CN109366255A - A kind of the microplasma burnishing device and method of metal surface - Google Patents
A kind of the microplasma burnishing device and method of metal surface Download PDFInfo
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- CN109366255A CN109366255A CN201811370684.9A CN201811370684A CN109366255A CN 109366255 A CN109366255 A CN 109366255A CN 201811370684 A CN201811370684 A CN 201811370684A CN 109366255 A CN109366255 A CN 109366255A
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- microplasma
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/002—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes using electric current
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Abstract
The invention belongs to metal material surfaces to process correlative technology field; it discloses the microplasma burnishing devices and method of a kind of metal surface; the device includes control assembly, surface profile survey meter, linkage mechanism, gas shield nozzle and plasma process rifle, and the surface profile survey meter and the linkage mechanism are connected to the control assembly；The gas shield nozzle is connected to the linkage mechanism, which is connected to the gas shield nozzle；After the completion of a upper polishing, the surface profile survey meter measures the surface profile of current polishing area, and obtained data are transferred to the control assembly, and then the best burnishing parameters for covering the convex stripe that upper scanning lap-joint generates are calculated in the control assembly, the control assembly controls plasma process rifle movement according to the best burnishing parameters to carry out next time polishing, thus overrides the convex stripe.The present invention improves the quality and polishing efficiency of polished surface, and is easy to use.
Description
Technical field
The invention belongs to metal material surfaces to process correlative technology field, more particularly, to a kind of the micro- of metal surface
Beam plasma burnishing device and method.
Background technique
The part obtained by increases material manufacturing technology, because surface generally can there are the metal bulky grain not being completely melt, tables
Surface roughness is larger.Processed using tradition machinery, such as use the methods of milling, electric spark, wire cutting acquisition metal parts with
And mold, equally there is the larger problem of surface roughness, use cannot be direct plungeed into.It can reduce gold by surface finish work technology
Metal surface roughness, traditional method for finishing surface are mostly to mechanically polish, inevitable to generate metal powder and form surface
Crackle, and the contacts such as electrobrightening and photochemical optical polishing polish the problems such as polluting generation environment.So seeking new table
Face method for fine finishing is extremely urgent.
High energy polishing has good development prospect as a kind of novel non-contact surface accurate processing technique.Currently, waiting
Ion beam has been successfully applied in metallic surface polishing, using high-purity Ar pneumoelectric from electric discharge tungsten electrode and anode material table
Plasma arc is formed between face.Under the effect of plasma arc high-energy density line, material surface metal reaches fusing point and melts,
Since surface to be treated is rough, the raised peak Jian Chu of rough surface melted by heat at first, on self gravity and surface
Under tension force effect, molten liquid fills up gully to recess flowing at first, and subsequent quick solidification is final to obtain smooth bright effect
Surface.
In plasma beam polishing process, liquid metal is formed under the collective effect of surface tension and hot capillary force in molten bath
Axisymmetric circulation, molten bath middle part liquid metal reaches boundary and is solidified under circulation effect, to form the two sides Rong Dao microprotrusion,
And plasma arc heat input is bigger, and protrusion is more obvious.Although local roughness is very low in the middle part of molten bath in this way, for entire
Roughness cannot be reduced to most perfect condition for burnishing surface.For that must use multiple tracks scanning that could complete the metal watch of polishing
For face, processing shows parallel ribbon striped.And the biggish metal works of initial roughness, and must use compared with high heat input
Carrying out multiple tracks scanning just can smooth irregular rough surface.Correspondingly, this field is preferable there is a kind of quality of finish is developed
Metal surface microplasma burnishing device and method technical need.
Summary of the invention
Aiming at the above defects or improvement requirements of the prior art, the present invention provides a kind of microplasmas of metal surface
Burnishing device and method, the polishing feature based on metal surface are studied and are devised and is a kind of using simple, quality of finish is preferable
Metal surface microplasma burnishing device and method.Existed based on previous all over plasma scanning when the burnishing device works
Lap-joint carries out next time scanning, and the parameters of Current Scan are that the data calculating obtained according to surface profile survey meter obtains
, such irregular rough surface of metal becomes regular ribbon grain surface after first pass plasma polishing process, with
Next convex stripe that upper polishing lap-joint will be covered all over polishing, the flat surface needed for obtaining improve polishing table afterwards
The quality in face, production efficiency is higher, and is easy to use.
