CN109373205B - High-efficient LED light source heat radiation structure - Google Patents
High-efficient LED light source heat radiation structure Download PDFInfo
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- CN109373205B CN109373205B CN201811058414.4A CN201811058414A CN109373205B CN 109373205 B CN109373205 B CN 109373205B CN 201811058414 A CN201811058414 A CN 201811058414A CN 109373205 B CN109373205 B CN 109373205B
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- light source
- heat
- led light
- circuit board
- connecting plate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
- F21V29/503—Cooling arrangements characterised by the adaptation for cooling of specific components of light sources
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/60—Cooling arrangements characterised by the use of a forced flow of gas, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/71—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks using a combination of separate elements interconnected by heat-conducting means, e.g. with heat pipes or thermally conductive bars between separate heat-sink elements
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention discloses a high-efficiency LED light source heat dissipation structure, aiming at solving the defect of poor heat dissipation effect of an LED light source. The LED lamp comprises an LED light source, a circuit board and a radiator, wherein the LED light source is arranged on the circuit board, high-heat-conductivity glue is connected between the circuit board and the radiator, and the edge of the LED light source on the circuit board is provided with a radiating through hole. The LED light source is installed on the circuit board, and the high heat-conducting glue between the circuit board and the radiator plays a good role in heat conduction, and heat generated by the work of the LED light source is transferred to the radiator to be quickly dissipated, and meanwhile, the heat dissipation through hole is arranged to be beneficial to forming convection heat dissipation. The high-efficiency LED light source heat dissipation structure has a good heat dissipation effect.
Description
Technical Field
The invention relates to an LED heat dissipation technology, in particular to a high-efficiency LED light source heat dissipation structure.
Background
The heat dissipation effect of the LED directly influences the luminous intensity and the service life of the LED in the using process, and particularly for high-power LEDs, the heat dissipation of the LED is more important. At present, the traditional heat dissipation mode is to directly stick and weld the LED on the heat dissipation substrate, but the heat dissipation effect of the mode is not good.
Disclosure of Invention
The invention overcomes the defect of poor heat dissipation effect of the LED light source, and provides the high-efficiency LED light source heat dissipation structure which has good heat dissipation effect.
In order to solve the technical problems, the invention adopts the following technical scheme: a high-efficiency LED light source heat dissipation structure comprises an LED light source, a circuit board and a heat sink, wherein the LED light source is installed on the circuit board, high-heat-conductivity glue is connected between the circuit board and the heat sink, and heat dissipation through holes are formed in the edge of the LED light source on the circuit board.
The LED light source is installed on the circuit board, and the high heat-conducting glue between the circuit board and the radiator plays a good role in heat conduction, and heat generated by the work of the LED light source is transferred to the radiator to be quickly dissipated, and meanwhile, the heat dissipation through hole is arranged to be beneficial to forming convection heat dissipation. The high-efficiency LED light source heat dissipation structure has a good heat dissipation effect.
Preferably, the circuit board is one of a rigid circuit board or a flexible circuit board. The circuit board adopts a hard circuit board or a flexible circuit board, and different use requirements are met. The lumen-imitating LED light source adopts a reverse buckling mode, the bottom of the hard circuit board is reversely buckled and adhered and welded, and the bottom of the lumen-imitating LED light source is directly provided with high heat conducting cloth, high heat conducting glue and a radiator.
Preferably, the high heat-conducting glue is internally provided with high heat-conducting cloth. The high heat-conducting cloth further improves the heat conduction effect.
