CN109317772B - Method for exploring laser brazing process parameters by combining experimental characterization and numerical simulation - Google Patents
Method for exploring laser brazing process parameters by combining experimental characterization and numerical simulation Download PDFInfo
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- CN109317772B CN109317772B CN201811381987.0A CN201811381987A CN109317772B CN 109317772 B CN109317772 B CN 109317772B CN 201811381987 A CN201811381987 A CN 201811381987A CN 109317772 B CN109317772 B CN 109317772B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
Abstract
The invention belongs to the field of laser brazing, and particularly relates to a method for exploring laser brazing process parameters by combining experimental representation and numerical simulation. According to the method, the microstructure and microhardness of the weldment obtained under different laser brazing process parameters (the output power of a laser, the welding time and the spot radius) are represented through experiments, and the corresponding relation between the laser brazing process and the welding quality is disclosed; establishing a correction model of welding temperature field distribution and stress-strain field of laser brazing by Comsol Multiphysics finite element analysis software, and revealing the inherent relation of laser brazing process parameters with temperature distribution and stress-strain distribution; and further guiding the laser brazing process experiment by using the correction model. The research method combining experimental representation and numerical simulation is more accurate and efficient in exploring laser brazing process parameters, and provides theoretical guidance and technical support for accurately controlling welding quality and service performance.
Description
Technical Field
The invention belongs to the field of laser brazing, and particularly relates to a method for exploring laser brazing process parameters by combining experimental representation and numerical simulation.
Background
With the development of miniaturization, refinement, light weight, and multi-functionalization of electronic devices, the packaging density of Printed Circuit Boards (PCBs) is significantly increasing, and the solder joint size and the solder leg pitch are both sharply decreasing. Based on this, laser soldering is widely used in the assembly of electronic components and the assembly of printed circuit boards due to its advantages of small heat affected zone, local heating, non-contact heating, rapid heating and rapid cooling.
The process parameters of laser brazing are the most critical factors affecting brazing performance. When the laser output power is too low, the brazing filler metal is difficult to melt, and atomic diffusion and alloying reaction between the brazing filler metal and the bonding pad are slow, as shown in fig. 2 (a); too high laser output power may result in thermal breakdown of the PCB substrate and even over-burning and damage of components on the non-soldered area around the solder joint, as shown in fig. 2 (d). Therefore, proper laser brazing process parameters are critical to achieving high quality welds.
However, the existing research on the laser brazing process generally passes a large number of groping tests, the cost is too high, the operation difficulty is high, and the process is complex, so that the method for accurately and efficiently researching the laser brazing process is imperative to find. The method can accurately know the distribution rule of the laser welding temperature field and the stress-strain field, guides practice theoretically and has important practical significance for accurately controlling the welding quality and the service performance.
Disclosure of Invention
Aiming at the defects of the prior art, the invention aims to provide a method for researching laser brazing process parameters by combining experimental characterization and numerical simulation.
In order to achieve the purpose, the invention adopts the technical scheme that:
a method for exploring laser brazing process parameters by combining experimental characterization and numerical simulation comprises the following steps:
(1) adjusting process parameters: welding the brazing filler metal/the substrate by the output power of the laser, the welding time and the spot radius;
(2) cutting, grinding, polishing and corroding the welded sample, and then characterizing and testing the sample to obtain a welding quality result;
(3) the geometric model of the temperature field and stress-strain field coupling was established using Comsol Multiphysics finite element software, according to the dimensions of the welded samples, with the following assumptions made in the numerical model: the solder material is isotropic; neglecting the reaction between the brazing filler metal/the substrate in the laser heating process; the brazing filler metal does not flow in the welding process, and the volume is not changed;
(4) optimizing the model: calculating physical property parameters of the solder alloy along with temperature change by using JMatPro material performance simulation software, and introducing the physical property parameters into the material properties of the geometric model established in the step (3); simultaneously, selecting a semi-ellipsoid heat source model as a laser heat source, and introducing the output power of a laser, the welding time, the spot radius and the laser absorption rate parameters of the brazing filler metal in a heat source phase; setting boundary conditions in sequence to obtain a correction model of temperature field and stress strain field coupling;
(5) and (3) verifying the accuracy of the correction model obtained in the step (4) by using the welding quality result obtained in the step (2) and the actually measured welding temperature, and further guiding the selection of the laser brazing process parameters by using the correction model.
In the scheme, the brazing filler metal in the step (1) is Sn3.0Ag0.5Cu lead-free brazing filler metal, and the substrate is a PCB substrate.
