CN109338434A - Room temperature is without nickel hole sealing agent - Google Patents
Room temperature is without nickel hole sealing agent Download PDFInfo
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- CN109338434A CN109338434A CN201811431113.1A CN201811431113A CN109338434A CN 109338434 A CN109338434 A CN 109338434A CN 201811431113 A CN201811431113 A CN 201811431113A CN 109338434 A CN109338434 A CN 109338434A
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- room temperature
- sealing agent
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- hole sealing
- nickel
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/18—After-treatment, e.g. pore-sealing
- C25D11/24—Chemical after-treatment
- C25D11/246—Chemical after-treatment for sealing layers
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- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
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- Organic Chemistry (AREA)
- Sealing Material Composition (AREA)
Abstract
The invention discloses a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, and the room temperature includes following component without nickel hole sealing agent: lithium salts 20-40%, pH buffer 6-15%, sealing of hole promotor 0.2-1%, deionized water surplus.Sealing of hole operation can be carried out under room temperature of the present invention, not only saves the energy, but also sealing of hole speed is fast, and high-efficient, sealing effect is good, does not generate bloom；Material surface after sealing of hole is smooth, ashless, corrosion resistance is strong.Under the premise of guaranteeing that various performances can reach national standard, sealing of hole ash will not be generated, to eliminate the adverse effect that sealing of hole ash finally uses product.The present invention not heavy metallic salts such as nickel and cobalt containing, safety and environmental protection, comply fully with European Union's rohs standard, and the Toxics such as treatment fluid is nickeliferous, cobalt or other heavy metals, waste water is nontoxic, can be widely used for the fields such as building, furniture, 3C household electrical appliances.
Description
Technical field
The present invention relates to the chemically treated technical fields of metal material surface, more particularly to a kind of pair of Process on Aluminum Alloy Oxidation Film
Layer carries out the room temperature of sealing pores without nickel hole sealing agent.
Background technique
Light metal material, such as aluminium, magnesium, zinc, titanium, aluminium alloy, magnesium alloy, kirsite and titanium alloy etc. have density
Small, conductive and heat-conductive ability is strong, excellent in mechanical performance and can secondary operation the advantages that, therefore obtained in national economy extensive
Using.But light metal material is generally easily corroded, therefore in order to preferably utilize light metal material, it usually need to be to light gold
Belong to material be surface-treated to avoid light metal material from being corroded, at present using it is more be to light metal material progress anode
Oxidation.
Currently, aluminium and its alloy generally use anodized surface guard technology, formed centainly in aluminium and its alloy surface
The oxidation film of thickness, since there are a large amount of micropores for the surface of oxidation film, it is necessary to carry out Seal treatment appropriate, common closing side
Method mainly has boiling water or high-temperature steam hole sealing technology, calcium and magnesium salt hole sealing technology, nickel salt closing, macromolecule resin closing.Boiling water or
The principle of high-temperature steam hole sealing technology is simple, and the closed process of film is exactly the hydro-combination process of aluminium oxide, and operation temperature is closing speed
The major control factors of degree, water quality also can significant impact close membrane appearance and speed in a closed circuit, excessive calcium ions and magnesium ions can make hole
There is spot and closing ash in film；Common nickel salt sealer is containing Ni2+, F- to human body and the toxic effect of environment, the amount of dissolution
Stringent limitation by regulations such as European Union's 94/27/EEC nickel instructions；The molecular volume of macromolecule resin is too big, can not diffuse into
Pore interior realizes good closed performance.
Therefore it provides a kind of room temperature of energy-efficient, asepsis environment-protecting green aluminium alloy is without nickel hole sealing agent sealing technique
It is highly desirable.
Summary of the invention
In order to solve the above-mentioned technical problem, one aspect of the present invention provides a kind of room temperature without nickel hole sealing agent, by quality percentage
Than calculating, the room temperature includes following component without nickel hole sealing agent: lithium salts 20-40%, pH buffer 6-15%, sealing of hole promotor
0.2-1%, deionized water surplus.
As a kind of perferred technical scheme, it is calculated by mass percentage, the room temperature further includes 2-4% without nickel hole sealing agent
Component D, the component D is polyethylene glycol and/or acrylic resin.
