be treated (template) coated with a resist in a specific thickness is subjected to a photo-cleaning treatment using the above-mentioned ultraviolet treatment apparatus [ 1 ] under the following photo-cleaning treatment conditions (supply conditions of the treatment gas, irradiation conditions of the ultraviolet rays, and heating conditions).
Types of process gases: CDA
Supply amount of process gas: 1L/min
Purge time of process gas: 60 seconds
Ultraviolet illuminance of window member: 70mW/cm2
Ultraviolet irradiation time: 35 seconds
Heating time of carbon heater: 50 seconds
Temperature of resist applied to the template: 100 deg.C
As a result, the resist removal rate was 2 nm/s.
Further, since the heating time of the carbon heater is 50 seconds included in the cleaning time of the processing gas of 60 seconds, the heating time of the carbon heater is not added to the throughput in the cleaning process of the template.
EXAMPLE 2
The ultraviolet treatment apparatus was manufactured according to the structure shown in fig. 1. The specification of the ultraviolet treatment apparatus is as follows. Making it an ultraviolet treatment apparatus [ 2 ].
Infrared-transmitting window member: tempax glass (registered trademark)
Size of infrared-transmitting window member: phi 50mm
Thickness of infrared-transmitting window member: 2mm
Distance from the lower surface of the infrared-transmitting window member to the upper surface of the window member: 80mm
Lamp heater: halogen heater
Power of halogen heater: 500W
The object to be treated (template) coated with a resist in a specific thickness is subjected to a photo-cleaning treatment using the above-mentioned ultraviolet treatment apparatus [ 2 ] under the following photo-cleaning treatment conditions (supply conditions of the treatment gas, irradiation conditions of the ultraviolet rays, and heating conditions).
Types of process gases: CDA
Supply amount of process gas: 1L/min
Purge time of process gas: 60 seconds
Ultraviolet illuminance of window member: 70mW/cm2
Ultraviolet irradiation time: 35 seconds
Heating time of halogen heater: 600 seconds
Temperature of resist applied to the template: 100 deg.C
As a result, the resist removal rate was 2 nm/s.
The heating time of the halogen heater was about 600 seconds for the electric power under the conditions of the present example, but the resist removal rate was the same as that of the ultraviolet treatment apparatus of example 1.
Comparative example
An ultraviolet treatment apparatus [ 3 ] having the same specification as the ultraviolet treatment apparatus [ 2 ] was produced except that the infrared transmission window member and the halogen heater were not provided.
The object to be treated (template) coated with a resist having a specific thickness as in the examples was subjected to a photo-cleaning treatment using the above-mentioned ultraviolet treatment apparatus [ 3 ] under the following photo-cleaning treatment conditions (supply conditions of the treatment gas, irradiation conditions of the ultraviolet rays, and heating conditions).
Types of process gases: CDA
Supply amount of process gas: 1L/min
Purge time of process gas: 60 seconds
Ultraviolet illuminance of window member: 70mW/cm2
Ultraviolet irradiation time: 100 seconds
As a result, the resist removal rate was 0.7 nm/s.
From the above results, it was confirmed that the ultraviolet treatment apparatus [ 1 ] of example 1 and the ultraviolet treatment apparatus [ 2 ] of example 2 were provided with heating means composed of a carbon heater or a halogen heater, and therefore the speed of removing the resist could be greatly increased, and the time for cleaning the template could be shortened.