Preferably, the radiator comprises an upper radiator, a lower radiator and a bottom plate, the upper radiator comprises an upper connecting plate and a plurality of upper radiating fins, the upper radiating fins are arranged on the lower surface of the upper connecting plate, the high heat-conducting glue is connected to the upper surface of the upper connecting plate, and the lower surface of the upper connecting plate is provided with a plurality of guide rods and a plurality of positioning cylinders; the lower heat radiation body comprises a lower connecting plate and a plurality of lower heat radiation fins, the lower heat radiation fins are arranged on the lower surface of the lower connecting plate, a plurality of guide holes are arranged on the lower connecting plate in a one-to-one correspondence manner with the guide rods, a plurality of ejector rods are arranged on the lower connecting plate in a one-to-one correspondence manner with the positioning cylinders, the guide rods are movably inserted in the guide holes, the lower ends of the guide rods are connected with the bottom plate, positioning springs are sleeved on the guide rods and arranged between the bottom plate and the lower heat radiation fins, deformation air bags are arranged in the positioning cylinders, the; two heat conducting clamping plates are arranged on the edges of two opposite sides of the lower connecting plate, upper radiating fins on two sides of the upper connecting plate are movably clamped between the two heat conducting clamping plates respectively to realize heat conduction, and the lower ends of the upper radiating fins are attached to the upper surface of the lower connecting plate.
The radiator is formed by combining an upper radiator, a lower radiator and a bottom plate, and is of a split structure, and heat conduction is realized between the upper radiator and the lower radiator in the guide hole through the attachment of an upper radiating fin and a heat conducting clamping plate and the insertion of a guide rod. When using under high temperature environment, it is higher to go up the radiator temperature, and the gas that warp in the gasbag this moment is heated the inflation and promotes the ejector pin downwards to make whole lower radiator move down, go up the clearance increase between radiator and the lower radiator, be favorable to the circulation of air, improve the radiating effect. When the temperature of the upper heat sink drops, the deformable air bag returns to its original shape, and the lower heat sink returns to its original position under the action of the positioning spring. The radiator that this kind of structure set up can be according to the position of radiator under the height automatic adjustment of temperature, and when the temperature was higher, lower radiator moved down, increased the clearance between radiator and the lower radiator for the circulation of air improves the radiating effect.
Preferably, a pricking pin for pricking the deformed air bag is installed in the positioning cylinder close to the opening end, and the pricking pin is obliquely arranged from bottom to top towards the ejector rod.
When last radiator temperature is too high, the deformation volume of warping the gasbag reaches extreme position and on the butt stabbed needle, stabbed the gasbag that warp, the gas in the gasbag that warp outwards blows out, blows to between radiator and the lower radiator, has accelerated gaseous circulation, is favorable to improving the radiating speed, prevents to appear overheated phenomenon and damages LED equipment.
Preferably, the guide rod and the positioning cylinder are both arranged on the upper radiating fins, and the guide rods are arranged at the two ends of the two upper radiating fins at the edge of the upper connecting plate; and the other upper radiating fins are provided with four positioning cylinders. This arrangement facilitates smooth movement of the lower fin.
Preferably, the lower surface of the base plate is provided with a solder layer. The setting of soldering tin layer can regard LED light source and radiator as a whole component, welds other circuit boards through the soldering tin layer on, uses and processes more nimble changeable.
Preferably, the bottom plate lower surface and the guide rod correspond to each other and are provided with mounting grooves, the top surfaces of the mounting grooves are provided with positioning insertion holes, the lower ends of the guide rods are provided with locking heads, the diameters of the locking heads are smaller than the diameters of the guide rods, the locking heads are inserted into the positioning insertion holes, the lower ends of the guide rods abut against the upper surface of the bottom plate, the locking heads are in threaded connection with locking nuts, and the locking nuts are arranged in the mounting grooves. The lower end of the guide rod and the bottom plate are convenient and reliable to install.
Compared with the prior art, the invention has the beneficial effects that: (1) the heat dissipation effect of the LED light source heat dissipation structure is good; (2) the position of radiator under the radiator can be according to the height automatic adjustment of temperature, and when the temperature was higher, lower radiator moved down, increased the clearance between radiator and the lower radiator, set up and puncture the deformation gasbag, make the gas in the deformation gasbag blow off for the circulation of air improves the radiating effect.