As a kind of perferred technical scheme, the lithium salts is lithium acetate and/or lithium sulfate.
As a kind of perferred technical scheme, the lithium salts is the composition of lithium acetate and lithium sulfate, corresponding parts by weight
Than for 1:(0.8-1.5).
As a kind of perferred technical scheme, the pH buffer is organic acid and/or acylate.
As a kind of perferred technical scheme, the organic acid be selected from acetic acid, succinic acid, fumaric acid, malic acid, oxalic acid,
One or more of lactic acid, citric acid, boric acid, malonic acid, the acylate are selected from ammonium salt, lithium salts, the magnesium salts of organic acid
One or more of.
As a kind of perferred technical scheme, the component D is the composition of polyethylene glycol and acrylic resin, accordingly
Weight part ratio is 1:(1-3).
As a kind of perferred technical scheme, the component D is the composition of polyethylene glycol and acrylic resin, accordingly
Weight part ratio is 1.1:1.8.
As a kind of perferred technical scheme, the molecular weight of the polyethylene glycol is 300-900.
As a kind of perferred technical scheme, the sealing of hole promotor is aerosol-OT salt and/or front three
Base glycine.
Compared with prior art, the invention has the benefit that the present invention contains unique sealing of hole substance, stabilizer, envelope
Hole promotor etc. can carry out sealing of hole operation under room temperature, not only save the energy, but also sealing of hole speed is fast, high-efficient, sealing effect
It is good, bloom is not generated, and closing does not change original color, and is not easy to fade；Material surface after sealing of hole is smooth, ashless, corrosion-resistant
Property it is strong, decoloration is few, and fixation power is strong, places do not lose color for a long time.It can reach the premise of national standard in the various performances of guarantee
Under, sealing of hole ash will not be generated, to eliminate the adverse effect that sealing of hole ash finally uses product.
The present invention not heavy metallic salts such as nickel and cobalt containing, safety and environmental protection, comply fully with European Union's rohs standard, treatment fluid is nickeliferous,
The Toxics such as cobalt or other heavy metals, waste water is nontoxic, can be widely used for the fields such as building, furniture, 3C household electrical appliances.
Specific embodiment
The detailed description for preferred implementation method of the invention below of participating in the election of and including embodiment this hair can be more easily to understand
Bright content.Unless otherwise defined, all technologies used herein and scientific term have common with fields of the present invention
The normally understood identical meaning of technical staff.When there is a conflict, the definition in this specification shall prevail.
For the purpose of following detailed description, it should be understood that the present invention can be used various substitutions variation and step it is suitable
Sequence, unless specifically stated on the contrary.In addition, being indicated in the case where in addition in any operational instances or otherwise pointing out
Such as all numbers of the amount of ingredient used in description and claims should be understood in all cases by term
" about " it modifies.Therefore, unless indicated to the contrary, the numerical parameter otherwise illustrated in the following description and appended dependent claims is root
The approximation changed according to the expected performance of the invention to be obtained.It is at least not intended to for the applicable of doctrine of equivalents being limited in
In the scope of the claims, each numerical parameter should at least be given up according to the number of the effective digital of report and by the way that application is common
Enter technology to explain.
Although illustrating that broad range of numberical range and parameter of the invention are approximations, listed in specific example
Numerical value is reported as accurately as possible.However, any numerical value inherently includes the standard deviation by finding in its each self-test measurement
The certain errors necessarily led to.
When a numberical range disclosed herein, above range is considered as continuously, and the minimum value including the range and most
Big value and each value between this minimum value and maximum value.Further, when range refers to integer, including the model
Each integer between minimum value and maximum value enclosed.In addition, when providing multiple range Expressive Features or characteristic, Ke Yihe
And the range.In other words, unless otherwise specified, otherwise all ranges disclosed herein are understood to include and are wherein included into
Any and all subrange.For example, should be regarded as including between minimum value 1 and maximum value 10 from the specified range of " 1 to 10 "
Any and all subrange.The Exemplary range of range 1 to 10 include but is not limited to 1 to 6.1,3.5 to 7.8,5.5 to
10 etc..