Description of the reference numerals
1 form panel
10 chamber formation
11 treatment chamber
12 opening
13 Infrared ray transmitting window member
20 light source unit
21 casing
22 window component
23 fixed plate
25 quasi-molecular lamp
26 discharge vessel
27 high voltage side electrode
28 grounded side electrode
29 lamp holder
30 lamp heater
35 heating element
S discharge space
Claims (1)
1. An optical cleaning apparatus for cleaning a surface of a template made of quartz glass used for nanoimprinting with ultraviolet light, the optical cleaning apparatus comprising:
a processing chamber forming member configured to form a processing chamber to which a processing gas is supplied, the processing chamber forming member being provided with a template to be processed;
a housing having a window member that is provided opposite to the template disposed in the processing chamber with a gap therebetween and transmits ultraviolet rays;
an ultraviolet light source disposed in the housing and configured to irradiate ultraviolet light to the template through the window member; and
a heating unit for heating the template,
the processing chamber forming member has an infrared ray transmitting window member provided to face the window member,
the heating unit is a lamp heater disposed opposite to the outer surface of the infrared ray transmitting window member,
the infrared ray transmitting window member absorbs far infrared rays and transmits near infrared rays having a wavelength of 0.8 to 2 [ mu ] m among infrared rays emitted from the heating unit through the infrared ray transmitting window member to heat foreign matters attached to the template,
the vacuum ultraviolet rays emitted from the ultraviolet light source do not transmit through the infrared transmitting window member.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016135648 | 2016-07-08 | ||
| JP2016-135648 | 2016-07-08 | ||
| PCT/JP2017/022318 WO2018008365A1 (en) | 2016-07-08 | 2017-06-16 | Light washing treatment device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109414849A CN109414849A (en) | 2019-03-01 |
| CN109414849B true CN109414849B (en) | 2022-05-10 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780041541.0A Active CN109414849B (en) | 2016-07-08 | 2017-06-16 | Light cleaning processing device |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6888624B2 (en) |
| KR (1) | KR102162392B1 (en) |
| CN (1) | CN109414849B (en) |
| TW (1) | TWI712480B (en) |
| WO (1) | WO2018008365A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6949191B1 (en) * | 2020-12-18 | 2021-10-13 | ホッティーポリマー株式会社 | 3D printer |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2577585B2 (en) * | 1987-11-27 | 1997-02-05 | 東芝セラミックス株式会社 | Manufacturing method of quartz glass tube |
| JPH07321046A (en) * | 1994-05-23 | 1995-12-08 | Hitachi Ltd | Device and method for thin film formation |
| JP2001155160A (en) | 1999-11-30 | 2001-06-08 | Komatsu Ltd | Device for inspecting external appearance of electronic component |
| JP4747398B2 (en) * | 2000-07-27 | 2011-08-17 | 株式会社Ｇｓユアサ | UV treatment equipment |
| JP2004202926A (en) * | 2002-12-26 | 2004-07-22 | Towa Corp | Cleaning method of component in resin molding and apparatus therefor |
| US20100072671A1 (en) * | 2008-09-25 | 2010-03-25 | Molecular Imprints, Inc. | Nano-imprint lithography template fabrication and treatment |
| CN101780699B (en) * | 2009-01-20 | 2014-01-08 | 晟铭电子科技股份有限公司 | Microstructure forming device and method and light guide plate thereof |
| JP5471514B2 (en) | 2010-01-28 | 2014-04-16 | ウシオ電機株式会社 | Light processing equipment |
| JP2011245384A (en) | 2010-05-25 | 2011-12-08 | Ushio Inc | Light irradiation device |
| JP5906037B2 (en) * | 2010-09-09 | 2016-04-20 | キヤノン株式会社 | Manufacturing method of optical components |
| JP5235977B2 (en) * | 2010-12-16 | 2013-07-10 | 富士フイルム株式会社 | Image forming apparatus and image forming method |
| JP2012256724A (en) * | 2011-06-09 | 2012-12-27 | Hitachi Kokusai Electric Inc | Substrate processing apparatus and method for manufacturing semiconductor device |
| JP5776631B2 (en) * | 2012-06-04 | 2015-09-09 | ウシオ電機株式会社 | Template cleaning method, pattern forming method, optical cleaning apparatus, and nanoimprint apparatus |
| JP5987522B2 (en) | 2012-07-23 | 2016-09-07 | ウシオ電機株式会社 | Template cleaning light irradiation apparatus, nanoimprint apparatus, template cleaning method, and pattern forming method |
| JP6111783B2 (en) * | 2013-03-27 | 2017-04-12 | 大日本印刷株式会社 | Imprint method and imprint apparatus |
| CN104308452A (en) * | 2014-08-21 | 2015-01-28 | 清华大学 | Amorphous alloy micro-nano structure stamping forming mould and preparation and application methods thereof |
| JP6550964B2 (en) * | 2015-06-26 | 2019-07-31 | ウシオ電機株式会社 | Optical processing apparatus and manufacturing method thereof |
-
2017
- 2017-06-16 CN CN201780041541.0A patent/CN109414849B/en active Active
- 2017-06-16 KR KR1020187036577A patent/KR102162392B1/en active IP Right Grant
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- 2017-06-16 WO PCT/JP2017/022318 patent/WO2018008365A1/en active Application Filing
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| Publication number | Publication date |
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| TW201811530A (en) | 2018-04-01 |
| CN109414849A (en) | 2019-03-01 |
| TWI712480B (en) | 2020-12-11 |
| KR102162392B1 (en) | 2020-10-06 |
| WO2018008365A1 (en) | 2018-01-11 |
| KR20190009339A (en) | 2019-01-28 |
| JP6888624B2 (en) | 2021-06-16 |
| JPWO2018008365A1 (en) | 2019-04-25 |
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