Drawings
FIG. 1 is a schematic structural view of embodiment 1 of the present invention;
FIG. 2 is a schematic structural view of embodiment 2 of the present invention;
FIG. 3 is a schematic view of the heat sink of the present invention;
FIG. 4 is a schematic view of a heat sink structure of the heat sink of the present invention;
FIG. 5 is a schematic structural diagram of a lower heat sink of the present invention;
in the figure: 1. LED light source, 2, circuit board, 3, high heat conduction glue, 4, high heat conduction cloth, 5, upper radiator, 6, lower radiator, 7, bottom plate, 8, upper connecting plate, 9, upper radiating fin, 10, guide rod, 11, positioning cylinder, 12, lower connecting plate, 13, lower radiating fin, 14, guide hole, 15, ejector rod, 16, positioning spring, 17, deformation gasbag, 18, heat conduction splint, 19, stabbing needle, 20, soldering tin layer, 21, mounting groove, 22, positioning jack, 23, locking head, 24, lock nut.
Detailed Description
The technical scheme of the invention is further described in detail by the following specific embodiments in combination with the attached drawings:
example 1: a high-efficiency LED light source heat dissipation structure (see attached figures 1, 3, 4 and 5) comprises an LED light source 1, a circuit board 2 and a heat sink, wherein the LED light source is arranged on the circuit board, high-heat-conducting glue 3 is connected between the circuit board and the heat sink, and heat dissipation through holes are formed in the edge of the LED light source on the circuit board. The circuit board is a hard circuit board. The high heat-conducting glue is internally provided with high heat-conducting cloth 4. The hard circuit board is provided with a via hole, the lumen-imitating LED light source adopts a back-off mode, the bottom of the hard circuit board penetrates through the via hole for back-off bonding, and the bottom of the lumen-imitating LED light source is directly provided with high heat conduction cloth, high heat conduction glue and a radiator.
The radiator comprises an upper radiator 5, a lower radiator 6 and a bottom plate 7, the upper radiator comprises an upper connecting plate 8 and a plurality of upper radiating fins 9, the upper radiating fins are arranged on the lower surface of the upper connecting plate in parallel, high heat-conducting glue is connected onto the upper surface of the upper connecting plate, and a plurality of guide rods 10 and a plurality of positioning cylinders 11 are arranged on the lower surface of the upper connecting plate; the lower heat radiation body comprises a lower connecting plate 12 and a plurality of lower heat radiation fins 13, the lower heat radiation fins are arranged on the lower surface of the lower connecting plate in parallel, a plurality of guide holes 14 are arranged on the lower connecting plate in one-to-one correspondence with the guide rods, a plurality of ejector rods 15 are arranged on the lower connecting plate in one-to-one correspondence with the positioning cylinders, the guide rods are movably inserted in the guide holes, the lower ends of the guide rods are connected with the bottom plate, positioning springs 16 are sleeved on the guide rods, the positioning springs are arranged between the bottom plate and the lower heat radiation fins, deformation air bags 17 are arranged in the positioning cylinders; two heat conducting clamping plates 18 are arranged on the edges of two opposite sides of the lower connecting plate, upper radiating fins on two sides of the upper connecting plate are movably clamped between the two heat conducting clamping plates respectively to realize heat conduction, and the lower ends of the upper radiating fins are attached to the upper surface of the lower connecting plate. And a pricking needle 19 for pricking the deformed air bag is arranged at the position close to the opening end in the positioning cylinder, and the pricking needle is obliquely arranged towards the ejector rod from bottom to top. The guide rod and the positioning cylinder are both arranged on the upper radiating fins, and the guide rods are arranged at the two ends of the two upper radiating fins at the edge of the upper connecting plate; and the other upper radiating fins are provided with four positioning cylinders. A layer of solder layer 20 is provided on the lower surface of the base plate. Bottom plate lower surface and guide arm correspond the position and all are equipped with mounting groove 21, and the mounting groove top surface is equipped with location jack 22, and the guide arm lower extreme is equipped with locking head 23, and locking head diameter is less than the guide arm diameter, and locking head adaptation cartridge is in location jack, and guide arm lower extreme butt is on the bottom plate upper surface, and threaded connection lock nut 24 is gone up to the locking, and lock nut sets up in the mounting groove.
