CN109338151A - A kind of electronic electric equipment copper alloy and purposes - Google Patents
A kind of electronic electric equipment copper alloy and purposes Download PDFInfo
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- CN109338151A CN109338151A CN201811536339.8A CN201811536339A CN109338151A CN 109338151 A CN109338151 A CN 109338151A CN 201811536339 A CN201811536339 A CN 201811536339A CN 109338151 A CN109338151 A CN 109338151A
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/04—Alloys based on copper with zinc as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
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Abstract
The present invention relates to a kind of electronic electric equipment copper alloy and purposes, which is characterized in that the copper alloy includes following weight composition: the Zn of 5.01~15.0wt%, the Sn of 0.1~2.0wt%, the P of the Fe of 0.01~2.0wt%, 0.01~0.5wt%, surplus are Cu and inevitable impurity.It is preferred that the weight percent of Fe, P meet: 5≤Fe/P≤100.
Description
Technical field
The present invention relates to alloy field more particularly to a kind of electronic electric equipment copper alloy and purposes.
Background technique
As electric/electronic device component, automotive part for example connector, lead frame, thermal component, relay,
Copper alloy plate used in the components such as switch, socket, to yield stress, tensile strength, elongation percentage, bendability, resistance to tired
Labor characteristic, proof stress relaxation property, conductivity there are certain requirements.In recent years, along with miniaturization, lightweight, high-density installation
Change, high temperature of use environment etc. propose copper alloy performance used in electronic equipment component, automotive part higher
Requirement.
It is used in material in electronic electric equipment, the use of more Cu alloy material includes at present brass, phosphor bronze, beryllium blueness
Copper, corson alloy, but these conventional Cu alloy materials have the following problems: and the comprehensive performance of brass is insufficient, it is difficult to simultaneously
Meet and (at 150 DEG C 1000 hours keep the temperatures, remnants to intensity >=500MPa, conductivity >=30IACS%, proof stress relaxation property
Stress >=60%) and bending machining performance have the field of high demand.Phosphor bronze is the alloy that intensity is improved by processing hardening,
It keeps the temperature 1000 hours at 150 DEG C, and residual stress≤60%, proof stress relaxation property is poor, while being added in phosphor bronze
Sn content is higher, and Sn is expensive, improves material cost, and the conductivity of phosphor bronze is low, only 20IACS% hereinafter,
The duty requirements high to conductivity can not be matched, there is certain restrictions to the application of phosphor bronze.And hold in beryllium-bronze production process
It is also easy to produce extremely toxic substance, it is expensive, so being generally only applied to certain pairs of elasticity, the higher military industry field of intensity requirement.Copper
Nickel silicon alloy is developed as a kind of Precipitation enhanced type alloy with substituting beryllium-bronze, but its cost is significantly higher than phosphorus blueness
Copper is usually applied to desired strength >=650MPa, the high-end field of connectors of conductivity >=40IACS%.Therefore, this usual
Cu alloy material be not all able to satisfy to a certain extent tend to miniaturization, lighting, high performance electronic and electric components
It is required that the Cu alloy material for developing a meet demand is of great significance.
Summary of the invention
The technical problem to be solved by the present invention is to the status for the prior art provide a kind of yield strength, electric conductivity and
Proof stress relaxation property is excellent and bending machining performance is good it is electric use Cu alloy material, it is electric to meet
Requirement of the equipment under different operating conditions.
Another technical problem to be solved by this invention is to provide a kind of yield strength for the status of the prior art, lead
Electrical property and the electric purposes with copper alloy that proof stress relaxation property is excellent and bending machining performance is good.
The technical scheme of the invention to solve the technical problem is: the present invention passes through using Cu, Zn, Sn as matrix
The promotion that the elements such as Fe, P realize performance is added, Fe simple substance is directly precipitated in one side Fe element, promotes the strength of materials；On the other hand
Fe-P compound is precipitated by Fe and P in the present invention, and scavenging material matrix is further promoted while not significantly reducing conductivity
The intensity of material.Further, ratio and processing technology of the present invention by control Fe, P, precipitate size, crystalline substance to alloy
The heterogeneous microstructures such as body orientation are controlled, and the equilibrium of conduction, yield strength, bending machining performance is realized.The present invention
Alloy improves the utilization of the waste materials such as iron bronze, tin-phosphor bronze added with elements such as Fe, P, reduces material cost.Particular technique
Scheme are as follows:
A kind of electric Cu alloy material, which includes the Zn that following weight includes: 5.01~15.0wt%,
The P of the Fe of the Sn of 0.1~2.0wt%, 0.01~2.0wt%, 0.01~0.5wt%, surplus are Cu and inevitable impurity.