The present invention provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, and the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 20-40%, pH buffer 6-15%, sealing of hole promotor 0.2-1%, deionized water surplus.
As a kind of perferred technical scheme, it is calculated by mass percentage, the room temperature further includes 2-4% without nickel hole sealing agent
Component D, the component D is polyethylene glycol and/or acrylic resin.
As a kind of perferred technical scheme, the lithium salts is lithium acetate and/or lithium sulfate.
As a kind of perferred technical scheme, the lithium salts is the composition of lithium acetate and lithium sulfate, corresponding parts by weight
Than for 1:(0.8-1.5).
As a kind of perferred technical scheme, the pH buffer is selected from one of organic acid or acylate or more
Kind.
As a kind of perferred technical scheme, the organic acid be selected from acetic acid, succinic acid, fumaric acid, malic acid, oxalic acid,
One or more of lactic acid, citric acid, boric acid, malonic acid, the acylate are selected from ammonium salt, lithium salts, the magnesium salts of organic acid
One or more of.
As a kind of perferred technical scheme, the component D is the composition of polyethylene glycol and acrylic resin, accordingly
Weight part ratio is 1:(1-3).
As a kind of perferred technical scheme, the component D is the composition of polyethylene glycol and acrylic resin, accordingly
Weight part ratio is 1.1:1.8.
As a kind of perferred technical scheme, the molecular weight of the polyethylene glycol is 300-900.
As a kind of perferred technical scheme, the sealing of hole promotor is aerosol-OT salt and/or front three
Base glycine.
As a kind of perferred technical scheme, the sealing of hole promotor is that aerosol-OT salt and trimethyl are sweet
The composition of propylhomoserin, corresponding weight part ratio are 1:(1-1.5).
Another aspect of the present invention additionally provides preparation method of the room temperature without nickel hole sealing agent, comprising the following steps:
(1) lithium salts, sealing of hole promotor are mixed, deionized water is added and stirs evenly, obtains solution；
(2) component D is added in above-mentioned solution, stirs 1-1.5h under the conditions of 250-300r/min, obtain mixing molten
Liquid；
(3) above-mentioned mixed solution is added in pH buffer, is stirred to react 2.5-3h at 30-35 DEG C, obtain room temperature without nickel
Hole sealing agent.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, includes the following steps:
(1) aluminum alloy base material after anodic oxidation is immersed without in nickel hole sealing agent, use ratio 20-40g/L, sealing of hole speed
Degree is 1-1.5 μm/min；
(2) the resulting aluminum alloy base material hole sealing agent remained on surface impregnated through no nickel hole sealing agent of step (1) is subjected to water
It washes, dries up, packs after flushing.
Lithium salts
In the application, the lithium salts is lithium acetate and/or lithium sulfate；Preferably, the lithium salts is lithium acetate and lithium sulfate
Composition, corresponding weight part ratio be 1:(0.8-1.5).Lithium acetate, molecular formula CH3COOLi, colourless crystallization have deliquescence
Property, it is dissolved in water and alcohol.Lithium sulfate, molecular formula Li2SO4, colourless monoclinic crystal or white crystals sprills are dissolved in water, do not dissolve in
Acetone and dehydrated alcohol.
Inventors have found that good closure may be implemented in the pore interior that the lithium salts in the application diffuses into oxidation film
Can so that not only there is excellent corrosion resistance, heat resistance, salt fog resistance by sealing of hole object, while have good wearability and
Antioxygenic property.Inventor also found by long-term research, in the application, when the weight ratio of lithium acetate and lithium sulfate is 1:
(0.8-1.5), especially 1:1.35, at the same sealing of hole promotor be aerosol-OT salt, trimethylglycine it is mixed
When closing object, the application there is extraordinary closed performance can be improved aluminium alloy when sealing of hole aluminium alloy 6061
6061 sealing effect.Inventor's supposition, the possible reason is: aluminium alloy 6061, relative to aluminium alloy 6063, magnesium and silicon
Content it is higher, form Mg in the alloy2Si phase, lithium acetate and lithium sulfate are in specific weight ratio, in sulfosuccinate two
Under the action of monooctyl ester sodium salt, trimethylglycine, can and Mg2Si phase generation effect, refines crystal grain, improves hardening effect.