To achieve the above object, according to one aspect of the present invention, the microplasma for providing a kind of metal surface is thrown
Electro-optical device, the burnishing device include that control assembly, surface profile survey meter, linkage mechanism, gas shield nozzle, plasma add
Work rifle and conductive workbench, the surface profile survey meter are connected to the control assembly；The linkage mechanism is connected to institute
Control assembly is stated, the gas shield nozzle is connected to the linkage mechanism, and the plasma process rifle is connected to the gas
Nozzle is protected, the conduction workbench is fixed on the lower section of the plasma process rifle, is used to carry polished metal work
Part；
Wherein, after the completion of upper one time polishing, the current polished metal work of the surface profile survey meter measurement
The surface profile of the polishing area of part, and obtained data are transferred to the control assembly, so the control assembly according to
Raised strip striped caused by scanning lap-joint when covering a upper polishing is calculated in Metal Surface Roughness and contour line
Best burnishing parameters, hereafter, the control assembly controls described in the linkage mechanism drives according to the best burnishing parameters
Plasma process rifle is moved to carry out next time polishing to the polished metal works, is thus override described band-like convex
Play striped.
Further, the burnishing device further includes minor arc DC power supply and the striking for being connected to the control assembly
High frequency electric source, the two sides of the plasma process rifle are connected with the positive and negative anodes of the striking high frequency electric source respectively, and described etc.
Ion processing rifle and the polished metal works are connected with the cathode of the minor arc DC power supply and anode respectively, described to lead
Electric workbench ground connection.
Further, the burnishing device further includes the gas flow controller for being connected to the control assembly, ionization gas
Gas cylinder and protection gas bottle, the ionization gas bottle and the protection gas bottle pass through the gas flow controller respectively with institute
It states plasma process rifle and the gas shield nozzle is connected.
Further, plasma minor arc is generated between the plasma process rifle and the polished metal works；It is described
Guide's arc is generated in plasma process rifle；The control assembly controls the scanning speed of the plasma process rifle, scanning simultaneously
Path, scanning height and scanning angle, the voltage and current of guide's arc, the plasma minor arc electric current, ionization gas and
It protects the gas flow rate of gas, send on time and rear stagnant time.
Further, the diameter of the plasma process rifle is 0.8mm.
Further, the diameter of the gas shield nozzle is 12mm.
Further, the running track of the plasma process rifle is unidirectional linear scanning path, Z-shaped linear scanning road
Diameter or Back Word type linear scanning path.
Further, next total power input used all over scanning is less than upper one time scanning total power input used, and
Next ratio all over scanning single track road width and upper one time scanning single track road width is 1:(4~8).
Other side according to the invention provides a kind of microplasma polishing method of metal surface, the polishing
Method the following steps are included:
(1) the microplasma burnishing device of metal surface as described above is provided, and polished metal works are placed
In on the conductive workbench, the burnishing device carries out first pass polishing to the polished metal works；
(2) the surface profile survey meter measures the surface profile of the polishing area of presently described polished metal works,
And the data measured are transferred to the control assembly, and then the control assembly is according to Metal Surface Roughness and contour line
The best burnishing parameters of raised strip striped caused by scanning lap-joint, thus described when upper one time polishing of covering is calculated
Burnishing device carries out the polished metal works according to the obtained best burnishing parameters next all over polishing；
(3) metal material for the polished metal works that the surface profile survey meter measurement is obtained through step (2)
Surface topography, and obtained data are transferred to the control assembly, and then the control assembly judges the polished metal
Whether the surface roughness of workpiece meets target call, if satisfied, then polishing terminates；Otherwise, step (2) are gone to.
It further, is 5L/min into the gas flow rate of the protection gas of the gas shield nozzle, sending on the time is
10s, rear stagnant time are 10s.
In general, through the invention it is contemplated above technical scheme is compared with the prior art, gold provided by the invention
The microplasma burnishing device and method of metal surface mainly have the advantages that
1. the control assembly controls the linkage mechanism according to the best burnishing parameters and drives the plasma process
Rifle is moved to carry out next time polishing to the polished metal works, is thus override the raised strip striped, is mentioned
The high quality and production efficiency of polished surface, and structure is simple, convenient for manufacture and uses.
2. the control assembly control simultaneously the scanning speed of the plasma process rifle, scan path, scanning height and
Scanning angle, the voltage and current of guide's arc, the electric current of the plasma minor arc, ionization gas and the gas stream for protecting gas
Speed sends on time and rear stagnant time, improves control integrated level.