The Zn of 5.01~15.0wt% is added in Cu alloy material of the present invention.Zn has larger solid solubility in Copper substrate,
The intensity of alloy can be improved when being solid-solution in Copper substrate, promote the drawing hardening effect during cold working, furthermore Zn may be used also
To improve the casting character, welding performance and the antistripping property for improving coating of alloy.But when Zn content is greater than 15wt%
When, the adverse effect of material conductivity is greatly enhanced, when Zn content is less than 5.01wt%, Zn pairing metalworking hardening
Facilitation effect is bad.Therefore, the present invention controls the content of Zn in 5.01~15.0wt%.
The Sn of 0.1~2.0wt% is added in Cu alloy material of the present invention.Sn exists in copper alloy with solution,
The distortion of lattice degree caused by crystal is larger, has better castering action to material property.The addition of Sn element allows alloy
There is better drawing hardening effect during alloy following process.Sn can also increase the thermal stability of alloy, further mention
The proof stress relaxation property of high alloy, while Sn can also increase the corrosion resistance of alloy, improve the connector of subsequent preparation
Etc. downstream product in moist, performance in corrosive medium reliability.But when the content of Sn is less than 0.1wt%, effect is not filled
Point；When more than 2.0wt%, the conductivity of alloy deteriorates.Therefore the present invention controls the content of Sn in 0.1~2.0wt%.
The Fe of 0.01~2.0wt% is added in Cu alloy material of the present invention.After adding Fe, one side Fe can prevent to tie again
Jingjing grain length is big, significantly refinement crystal grain, to improve copper alloy yield strength and hardness, another aspect Fe will form Fe simple substance or
Fe-P compound, scavenging material matrix, so that it is strong further to promote material under conditions of not influencing conductivity is precipitated in person and P
Degree.But Fe constituent content is usually no more than 2.0wt% in brass alloys, otherwise will cause Fe-riched phase segregation, reduces brass
The corrosion resistance of alloy, while difficulty can be increased in casting, reduce lumber recovery.And when Fe content is lower than 0.01wt%, analysis
Mutually insufficient out, material property promotes deficiency, so the present invention controls Fe content in 0.01~2.0wt%, is both avoided that in this way
There is iron segregation phenomena, while reducing casting difficulty, grain refining effect is best.
The P of 0.01~0.5wt% is added in Cu alloy material of the present invention, P element is the good degasifier of copper alloy, takes off
Oxygen agent.P can form Fe-P precipitated phase with Fe in the present invention, this precipitated phase can effectively improve the intensity of material, while can fit
Degree improves the recrystallization temperature and conductivity of material.P has the ability for promoting copper melt flow in copper solution, makes Fe-P precipitated phase
It is distributed more uniform, disperse.When the additive amount of P is less than 0.01wt%, compounds effective cannot be formed, additive amount is more than
0.5wt% not only increases the adverse effect of electric conductivity, but also is easy to reduce material plasticity.Therefore the content control of P is existed
0.01~0.5wt%.
Preferably, the weight percent of Fe, P meet: 5≤Fe/P≤100 in alloy of the present invention.The present invention is in Cu-
The elements such as Fe, P are added on Zn-Sn matrix simultaneously, wherein Fe is conducive to improve intensity, handles through Precipitation and Fe-P chemical combination is precipitated
Object and Fe simple substance hinder the migration of dislocation to improve the recrystallization temperature of copper alloy, and material is strengthened, while Fe-P
The precipitation of compound has purified matrix, and the conductivity of material gets a promotion, but the Fe added is excessive easily to form richness in the alloy
Iron phase easily causes material surface peeling defect, or weakens the mechanical property or buckling performance of material；One side of P alloying element
Face forms Fe-P compound with Fe and refines crystal grain phase, on the other hand carries out effective deoxidation to Copper substrate, increases the mobility of alloy,
Prevent hydrogen embrittlement, improve the surface property of copper alloy, but P can reduce the electric conductivity of Copper substrate, therefore, the dosage of Fe, P with
The superiority and inferiority of material property is closely related.Within the scope of Fe, P, the present invention preferably 5≤Fe/P≤100 can promote in the range
P is precipitated to indirectly control the amount of precipitation of Fe simple substance with Fe-P second-phase dispersion, and Fe simple substance is prevented to be precipitated excessive and cause to be precipitated
Mutually assemble.And as Fe/P >=100, Fe and P is not sufficiently reacted, and generates less Fe-P precipitated phase, while Fe simple substance is precipitated
Excessively, Fe simple substance is assembled on the surface of the material, keeps precipitated phase excessively coarse, is easy to become break origins during stretching,
Material property is influenced, as Fe/P≤5, there is free P in alloy, material conductivity is seriously reduced, so the present invention will make
The weight percent of Fe, P meet: 5≤Fe/P≤100.