In the above scheme, the adjustment range of the process parameters in the step (1) is as follows: the output power of the laser is 10-20W, the brazing time is 0.3-1.0 s, and the radius of a light spot is 0.2-0.6 mm.
In the above scheme, the welding quality in the step (2) includes: appearance observation of welding spots, welding temperature, microstructure and microhardness.
In the above scheme, in the material properties in step (4), physical parameters such as density, heat capacity, thermal conductivity and the like of the material of the PCB substrate, the Cu pad and the gold-plating layer, which have low temperature variation, are set to be constant.
In the foregoing solution, the set boundary conditions include: setting boundary conditions of heat radiation and heat convection on the surface of the brazing filler metal with higher temperature and the upper surface of the substrate, wherein the radiation rates of the brazing filler metal and the substrate to the environment are 0.2-0.5 and 0.8-0.95 respectively, setting the type of convection heat transfer to be natural convection, and enabling the side surface and the lower surface of the substrate with lower temperature to be approximately thermal insulation.
In the scheme, in the temperature field correction model, the latent heat of phase change of the brazing filler metal under the action of laser is considered, and the activation energy is set to be 55-65 KJ/mol.
The invention has the following beneficial effects: according to the invention, the microstructure and microhardness of the weldment obtained under different laser brazing process parameters are represented through experiments, and the corresponding relation between the laser brazing process and the welding quality is disclosed; through Comsol
Establishing a correction model of welding temperature field distribution and stress-strain field of laser brazing by Multiphysics finite element analysis software, and revealing the internal relation of laser brazing process parameters with temperature distribution and stress-strain distribution; the temperature calculated through numerical simulation of the correction model is consistent with the temperature measured by experiments, which shows that the established correction model is consistent with the actual situation of laser brazing; the research method combining the experimental representation and numerical simulation for verifying the correctness and the reliability of the model simulation calculation result by the experimental result and further guiding the laser brazing process experiment by the simulation calculation result is more accurate and efficient in researching laser brazing process parameters and provides theoretical guidance and technical support for accurately controlling the welding quality and the service performance.
Drawings
FIG. 1 is a graph of physical property parameters of Sn3.0Cu0.5Ag solder used in Comsol Multiphysics numerical simulation as a function of temperature.
Fig. 2 is a photograph of a weld spot obtained at different laser output powers for a weld time of 0.8 s: (a) p is 10W; (b) p ═ 15W; (c) p ═ 16W; (d) p ═ 20W.
Fig. 3 is a schematic view of laser brazing (mold).
FIG. 4 is a schematic illustration of laser heat sources and boundary conditions in a Comsol Multiphysics numerical simulation.
FIG. 5 is a microstructure of a weld spot under different laser brazing process parameters: (a) p is 14W, t is 0.8 s; (b) p is 16W, t is 0.8 s; (c) p is 18W, t is 0.8 s; (d) p is 16W, t is 0.6 s; (e) p is 16W and t is 1.0 s.
FIG. 6 is the microhardness of the spot under different laser brazing process parameters: (a) under different laser output powers; (b) under different laser output time.
FIG. 7 is a temperature field plot of Comsol Multiphysics numerically simulating different laser welding process parameters: (a) p is 14W, t is 0.8 s; (b) p is 16W, t is 0.8 s; (c) p is 18W, t is 0.8 s; (d) p is 16W, t is 0.6 s; (e) p is 16W and t is 1.0 s.
FIG. 8 is a graph of the stress-strain field under the Comsol Multiphysics numerical simulation of different laser welding process parameters: (a) p is 14W, t is 0.8 s; (b) p is 16W, t is 0.8 s; (c) p is 18W, t is 0.8 s; (d) p is 16W, t is 0.6 s; (e) p is 16W and t is 1.0 s.
FIG. 9 is a graph comparing experimentally measured temperatures and simulated calculated temperatures.
FIG. 10 is a microstructure diagram of a solder joint of example 1, a temperature field diagram and a thermal stress-strain field diagram obtained by simulation.
FIG. 11 is a microstructure diagram of a solder joint of example 2, a temperature field diagram and a thermal stress-strain field diagram obtained by simulation.
FIG. 12 is a microstructure diagram of a solder joint of example 3, a temperature field diagram and a thermal stress-strain field diagram obtained by simulation.
Figure 13 is a process scheme of the process of the present invention.
Detailed Description
In order to better understand the present invention, the following examples are further provided to illustrate the present invention, but the present invention is not limited to the following examples.
