CN109385609A - Target material welding method - Google Patents
Target material welding method Download PDFInfo
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- CN109385609A CN109385609A CN201710669908.5A CN201710669908A CN109385609A CN 109385609 A CN109385609 A CN 109385609A CN 201710669908 A CN201710669908 A CN 201710669908A CN 109385609 A CN109385609 A CN 109385609A
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- laser
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- target
- backboard
- welding surface
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- Chemical & Material Sciences (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Laser Beam Processing (AREA)
Abstract
A kind of target material welding method, comprising: provide target and backboard, the target has the first welding surface, and the backboard has the second welding surface；First welding surface is fitted in into second welding surface；First welding surface, the second welding surface are circumferentially welded using first laser, the weld start position is the welding end position；The power density of the first laser is controlled 106W/cm2- 107W/cm2Between；Repair welding is carried out to the weld start position using second laser；The power density of the second laser is controlled 103W/cm2- 104W/cm2Between.Thereby it is ensured that the bonding strength between target and backboard, prevents from revealing between the first welding surface, the second welding surface.
Description
Technical field
The present invention relates to technical field of semiconductors, and in particular to a kind of target material welding method.
Background technique
In target sputtering process field, target is usually fixed on backboard and forms target material assembly, and backboard is for fixing
To sputtering equipment, target is used for sputter coating.The mode that soldering is generallyd use between target and backboard is fixed.Target sputter
In technique, environment locating for target material assembly is usually relatively more severe, specifically, the sputter face of target is under high vacuum environment, band
Charged particle continuously bombards the sputter face of target, makes it have higher temperature；And the back side of target is (opposite with the sputter face
Face) usually circulate coolant liquid, to reduce the temperature of target, thus pressure with higher.That is, the two sides of target have
Biggish pressure difference will lead to cold if having hole between weld strength deficiency or target and backboard between target and backboard
But the exudation of liquid damages sputtering equipment, causes sputtering process that can not be normally carried out.
Summary of the invention
Problems solved by the invention is that the welding manner of target and backboard may cause weldering at position while welding in the prior art
Intensity deficiency is connect, or generates hole, influences being normally carried out for sputtering process.
To solve the above problems, the present invention provides a kind of target material welding method, comprising: provide target and backboard, the target
Material has the first welding surface, and the backboard has the second welding surface；First welding surface is fitted in into second welding surface；
First welding surface, the second welding surface are circumferentially welded using first laser, the weld start position is that the welding terminates
Position；The power density of the first laser is controlled 106W/cm2- 107W/cm2Between；Using second laser to the welding
Initial position carries out repair welding；The power density of the second laser is controlled 103W/cm2- 104W/cm2Between.
Optionally, the method for carrying out repair welding to weld start position using second laser includes: to utilize described second
Hole on initial position described in laser alignment is to melt the inner wall of described hole；Cool down to the weld start position,
To condense melted described hole；Fill solder in described hole, and using the second laser weld the solder and
Hole.
Optionally, the method for the inner wall of second laser fusing described hole is utilized are as follows: control the second laser ring
Around the circumferentially uniform movement of described hole；Or, control target and backboard movement, make each position circumferential on described hole according to
The secondary alignment second laser.
Optionally, it is at least twice using the number of the inner wall of second laser fusing described hole.
Optionally, the method to cool down to the weld start position are as follows: the target and backboard are placed in air
Middle carry out natural cooling.
Optionally, the solder and the target use identical material；Or, the solder is with the backboard using identical
Material.
Optionally, it is at least twice using the number that the second laser carries out repair welding to the weld start position.
Optionally, the spot diameter of the first laser is controlled between 0.2mm-2.0mm, controls the second laser
Spot diameter between 0.2mm-2.0mm.
Optionally, the target is aluminium target, and the backboard is aluminum alloy back plate；Or, the target is titanium target material, it is described
Backboard is titanium alloy backboard.