Precipitated phase of the present invention includes Fe simple substance and Fe-P compound, these precipitated phases disperse educt in the material, precipitated phase
Average grain diameter≤0.6 μm.The present invention adds the elements such as Fe, P, and through fixation rates, Fe simple substance and Fe-P compound is precipitated,
The presence of precipitated phase in alloy, on the one hand improves the recrystallization temperature of copper alloy, hinders the migration of dislocation, and material obtains strong
Change；The precipitation of another aspect Fe-P compound has purified matrix, and the conductivity of material is made to get a promotion, while further realizing conjunction
The promotion of golden intensity.And the particle size of precipitated phase has an important influence material property, precipitated phase gets over small and dispersed, alloy
Intensity and bending machining performance are better, the excessively coarse then material property decline of precipitated phase, while easily becoming rupture when stretching
Point influences the use of material, so the present invention controls precipitated phase partial size by control Fe, P ratio and processing technology.
Research finds that when 0.6 μm of precipitated phase average grain diameter >, material property decline, material is easily broken off in use, so
The average grain diameter control of precipitated phase is≤0.6 μm by the present invention.
The present invention controls the crystal face intensity of { 111 }, { 200 }, { 220 }, { 311 }, meets its crystal face intensity
0.2≤{I{111}+I{311}+0.5*I{200}}/I{220}≤5.The yield strength and bending machining performance of material are in material
It is all played a crucial role in, but often finds that the promotion of material yield strength adds along with bending in an experiment
Work performance is remarkably decreased, so the yield strength of balancing material and bending machining performance are particularly important.The present invention is main
By techniques such as solid solution aging, rollings, the high preferred orientation of material is controlled.In the present invention, copper alloy band is in 0 <
X-ray diffraction crystal face within the scope of 2 90 ° of θ < mainly has { 111 }, { 200 }, { 220 }, { 311 }, wherein crystal face { 111 },
{ 200 }, the change of { 220 }, { 311 } has large effect for material yield strength and bending machining performance, so in order to
The balance for realizing yield strength and bending machining performance, controls the crystal face intensity of { 111 }, { 200 }, { 220 }, { 311 }
System.The present invention is tested by different technique, and is carried out analysis to its result and found: surrender of { 311 } crystal face to material
Intensity has important influence, as the rate of cold-drawn increases, the enhancing of { 311 } crystal face diffracted intensity, and the yield strength of material
Also obviously increase, but { 220 } crystal face increase it is unfavorable to the bending machining performance of material；{ 200 } bending machining of the crystal face to material
Performance has important influence, its crystal face diffracted intensity enhances after solid solution, and the bending machining performance of material is good, but { 200 } are brilliant
Increase the increase for being unfavorable for material yield strength in face；After solution treatment, the enhancing of { 111 } crystallographic plane diffraction peak, the bending of material
Can be good, but as the increase of the rate of cold-drawn, { 311 } crystal face increase, { 200 } crystal face is gradually less, and { 111 } crystal face first reduces
After increase, the buckling performance of material also decreases.The high preferred orientation of { 111 }, { 200 }, { 220 } and { 311 } is controlled for obtaining
Ideal bending machining performance and yield strength (value R/t≤2 in the direction value R/t≤1, BW in the direction GW and yield strength >=
It 500MPa) plays an important role, the high preferred orientation of copper alloy of the present invention meets: 0.2≤{ I { 111 }+I { 311 }+0.5*I
{ 200 } }/I { 220 }≤5, wherein I { 111 } is the X-ray diffraction intensity of { 111 } crystal face, and I { 200 } is that the X of { 200 } crystal face is penetrated
Line diffracted intensity, I { 220 } are the X-ray diffraction intensities of { 220 } crystal face, and I { 311 } is the X-ray diffraction intensity of { 311 } crystal face.
