CN109373215A - A kind of ultra-high brightness LED glass fluorescent lamp - Google Patents
A kind of ultra-high brightness LED glass fluorescent lamp Download PDFInfo
- Publication number
- CN109373215A CN109373215A CN201811418061.4A CN201811418061A CN109373215A CN 109373215 A CN109373215 A CN 109373215A CN 201811418061 A CN201811418061 A CN 201811418061A CN 109373215 A CN109373215 A CN 109373215A
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- Prior art keywords
- fluorescent lamp
- mounting base
- ultra
- resistor
- high brightness
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/27—Retrofit light sources for lighting devices with two fittings for each light source, e.g. for substitution of fluorescent tubes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V31/00—Gas-tight or water-tight arrangements
- F21V31/005—Sealing arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B44/00—Circuit arrangements for operating electroluminescent light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention discloses a kind of ultra-high brightness LED glass fluorescent lamp, including mounting plate, is mounted on mounting base on front side of the both ends of the mounting plate, and glass tube is provided between two groups of mounting bases, and the upside and downside of the mounting base are provided with heat dissipation turnover panel;A kind of ultra-high brightness LED glass fluorescent lamp of the present invention can effectively radiate to the driving power circuit board inside mounting base, and the installation site of entire fluorescent lamp can be finely adjusted, it avoids and occurs the problem of position inaccurate during installation, the circuit of driving power is improved, improve the transfer efficiency of power supply, reduce the loss of power, using multiple semiconductor wafers, promote the section temperature drop of LED lamp bead low, to improve light-emitting area, reach light efficiency substantial increase, effectively increase the brightness of fluorescent lamp, use high thermal conductivity LED casting glue, improve the heat-sinking capability of lamp bead, using the ultralow light loss glass Manifold technology of aqueous dusting, improve the light transmittance of glass tube.
Description
Technical field
The invention belongs to lighting technical fields, and in particular to arrive a kind of LED glass fluorescent lamp, more particularly a kind of superelevation
Brightness LED glass fluorescent lamp.
Background technique
LED glass fluorescent lamp, is commonly called as straight lamp, is the substitute of conventional fluorescent fluorescent tube, is embodied in energy conservation and environmental protection two
Aspect, size mounting means is identical with conventional fluorescent, but principle of luminosity be carried out using LED semiconductor chip it is luminous, by outer
Shell material matter is divided into two classes, and one is glass, one is aluminium and PC, 90lm/W~200lm/W in luminous efficiency, and LED glass
Fluorescent lamp is easy for installation, is a kind of common illuminator in actual life;
There are certain drawbacks in existing LED glass fluorescent lamp, existing LED glass fluorescent lamp during use
Driving circuit uses traditional non-isolated circuit, and power supply conversion efficiency is general, and there are certain loss of power, glass pipe surfaces
Light extraction efficiency it is general, light loss is larger when in use, and the heat dissipation effect of lamp bead is general, and the heat-conducting effect of fluorescent lamp is also inadequate
Significantly, furthermore the brightness of branch LED lamp bead is smaller when in use, and the illumination zone of entire LED glass fluorescent lamp is caused relatively to have
It limits, and does not have effective cooling measure to LED power driving circuit, when used for a long time LED power driving circuit temperature liter
Height can impact service efficiency, not high in LED glass fluorescent lamp degree flexible for installation, can not adjust to installation site
It is whole, it is more troublesome.
Summary of the invention
In order to overcome above-mentioned technical problem, the purpose of the present invention is to provide a kind of ultra-high brightness LED glass fluorescent lamp,
Can effectively radiate to the driving power circuit board inside mounting base, and can installation site to entire fluorescent lamp into
Row fine tuning, avoids and occurs the problem of position inaccurate during installation, improve to the circuit of driving power, improve power supply
Transfer efficiency, reduce the loss of power, using multiple semiconductor wafers, promote the section temperature drop of LED lamp bead low, with improve shine
Area reaches light efficiency substantial increase, effectively increases the brightness of fluorescent lamp, using high thermal conductivity LED casting glue, improves lamp bead
Heat-sinking capability the light transmittance of glass tube is improved using the ultralow light loss glass Manifold technology of aqueous dusting.