Optionally, before circumferentially welding first welding surface, the second welding surface using the first laser, institute is cleaned
State the first welding surface, the second welding surface.
Compared with prior art, technical solution of the present invention has the advantage that
The target material welding method utilizes the second welding of the first welding surface and backboard of first laser welding target
Face, laser welding blend the material of target and backboard on welding position, to make to have between target and backboard higher
Bonding strength；Meanwhile repair welding is carried out to the hole in weld start position using second laser, it can be avoided and originated in welding
Gap or hole, the bonding strength being further ensured that between target and backboard are generated between position, welding end position to prevent
It is revealed between the first welding surface, the second welding surface.
Detailed description of the invention
The target material assembly that Fig. 1 is the specific embodiment of the invention after first laser circumferentially welding radially on section view
Figure；
Fig. 2 is the enlarged drawing of a-quadrant shown in Fig. 1；
Fig. 3 is structural schematic diagram of the hole shown in Fig. 2 after second laser is irradiated；
Fig. 4 is specific embodiment of the invention target welding process figure.
Specific embodiment
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Referring to Fig.1, a kind of target material welding method provides target 10 and backboard 20, wherein target 10 has for welding
First welding surface 11, the sputter face 12 for sputter and the back side 13 opposite with the sputter face 12, backboard 20 have the second weldering
Junction 21.When the first welding surface 11, the second welding surface 21 are welded and fixed, target 11 and backboard 12 surround cavity oo.
Target 10 is in sputtering process, and sputter face 12 is under high vacuum environment, and charged particle continuously bombards splashing for target
Face 12 is penetrated, the temperature with higher of sputter face 12 is made；Circulation has coolant liquid in cavity oo, and coolant liquid is inhaled for taking away target 10
The heat of receipts reduces the temperature of target 10, so that having relatively high pressure in cavity oo.That is, the two of target 10
Side has biggish pressure difference.Therefore, to prevent coolant liquid from leaking to the external world, need to guarantee that the first welding surface 11, second welds
There is enough weld strengths between face 21.
In the present embodiment, the welding manner between the first welding surface 11, the second welding surface 12 is as follows:
So that the first welding surface 11 is fitted in the second welding surface 12, and welds institute using first laser x (in figure shown in arrow)
State the first welding surface 11 and the second welding surface 12.Specifically, the first laser x along target 10 circumferential direction gradually by described first
Welding surface 11 and the second welding surface 12 are welded and fixed.
Laser welding utilizes the laser beam with high-energy density to irradiate two workpiece to be welded, being capable of local heating work
Part, and workpiece is melted, to achieve the purpose that welding.In the present embodiment, when first laser x exposes to the first welding surface 11 and
When the bonding position of two welding surfaces 12, the material of target 10 and backboard 20 on the position can be melted, when target 10 and backboard
20 when being cooled to room temperature, and the material on the first welding surface 11, the second welding surface 12 mutually merges, and completes welding.
Compared to the mode of conventional brazing, laser welding melts target 10 mutually with material of the backboard 20 on welding position
It closes, to make that there is higher bonding strength between target 10 and backboard 20.It is set when target 10 and backboard 20 are fixed to sputter
When standby upper, even if having biggish pressure difference between the sputter face 12 and the back side 13 of target, target 10 and backboard 20 will not be made
Between welding position deform or crack, coolant liquid will not be made to ooze out, not will lead to sputtering process can not be normally carried out.
In the present embodiment, the spot diameter of the first laser x is controlled between 0.2mm-2.0mm, passes through control first
The spot diameter of laser x, be not in first laser x irradiation area it is excessive, the phenomenon that leading to ablation weld seam generation.
Meanwhile the power density of the first laser x is controlled 106W/cm2- 107W/cm2Between.Under this power density
Laser that target 10 and 20 surface of backboard can be made to be heated is recessed at hole, form deep penetration welding, have that speed of welding is fast, depth-to-width ratio
Big feature.