As { I { 111 }+I { 311 }+0.5*I { 200 } }/I { 220 } < 0.2, the yield strength of alloy is in 500MPa hereinafter, 90 ° of bendings
Value R/t≤1 in the direction value R/t≤1, BW in the direction GW in test；As { I { 111 }+I { 311 }+0.5*I { 200 } }/I { 220 } >
When 5, although the value R/t > 2 in the yield strength of alloy direction BW in 500MPa or more, 90 ° of folding tests, bendability
Do not reach requirement, therefore, yield strength and bending machining performance in order to balance, the present invention by I { 111 }, I { 200 }, I { 220 } and
I { 311 } is limited to 0.2≤{ I { 111 }+I { 311 }+0.5*I { 200 } }/I { 220 }≤5.
The also Co of Ni and/or 0.001~1.0wt% added with 0.001~1.0wt% in Cu alloy material of the present invention.
Ni can be infinitely dissolved with Cu, and the intensity of alloy, conduction of the Ni to copper alloy can be improved when being solid-solution in Copper substrate
Rate influences small compared with other elements such as Sn, P.Ni can form the precipitated phase of Ni-P compound with P element by heat treatment simultaneously, from
And improve the intensity of alloy, conductivity.But work as the excessive conductivity that will lead to of Ni content and be greatly reduced, it is not inconsistent condensation material and wants
It asks, so the present invention controls Ni content in 0.001~1.0wt%.
Co can be solid-solution in matrix, improve the intensity of material by the effect of solution strengthening, while Co and p-shaped be at CoP phase,
Influence while mutually promoting alloy strength by precipitation strength to conductivity is smaller, but add Co content it is excessive when, base
Remaining Co element also increases in body, to influence the conductivity of alloy, and unfavorable to buckling performance.So the present invention contains Co
Co of the amount control in 0.001~1.0wt%.
May also include in the weight percent composition of the copper alloy total amount no more than Al, Mg of 2.0wt%, Cr, Ti, Zr,
B, at least one of Ag, Mn, Si, RE element, wherein Al, Cr, Zr, Ti, RE have the function of improving intensity, and B's is added with
Conducive to refinement crystal grain, the addition of this dvielement can form the crystallization of a large amount of small and dispersed distributions during solution solidifies
Forming core plays the role of refining crystal grain, and Mn can play deoxidation in fusion process, improve the purity of alloy, can be with
The hot-working character for improving alloy, improves the basic mechanical performance of alloy, drops low-alloyed elasticity modulus, Ag be not greatly reduced
The promotion of solid solution strengthening effect is realized in the case where conductivity, but these element excessive additions, material property reduce instead, no
Conducive to the promotion of material comprehensive performance, Si is mainly used for improving the casting fluidity of alloy, reduces the oxygen of copper liquid in casting process
Change, improves processability, Mg has the effect of deoxidation, desulfurization and improves alloy proof stress relaxation property, but these elements
Addition is excessive.
To sum up, the present invention, by elements such as addition Fe, P, passes through solution strengthening and ageing strengthening using Cu-Zn-Sn as matrix
It combines, on the one hand by the way that Fe simple substance and Fe-P compound is precipitated, promotes the strength of materials, refine crystal grain, on the other hand pass through control
Fe, P ratio processed and processing technology, control precipitated phase partial size and high preferred orientation, thus jointly realize conduction, yield strength,
The equilibrium of bending machining performance meets yield strength >=500MPa, conductivity >=30%IACS, the excellent (GW of bending machining performance
Value R/t≤2 in the direction value R/t≤1, BW in direction), proof stress relaxation property it is excellent (keep the temperature 1000 hours at 150 DEG C, it is residual
Residue stress >=70%) material property, can be suitable for semiconductor device connector, other terminals or electromagnetic relay
Movable conductive piece or the electronic electric equipments conducting element such as lead frame.