The purpose of the present invention can be achieved through the following technical solutions:
The both ends front side of a kind of ultra-high brightness LED glass fluorescent lamp, including mounting plate, the mounting plate is mounted on installation
Seat, and glass tube is provided between two groups of mounting bases, the upside and downside of the mounting base are provided with heat dissipation turnover panel, and wherein
The side of one group of mounting base is provided with wire interface, and the inside of the glass tube and mounting plate joining place are equipped with PCB aluminum substrate,
And the side internal cohesion of PCB aluminum substrate has bracket, the inside of the bracket offers silica gel slot, and the inner bottom of silica gel slot
It is provided with chip, two groups of gold threads are connected on the upside of the chip, are connected with shaft between heat dissipation turnover panel and the mounting base, and
The uper side surface of heat dissipation turnover panel is equipped with pulling-on piece, is connected between the downside of the heat dissipation turnover panel and the inside of mounting base dust-proof
Net is provided with sliding rail on rear side of the mounting plate, and equidistantly offers several groups fixing threaded hole, the cunning through the surface of sliding rail
The outside both ends of rail are respectively arranged with the first fixinig plate and the second fixinig plate, and run through the table of the first fixinig plate and the second fixinig plate
Face is provided with fastening bolt.
As a further solution of the present invention: the mounting base is internally provided with driving power circuit board, driving power
Circuit board includes several groups inductance coil, and mounting groove is offered inside the side of mounting base, and the glass tube passes through installation
Slot and mounting base insertion connect.
As a further solution of the present invention: the heat dissipation turnover panel is flexibly connected by shaft with mounting base, and heat dissipation is turned over
Plate activity between 0 ° -90 ° in the horizontal direction.
As a further solution of the present invention: the periphery of the wire interface is enclosed with insulated enclosure circle, and wire interface
Conducting wire is provided between driving power circuit board to connect.
As a further solution of the present invention: it is filled with methyl system organic silica gel inside the silica gel slot, and silica gel slot
Bottom is provided with spread powder, and the bottom of the bracket is coated with reflectorised paint, and the bracket passes through LED casting glue and PCB aluminum substrate
Encapsulating.
As a further solution of the present invention: the chip is connected by crystal-bonding adhesive and bracket bonding, and chip is provided with
Positive and negative anodes, positive and negative anodes are connected with the connector of two groups of gold threads respectively.
As a further solution of the present invention: the height on both sides of first fixinig plate and the second fixinig plate are greater than its middle part
Height, and the two sides of the first fixinig plate and the second fixinig plate are not contacted with the rear side of sliding rail.
As the further scheme of the present invention: the circuit connecting mode of the driving power circuit board are as follows: firewire L and fuse
RF1 concatenation, and firewire L and zero curve N are respectively connected to the upper and lower ends mouth of electric bridge BD1, the side ports ground connection of electric bridge BD1, electric bridge
Another side ports of BD1 are parallel with resistor R7, inductance coil L1, capacitor C1 and capacitor C2, and one end of capacitor C2 is serially connected with more
Circle inductance coil L2-1, one end of multiturn inductance coil L2-1 are serially connected with chip, and one end of chip is further connected with diode D1 and more
Circle inductance coil L2-2, the other end of chip is serially connected with resistor R1, and the other end of chip is also parallel with capacitor C4, resistor
R2 and resistor R3, wherein capacitor C4, resistor R1 and resistor R2 connect, one end of resistor R1 be parallel with capacitor C3 and
Capacitor C5, one end of capacitor C3 are parallel with resistor R5, and one end of resistor R5 concatenates the positive grade of LED power, resistor R5's
The cathode of other end concatenation LED power.
Beneficial effects of the present invention:
1, the present invention is improved by the non-isolated circuit to driving power circuit board, can effectively be reduced in daylight
The electric energy loss of lamp work forward drive power supply circuit board reduces the internal resistance of inductance, reduces by improving the line footpath of inductance coil
Inductance calorific value improves the transfer efficiency of power supply.
2, it is constituted by using multi-wafer, reflecting system, promotes section temperature drop low, so as to improve light-emitting area, reach light
Substantial increase is imitated, and then can be improved the brightness of single lamp bead, promotes the brightness of entire fluorescent lamp to improve, system has using methyl
Machine silica gel adds spread powder as filling, in frame bottom compound reflecting paint, so that the brightness issued is further
Increase.
3, by using the ultralow light loss glass Manifold technology of aqueous dusting, improve glass tube making technology, so that entire glass
The light transmittance of pipe is greatly improved.
