CN109326901B - Conductive spring and conductive wire for electroplating roller - Google Patents
Conductive spring and conductive wire for electroplating roller Download PDFInfo
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- CN109326901B CN109326901B CN201810581666.9A CN201810581666A CN109326901B CN 109326901 B CN109326901 B CN 109326901B CN 201810581666 A CN201810581666 A CN 201810581666A CN 109326901 B CN109326901 B CN 109326901B
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- conductive
- conductive spring
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- metal copper
- spring
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
- H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/007—Current directing devices
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/16—Apparatus for electrolytic coating of small objects in bulk
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/30—Clamped connections, spring connections utilising a screw or nut clamping member
- H01R4/36—Conductive members located under tip of screw
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a conductive spring and a conductive wire for an electroplating roller, wherein the conductive spring comprises: a conductive spring body and a lock head structure; one end of the conductive spring body is fixedly connected with the lock head structure. The conductive wire for the electroplating roller comprises a conductive wire body, metallic copper and a conductive spring; the metal copper is connected to the tail end of the conductive wire body and comprises a conductive end head and an encapsulation part; the conductive spring is detachably wrapped and locked outside the metal copper. According to the conductive spring and the conductive wire for the electroplating roller, the conductive spring is additionally arranged on the conductive wire, so that when the roller is used for electroplating large-size products, the uniformity of current distribution around the products is improved, the phenomenon that plating is uneven in a low-current area and a high-current area is caused, the film thickness ratio of the high-low area is reduced by 15%, the phenomenon of blackening on the surfaces of the products is reduced, and the quality of the electroplated products is improved.
Description
Technical Field
The invention relates to the technical field of electroplating accessories, in particular to a conductive spring and a conductive wire for an electroplating roller.
Background
The prior galvanization process mainly comprises acid potassium chloride and alkaline zincate galvanization, and the alkaline galvanization has obvious advantages compared with the acid galvanization: 1. the binding force of the plating layer is better, 2. The corrosion resistance is strong, 3. The permeability of the current low area is better. Thus, in the automotive industry, automotive host factories clearly require the use of alkaline galvanization process technologies.
The alkaline galvanization generally adopts a barrel plating mode, the volume of the roller is smaller, and the current cannot be uniformly distributed in the roller, so that in the alkaline galvanization process, conductive metal is adopted as cathode connection to conduct electricity. When the metal is put into the solution, metal ions in thermal motion in the metal crystal leave the surface of the metal to enter the solution under the action of polar water molecules; the metal ions in the solution are attracted by electrons on the surface of the metal, deposited on the surface of the metal, and after reaching equilibrium in the solution with a certain concentration, form an electric double layer with opposite charges on the interface between the metal and the solution, so as to generate a potential difference. This potential difference is referred to as the electrode potential of the metal. Electrode potential of zincE(Zn 2+ Zn) is represented by E (Cu) 2+ Cu). The higher the value, the stronger the electron-obtaining capability of the oxidation-reduction pair in various oxidation states, and the weaker the electron-losing capability in the reduction state; the lower the value, the opposite is true.
E(Zn 2+ /Zn)＝-0.76，E(Cu 2+ From this, zn is more volatile than Cu, cu) =0.34 2+ Specific Zn 2+ Electrons are more readily available.
However, copper is used as a metal and can pollute plating solution, so that the metal copper used as a conductive mode needs to be encapsulated in the actual galvanization process, and the actual conductive part is a small part of the head.
In order to adapt to parts to be plated with different specifications, the conventional electroplating roller is usually connected with a cathode by adopting a flexible wire. The copper is used as conductive metal, so that only a small part of the head of the copper plays a role in actual conductivity in order to avoid pollution to plating solution, and the copper is applicable to small-specification (the length is not more than 75 mm) products; however, for large-size (length is more than 90 mm) products, because the roller rolls (mixing period is not considered), a part of products can be clamped with each other, because the conductive copper is only conductive at the head, other parts are wrapped by glue and are not conductive, so that the current distribution of different parts of the surface of the long-size product to be electroplated is different, or the current density distribution of the surfaces of different products is uneven, and the conditions of high local current density and low local current density occur. According to Faraday's law, the amount of metal deposited at the cathode is proportional to the current passing through it, and the current passing through a certain part is large, so that more metal is deposited, the thicker the coating is, and conversely, the thinner the coating is. Therefore, uneven current distribution causes uneven plating in a low current area and a high current area, uneven plating in the high and low areas (excessively large film thickness ratio in the high and low areas), and even blackening and non-brightness of part of the product surface.