Copper alloy of the present invention can be processed into Strip, bar, wire rod etc. according to different application demands.It is with Strip
Example, the preparation process of copper alloy of the present invention are as follows:
(1) founding: copper alloy raw material is melted, and then produces ingot casting, casting temperature by horizontal casting or D.C.casting
Control is at 1050 DEG C~1300 DEG C.
(2) hot rolling: to guarantee that coarse precipitated phase present in ingot casting is dissolved into matrix, the hot-rolled temperature control of alloy again
Alloy is up to the purpose homogenized under 750 DEG C~900 DEG C, soaking time 3h~6h, this technique, to reduce phase after hot rolling to the greatest extent
The precipitation of particle, alloy finishing temperature control is at 650 DEG C or more, and online water is cooling after hot rolling.85% or more rolling rate.
(3) mill face: hot rolling rear surface oxide skin is thicker, and for the surface quality for guaranteeing later period band, hot rolled plate mills face up and down
0.5~1.0mm.
(4) once cold rolling: in this cold-rolled process, it is desirable that always rolling rate >=70%, so that the later period is dissolved process, shape
At ideal recrystallized structure.
(5) solution treatment/ageing treatment: according to the configuration and demand of distinct device, can choose carry out solution treatment or
The mode and technique of person's ageing treatment.
Solution treatment is at a kind of heat for forming solute element solid solution again in matrix and being recrystallized
Reason.{ 111 }, { 200 } crystal face diffracted intensity increase after copper alloy solution treatment of the present invention, can promote the plasticity of alloy, are subsequent
Cold deformation provides basis.Solution treatment preferably carries out 1min to 1h at a temperature of 700~980 DEG C, more preferably progress 10min
To the solution treatment of 50min.If solid solution temperature is lower than 700 DEG C, alloy recrystallization is incomplete, increases following process
Difficulty, and redissolution of the solute element in solid solution is also insufficient.In addition, if solid solution temperature is higher than 980 DEG C, then
Crystal grain becomes thick, and the flexible processability of material is easily deteriorated.
At this moment ageing treatment mainly achievees the purpose that Second Phase Precipitation and organization softening.It is compared with cold rolling state, after timeliness
Alloy increases 30% or more along the diffraction peak intensity of rolling surface { 200 } crystal face, and the plasticity of alloy improves.Aging temp control exists
350 DEG C~600 DEG C, 6~12h of retention time, more preferably, temperature is controlled at 400 DEG C~550 DEG C, 4~10h of retention time, this
Sample Fe and p-shaped are at compound, with minute shape disperse educt in copper parent phase, can have both high intensity and excellent bending adds
Work, if aging temp is excessively high, the time is long, precipitate coarsening, precipitate partial size not can be effectively controlled, bending machining performance
Deteriorate；, whereas if temperature is low, the time is short, precipitation process progress is insufficient, and bending machining performance, the strength of materials are unable to reach
Desired value.
(6) secondary cold-rolling: cold rolling is carried out to the Cu alloy material after heat treatment, with the progress of cold rolling, along rolling surface
{ 111 }, { 311 } face diffraction maximum intensity increase, the energy storage of material and conducive to precipitate continue be precipitated lattice defect increase,
To which the distribution for continuing precipitation and fine uniform structure of precipitate can be promoted in subsequent ageing treatment, the conduction of material is improved
Rate, yield strength and bendability.Therefore, for the deformation amount controlling of secondary cold-rolling 60% or more, deflection is too small, precipitated phase
Uniform dispersion is poor, amount of precipitation is smaller, while being unfavorable for the completion of later period Aging Microstructure perfect recrystallization, to final band
Bending machining it is unfavorable.
(7) ageing treatment: alloy realizes that the critical process of precipitation strength, the aging temp are controlled at 350~550 DEG C, protected
Warm 6~12h of time, preferably aging temp control are at 400~500 DEG C, 4~10h of time.Temperature height be conducive to tissue completely again
Crystallization and the second phase precipitation, but it is excessively high easily occur precipitate aggregation and overaging problem.Low temperature aging is both unfavorable for band
Recrystallization is also unfavorable for the precipitation of the second phase, is affected to the bending machining of band.