Example 1
A method for exploring laser brazing process parameters by combining experiments and numerical simulation comprises the following steps:
(1) adjusting technological parameters of 12W of output power of a laser, 0.8s of welding time, 0.4mm of spot radius and the like, and welding the Sn3.0Ag0.5Cu lead-free solder/PCB substrate; the laser is a continuous semiconductor laser, the laser wavelength is 915nm, the maximum output power is 50W, and the minimum spot radius is 0.12 mm;
(2) vertically cutting the welding spot along the center of the welding spot by using a linear diamond cutting machine, then respectively polishing the longitudinal section of the welding spot by using 400-3000 # abrasive paper, then respectively polishing by using W2.5 and W0.5 diamond polishing pastes, and finally corroding by using 4% nitric acid alcohol corrosive liquid for 15 s; adjusting the magnification of a metallographic microscope, and observing the microstructure of the corroded sample; adjusting the test force of a microhardness tester to 25g, the load time to 10s, and testing the micro Vickers hardness of a sample;
(3) according to the size of a welding sample, a geometric model of coupling of a temperature field and a stress-strain field is established by using Comsol Multiphysics finite element software, and is shown in FIG. 3; the numerical model makes the following assumptions: the solder material is isotropic; neglecting the reaction between the brazing filler metal/the substrate in the laser heating process; the brazing filler metal does not flow in the welding process, and the volume does not change (neglecting volume force);
(4) calculating physical property parameters of the solder alloy along with temperature change by using JMatPro material performance simulation software, introducing the physical property parameters into material attributes of the established model, and adding a heat sourceItem, setting boundary conditions in turn; in the numerical model, setting physical parameters such as density, heat capacity, heat conductivity coefficient and the like of the materials of the PCB substrate, the Cu bonding pad and the gold-plating layer with low temperature change as constants (looking up from a material database carried by COMSOL software), wherein specific numerical values are shown in a table 1, while setting physical parameters of the brazing filler metal directly acted by laser as variables (obtained by calculating JMatPro material performance simulation software) changing along with temperature, wherein the specific numerical values are shown in the table 1 and are introduced into the material attributes of the correction model by an interpolation function; in order to make the model more consistent with the experimental result, a semi-ellipsoid heat source model is selected as the laser heat source, as shown in fig. 4(a), the heat source formula is as follows:
introducing parameters such as laser output power (P ═ 12W), soldering time (t ═ 0.8s), spot radius (a ═ 0.4mm), and laser absorption rate (α ═ 0.05) of the solder into a heat source formula; boundary conditions of heat radiation and heat convection are set on the surface of the solder having a higher temperature and the upper surface of the substrate, in which the radiation rates of the solder and the substrate to the environment are 0.5 and 0.9, respectively, and the type of convection heat transfer is set to natural convection, and the side surface and the lower surface of the substrate having a lower temperature are approximately thermally insulated, as shown in fig. 4 (b). In order to accurately simulate and calculate the temperature distribution of the laser brazing process, the activation energy is set to 65KJ/mol by considering the phase change latent heat (solid-liquid phase change) of the brazing filler metal under the action of laser.
TABLE 1 values of Material parameters
The experimental result of this example shows that the microstructure of the solder joint is mainly beta-Sn phase, and the eutectic structure is not obvious, as shown in FIG. 10 (a); the simulation result shows that the maximum temperature of the welding spot is 214 ℃, which is consistent with the actually measured welding temperature, and the simulated temperature field after the calculation is finished is shown in fig. 10 (b); the simulation results show that the thermal stress is mainly concentrated on the Cu pad, the maximum value is 306MPa, and the simulated thermal stress field after the calculation is completed is shown in fig. 10 (c). The above experimental results and numerical simulation results show that the welding temperature generated under the laser brazing process parameters of the present embodiment is low, which results in insufficient alloying reaction of the solder, less eutectic structures being generated, and less microhardness of the welding spot.