Disclosure of Invention
The invention mainly solves the technical problem of providing a conductive spring for a conductive wire of an electroplating roller, which can solve the problem of poor plating uniformity caused by uneven cathode current distribution in the existing alkaline barrel galvanization process.
In order to solve the technical problems, the invention adopts a technical scheme that: there is provided a conductive spring comprising: a conductive spring body and a lock head structure; one end of the conductive spring body is fixedly connected with the lock head structure.
In a preferred embodiment of the invention, the lock head structure comprises a metal lock shell and a positioning bolt, wherein the metal lock shell is of a hollow cylindrical structure with two open ends, symmetrically distributed bolt holes are formed in the same circumference of the metal lock shell, and the positioning bolt is arranged in the bolt holes to realize the locking and fixing functions.
In a preferred embodiment of the invention, the metal lock case comprises a vertical section, and two ends of the vertical section are necking sections connected with the vertical section into a whole; the bolt holes are distributed on the vertical section.
In a preferred embodiment of the present invention, the number of the bolt holes is 2 or 4.
In order to solve the technical problems, the invention adopts another technical scheme that: providing a conductive wire for an electroplating roller, comprising a conductive wire body, metallic copper and a conductive spring; the metal copper is connected to the tail end of the conductive wire body and comprises a conductive end head and an encapsulation part; the conductive spring is detachably wrapped and locked outside the metal copper.
In a preferred embodiment of the present invention, the conductive spring body of the conductive spring is sleeved on the encapsulation portion of the metal copper, the metal lock shell is sleeved on the conductive end of the metal copper, and the positioning bolt is symmetrically screwed to abut against the conductive end to realize locking and fixing of the metal copper.
The beneficial effects of the invention are as follows: according to the conductive spring and the conductive wire for the electroplating roller, the conductive spring is additionally arranged on the conductive wire, so that when the roller is used for electroplating large-size products, the uniformity of current distribution around the products is improved, the phenomenon that plating is uneven in a low-current area and a high-current area is caused, the film thickness ratio of the high-low area is reduced by 15%, the phenomenon of blackening on the surfaces of the products is reduced, and the quality of the electroplated products is improved.
Drawings
FIG. 1 is a schematic view of a conductive spring according to a preferred embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a conductive wire portion of the plating barrel shown;
FIG. 3 is a graph showing the ratio of the film thickness of the plating layer on the cylinder with and without the conductive spring according to different test amounts;
the components in the drawings are marked as follows: 1. the conductive spring body, 2, the tapered end structure, 21, the metal lock shell, 22, the positioning bolt, 23, the bolt hole, 211, the vertical section, 212, the necking section, 3, the conductive wire body, 4, the metal copper, 41, the conductive terminal, 42 and the encapsulation part.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Referring to fig. 1 and 2, an embodiment of the present invention includes:
the large difference of the plating thickness of the high area and the low area of the part (product) is the poor uniformity of the plating thickness of the plating piece. According to Faraday's law, the amount of metal deposited at the cathode is proportional to the current passing through it, and the current passing through a certain part is large, so that more metal is deposited, the thicker the coating is, and conversely, the thinner the coating is. Therefore, the thickness of the plating layer at different parts of the cathode surface is determined by the amount of current passing through each part, and if the current is uniformly distributed on the cathode, the plating layer can be uniformly distributed on the part, and the difference of the film thickness of the high and low areas of the plated part can be reduced.
The barrel plating is carried out in a relatively closed roller, compared with the hanging plating in a completely exposed state, the material transmission is more than one barrier, during the barrel plating, only the surface layer part is plated, but the inner layer part is hardly plated due to the shielding and shielding of the surface layer part, and the like, so that the part needs to roll continuously in the barrel plating process, the inner layer part and the surface layer part are changed continuously, and the mixing period of the barrel plating is formed.
Example 1
The invention discloses a conductive spring, comprising: a conductive spring body 1 and a lock head structure 2; one end of the conductive spring body 1 is fixedly connected with the lock head structure 2.
The lock head structure 2 comprises a metal lock shell 21 and a positioning bolt 22, wherein the metal lock shell 21 is of a hollow cylindrical structure with two open ends, 2 or four symmetrically distributed bolt holes 23 are formed in the same circumference of the metal lock shell 21, and concretely, the metal lock shell 21 comprises a vertical section 211, and two ends of the vertical section are necking sections 212 connected with the vertical section into a whole; the bolt holes 23 are distributed over the vertical section 211. The number of the positioning bolts 22 is matched with the number of the bolt holes 23, the positioning bolts 22 are inserted into the bolt holes 23, and the positioning bolts are screwed in or out through threaded fit.