(8) cold rolling three times: cold deformation is applied to the alloy after timeliness and is conducive to further increasing for band intensity, but is deformed
Amount should not be too large, the excessive easy apparent anisotropy of formation, and will increase { 220 } crystal face diffracted intensity, be unfavorable for the direction BW
The bending machining energy of band.With the increase of working modulus, near precipitate, the compatibility of deformation of crystal is deteriorated for pile-up of dislocation,
The easy mutagenesis of precipitate deteriorates at formation of crack, the buckling performance of alloy when bending deformation.Wherein the direction BW deteriorates more obvious.Cause
This, deformation amount controlling is below 60%.
(9) low-temperature annealing: for copper alloy higher for zinc content, it is strong to be conducive to surrender for low-temperature annealing after cold deformation
The raising of degree, flexible processing performance, while the conductivity that can improve alloy is precipitated in also a small amount of compound, discharges certain
Residual stress.So by after third time cold rolling copper alloy plate carry out low-temperature annealing, low-temperature anneal temperature control 200 DEG C~
1h~5h time is kept the temperature between 250 DEG C.Temperature is excessively high, and copper alloy plate softens in a short time, and alloy strength feature reduces,
Be unfavorable for using.If temperature is too low, it is unable to fully obtain the effect for improving features described above.
Compared with the prior art, the advantages of the present invention are as follows:
(1) present invention adds the elements such as Fe, P on Cu-Zn-Sn matrix, and the weight ratio for controlling Fe, P meets: 5≤Fe/
P≤100 make to generate appropriate Fe simple substance and Fe-P precipitated phase in alloy, while making precipitated phase disperse educt.
(2) in order to improve bending machining performance and yield strength with balancing material, the present invention is to I { 111 }, I { 200 }, I
{ 220 } it is defined with I { 311 } crystal orientation, which is that X-ray diffraction intensity determines.Copper alloy of the present invention
The X-ray diffraction intensity of crystal face meets: 0.2≤{ I { 111 }+I { 311 }+0.5*I { 200 } }/I { 220 }≤5 realizes material
The material is set to realize excellent comprehensive performance of the copper alloy including yield strength, electric conductivity, bendability；
(3) alloy Fe simple substance and Fe-P compound of the present invention average grain diameter≤0.6 μm；
(4) yield strength >=500MPa, conductivity >=30%IACS may be implemented in copper alloy of the present invention；Manufactured band
90 ° of bendabilities are as follows: value R/t≤2 in the direction value R/t≤1, BW in the direction GW；1000 hours are kept the temperature at 150 DEG C, it is remaining
70% or more stress, proof stress relaxation property is excellent；
(5) present invention solves the problems, such as the recycling of the Various Wastes such as tin-phosphor bronze, iron bronze, brass, improves material use
Rate saves material cost, promotes recycling for waste material.
(6) alloy of the present invention can be processed into the products such as stick line, strip, be widely applied semiconductor device connector, its
The electronic electric equipments conducting elements such as the movable conductive piece or lead frame of his terminal or electromagnetic relay.
Detailed description of the invention
Fig. 1 is the metallograph of the resulting 1000X of the embodiment of the present invention 1, and stain is the precipitated phase of this copper alloy in figure,
He is matrix.It will be seen from figure 1 that the copper alloy precipitated phase disperse is evenly dispersed, precipitated phase partial size is significantly less than 0.6
μm, the horizontal line in the lower right corner is size scale.
Specific embodiment
The present invention will be described in further detail below with reference to the embodiments of the drawings.
Ingredient is respectively formed according to table 1, the ingot casting melted, manufacture specification is 170mm × 320mm is carried out at 1150 DEG C.It will
After above-mentioned ingot casting keeps the temperature 5 hours at 850 DEG C, carrying out hot rolling makes its plate thickness reach 16.5mm；Then, implementing milling face makes its thickness
Degree reaches 15mm, then by once cold rolling at the plate with a thickness of 2mm；Then the plate after cold rolling is heated to 440 DEG C, keeps the temperature 8h,
Carry out first time timeliness；Material after timeliness is subjected to second of cold rolling, 0.35mm is cold-rolled to, then carries out at 400 DEG C
Second of ageing treatment of middle heat preservation 8h；Finally carrying out pinch pass is cold rolling three times, rolls target plate thickness 0.2mm；In pinch pass
Afterwards, 4h is kept the temperature in 210 DEG C and carry out low-temperature annealing, obtain strip samples.