The LED light source is installed on the circuit board, and the high heat-conducting glue between the circuit board and the radiator plays a good role in heat conduction, and heat generated by the work of the LED light source is transferred to the radiator to be quickly dissipated, and meanwhile, the heat dissipation through hole is arranged to be beneficial to forming convection heat dissipation. The radiator is formed by combining an upper radiator, a lower radiator and a bottom plate, and is of a split structure, and heat conduction is realized between the upper radiator and the lower radiator in the guide hole through the attachment of an upper radiating fin and a heat conducting clamping plate and the insertion of a guide rod. When using under high temperature environment, it is higher to go up the radiator temperature, and the gas that warp in the gasbag this moment is heated the inflation and promotes the ejector pin downwards to make whole lower radiator move down, go up the clearance increase between radiator and the lower radiator, be favorable to the circulation of air, improve the radiating effect. When the temperature of the upper heat sink drops, the deformable air bag returns to its original shape, and the lower heat sink returns to its original position under the action of the positioning spring. The radiator that this kind of structure set up can be according to the position of radiator under the height automatic adjustment of temperature, and when the temperature was higher, lower radiator moved down, increased the clearance between radiator and the lower radiator for the circulation of air improves the radiating effect. When last radiator temperature is too high, the deformation volume of warping the gasbag reaches extreme position and on the butt stabbed needle, stabbed the gasbag that warp, the gas in the gasbag that warp outwards blows out, blows to between radiator and the lower radiator, has accelerated gaseous circulation, is favorable to improving the radiating speed, prevents to appear overheated phenomenon and damages LED equipment.
Example 2: a high-efficiency LED light source heat dissipation structure (see attached figure 2) is similar to that of embodiment 1, and mainly differs in that a circuit board in the embodiment is a flexible circuit board, and high-heat-conduction glue is not provided with high-heat-conduction cloth. The other structure is the same as embodiment 1.
The embodiments described above are merely two preferred embodiments of the present invention, and are not intended to limit the present invention in any way, and other variations and modifications may be made without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (6)
1. A high-efficiency LED light source heat dissipation structure is characterized by comprising an LED light source, a circuit board and a heat sink, wherein the LED light source is arranged on the circuit board, high-heat-conductivity glue is connected between the circuit board and the heat sink, and the edge of the LED light source on the circuit board is provided with a heat dissipation through hole; high heat-conducting cloth is arranged in the high heat-conducting glue; the radiator comprises an upper radiator, a lower radiator and a bottom plate, wherein the upper radiator comprises an upper connecting plate and a plurality of upper radiating fins, the upper radiating fins are arranged on the lower surface of the upper connecting plate, high heat-conducting glue is connected onto the upper surface of the upper connecting plate, and a plurality of guide rods and a plurality of positioning cylinders are arranged on the lower surface of the upper connecting plate; the lower heat radiation body comprises a lower connecting plate and a plurality of lower heat radiation fins, the lower heat radiation fins are arranged on the lower surface of the lower connecting plate, a plurality of guide holes are arranged on the lower connecting plate in a one-to-one correspondence manner with the guide rods, a plurality of ejector rods are arranged on the lower connecting plate in a one-to-one correspondence manner with the positioning cylinders, the guide rods are movably inserted in the guide holes, the lower ends of the guide rods are connected with the bottom plate, positioning springs are sleeved on the guide rods and arranged between the bottom plate and the lower heat radiation fins, deformation air bags are arranged in the positioning cylinders, the; two heat conducting clamping plates are arranged on the edges of two opposite sides of the lower connecting plate, upper radiating fins on two sides of the upper connecting plate are movably clamped between the two heat conducting clamping plates respectively to realize heat conduction, and the lower ends of the upper radiating fins are attached to the upper surface of the lower connecting plate.
2. A high efficiency LED light source heat sink structure as claimed in claim 1, wherein the circuit board is one of a rigid circuit board or a flexible circuit board.
3. The efficient LED light source heat dissipation structure as recited in claim 1, wherein a pricking pin for pricking the deformed air bag is installed in the positioning cylinder near the opening end, and the pricking pin is inclined from bottom to top towards the top rod.