If the power density of the first laser x is less than 106W/cm2, then the surface of target 10 and backboard 20 can only be melted,
Cause the metal layer mutually merged relatively thin, reduces the bonding strength between target 10 and backboard 20；Meanwhile it can not rapid melting
Target 10 and backboard 20 reduce target speed of welding.If the power density of the first laser x is greater than 107W/cm2, then it is easy to burn
The target 10 and backboard 20 are worn, causes product unqualified.
Optionally, before circumferentially welding first welding surface 11, the second welding surface 21 using the first laser x,
Clean first welding surface 11, the second welding surface 21.To remove the first welding surface 11, the oxide on the second welding surface 21,
It lays a solid foundation for post laser welding.Specifically, first welding surface 11, the second welding surface can be cleaned using acid solution
21, such as hydrofluoric acid, nitric acid, hydrochloric acid, sulfuric acid or its mixed solution etc..
In the present embodiment, gradually the target 10 and backboard 20 are welded and fixed along the circumferential direction of target 10 by first laser x.Institute
Stating first laser x in the welding process has weld start position aa and welding end position (not shown), if welding knot
Shu Shi, first laser x do not reach weld start position, then have gap between welding end position and weld start position aa,
The gap will lead to the exudation of coolant liquid in sputtering process, cause sputtering process that can not be normally carried out.
If at the end of welding, first laser x exposes to weld start position aa, i.e. welding end position and welding start bit
It sets aa to coincide, at this point, initial position aa experienced twice laser weldings, is easy to produce hole on the position, reduces by first
Bonding strength between welding surface 11, the second welding surface 12, there are coolant liquid exudations, cause sputtering process that can not be normally carried out
It happens.
Occurs gap between welding end position and weld start position aa in order to prevent, or in weld start position
Aa generates hole.In the present embodiment, when circumferentially welding target 10 and backboard 20 using first laser x, make to weld stop bits
It sets and coincides with weld start position aa, welding end position at this time is weld start position aa.Between thus can be avoided
The generation of gap.
In addition, being recycled second laser y after circumferentially welding target 10 and backboard 20 using first laser x (shown in Fig. 2)
Repair welding is carried out to the weld start position aa, fills up the hole caused by weld start position aa, to guarantee the first weldering
Bonding strength between junction 11, the second welding surface 12, avoids the exudation of coolant liquid.
Specifically, the spot diameter for controlling the second laser y passes through control second laser between 0.2mm-2.0mm
The spot diameter of y, be not in second laser y irradiation area it is excessive, the phenomenon that leading to ablation weld seam generation.Meanwhile it controlling
The power density of the second laser y is 103W/cm2- 104W/cm2Between.Laser fusion penetration under this power density is shallow, will not
Large area melts target 10 and backboard 20, is suitable for carrying out repair welding to weld start position aa.
Referring to Fig. 2, after target 10 and backboard 20 are welded and fixed using first laser x, produced in the weld start position
Raw hole bb.The shape of hole bb is irregular, if fill solder to hole bb is directly carried out repair welding, will lead to solder
Can not with the inside of hole bb is intact is bonded so that having bubble inside the target 10 and backboard 20 after repair welding, reduce target
Bonding strength between 10 and backboard 20.
In the present embodiment, the method for carrying out repair welding to weld start position aa using second laser y is as follows:
Be directed at the hole bb in the weld start position using the second laser y, when second laser y expose to it is described
When hole bb, described hole bb can be heated, and melts the inner wall of hole bb.Then the weld start position is dropped
Temperature, to condense melted described hole bb.