For 20 embodiment alloys being prepared, test respectively mechanical property, conductivity, proof stress relaxation property,
Buckling performance, crystal orientation.
Tensile test at room temperature is according to " GB/T 228.1-2010 metal material stretching test part 1: room temperature test method "
It is carried out on electronic universal testing machine for mechanical properties, uses width for the sample of taking the lead of 12.5mm, tensile speed 5mm/min.
Conductivity test is according to " GB/T 3048.2-2007 wire and cable electrical performance test method part 2: metal material
Resistivity test ", this detecting instrument is ZFD micro computer electric bridge instrument for measuring DC resistance, and Sample Width 20mm, length is
500mm。
Proof stress relaxation property is tested according to " JCBA T309:2004 copper and copper alloy thin plate bending stress relaxation test
Method ", along rolling direction sampling, Sample Width 10mm, length 100mm is parallel to, initial loading stress value is that 0.2% surrender is strong
The 70% of degree, test temperature are 150 DEG C, time 1000h.
Buckling performance test carries out on bending test machine according to " GBT 232-2010 bend test of metal materials method ",
Sample Width is 5mm, length 50mm.
X-ray diffraction intensity I { 111 }, the I in { 111 }, { 200 }, { 220 } and { 311 } face on each sample surface are measured respectively
{ 200 }, I { 220 } and I { 311 } finds out the value of 0.2≤{ I { 111 }+I { 311 }+0.5*I { 200 } }/I { 220 }≤5.
The ingredient and results of property of each embodiment and comparative example are as shown in Tables 1 and 2.
The ingredient of 1 embodiment of table, comparative example
2 embodiment of table, the performance test results of comparative example
Claims (9)
1. a kind of electronic electric equipment copper alloy, which is characterized in that the copper alloy includes following weight composition: 5.01~
The P of the Fe of the Sn of the Zn of 15.0wt%, 0.1~2.0wt%, 0.01~2.0wt%, 0.01~0.5wt%, surplus is for Cu and not
Evitable impurity.
2. electronic electric equipment copper alloy according to claim 1, it is characterised in that the weight percent of Fe, P meet:
5≤Fe/P≤100。
3. electronic electric equipment copper alloy according to claim 2, it is characterised in that the precipitation phase average of the copper alloy
Partial size≤0.6 μm.
4. electronic electric equipment copper alloy according to claim 1-3, it is characterised in that the copper alloy crystal face
X-ray diffraction intensity meet: 0.2≤{ I { 111 }+I { 311 }+0.5*I { 200 } }/I { 220 }≤5；Wherein:
I { 111 } is the X-ray diffraction intensity of { 111 } crystal face；
I { 200 } is the X-ray diffraction intensity of { 200 } crystal face；
I { 220 } is the X-ray diffraction intensity of { 220 } crystal face；
I { 311 } is the X-ray diffraction intensity of { 311 } crystal face.
5. electronic electric equipment copper alloy according to claim 1 to 3, which is characterized in that the copper alloy further includes
The Co of the Ni and/or 0.001~1.0wt% of 0.001~1.0wt%.
6. electronic electric equipment copper alloy according to claim 1-3, which is characterized in that the weight of the copper alloy
It further include that total amount is no more than in Al, Cr, Ti, Zr, B, Ag, Mn, Mg, Si and RE of 2.0wt% at least in amount percentage composition
A kind of element.
7. electronic electric equipment copper alloy according to claim 1-3, which is characterized in that the copper alloy is bent
Take intensity >=500MPa, conductivity >=30%IACS.
8. electronic electric equipment copper alloy according to claim 1-3, which is characterized in that the band of the copper alloy
90 ° of bending machining performances of material are as follows: value R/t≤2 in the direction value R/t≤1, BW in the direction GW.
9. such as the purposes of the described in any item electronic electric equipment copper alloys of claim 1-8, it is characterised in that as preparation
The connector of semiconductor device, terminal, electromagnetic relay reed or lead frame raw material.
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| CN114347586A (en) * | 2022-01-25 | 2022-04-15 | 宁波博威合金材料股份有限公司 | Copper-copper composite strip, preparation method and application |
| CN114507828A (en) * | 2022-02-17 | 2022-05-17 | 贵溪奥泰铜业有限公司 | Phosphor bronze alloy with excellent conductivity and production method thereof |
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