3. sending on and the rear stagnant protection gas, it can be ensured that the success of the starting the arc, while continuing to prevent gold after polishing contact
Belong to the oxidation of tungsten needle inside the oxidation and the plasma process rifle of material surface.
4. the simple process of the polishing method can handle increasing material system of the surface roughness Ra between 1 μm~10 μm
The hardware or other roughing parts and mold of shape are caused, with strong applicability, flexibility is preferable.
Detailed description of the invention
Fig. 1 is that the microplasma burnishing device of metal surface provided by the invention is in the schematic diagram of use state.
Fig. 2 a is the unidirectional linear scanning path of the microplasma burnishing device first pass of the metal surface in Fig. 1
Schematic diagram.
The microplasma burnishing device of metal surface in Fig. 2 b Fig. 1 is carried out according to the unidirectional linear scanning path of first pass
Diagrammatic cross-section of the workpiece obtained after scanning along the direction 1-1.
Fig. 2 c is the unidirectional linear scanning path of microplasma burnishing device second time scanning of the metal surface in Fig. 1
Schematic diagram.
The microplasma burnishing device of metal surface in Fig. 2 d Fig. 1 is carried out according to second time unidirectional linear scanning path
Diagrammatic cross-section of the workpiece obtained after scanning along the direction 2-2.
Fig. 3 a is the Z-shaped linear scanning road of the microplasma burnishing device first pass of the metal surface in Fig. 1
The schematic diagram of diameter.
Fig. 3 b be the metal surface in Fig. 1 microplasma burnishing device according to the Z-shaped scan path in Fig. 3 a into
Diagrammatic cross-section of the workpiece obtained after row scanning along the direction 3-3.
Fig. 3 c is the Z-shaped linear scanning road of microplasma burnishing device second time scanning of the metal surface in Fig. 1
The schematic diagram of diameter.
Fig. 3 d be the metal surface in Fig. 1 microplasma burnishing device according to the Z-shaped scan path in Fig. 3 c into
Diagrammatic cross-section of the workpiece obtained after row scanning along the direction 4-4.
Fig. 4 a is the Back Word type linear scanning road of the microplasma burnishing device first pass of the metal surface in Fig. 1
The schematic diagram of diameter.
Fig. 4 b be the metal surface in Fig. 1 microplasma burnishing device according to the Back Word type scan path in Fig. 4 a into
Diagrammatic cross-section of the workpiece obtained after row scanning along the direction 5-5.
Fig. 4 c is the Back Word type linear scanning road of microplasma burnishing device second time scanning of the metal surface in Fig. 1
The schematic diagram of diameter.
Fig. 4 d be the metal surface in Fig. 1 microplasma burnishing device according to the Back Word type scan path in Fig. 4 c into
Diagrammatic cross-section of the workpiece obtained after row scanning along the direction 6-6.
In all the appended drawings, identical appended drawing reference is used to denote the same element or structure, in which: 1- surface profile is visited
Survey instrument, 2- plasma process rifle, 3- gas shield nozzle, 4- ionization gas bottle, 5- protection gas bottle, 6- control assembly, 7- connection
Motivation structure, 8- conduction workbench, the polished metal works of 9-, 10- gas flow controller, 11- minor arc DC power supply, 12-
Striking high frequency electric source.
Specific embodiment
In order to make the objectives, technical solutions, and advantages of the present invention clearer, with reference to the accompanying drawings and embodiments, right
The present invention is further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and
It is not used in the restriction present invention.As long as in addition, technical characteristic involved in the various embodiments of the present invention described below
Not constituting a conflict with each other can be combined with each other.
Referring to Fig. 1, the microplasma burnishing device of metal surface provided by the invention, described device includes surface wheel
Wide survey meter 1, plasma process rifle 2, gas shield nozzle 3, ionization gas bottle 4, protection gas bottle 5, control assembly 6, linkage
Mechanism 7, conductive workbench 8, gas flow controller 10, minor arc DC power supply 11 and striking high frequency electric source 12.The conduction
Workbench 8 is grounded, and is fixed motionless.The surface profile survey meter 1 is connected with the control assembly 6, the control
Component 6 is used to control the surface profile survey meter 1 and treats the surface profile of the polishing area progress of polishing metal workpiece 9 in real time
Measurement, the real-time data transmission that the surface profile survey meter 1 also will test give the control assembly 6, the control assembly 6
Every optimal parameter in polishing process is determined according to the data received.The linkage mechanism 7, the gas flow control
Device 10, the minor arc DC power supply 11 and the striking high frequency electric source 12 processed are connected to the control assembly 6, and the control
Component 6 processed controls the linkage mechanism 7, the gas flow controller 10, the minor arc DC power supply 11 respectively and described draws
Camber frequency power 12.The gas shield nozzle 3 is connected to one end of the linkage mechanism 7, and the plasma process rifle 2 connects
In the gas shield nozzle 3.The ionization gas bottle 4 and the protection gas bottle 5 are connected to the gas flow control
Device 10 processed.The two sides of the plasma process rifle 2 are connected with the positive and negative anodes of the striking high frequency electric source 12 respectively, and described etc.