Referring to Fig. 3, for the schematic diagram of the hole bb after second laser is irradiated, at this point, the inner wall of hole bb becomes more
It is round and smooth.When in by fill solder to hole bb, solder can uniformly be contacted with the inside of hole bb, recycle second laser
Y alignment holes bb melts solder, is fixedly welded on solder in hole bb, completes the repair welding to weld start position aa.Herein
In the process, due to solder can with the inside of hole bb is intact is bonded so that inside the target 10 and backboard 20 after repair welding not
Bubble can be generated, to promote the bonding strength between target 10 and backboard 20.
Optionally, when second laser y irradiates hole bb, shine second laser y from top to bottom in the vertical direction
It penetrates.At this point, the metal after fusing can flow to the bottom of hole bb under the effect of gravity, will not after the fusing of hole bb inner wall
It flows out to outside hole bb.
Specifically, making the hot spot of second laser y cover entire hole bb, so that hole if the diameter of hole bb is smaller
The inner wall of bb becomes round and smooth.If hole bb's is relatively large in diameter, week of the second laser y around described hole bb can control
To uniform movement, to melt the inner wall of hole bb；Alternatively, control target 10 and backboard 20 move, make described hole bb last week
To each position be successively directed at the second laser y, to melt the inner wall of hole bb.
Further, after irradiating hole bb using second laser y, need to observe the concrete condition of hole bb.If hole bb
Inner wall it is sufficiently oily, be still irregular state, then need to continue with second laser y irradiation hole bb, until hole
The inner wall of bb becomes round and smooth.That is, can be more using the number of the inner wall of second laser y fusing described hole bb
It is secondary.
In the present embodiment, the method that cools down to the weld start position aa are as follows: by the target 10 and backboard 20
It is placed in air and carries out natural cooling.It in other variations, can also dry it, accelerate convection current, to be quickly cooled down
State weld start position aa.
In addition, the solder can use material identical with the target 10；Alternatively, using identical as the backboard 20
Material.Also, the target 10 is aluminium target, and the backboard 20 is aluminum alloy back plate；Alternatively, the target 10 is titanium target
Material, the backboard 20 are titanium alloy backboard.
That is, the main component of solder, target 10 and backboard 20 is identical material, melted with roughly the same
Point, when second laser y exposes to solder, target 10 and backboard 20, solder can be melted simultaneously with target 10, backboard 20,
Be conducive to for solder to be welded and fixed to hole bb.
Further, when the solder being welded and fixed to hole bb using second laser y, it is also desirable to observe the welding
The concrete condition of initial position aa.If solder is needed to add solder again, be mended there is no preferable filling hole bb
Weldering.That is, can be multiple to the hole bb number for carrying out repair welding using the second laser y.
It should be noted that the weld start position aa may have multiple described hole bb in the present embodiment, because
This, needs to carry out repair welding respectively to multiple hole bb using second laser y.It is strong to promote the connection between target 10 and backboard 20
Degree.
It is the welding process figure of the present embodiment target and backboard referring to Fig. 4, specific welding process is as follows:
Target 10 and backboard 20 are provided, the target 10 has the first welding surface 11, and the backboard 20 has the second welding
Face 21.
First welding surface 11 and the second welding surface 12 are cleaned using acid solution, and by first welding surface 11 and the
Two welding surfaces 12 standing is dried.
First welding surface 11 is fitted in into second welding surface 12, using first laser x along the circumferential direction of target 10
Weld first welding surface 11 and the second welding surface 12.Also, at the end of first laser x welding, first laser x is exposed to
Weld start position aa, even if welding end position coincides with weld start position aa.
After target 10 and backboard 20 are welded and fixed using first laser x, hole can be generated in the weld start position
bb.Repair welding is carried out using second laser y alignment described hole bb, to complete the welding of target 10 and backboard 20.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (10)
1. a kind of target material welding method characterized by comprising
Target and backboard are provided, the target has the first welding surface, and the backboard has the second welding surface；
First welding surface is fitted in into second welding surface；
First welding surface, the second welding surface are circumferentially welded using first laser, the weld start position is the welding
End position；
The power density of the first laser is controlled 106W/cm2- 107W/cm2Between；
Repair welding is carried out to the weld start position using second laser；
The power density of the second laser is controlled 103W/cm2- 104W/cm2Between.