4, by using high thermal conductivity LED casting glue, LED casting glue is translucent organic glue, thus relative to tradition
LED casting glue with good light transmittance, and can effectively improve the heat-sinking capability of lamp bead, on PCB aluminum substrate simultaneously
The high anti-ink of coating, to improve the reflection efficiency of single lamp bead.
5, by setting heat dissipation turnover panel, heat dissipation turnover panel can be pulled open by pulling-on piece, Air Filter is unfolded inside mounting base,
And then expand mounting base and external contact area, so that mounting base has excellent thermal diffusivity, energy to fluorescent lamp during operation
It is enough effectively to radiate to the driving power circuit board inside mounting base.
6, by setting sliding rail, the first fixinig plate is adjusted with the second fixinig plate position, fluorescent lamp is being installed
When it is more flexible, avoid punch installation when position inaccurate cause installation there is the appearance of the case where error.
Detailed description of the invention
The present invention will be further described below with reference to the drawings.
Fig. 1 is a kind of overall structure diagram of ultra-high brightness LED glass fluorescent lamp of the present invention.
Fig. 2 is a kind of schematic diagram of internal structure of ultra-high brightness LED glass fluorescent lamp of the present invention.
Fig. 3 is the overall structure diagram of bracket in a kind of ultra-high brightness LED glass fluorescent lamp of the present invention.
Fig. 4 is the expanded view of heat dissipation turnover panel in a kind of ultra-high brightness LED glass fluorescent lamp of the present invention.
Fig. 5 is the rearview of mounting plate in a kind of ultra-high brightness LED glass fluorescent lamp of the present invention.
Fig. 6 is the non-isolated circuit diagram of modified in a kind of ultra-high brightness LED glass fluorescent lamp of the present invention.
1, mounting plate in figure;2, glass tube;3, mounting base;4, radiate turnover panel;5, wire interface;6, PCB aluminum substrate;7, it props up
Frame;8, mounting groove;9, silica gel slot;10, chip;11, gold thread;12, shaft;13, pulling-on piece;14, Air Filter;15, sliding rail;16, solid
Determine screw hole;17, the first fixinig plate;18, fastening bolt;19, the second fixinig plate.
Specific embodiment
Below in conjunction with the embodiment of the present invention, technical scheme in the embodiment of the invention is clearly and completely described,
Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.Based in the present invention
Embodiment, all other embodiment obtained by those of ordinary skill in the art without making creative efforts, all
Belong to the scope of protection of the invention.
As shown in figures 1 to 6, a kind of ultra-high brightness LED glass fluorescent lamp, including mounting plate 1, the both ends front side of mounting plate 1 is
Mounting base 3 is installed, and is provided with glass tube 2 between two groups of mounting bases 3, the upside and downside of mounting base 3 are provided with heat dissipation
Turnover panel 4, and wherein the side of one group of mounting base 3 is provided with wire interface 5, the inside of glass tube 2 and 1 joining place of mounting plate are installed
There is PCB aluminum substrate 6, and the side internal cohesion of PCB aluminum substrate 6 has bracket 7, the inside of bracket 7 offers silica gel slot 9, and silicon
The inner bottom of glue groove 9 is provided with chip 10, and the upside of chip 10 is connected with two groups of gold threads 11, heat dissipation turnover panel 4 and mounting base 3 it
Between be connected with shaft 12, and the uper side surface for the turnover panel 4 that radiates is equipped with pulling-on piece 13, and the downside of the turnover panel 4 that radiates is interior with mounting base 3
Air Filter 14 is connected between portion, the rear side of mounting plate 1 is provided with sliding rail 15, and if equidistantly offering through the surface of sliding rail 15
A dry group fixing threaded hole 16, the outside both ends of sliding rail 15 are respectively arranged with the first fixinig plate 17 and the second fixinig plate 19, and through the
The surface of one fixinig plate 17 and the second fixinig plate 19 is provided with fastening bolt 18.
As a further solution of the present invention: mounting base 3 is internally provided with driving power circuit board, driving power circuit
Plate includes several groups inductance coil, and mounting groove 8 is offered inside the side of mounting base 3, glass tube 2 by mounting groove 8 with
The insertion connection of mounting base 3.