Ion processing rifle 2 and the polished metal works 9 are connected with the cathode of the minor arc DC power supply 11 and anode respectively.Institute
State ionization gas bottle 4 and the protection gas bottle 5 by the gas flow controller 10 respectively with the plasma process rifle 2
And the gas shield nozzle 3 is connected, wherein the gas flow controller 10 is controlled by the control assembly 6.
The control assembly 6 controls the movement of the linkage mechanism 7, and the linkage mechanism 7 is for driving the plasma
The upper and lower and side-to-side movement of rifle 2 is processed, to adjust position of the plasma process rifle 2 relative to the polished metal works 9
It sets, that is, realizes vertical spacing between the plasma process rifle 2 and the surface of the polished metal works 9 and X-axis and Y
The movement of axis direction.In plasma polishing process, working height (the i.e. described plasma process rifle 2 and the polished metal
Vertical spacing between the surface of workpiece 9) ion beam form and Energy distribution are had a major impact, and transported in X-axis and Y direction
Dynamic scanning speed has a major impact polished surface pattern, and scanning speed is too fast to form fish scale on single-channel scanning track
Line causes surface roughness to increase.
In present embodiment, between the plasma process rifle 2 and the surface of the polished metal works 9 generate etc. from
Total high power of subarc process be no more than 250W, using when plasma beam polished metal surface to the magnitude of heat input, energy
Measured scaling loss and surface topography defect that senior general causes surface metal element.
It is golden in polishing process to prevent that the gas shield nozzle 3 and the protection gas bottle 5 collectively constitute protection component
The oxidation of metal surface.Wherein, the control assembly 6 sends commands to the gas flow controller 10, the gas flow control
Device 10 processed according to receive the order control protection gas send on and it is rear stagnant, and described in real-time control protect gas flow.
The success or not that will affect the starting the arc whether sending on of the protection gas, and rear stagnant can continue after polishing of the protection gas
Prevent the oxidation of the 2 inside tungsten needle of oxidation and the plasma process rifle of metal material surface.
The control assembly 6 can control the scanning speed of the plasma process rifle 2, scan path, scanning height simultaneously
Degree, scanning angle；The voltage and current of guide's arc；The electric current of plasma minor arc, is sent on the gas flow rate for ionizing gas and protecting gas
Time and rear stagnant time.Guide's arc generates in the plasma process rifle 2, the striking high frequency electric source 12 and the master
Arc DC power supply 11 is in parallel to help the plasma minor arc in the plasma process rifle 2 and the polished metal works 9
Surface between generate, be used for the surface polishing of the polished metal works 9.In present embodiment, the plasma adds
The diameter of work rifle 2 is equal to 0.8mm, and the diameter of the gas shield nozzle 3 is equal to 12mm.
When polishing using the burnishing device, the protective gas is opened to be cleaned with dry protective gas
Entire gas circuit；Then, the plasma gas is opened, the control assembly 6 controls the striking high frequency electric source 12 and generates elder generation
Arc is led, while the control assembly 6 obtains workpiece surface profile according to the surface profile survey meter 1 and calculates polishing most preferably
Parameter, and the plasma process rifle 2 is controlled according to the linear scanning path mode inputted and is moved to scan path starting point；Institute
It states striking high frequency electric source 12 and 11 parallel operation of minor arc DC power supply adds the plasma minor arc in the plasma
It is generated between work rifle 2 and the surface of the polished metal works 9.Then, according to input path and calculating gained optimal parameter
The flat scanning of first pass parallel track is carried out in workpiece surface, irregular bulky grain rough surface is formed by first pass
Regular parallel raised strip striated surface；After the completion of first pass polishing, the plasma process rifle 2 revert to homeposition, institute
Control assembly 6 is stated by the surface profile survey meter 1 to obtain polishing area surface profile, and calculates the polishing of high spot most
Good parameter, to carry out second time flat scanning of the protrusion that covering first pass generates, first pass formation rule is parallel
Ribbon grain surface size after second time scanning will reduce, and such as be actually needed, and repeatable above-mentioned steps carry out multipass and sweep
Processing is retouched, until the surface roughness needed.