But inventors have found that it is applied to aluminium alloy 6061 when the weight ratio of lithium acetate and lithium sulfate is 1:1.35 and is easy
The phenomenon of ash is caused.
PH buffer
In the application, due to the sulfuric acid of oxidation trough apply at the scene in can take a part of tank liquor out of into sealing of hole slot, pH is slow
The effect of electuary is to stablize sealing of hole slot PH in 5.5-8.5.The pH buffer is selected from one of organic acid or acylate
Or it is a variety of；Preferably, the organic acid be selected from acetic acid, succinic acid, fumaric acid, malic acid, oxalic acid, lactic acid, citric acid, boric acid,
One or more of malonic acid, the acylate are selected from one or more of ammonium salt, lithium salts, magnesium salts of organic acid；It is excellent
Choosing, the pH buffer is ammonium acetate.
Component D
In the application, the component D is polyethylene glycol and/or acrylic resin；Preferably, the component D is poly- second two
The composition of pure and mild acrylic resin, corresponding weight part ratio are 1:(1-3)；Preferably, the molecular weight of the polyethylene glycol is
300-900。
Inventors have found that in the application, when the composition that the component D is polyethylene glycol and acrylic resin, especially
When Macrogol 600 and acrylic resin are combined with weight ratio for 1.1:1.8, the production of sealing of hole ash can be substantially reduced
It is raw.Inventor speculates, due to containing more alloying element in aluminium alloy 6061, be easy to make lithium acetate and lithium sulfate it is excessive into
The pore interior for entering oxidation film, causes dusting.Inventor speculates that the weight ratio of Macrogol 600 and acrylic resin is
When 1.1:1.8, it can be adsorbed on the surface of anode oxide film in a manner of combine adsorption without entering inside micropore, not only will not
The deposition of lithium is influenced, and substantially reduces the generation of sealing of hole ash.
The present invention is specifically described below by embodiment.It is necessarily pointed out that following embodiment is only used
In the invention will be further described, it should not be understood as limiting the scope of the invention, professional and technical personnel in the field
The some nonessential modifications and adaptations made according to the content of aforementioned present invention, still fall within protection scope of the present invention.
In addition, if without other explanations, it is raw materials used to be all commercially available.Such as acrylic resin is purchased from Mitsubishi,
Model BR113.
Embodiment
Embodiment 1
Embodiment 1 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 30%, pH buffer 10%, sealing of hole promotor 0.6%, deionized water surplus.
The room temperature further includes 3% component D without nickel hole sealing agent.
Wherein, the lithium salts is the composition of lithium acetate and lithium sulfate, and corresponding weight part ratio is 1:1.35；The pH is slow
Electuary is ammonium acetate；The sealing of hole promotor is the composition of aerosol-OT salt and trimethylglycine, accordingly
Weight part ratio be 1:1；The component D is the composition of Macrogol 600 and acrylic resin, and corresponding weight part ratio is
1.1:1.8；The acrylic resin is purchased from Mitsubishi, model BR113.
On the other hand the present embodiment additionally provides preparation method of the room temperature without nickel hole sealing agent, comprising the following steps:
(1) lithium salts, sealing of hole promotor are mixed, deionized water is added and stirs evenly, obtains solution；
(2) component D is added in above-mentioned solution, stirs 1h under the conditions of 250r/min, obtains mixed solution；
(3) above-mentioned mixed solution is added in pH buffer, is stirred to react 2.5h at 30 DEG C, obtain room temperature without nickel sealing of hole
Agent.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, includes the following steps:
(1) aluminum alloy base material after anodic oxidation is immersed without in nickel hole sealing agent, use ratio 30g/L, sealing of hole speed
For 1.3 μm/min；
(2) the resulting aluminum alloy base material hole sealing agent remained on surface impregnated through no nickel hole sealing agent of step (1) is subjected to water
It washes, is dried up after flushing.