Example 2
The invention provides a conductive wire for an electroplating roller, which comprises a conductive wire body 3, metal copper 4 and a conductive spring in the embodiment 1; wherein, the metal copper 4 is connected to the end of the conductive wire body 3 and is connected to the metal wire core of the conductive wire body 3, and the metal copper 4 comprises a conductive terminal 41 and an encapsulation part 42 which is wrapped by glue except the conductive terminal; the conductive spring is detachably wrapped and locked outside the metal copper 4.
The specific connection relation between the conductive spring and the metal copper 4 is as follows:
the conductive spring body 1 of the conductive spring is sleeved with the rubber coating part 42 wrapping the metal copper 4, the lock head structure 2 is sleeved with the conductive end 41 wrapping the metal copper 4, and the positioning bolt 22 is symmetrically inserted into the bolt hole and screwed to the conductive end 41 of the conductive copper, so that the metal copper 4 is locked and fixed.
When the conductive wire for the electroplating roller with the conductive spring is placed in the conductive roller and used for rolling and electroplating products with large specifications (the length is more than 90 mm), the conductive spring is made of metal and has the function of transmitting electrons, so that the current of the conductive end part of the metal copper can be transmitted to the area where the conductive spring is located, the uniformity of current distribution is improved, and finally the uniformity of electroplating is improved.
When the product with large specification is not required to be electroplated, the conductive spring is taken down from the metal copper by unscrewing the positioning bolt.
The conductive wire roller is used for electroplating large-specification products, meanwhile, the conventional conductive wire roller is used for electroplating large-specification products as comparison, and the thickness value of an electroplating film on the product is checked, and the result is shown in the following table:
TABLE 1 film thickness values of the products
TABLE 2 sample film thickness to high and low zone ratios
| Testing device | Film thickness ratio of conductive spring | Low-high film thickness ratio without conductive spring |
| 1 | 1∶2.23 | 1∶2.49 |
| 2 | 1∶2.08 | 1∶2.3 |
| 3 | 1∶2.34 | 1∶2.33 |
| 4 | 1∶2.31 | 1∶2.72 |
| 5 | 1∶2.08 | 1∶2.67 |
| 6 | 1∶2.05 | 1∶2.2 |
| 7 | 1∶2.3 | 1∶2.36 |
| 8 | 1∶2.4 | 1∶2.25 |
| 9 | 1∶2.33 | 1∶2.16 |
| 10 | 1∶2.26 | 1∶2.23 |
| 11 | 1∶2.34 | 1∶2.17 |
| 12 | 1∶2.17 | 1∶2.33 |
| 13 | 1∶2.15 | 1∶2.3 |
| 14 | 1∶2.11 | 1∶2.31 |
| 15 | 1∶2.23 | 1∶2.31 |
| 16 | 1∶2.58 | 1∶2.23 |
| 17 | 1∶2.2 | 1∶2.49 |
| 18 | 1∶2.41 | 1∶2.41 |
| 19 | 1∶2.26 | 1∶2.39 |
| 20 | 1∶2.41 | 1∶2.48 |
The test amounts shown in Table 2 are plotted on the abscissa and the film thickness ratio is plotted on the ordinate, as shown in FIG. 3.
As is clear from the contents shown in the above tables 1, 2 and 3, after the conductive spring is added, the film thickness ratio of the high area and the low area of the product is reduced by 15%, the film thickness ratio of the plating layer is reduced, and the phenomenon of non-brightness of the low area is improved.
The invention relates to a conductive spring and a conductive wire for an electroplating roller, which have the following advantages:
1. the whole barrel plating process effectively enhances the current dispersion capability, avoids the problem of uneven current distribution in the roller, and reduces the film thickness ratio of high and low areas by 15%;
2. can reduce blackening phenomenon (i.e. reduce the problem of non-brightness of low current area)