The running track of the plasma process rifle 2 can be unidirectional linear scanning path, is also possible to Z-shaped straight line and sweeps
Path or Back Word type linear scanning path are retouched, wherein when can save required for polishing process using linear scanning track
Between, polishing efficiency is improved, large particulate matter or irregular track can be removed by microplasma scanning polishing, and multiple tracks is swept
There is raised phenomenon in lap-joint after retouching；It is related to total power input size to scan the bump sizes that lap-joint generates, it is total to input
The bump sizes of the bigger generation of power are bigger, and the surface roughness of the polished metal works 9 is bigger.In addition, total input work
Rate is bigger, and the pool width of generation is wider, and scanning next time is carried out all over scanning in lap-joint based on previous, scans next time
Every adjustable parameter be to be calculated according to the control assembly 6 by the obtained data of the surface profile survey meter 1 detection
It arrives.
Next total power input used all over scanning always than upper one time used in total power input it is small, it is next all over scanning single track
The ratio of road width and upper one time scanning single track road width is 1:(4~8).A upper single-channel scanning terminates terminal, the minor arc direct current
Power supply 11 is closed, and the plasma minor arc disappears, and the striking high frequency electric source 12 keeps work, until the plasma process rifle
2 are moved to the starting point that next single-channel scanning starts, and the minor arc DC power supply 11 is again turned on, and the plasma minor arc is again
It is generated between the plasma process rifle 2 and the surface of the polished metal works 9.It is obtained by rapid prototyping technology
Metallic article or other roughing parts and mold, the irregular bulky grain on surface or irregular track are by first pass etc.
It will be melted after ion polishing process, subsequent second time polishing will cover the convex portion of first pass polishing lap-joint, repeat and walk
Suddenly until obtaining flat surface.
The burnishing device can handle the metal knot of increasing material manufacturing forming of the surface roughness Ra between 1 μm~10 μm
Component or other roughing parts and mold.It is low with general power by using the plasma process rifle 2 that diameter is 0.8mm
Linear scanning polishing has been carried out in the plasma arc of 250W, high spot is overlapped by multiple scanning, it is thick constantly to reduce metal surface
Rugosity, the higher metallic article of initial roughness reach identical final mesh relative to the lower metallic article of initial roughness
It is more to mark repetition polishing number required for roughness.When roughness Ra is higher, need bigger heat input could melt compared with
High surface bulge and particulate matter, it is also wider to be formed by molten bath, can complete under short period and relatively short stroke big
Area polishing.After first pass polishes, metal surface has become more flat and smooth, but there is regular raised strip item
Line influences integral planar roughness size, and after carrying out second time polishing covering first pass polishing protrusion, first pass is formed
Height of projection will greatly reduce, it will obtain more flat and smooth plane.After twice of polishing process, it can satisfy big
Most metallic article surface roughness requirements, surface roughness can be further decreased by repeating polishing number, thick to surface at present
The hardware or other roughing parts and mold of increasing material manufacturing forming of the rugosity Ra between 1 μm~10 μm are thrown
Light, roughness of polished can achieve 0.1 μm, but continue to repeat to polish that after reaching 0.1 μm, surface will be increased to a certain degree
Roughness, increased surface roughness can reach 0.4 μm.The metallic article for being 10um relative to initial surface roughness Ra, work
Part surface roughness, which is reduced to 0.1 μm, means that roughness reduces 99%.
The present invention also provides the microplasma polishing method of metal surface, which mainly includes following step
It is rapid:
Step 1, provides the microplasma burnishing device of metal surface as described above, and by polished metal works
It is placed on the conductive workbench, the burnishing device carries out first pass polishing to the polished metal works.