Embodiment 2
Embodiment 2 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 20%, pH buffer 6%, sealing of hole promotor 0.2%, deionized water surplus.
The room temperature further includes 2% component D without nickel hole sealing agent.
Wherein, the lithium salts is the composition of lithium acetate and lithium sulfate, and corresponding weight part ratio is 1:1.35；The pH is slow
Electuary is ammonium acetate；The sealing of hole promotor is the composition of aerosol-OT salt and trimethylglycine, accordingly
Weight part ratio be 1:1；The component D is the composition of Macrogol 600 and acrylic resin, and corresponding weight part ratio is
1.1:1.8；The acrylic resin is purchased from Mitsubishi, model BR113.
On the other hand the present embodiment additionally provides preparation method of the room temperature without nickel hole sealing agent, with embodiment 1.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, with embodiment 1.
Embodiment 3
Embodiment 3 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 30%, pH buffer 10%, sealing of hole promotor 0.6%, deionized water surplus.
The room temperature further includes 3% component D without nickel hole sealing agent.
Wherein, the lithium salts is lithium acetate；The pH buffer is ammonium acetate；The sealing of hole promotor is sulfosuccinate
The composition of dioctyl ester sodium salt and trimethylglycine, corresponding weight part ratio are 1:1；The component D be Macrogol 600 and
The composition of acrylic resin, corresponding weight part ratio are 1.1:1.8；The acrylic resin is purchased from Mitsubishi, model
BR113。
On the other hand the present embodiment additionally provides preparation method of the room temperature without nickel hole sealing agent, with embodiment 1.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, with embodiment 1.
Embodiment 4
Embodiment 4 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 30%, pH buffer 10%, sealing of hole promotor 0.6%, deionized water surplus.
The room temperature further includes 3% component D without nickel hole sealing agent.
Wherein, the lithium salts is lithium sulfate；The pH buffer is ammonium acetate；The sealing of hole promotor is sulfosuccinate
The composition of dioctyl ester sodium salt and trimethylglycine, corresponding weight part ratio are 1:1；The component D be Macrogol 600 and
The composition of acrylic resin, corresponding weight part ratio are 1.1:1.8；The acrylic resin is purchased from Mitsubishi, model
BR113。
On the other hand the present embodiment additionally provides preparation method of the room temperature without nickel hole sealing agent, with embodiment 1.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, with embodiment 1.
Embodiment 5
Embodiment 5 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 30%, pH buffer 10%, sealing of hole promotor 0.6%, deionized water surplus.
The room temperature further includes 3% component D without nickel hole sealing agent.
Wherein, the lithium salts is the composition of lithium acetate and lithium sulfate, and corresponding weight part ratio is 1:1.35；The pH is slow
Electuary is ammonium acetate；The sealing of hole promotor is the composition of aerosol-OT salt and trimethylglycine, accordingly
Weight part ratio be 1:1；The component D is Macrogol 600；On the other hand the present embodiment additionally provides the room temperature and seals without nickel
The preparation method of hole agent, with embodiment 1.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, with embodiment 1.
Embodiment 6
Embodiment 6 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 30%, pH buffer 10%, sealing of hole promotor 0.6%, deionized water surplus.
The room temperature further includes 3% component D without nickel hole sealing agent.
Wherein, the lithium salts is the composition of lithium acetate and lithium sulfate, and corresponding weight part ratio is 1:1.35；The pH is slow
Electuary is ammonium acetate；The sealing of hole promotor is the composition of aerosol-OT salt and trimethylglycine, accordingly
Weight part ratio be 1:1；The component D is acrylic resin；The acrylic resin is purchased from Mitsubishi, model BR113.
On the other hand the present embodiment additionally provides preparation method of the room temperature without nickel hole sealing agent, with embodiment 1.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, with embodiment 1.
Embodiment 7
Embodiment 7 provides a kind of room temperature without nickel hole sealing agent, is calculated by mass percentage, the room temperature is without nickel hole sealing agent packet
Include following component: lithium salts 30%, pH buffer 10%, sealing of hole promotor 0.6%, deionized water surplus.
The room temperature further includes 3% component D without nickel hole sealing agent.