3. Can be applied to the whole barrel plating process in each roller, and has wider coverage.
In the description of the present invention, it should be noted that, directions or positional relationships indicated by terms such as "upper", "lower", "left", "right", "inner", "outer", etc., are directions or positional relationships based on those shown in the drawings, or those that are conventionally put in use of the inventive product, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific direction, be configured and operated in a specific direction, and thus should not be construed as limiting the present invention. The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The conductive wire for the electroplating roller is characterized by comprising a conductive wire body, metal copper and a conductive spring; the metal copper is connected to the tail end of the conductive wire body and comprises a conductive end head and an encapsulation part; the conductive spring is detachably wrapped and locked outside the metal copper;
the conductive spring comprises a conductive spring body and a lock head structure; one end of the conductive spring body is fixedly connected with the lock head structure; the lock head structure comprises a metal lock shell and positioning bolts, wherein the metal lock shell is of a hollow cylindrical structure with two open ends, bolt holes which are symmetrically distributed are formed in the same circumference of the metal lock shell, and the positioning bolts are arranged in the bolt holes to realize the locking and fixing functions; the conductive spring body of the conductive spring is sleeved with the rubber coating part for wrapping the metal copper, the metal lock shell is sleeved with the conductive end head of the metal copper, and the positioning bolt is symmetrically screwed to abut against the conductive end head to realize locking and fixing of the metal copper;
the conductive wire for the electroplating roller with the conductive spring is placed in the conductive roller, and when the conductive wire is used for rolling a large-size product with the electroplating length exceeding 90mm, the current of the conductive end part of the metal copper can be transmitted to the area where the conductive spring is located, so that the uniformity of current distribution is improved, and finally, the uniformity of electroplating is improved;
when large-size products do not need to be electroplated, the conductive spring is taken down from the metal copper by unscrewing the positioning bolt.
2. The wire for a plating barrel according to claim 1, wherein said metal lock case comprises a vertical section, both ends of said vertical section being reduced sections integrally connected therewith; the bolt holes are distributed on the vertical section.
3. The conductive wire for a plating barrel according to claim 1, wherein the number of the bolt holes is 2 or 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810581666.9A CN109326901B (en) | 2018-06-07 | 2018-06-07 | Conductive spring and conductive wire for electroplating roller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810581666.9A CN109326901B (en) | 2018-06-07 | 2018-06-07 | Conductive spring and conductive wire for electroplating roller |
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| Publication Number | Publication Date |
|---|---|
| CN109326901A CN109326901A (en) | 2019-02-12 |
| CN109326901B true CN109326901B (en) | 2023-08-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810581666.9A Active CN109326901B (en) | 2018-06-07 | 2018-06-07 | Conductive spring and conductive wire for electroplating roller |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3634047A (en) * | 1970-05-04 | 1972-01-11 | Burroughs Corp | Electroplated member and method and apparatus for electroplating |
| JPH0748699A (en) * | 1993-08-04 | 1995-02-21 | Hasegawa Haruyuki | Lead wire of plating barrel and plating barrel using the lead wire |
| CN102422170A (en) * | 2009-03-27 | 2012-04-18 | 特拉华资本构造公司 | Scrub inducing compliant electrical contact |
| KR20130030398A (en) * | 2011-09-19 | 2013-03-27 | 최경식 | A power supplying apparatus for barrel electricity plating |
| CN202957385U (en) * | 2012-10-23 | 2013-05-29 | 许博凯 | Connector terminal structure |
| CN205029038U (en) * | 2015-09-12 | 2016-02-10 | 山东光大线路器材有限公司 | Quick energy -conserving electrical connection terminal |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070245553A1 (en) * | 1999-05-27 | 2007-10-25 | Chong Fu C | Fine pitch microfabricated spring contact structure & method |
-
2018
- 2018-06-07 CN CN201810581666.9A patent/CN109326901B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3634047A (en) * | 1970-05-04 | 1972-01-11 | Burroughs Corp | Electroplated member and method and apparatus for electroplating |
| JPH0748699A (en) * | 1993-08-04 | 1995-02-21 | Hasegawa Haruyuki | Lead wire of plating barrel and plating barrel using the lead wire |
| CN102422170A (en) * | 2009-03-27 | 2012-04-18 | 特拉华资本构造公司 | Scrub inducing compliant electrical contact |
| KR20130030398A (en) * | 2011-09-19 | 2013-03-27 | 최경식 | A power supplying apparatus for barrel electricity plating |
| CN202957385U (en) * | 2012-10-23 | 2013-05-29 | 许博凯 | Connector terminal structure |
| CN205029038U (en) * | 2015-09-12 | 2016-02-10 | 山东光大线路器材有限公司 | Quick energy -conserving electrical connection terminal |
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| Publication number | Publication date |
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| CN109326901A (en) | 2019-02-12 |
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