Specifically, the surface profile survey meter 1 measures the surface topography of original material, and the data measured are transferred to
The control assembly 6.The control assembly 6, which calculates first pass polishing process according to Metal Surface Roughness and contour line, to be made
The scanning speed of the plasma process rifle 2, scan path, scanning height, scanning angle, plasma minor arc electric current,
The technological parameters such as voltage and current of ionizing air speed, guide's arc.Meanwhile the control assembly 6 joins the technique being calculated
Number together with the motion profile mode that is manually entered and to protect the gas flow rates of gas be 5L/min, sends on the time be 10s, be rear stagnant when
Between for the technological parameters such as 10s be respectively transmitted to the linkage mechanism 7, the minor arc DC power supply 11 and gas flow control
Device 10.
The gas flow controller 10 sends on dry-run protection gas nitrogen cleaning gas circuit, and sends on ionization gas high-purity argon gas,
The striking high frequency electric source 12 is opened, and guide's arc generates inside the plasma process rifle 2.Later, the linkage mechanism 7 is pressed
According to the starting for calculating resulting scanning height and scanning angle drives the plasma process rifle 2 to be moved to selected polishing area
Point.Then, the minor arc DC power supply 11 works, and plasma minor arc is in the plasma process rifle 2 and the polished metal
It is generated between the surface of workpiece 9.According to optimal computed experiment parameter, the linkage mechanism 7 drives the plasma process rifle 2 to press
Plane motion is carried out according to the scanning trajectory model of input, as shown in Fig. 2 a, Fig. 3 a and Fig. 4 a, gray shade line indicates this in figure
The secondary also non-zone of action of scanning；Relative smooth surface (as shown in Fig. 2 b, Fig. 3 b and Fig. 4 b) is obtained after completing first pass polishing,
The minor arc DC power supply 11 stops working, and the plasma process rifle 2 automatically returns to starting point.
The corresponding plane motion in the unidirectional linear scanning track, when terminating to reach single track final on trajectory when time single-channel scanning
When, the minor arc DC power supply 11 stops working, and it is next single that the linkage mechanism 7 drives the plasma process rifle 2 to move to
Road sweep starting point, the minor arc DC power supply 11 start again at work, and solid arrow as shown in Figure 2 a represents the minor arc direct current
For the plasma process rifle 2 according to arrow direction, dotted arrow represents the minor arc direct current under 11 working condition of power supply
The plasma process rifle 2 is according to arrow direction under 11 stop working state of source；The font linear scanning track " Z " is flat
Face movement, when end is when secondary single-channel scanning reaches single track final on trajectory, the minor arc DC power supply 11 stops working, described
Motivation structure 7 drives the plasma process rifle 2 to move to next single-channel scanning starting point, and the minor arc DC power supply 11 starts again at
Work, solid arrow as shown in Figure 3a represent under 11 working condition of minor arc DC power supply the plasma process rifle 2 according to
Arrow direction, dotted arrow represent under 11 stop working state of minor arc DC power supply the plasma process rifle 2 by
According to arrow direction；The Back Word type linear scanning trajectory plane movement reaches single track rail when terminating first time single-channel scanning
When mark terminal, the minor arc DC power supply 11 stops working, and the linkage mechanism 7 drives the plasma process rifle 2 to move to
Second of single-channel scanning starting point, the minor arc DC power supply 11 start again at work, as shown in fig. 4 a described in solid arrow representative
For the plasma process rifle 2 according to arrow direction, dotted arrow represents the master under 11 working condition of minor arc DC power supply
The plasma process rifle 2 is according to arrow direction under 11 stop working state of arc DC power supply, from the of first pass
Two single-channel scanning starting points terminate terminal to first pass, and the minor arc DC power supply 11 remains working condition, described etc.
Ion processes rifle 2 according to arrow direction.Finally, the polished metal works 9 are placed in the conductive workbench
Upper cooling 1min.
Step 2, the surface profile of polishing area of the surface profile survey meter measurement after upper one time polishing, and
The data measured are transferred to the control assembly, and then the control assembly is according to Metal Surface Roughness and contour line meter
The best burnishing parameters of raised strip striped caused by scanning lap-joint when obtaining covering a polishing are calculated, thus the dress
It sets and next time polishing is carried out to the polished metal works 9 according to the obtained best burnishing parameters.
Specifically, the surface profile survey meter 1 measures the polished metal works 9 after first pass polishes
Metal material surface pattern, and obtained data are transferred to the control assembly 6, and then the control assembly 6 is according to reception
To Metal Surface Roughness and contour line calculate sweeping for the plasma process rifle 2 used in second time polishing process
Retouch speed, scan path, scanning height, scanning angle, plasma minor arc electric current, ionizing air speed, guide's arc voltage and electricity
The technological parameters such as stream.The control assembly 6 by the technological parameter being calculated together with the motion profile mode being manually entered and
The gas flow rate of protection gas is 5L/min, to send on the time be 10s, the rear stagnant time is that the parameters such as 10s are respectively transmitted to the linkage
Mechanism 7, the minor arc DC power supply 11 and the gas flow controller 10.