4. The efficient LED light source heat dissipation structure as defined in claim 1, wherein the guide rod and the positioning cylinder are both disposed on the upper heat sink, and a guide rod is disposed at both ends of the two upper heat sinks at the edge of the upper connection plate; and the other upper radiating fins are provided with four positioning cylinders.
5. A high efficiency LED light source heat sink structure as recited in claim 1, wherein a solder layer is disposed on the bottom surface of the base plate.
6. The heat dissipation structure of any one of claims 1 to 5, wherein the bottom plate has a mounting groove at a position corresponding to the guide bar, the mounting groove has a positioning hole at a top surface, the lower end of the guide bar has a locking head with a diameter smaller than that of the guide bar, the locking head is inserted into the positioning hole, the lower end of the guide bar abuts against the top surface of the bottom plate, the locking head is connected with a locking nut by screw threads, and the locking nut is disposed in the mounting groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811058414.4A CN109373205B (en) | 2018-09-11 | 2018-09-11 | High-efficient LED light source heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811058414.4A CN109373205B (en) | 2018-09-11 | 2018-09-11 | High-efficient LED light source heat radiation structure |
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| CN109373205A CN109373205A (en) | 2019-02-22 |
| CN109373205B true CN109373205B (en) | 2020-05-22 |
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| CN201811058414.4A Active CN109373205B (en) | 2018-09-11 | 2018-09-11 | High-efficient LED light source heat radiation structure |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021231939A1 (en) * | 2020-05-14 | 2021-11-18 | Lumileds Llc | Dual function lighting device |
| CN112879815B (en) * | 2020-10-26 | 2023-01-31 | 深圳爱克莱特科技股份有限公司 | High heat conduction LED lamps and lanterns |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102287644A (en) * | 2011-07-28 | 2011-12-21 | 深圳市耐沃克科技有限公司 | High-power light-emitting diode (LED) lamp with double radiating mechanisms of heat conduction and convectional radiating |
| CN202266842U (en) * | 2011-04-28 | 2012-06-06 | 都江堰市华刚电子科技有限公司 | Light emitting diode (LED) illumination lamp with sealing structure |
| CN204664971U (en) * | 2015-06-10 | 2015-09-23 | 苏州睿绮电子有限公司 | A kind of thermal louver |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101520569A (en) * | 2008-02-29 | 2009-09-02 | 南京汉德森科技股份有限公司 | Power chip type LED light source for LCD backlight module |
| CN201688371U (en) * | 2010-05-26 | 2010-12-29 | 奉碧芸 | Heat emission structure of a luminous tube |
| CN203036591U (en) * | 2012-08-09 | 2013-07-03 | 陈建伟 | Power light emitting diode (LED) heat dissipation structure |
| CN203757501U (en) * | 2014-01-24 | 2014-08-06 | 张晓峰 | LED (Light Emitting Diode) lighting lamp |
| CN104896334B (en) * | 2015-06-10 | 2017-03-01 | 苏州睿绮电子有限公司 | A kind of thermal louver |
| US9869464B2 (en) * | 2015-09-23 | 2018-01-16 | Cooper Technologies Company | Hermetically-sealed light fixture for hazardous environments |
| CN206835538U (en) * | 2017-06-09 | 2018-01-02 | 上海斐讯数据通信技术有限公司 | A kind of electronic equipment for automatically adjusting radiating |
| CN208764897U (en) * | 2018-09-11 | 2019-04-19 | 天台天宇光电股份有限公司 | A kind of LED light source radiator structure |
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2018
- 2018-09-11 CN CN201811058414.4A patent/CN109373205B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202266842U (en) * | 2011-04-28 | 2012-06-06 | 都江堰市华刚电子科技有限公司 | Light emitting diode (LED) illumination lamp with sealing structure |
| CN102287644A (en) * | 2011-07-28 | 2011-12-21 | 深圳市耐沃克科技有限公司 | High-power light-emitting diode (LED) lamp with double radiating mechanisms of heat conduction and convectional radiating |
| CN204664971U (en) * | 2015-06-10 | 2015-09-23 | 苏州睿绮电子有限公司 | A kind of thermal louver |
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