As a further solution of the present invention: heat dissipation turnover panel 4 is flexibly connected by shaft 12 with mounting base 3, and heat dissipation is turned over
The activity between 0 ° -90 ° in the horizontal direction of plate 4.
As a further solution of the present invention: the periphery of wire interface 5 is enclosed with insulated enclosure circle, and wire interface 5 with
Conducting wire connection is provided between driving power circuit board.
As a further solution of the present invention: methyl system organic silica gel, and the bottom of silica gel slot 9 are filled with inside silica gel slot 9
Portion is provided with spread powder, and the bottom of bracket 7 is coated with reflectorised paint, and bracket 7 passes through LED casting glue and 6 encapsulating of PCB aluminum substrate.
As a further solution of the present invention: chip 10 is connected by crystal-bonding adhesive and the bonding of bracket 7, and chip 10 is provided with
Positive and negative anodes, positive and negative anodes are connected with the connector of two groups of gold threads 11 respectively.
As a further solution of the present invention: the height on both sides of the first fixinig plate 17 and the second fixinig plate 19 are greater than its middle part
Height, and the two sides of the first fixinig plate 17 and the second fixinig plate 19 are not contacted with the rear side of sliding rail 15.
As the further scheme of the present invention: the circuit connecting mode of driving power circuit board are as follows: firewire L and fuse RF1
Concatenation, and firewire L and zero curve N are respectively connected to the upper and lower ends mouth of electric bridge BD1, the side ports ground connection of electric bridge BD1, electric bridge BD1
Another side ports be parallel with resistor R7, inductance coil L1, capacitor C1 and capacitor C2, one end of capacitor C2 is serially connected with multiturn electricity
Feel coil L2-1, one end of multiturn inductance coil L2-1 is serially connected with chip, and one end of chip is further connected with diode D1 and multiturn electricity
Feel coil L2-2, the other end of chip is serially connected with resistor R1, and the other end of chip be also parallel with capacitor C4, resistor R2 and
Resistor R3, wherein capacitor C4, resistor R1 and resistor R2 connect, and one end of resistor R1 is parallel with capacitor C3 and capacitor
C5, one end of capacitor C3 are parallel with resistor R5, and the positive grade of one end concatenation LED power of resistor R5, resistor R5's is another
The cathode of end concatenation LED power.
Mounting base is mounted on the front side both ends of mounting plate by a kind of ultra-high brightness LED glass fluorescent lamp when in use, then will
PCB aluminum substrate is installed on the front side of mounting plate, and glass tube is embedded into the mounting groove of two groups of installation groups, in the external electricity of wire interface
Source, external power supply conductive finger driving power circuit board, by driving power circuit board by gold thread conduction to each internal stent
Chip is driven, and bracket, silica gel slot, chip and gold thread constitute single lamp bead, and chip is semiconductor wafer, will be electric by chip
It can be converted into luminous energy, when electric current flows through conducting wire and acts on eyeglass, electrons are pushed to the area p, and electronics meets with hole in the area p,
Then energy is issued in the form of photon, so as to generate brightness, multiple groups chip generates Intensity LEDs simultaneously, and then provides photograph
It is bright, multiple groups are set by the chip in bracket, using a wafer substrates, four chips are put in bilateral symmetry side, and mutually constitute
Reflecting system promotes section temperature drop low, so as to improve light-emitting area, reaches light efficiency substantial increase, and then can be improved single
The brightness of lamp bead promotes the brightness of entire fluorescent lamp to improve, fills out in silica gel slot so that the light efficiency of single lamp bead is greater than 220lm/W
The silica gel filled uses methyl system organic silica gel, and adds spread powder, in frame bottom compound reflecting paint, so that issuing
Brightness further increase, and have biggish range of scatter, the non-isolated circuit of driving power circuit board is improved, is adopted
The peak value control that electric current is carried out with the mode of the wealthy winding of model (L2-1, L2-2), when LED power output variation reaches the maximum of setting
Value, feedback winding obtain enough induced electromotive forces, are compared, are turned off with the output comparator of IC internal controller
State, the propagation of this energy be by Faraday's law, directly consuming electric energy from circuit, meanwhile, pass through raising
The line footpath of inductance coil reduces the internal resistance of inductance, reduces inductance calorific value, to improve the efficiency of 1-2%, by increasing coil
Diameter reduces internal resistance to 0.11 ohm, reduces the power loss of 0.15W, improves 1.5% efficiency, so as to improve power supply
Transfer efficiency, reduce the loss of power, bracket and when the gold thread encapsulating of PCB aluminum substrate, using high thermal conductivity LED casting glue, LED encapsulating
Glue is translucent organic glue, thus with good light transmittance relative to traditional LED casting glue, and can effectively mention