Wherein, the lithium salts is the composition of lithium acetate and lithium sulfate, and corresponding weight part ratio is 1:1.35；The pH is slow
Electuary is ammonium acetate；The sealing of hole promotor is aerosol-OT salt；The component D is Macrogol 600 and third
The composition of olefin(e) acid resin, corresponding weight part ratio are 1.1:1.8；The acrylic resin is purchased from Mitsubishi, model
BR113。
On the other hand the present embodiment additionally provides preparation method of the room temperature without nickel hole sealing agent, with embodiment 1.
Third aspect present invention additionally provides application method of the room temperature without nickel hole sealing agent, with embodiment 1.
Performance evaluation
1. salt spray test
The sealing of hole effect for the hole sealing agent that embodiment 1-7 is prepared is measured by salt spray test.Salt spray test method is will
5 piece of 6063 aluminum alloy base material of same hole sealing agent sealing of hole is placed in the WY-60D type of Dongguan City pairing Electronic Science and Technology Co., Ltd. production
In salt-mist corrosion tester, after being sodium-chloride water solution splash 16 hours of 5 weight % with concentration at 35 DEG C, again will after taking-up
Substrate is placed in the climatic chamber that another temperature is 40 DEG C, relative humidity is 80%, observe substrate, be recorded in how long when
Between rear substrate surface occur abnormal, the time is longer, removes the maximum data and minimum data, and calculate the average of time, as a result
It is recorded in table 1.
2. pressing down grey measure of merit
(1) aluminium is 6063, dimensions 100*50*1mm, is first cleaned 5 minutes in 60 degree of SF-514 degreasing agent
(SF-514 is Zhuhai Aomei human relations Products), the rinsing of tap water room temperature, then polished in 100 degree of SF-517 chemical polishing solution
1 minute (SF-517 is Zhuhai Aomei human relations Products), tap water room temperature rinsing, except (30% nitric acid, room temperature 2 divide for stain dedusting
Clock), and anodic oxidation (sulfuric acid 18%, 20 degree of temperature, current density 1.5A/dm2, 40 minutes time), by the aluminium after anodic oxidation
Material 6063 immerse that embodiment 1-7 is prepared respectively without in nickel hole sealing agent, use ratio 30g/L, sealing of hole speed is 1.3 μ
m/min；
(2) the resulting aluminum alloy base material hole sealing agent remained on surface impregnated through no nickel hole sealing agent of step (1) is subjected to water
It washes, is dried up after flushing.
According to evaluating below dedusting effect index:
Whether a. appearance: visually observing uniformly ashless, and finger streaks that whether there is or not finger-marks；
B. oil pen tests: the aluminum alloy base material after referring to closing, after placing 2 hours, applies a dot with ZEBRA oil pen,
It is wiped after 10 seconds with wet cloth, the depth of trace is left in observation: evaluation index is noresidue, slight residual, severe residual.
Test result is shown in Table 1.
Table 1
| Sealing of hole effect | Appearance | Oil pen's test | |
| Embodiment 1 | 3532 | Uniform ashless, no finger-marks | Noresidue |
| Embodiment 2 | 3189 | Uniform ashless, no finger-marks | Noresidue |
| Embodiment 3 | 1563 | There is yellow ash, there are finger-marks | Slight residual |
| Embodiment 4 | 1713 | There is yellow ash, there are finger-marks | Slight residual |
| Embodiment 5 | 1968 | There is yellow ash, there are finger-marks | Severe residual |
| Embodiment 6 | 1730 | There is yellow ash, there are finger-marks | Severe residual |
| Embodiment 7 | 2653 | There is yellow ash, there are finger-marks | Slight residual |
Embodiment above-mentioned is merely illustrative, and is used to explain the present invention some features of the method.Appended right
It is required that the range as wide as possible for being intended to require to be contemplated that, and embodiments as presented herein is only according to all possible reality
Apply the explanation of the embodiment of the combined selection of example.Therefore, the purpose of applicant is that the attached claims are not illustrated this
The exemplary selectional restriction of the feature of invention.Some numberical ranges used also include son in the claims
Range, the variation in these ranges should also be construed to be covered by the attached claims in the conceived case.