The linkage mechanism 7 is transported according to calculating gained scanning height and the mobile plasma process rifle 2 of scanning angle
Move the starting point that generated elevated regions are polished by first pass.The minor arc DC power supply 11 works, the plasma
Minor arc generates between the plasma process rifle 2 and 9 surface of polished metal works.
According to Optimal calculation experiment parameter, the linkage mechanism 7 drives the plasma process rifle 2 to scan rail according to input
Mark mode carries out plane motion, and (as shown in Fig. 2 c, Fig. 3 c and Fig. 4 c, gray shade line indicates this time also non-active region of scanning
Domain) with cover first pass polishing generate protrusion, complete second time polishing after obtain smooth surface (such as Fig. 2 d, Fig. 3 d and
Shown in Fig. 4 d), the minor arc DC power supply 11 stops working, and the plasma process rifle 2 automatically returns to starting point.
The plane motion of the unidirectional linear scanning track, when terminate when secondary single-channel scanning reach single track final on trajectory when,
The minor arc DC power supply 11 stops working, and the linkage mechanism 7 drives the plasma process rifle 2 to move to next single track and sweeps
Starting point is retouched, the minor arc DC power supply 11 starts again at work, and solid arrow as shown in Figure 2 c represents the minor arc DC power supply
For the plasma process rifle 2 according to arrow direction, dotted arrow represents the minor arc DC power supply 11 under 11 working conditions
The plasma process rifle 2 is according to arrow direction under stop working state；" Z " the font linear scanning trajectory plane fortune
Dynamic, when end is when secondary single-channel scanning reaches single track final on trajectory, the minor arc DC power supply 11 stops working, the gear
Structure 7 drives the plasma process rifle 2 to move to next single-channel scanning starting point, and the minor arc DC power supply 11 starts again at work
Make, solid arrow as shown in Figure 3c represents under 11 working condition of minor arc DC power supply the plasma process rifle 2 according to arrow
The movement of head direction, dotted arrow represent under 11 stop working state of minor arc DC power supply the plasma process rifle 2 according to
Arrow direction；The Back Word type linear scanning trajectory plane movement, it is straight to represent the minor arc for solid arrow as illustrated in fig. 4 c
The plasma process rifle 2 is protected always according to arrow direction, the minor arc DC power supply 11 under 11 working condition of galvanic electricity source
Hold working condition.Cooling 1min on the conductive workbench 8 is placed in the polishing metal workpiece 9.
Step 3, the metal material for the polished metal works that the surface profile survey meter measurement is obtained through step 2
Expect surface topography, and obtained data is transferred to the control assembly, and then the control assembly judges the polished gold
Whether the surface roughness of metal work-pieces meets target call, if satisfied, then polishing terminates；Otherwise, step 2 is gone to.
Specifically, the surface profile survey meter 1 measures the polished metal works 9 after second time polishing
Metal material surface pattern, and obtained data are transferred to the control assembly 6, and then the control assembly 6 is according to receiving
To Metal Surface Roughness judge whether the surface roughness of the polished metal works 9 meets target call, if not having
Have, then goes to step 2；Otherwise, polishing terminates.Wherein, the increasing material manufacturing to surface roughness Ra between 1 μm~10 μm at
The hardware of shape or other roughing parts and mold are polished, and roughness of polished can achieve 0.1 μm.
The microplasma burnishing device and method of metal surface provided by the invention, after carrying out first time polishing, gold
Metal surface becomes more smooth smooth, but there are raised strip stripeds, influence integral planar roughness size, then carry out second
After secondary polishing is to cover the protrusion that first pass polishing generates, the height that first pass polishing is formed by protrusion will be greatly reduced, such as
This available more flat and smooth plane, improves quality of finish and efficiency, flexibility is higher, and easy to use.
As it will be easily appreciated by one skilled in the art that the foregoing is merely illustrative of the preferred embodiments of the present invention, not to
The limitation present invention, any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should all include
Within protection scope of the present invention.