The heat-sinking capability of high lamp bead coats high anti-ink simultaneously on PCB aluminum substrate, so that the reflection efficiency of single lamp bead is improved,
Aqueous dusting ultralow light loss glass Manifold technology is used when glass tube dusting, improves glass tube making technology, by entire glass tube
Light transmittance is increased to 92% or more, so that the light transmittance of entire daylight etc. is preferable, lamp bead reflection efficiency is high, and small, heat radiation energy is lost
Power is stronger, can be pulled open heat dissipation turnover panel by pulling-on piece, and Air Filter is unfolded inside the mounting base, and then expands mounting base and external
Contact area so that fluorescent lamp during operation mounting base have excellent thermal diffusivity, can be effectively to mounting base inside
Driving power circuit board radiate, can be by the first fixinig plate and the second fixinig plate on the slide rail in fluorescent lamp installation
It is slided, tightens fastening bolt and the position of the first fixinig plate and the second fixinig plate is fixed, in the first fixinig plate and second
The additional bolt in position that the two sides of fixinig plate tilt can be fixed with contact surface, the first fixinig plate and the second fixinig plate position
It can adjust, so that fluorescent lamp is more flexible during installation, avoiding the position inaccurate when punching installation causes to install out
The case where existing error, occurs, more practical.
The present invention is improved by the non-isolated circuit to driving power circuit board, can effectively be reduced in fluorescent lamp
The electric energy loss of work forward drive power supply circuit board reduces the internal resistance of inductance, reduces electricity by improving the line footpath of inductance coil
Feel calorific value, improves the transfer efficiency of power supply;It is constituted by using multi-wafer, reflecting system, promotes section temperature drop low, so as to mention
High light-emitting area reaches light efficiency substantial increase, and then can be improved the brightness of single lamp bead, promotes the brightness of entire fluorescent lamp
It improves, using methyl system organic silica gel as filling, and spread powder is added, in frame bottom compound reflecting paint, so as to make
The brightness that must be issued further increases;By using the ultralow light loss glass Manifold technology of aqueous dusting, improve glass tube making technology,
So that the light transmittance of entire glass tube is greatly improved;By using high thermal conductivity LED casting glue, LED casting glue is half
Transparent organic glue, thus with good light transmittance relative to traditional LED casting glue, and can effectively improve lamp bead
Heat-sinking capability, high anti-ink is coated simultaneously on PCB aluminum substrate, to improve the reflection efficiency of single lamp bead;Pass through setting
Radiate turnover panel, can be pulled open heat dissipation turnover panel by pulling-on piece, and Air Filter is unfolded inside the mounting base, and then expands mounting base and outer
The contact area in portion, so that mounting base has excellent thermal diffusivity to fluorescent lamp during operation, it can be effectively in mounting base
The driving power circuit board in portion radiates;By the way that sliding rail is arranged, the first fixinig plate is adjusted with the second fixinig plate position
Section keeps fluorescent lamp more flexible during installation, and avoiding the position inaccurate when punching installation causes installation error occur
Situation occurs.
Above content is only to structure of the invention example and explanation, affiliated those skilled in the art couple
Described specific embodiment does various modifications or additions or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, is within the scope of protection of the invention.
Claims (8)
1. a kind of ultra-high brightness LED glass fluorescent lamp, which is characterized in that including mounting plate (1), the both ends of the mounting plate (1)
Front side is mounted on mounting base (3), and is provided with glass tube (2) between two groups of mounting bases (3), the upside of the mounting base (3)
It is provided with heat dissipation turnover panel (4) with downside, and wherein the side of one group of mounting base (3) is provided with wire interface (5), the glass
The inside and mounting plate (1) joining place for managing (2) are equipped with PCB aluminum substrate (6), and the side internal cohesion of PCB aluminum substrate (6) has
The inside of bracket (7), the bracket (7) offers silica gel slot (9), and the inner bottom of silica gel slot (9) is provided with chip (10),
It is connected with two groups of gold threads (11) on the upside of the chip (10), is connected with shaft between the heat dissipation turnover panel (4) and mounting base (3)
(12), and the uper side surface of heat dissipation turnover panel (4) is equipped with pulling-on piece (13), downside and mounting base (3) of heat dissipation turnover panel (4)
It is connected between inside Air Filter (14), is provided with sliding rail (15) on rear side of the mounting plate (1), and run through the table of sliding rail (15)
Face equidistantly offers several groups fixing threaded hole (16), and the outside both ends of the sliding rail (15) are respectively arranged with the first fixinig plate (17)
With the second fixinig plate (19), and the surface of the first fixinig plate (17) and the second fixinig plate (19) is provided with fastening bolt (18).