Claims (10)
1. a kind of room temperature is without nickel hole sealing agent, which is characterized in that be calculated by mass percentage, the room temperature includes such as without nickel hole sealing agent
Lower component: lithium salts 20-40%, pH buffer 6-15%, sealing of hole promotor 0.2-1%, deionized water surplus.
2. a kind of room temperature according to claim 1 is without nickel hole sealing agent, which is characterized in that it is calculated by mass percentage, it is described
Room temperature is polyethylene glycol and/or acrylic resin without the component D, the component D that nickel hole sealing agent further includes 2-4%.
3. a kind of room temperature according to claim 1 is without nickel hole sealing agent, which is characterized in that the lithium salts be lithium acetate and/or
Lithium sulfate.
4. a kind of room temperature according to claim 3 is without nickel hole sealing agent, which is characterized in that the lithium salts is lithium acetate and sulfuric acid
The composition of lithium, corresponding weight part ratio are 1:(0.8-1.5).
5. a kind of room temperature according to claim 1 is without nickel hole sealing agent, which is characterized in that the pH buffer is organic acid
And/or acylate.
6. a kind of room temperature according to claim 5 is without nickel hole sealing agent, which is characterized in that the organic acid is selected from acetic acid, amber
One or more of amber acid, fumaric acid, malic acid, oxalic acid, lactic acid, citric acid, boric acid, malonic acid, the acylate choosing
From one or more of the ammonium salt, lithium salts, magnesium salts of organic acid.
7. a kind of room temperature according to claim 2 is without nickel hole sealing agent, which is characterized in that the component D be polyethylene glycol and
The composition of acrylic resin, corresponding weight part ratio are 1:(1-3).
8. a kind of room temperature according to claim 7 is without nickel hole sealing agent, which is characterized in that the component D be polyethylene glycol and
The composition of acrylic resin, corresponding weight part ratio are 1.1:1.8.
9. according to a kind of described in any item room temperature of claim 7-8 without nickel hole sealing agent, which is characterized in that the polyethylene glycol
Molecular weight is 300-900.
10. a kind of room temperature according to claim 1 is without nickel hole sealing agent, which is characterized in that the sealing of hole promotor is sulfonation
Dioctyl succinate sodium salt and/or trimethylglycine.
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|---|---|---|---|
| CN201811431113.1A CN109338434B (en) | 2018-11-28 | 2018-11-28 | Room temperature is without nickel hole sealing agent |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811431113.1A CN109338434B (en) | 2018-11-28 | 2018-11-28 | Room temperature is without nickel hole sealing agent |
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| CN109338434B CN109338434B (en) | 2019-11-05 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110512258A (en) * | 2019-10-11 | 2019-11-29 | 东莞市慧泽凌化工科技有限公司 | A kind of no nickel hole-sealing technology |
| CN111485269A (en) * | 2020-04-10 | 2020-08-04 | 高瑞安 | Chemical treatment liquid for sealing hole of aluminum profile electrolytic oxide film and hole sealing method |
| CN114717630A (en) * | 2022-03-18 | 2022-07-08 | 江门市优博科技有限公司 | Novel environment-friendly sealing agent for aluminum and aluminum alloy anodic oxide film and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110512258A (en) * | 2019-10-11 | 2019-11-29 | 东莞市慧泽凌化工科技有限公司 | A kind of no nickel hole-sealing technology |
| CN111485269A (en) * | 2020-04-10 | 2020-08-04 | 高瑞安 | Chemical treatment liquid for sealing hole of aluminum profile electrolytic oxide film and hole sealing method |
| CN114717630A (en) * | 2022-03-18 | 2022-07-08 | 江门市优博科技有限公司 | Novel environment-friendly sealing agent for aluminum and aluminum alloy anodic oxide film and preparation method thereof |
| CN114717630B (en) * | 2022-03-18 | 2024-05-10 | 江门市优博科技有限公司 | Environment-friendly sealing agent for aluminum and aluminum alloy anodic oxide film and preparation method thereof |
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|---|---|
| CN109338434B (en) | 2019-11-05 |
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