2. target material welding method as described in claim 1, which is characterized in that described to utilize second laser to weld start position
Carry out repair welding method include:
The hole on the initial position is directed at using the second laser to melt the inner wall of described hole；
Cool down to the weld start position, to condense melted described hole；
Solder is filled in described hole, and welds the solder and hole using the second laser.
3. target material welding method as claimed in claim 2, which is characterized in that utilize second laser fusing described hole
The method of inner wall are as follows: control circumferentially uniform movement of the second laser around described hole；Or, control target and backboard fortune
It is dynamic, so that each position circumferential on described hole is successively directed at the second laser.
4. target material welding method as claimed in claim 3, which is characterized in that utilize second laser fusing described hole
The number of inner wall is at least twice.
5. target material welding method as claimed in claim 2, which is characterized in that the side to cool down to the weld start position
Method are as follows: the target and backboard are placed in air and carry out natural cooling.
6. target material welding method as claimed in claim 2, which is characterized in that the solder and the target use identical material
Material；Or, the solder and the backboard use identical material.
7. target material welding method as claimed in claim 2, which is characterized in that originated using the second laser to the welding
The number that position carries out repair welding is at least twice.
8. target material welding method as described in claim 1, which is characterized in that the spot diameter for controlling the first laser exists
Between 0.2mm-2.0mm, the spot diameter of the second laser is controlled between 0.2mm-2.0mm.
9. target material welding method as described in claim 1, which is characterized in that the target is aluminium target, and the backboard is aluminium
Alloy backboard；Or, the target is titanium target material, the backboard is titanium alloy backboard.
10. target material welding method as described in claim 1, which is characterized in that circumferentially welding institute using the first laser
Before stating the first welding surface, the second welding surface, first welding surface, the second welding surface are cleaned.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710669908.5A CN109385609A (en) | 2017-08-08 | 2017-08-08 | Target material welding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710669908.5A CN109385609A (en) | 2017-08-08 | 2017-08-08 | Target material welding method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109385609A true CN109385609A (en) | 2019-02-26 |
Family
ID=65413130
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710669908.5A Pending CN109385609A (en) | 2017-08-08 | 2017-08-08 | Target material welding method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112427793A (en) * | 2020-10-26 | 2021-03-02 | 宁波江丰电子材料股份有限公司 | Filling method for electron beam welding air holes |
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| CN104708199A (en) * | 2015-03-13 | 2015-06-17 | 无锡汉神电气有限公司 | Laser wire filling welding repairing craft for bad laser-welding seam |
| CN105397337A (en) * | 2015-12-18 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Method for conducting laser modification welding on titanium alloy weld joint through wave absorbing coating |
| CN106914700A (en) * | 2016-12-29 | 2017-07-04 | 中国航天时代电子公司 | A kind of ultrasonic wave added laser soldering device and method for different metal materials |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101015893A (en) * | 2007-02-28 | 2007-08-15 | 商颖工业有限公司 | Rustless steel container and its production method |
| CN102713549A (en) * | 2010-01-25 | 2012-10-03 | 株式会社鹭宫制作所 | Pressure sensing device |
| CN104708199A (en) * | 2015-03-13 | 2015-06-17 | 无锡汉神电气有限公司 | Laser wire filling welding repairing craft for bad laser-welding seam |
| CN105397337A (en) * | 2015-12-18 | 2016-03-16 | 中国航空工业集团公司北京航空制造工程研究所 | Method for conducting laser modification welding on titanium alloy weld joint through wave absorbing coating |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112427793A (en) * | 2020-10-26 | 2021-03-02 | 宁波江丰电子材料股份有限公司 | Filling method for electron beam welding air holes |
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Application publication date: 20190226 |