2. a kind of ultra-high brightness LED glass fluorescent lamp according to claim 1, which is characterized in that the mounting base (3)
It is internally provided with driving power circuit board, driving power circuit board includes several groups inductance coil, and the side of mounting base (3)
Inside offers mounting groove (8), and the glass tube (2) is connected by mounting groove (8) and mounting base (3) insertion.
3. a kind of ultra-high brightness LED glass fluorescent lamp according to claim 1, which is characterized in that the heat dissipation turnover panel (4)
It is flexibly connected by shaft (12) with mounting base (3), and turnover panel (4) activity between 0 ° -90 ° in the horizontal direction of radiating.
4. according to right want 2 described in a kind of ultra-high brightness LED glass fluorescent lamp, which is characterized in that the wire interface (5)
Periphery is enclosed with insulated enclosure circle, and is provided with conducting wire between wire interface (5) and driving power circuit board and connect.
5. a kind of ultra-high brightness LED glass fluorescent lamp according to claim 1, which is characterized in that in the silica gel slot (9)
Portion is filled with methyl system organic silica gel, and the bottom of silica gel slot (9) is provided with spread powder, and the bottom of the bracket (7) is coated with
Reflectorised paint, the bracket (7) pass through LED casting glue and PCB aluminum substrate (6) encapsulating.
6. a kind of ultra-high brightness LED glass fluorescent lamp according to claim 1, which is characterized in that the chip (10) is logical
It crosses crystal-bonding adhesive and bracket (7) bonding connects, and chip (10) is provided with positive and negative anodes, positive and negative anodes connect with two groups gold thread (11) respectively
Head is connected.
7. a kind of ultra-high brightness LED glass fluorescent lamp according to claim 1, which is characterized in that first fixinig plate
(17) and the height on both sides of the second fixinig plate (19) are greater than the height in the middle part of it, and the first fixinig plate (17) and the second fixinig plate
(19) two sides are not contacted with the rear side of sliding rail (15).
8. a kind of ultra-high brightness LED glass fluorescent lamp according to claim 2, which is characterized in that the driving power electricity
The circuit connecting mode of road plate are as follows: firewire L is concatenated with fuse RF1, and firewire L and zero curve N are respectively connected to the upper and lower of electric bridge BD1
Two-port, the side ports ground connection of electric bridge BD1, another side ports of electric bridge BD1 are parallel with resistor R7, inductance coil L1, electricity
Hold C1 and capacitor C2, one end of capacitor C2 is serially connected with multiturn inductance coil L2-1, and one end of multiturn inductance coil L2-1 is serially connected with
Chip, one end of chip are further connected with diode D1 and multiturn inductance coil L2-2, and the other end of chip is serially connected with resistor R1, and
The other end of chip is also parallel with capacitor C4, resistor R2 and resistor R3, and wherein capacitor C4, resistor R1 and resistor R2 are equal
Series connection, one end of resistor R1 are parallel with capacitor C3 and capacitor C5, and one end of capacitor C3 is parallel with resistor R5, resistor R5's
One end concatenates the positive grade of LED power, the cathode of the other end concatenation LED power of resistor R5.
Priority Applications (1)
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CN201811418061.4A CN109373215A (en) | 2018-11-26 | 2018-11-26 | A kind of ultra-high brightness LED glass fluorescent lamp |
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CN201811418061.4A CN109373215A (en) | 2018-11-26 | 2018-11-26 | A kind of ultra-high brightness LED glass fluorescent lamp |
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CN209165079U (en) * | 2018-11-26 | 2019-07-26 | 安徽芯瑞达科技股份有限公司 | A kind of ultra-high brightness LED glass fluorescent lamp |
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