Claims (10)
1. a kind of microplasma burnishing device of metal surface, it is characterised in that:
The burnishing device includes control assembly, surface profile survey meter, linkage mechanism, gas shield nozzle, plasma process
Rifle and conductive workbench, the surface profile survey meter are connected to the control assembly；The linkage mechanism is connected to described
Control assembly, the gas shield nozzle are connected to the linkage mechanism, and the plasma process rifle is connected to the gas and protects
Nozzle is protected, the conduction workbench is fixed on the lower section of the plasma process rifle, is used to carry polished metal works；
Wherein, after the completion of upper one time polishing, the current polished metal works of the surface profile survey meter measurement
The surface profile of polishing area, and obtained data are transferred to the control assembly, and then the control assembly is according to metal
Surface roughness and contour line are calculated when covering a upper polishing and scan raised strip striped caused by lap-joint most
Good burnishing parameters；Hereafter, the control assembly according to the best burnishing parameters control the linkage mechanism drive it is described it is equal from
Son processing rifle is moved to carry out next time polishing to the polished metal works, and the raised strip item is thus override
Line.
2. the microplasma burnishing device of metal surface as described in claim 1, it is characterised in that: the burnishing device is also
Minor arc DC power supply and striking high frequency electric source including being connected to the control assembly, the two sides of the plasma process rifle
It is connected respectively with the positive and negative anodes of the striking high frequency electric source, and the plasma process rifle and the polished metal works point
It is not connected with the cathode of the minor arc DC power supply and anode, the conduction workbench ground connection.
3. the microplasma burnishing device of metal surface as described in claim 1, it is characterised in that: the burnishing device is also
Gas flow controller, ionization gas bottle and protection gas bottle including being connected to the control assembly, the ionization gas bottle
And the protection gas bottle is sprayed with the plasma process rifle and the gas shield respectively by the gas flow controller
Mouth is connected.
4. the microplasma burnishing device of metal surface as described in claim 1, it is characterised in that: the plasma process
Plasma minor arc is generated between rifle and the polished metal works；Guide's arc is generated in the plasma process rifle；The control
Component processed controls scanning speed, scan path, scanning height and the scanning angle of the plasma process rifle, the guide simultaneously
The voltage and current of arc, the plasma minor arc electric current, ionization gas and protect gas gas flow rate, send on the time and it is rear stagnant when
Between.
5. the microplasma burnishing device of metal surface as described in claim 1, it is characterised in that: the plasma process
The diameter of rifle is 0.8mm.
6. the microplasma burnishing device of metal surface as described in claim 1, it is characterised in that: the gas shield spray
The diameter of mouth is 12mm.
7. the microplasma burnishing device of metal surface as claimed in any one of claims 1 to 6, it is characterised in that: described etc.
The running track that ion processes rifle is unidirectional linear scanning path, Z-shaped linear scanning path or Back Word type linear scanning road
Diameter.
8. the microplasma burnishing device of metal surface as claimed in any one of claims 1 to 6, it is characterised in that: next time
Scanning total power input used is less than upper one time scanning total power input used, and next all over scanning single track road width and upper one
Ratio all over scanning single track road width is 1:(4~8).
9. a kind of microplasma polishing method of metal surface, which is characterized in that the polishing method the following steps are included:
(1) the microplasma burnishing device of the described in any item metal surfaces claim 1-8 is provided, and by polished metal
Workpiece is placed on the conductive workbench, and the burnishing device carries out first pass polishing to the polished metal works；
(2) the surface profile survey meter measures the surface profile of the polishing area of presently described polished metal works, and will
The data measured are transferred to the control assembly, and then the control assembly is according to Metal Surface Roughness and profile line computation
A best burnishing parameters when polishing at raised strip striped caused by scanning lap-joint are obtained, thus the polishing dress
It sets and next time polishing is carried out to the polished metal works according to the obtained best burnishing parameters；
(3) metal material surface for the polished metal works that the surface profile survey meter measurement is obtained through step (2)
Pattern, and obtained data are transferred to the control assembly, and then the control assembly judges the polished metal works
Surface roughness whether meet target call, if satisfied, then polishing terminate；Otherwise, step (2) are gone to.
10. the microplasma polishing method of metal surface as claimed in claim 9, it is characterised in that: enter the gas
The gas flow rate for protecting the protection gas of nozzle is 5L/min, and sending on the time is 10s, and the rear stagnant time is 10s.
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| CN114102398A (en) * | 2021-12-02 | 2022-03-01 | 江咏梅 | Polishing equipment for treating surface oxide layer of metal plate |
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