Example 2
A method for exploring laser brazing process parameters by combining experiments and numerical simulation comprises the following steps:
(1) adjusting technological parameters of 16W of output power of a laser, 0.8s of welding time, 0.4mm of spot radius and the like, and welding the Sn3.0Ag0.5Cu lead-free solder/PCB substrate; the laser is a continuous semiconductor laser, the laser wavelength is 915nm, the maximum output power is 50W, and the minimum spot radius is 0.12 mm;
(2) vertically cutting along the center of a welding spot by using a linear diamond cutting machine, then respectively polishing the longitudinal section of the welding spot by using 400-3000 # abrasive paper, then respectively polishing by using W2.5 and W0.5 diamond polishing pastes, finally corroding by using 4% nitric acid alcohol corrosive liquid for 15s, adjusting the magnification of a metallographic microscope, and observing the microstructure of a corroded sample; adjusting the test force of a microhardness tester to 25g, the load time to 10s, and testing the micro Vickers hardness of a sample;
(3) according to the size of a welding sample, a geometric model of coupling of a temperature field and a stress-strain field is established by using Comsol Multiphysics finite element software, and is shown in FIG. 3; the numerical model makes the following assumptions: the solder material is isotropic; neglecting the reaction between the brazing filler metal/the substrate in the laser heating process; the brazing filler metal does not flow in the welding process, and the volume does not change (neglecting volume force);
(4) calculating physical property parameters of the solder alloy along with temperature change by using JMatPro material performance simulation software, introducing the physical property parameters into material attributes of the built model, adding heat source items, and sequentially setting boundary conditions; in the numerical model, setting physical parameters such as density, heat capacity, heat conductivity coefficient and the like of the materials of the PCB substrate, the Cu bonding pad and the gold-plating layer with low temperature change as constants (looking up from a material database carried by COMSOL software), wherein specific numerical values are shown in a table 1, while setting physical parameters of the brazing filler metal directly acted by laser as variables (obtained by calculating JMatPro material performance simulation software) changing along with temperature, wherein the specific numerical values are shown in the table 1 and are introduced into the material attributes of the correction model by an interpolation function; in order to make the model more consistent with the experimental result, a semi-ellipsoid heat source model is selected as a laser heat source (same as example 1), and parameters of laser output power (16W), brazing time (0.8s), spot radius (0.4mm) and laser absorption rate (0.05) of brazing filler metal are introduced into a heat source phase, as shown in fig. 4 (a); boundary conditions of heat radiation and heat convection are set on the surface of the solder having a higher temperature and the upper surface of the substrate, in which the radiation rates of the solder and the substrate to the environment are 0.5 and 0.9, respectively, and the type of convection heat transfer is set to natural convection, and the side surface and the lower surface of the substrate having a lower temperature are approximately thermally insulated, as shown in fig. 4 (b). In order to accurately simulate and calculate the temperature distribution of the laser brazing process, the activation energy is set to 65KJ/mol by considering the phase change latent heat (solid-liquid phase change) of the brazing filler metal under the action of laser.
The experimental result of this example shows that the microstructure of the solder joint is a uniform granular β -Sn phase surrounded by a fine eutectic network structure, as shown in fig. 11 (a); the simulation result shows that the maximum temperature of the welding spot is 256 ℃, which is consistent with the actually measured welding temperature, and the simulation temperature field after the calculation is finished is shown in fig. 11 (b); the simulation results show that the thermal stress is mainly concentrated on the Cu pad, the maximum value is 430MPa, and the simulated thermal stress field after the calculation is completed is shown in fig. 11 (c). The above experimental results and numerical simulation results show that the welding temperature generated under the laser brazing process parameters of the present embodiment is suitable for good welding of the sn3.0ag0.5cu brazing filler metal, a fine and uniform microstructure is obtained, and the microhardness of the welding spot is large.
Example 3
A method for exploring laser brazing process parameters by combining experiments and numerical simulation comprises the following steps:
(1) adjusting technological parameters of 18W of output power of a laser, 0.8s of welding time, 0.4mm of spot radius and the like, and welding the Sn3.0Ag0.5Cu lead-free solder/PCB substrate; the laser is a continuous semiconductor laser, the laser wavelength is 915nm, the maximum output power is 50W, and the minimum spot radius is 0.12 mm;
(2) vertically cutting the welding spot along the center of the welding spot by using a linear diamond cutting machine, then respectively polishing the longitudinal section of the welding spot by using 400-3000 # abrasive paper, then respectively polishing by using W2.5 and W0.5 diamond polishing pastes, and finally corroding by using 4% nitric acid alcohol corrosive liquid for 15 s; adjusting the magnification of a metallographic microscope, and observing the microstructure of the corroded sample; adjusting the test force of a microhardness tester to 25g, the load time to 10s, and testing the micro Vickers hardness of a sample;
(3) according to the size of a welding sample, a geometric model of coupling of a temperature field and a stress-strain field is established by using Comsol Multiphysics finite element software, and is shown in FIG. 3; where the following assumptions were made in the numerical model: the solder material is isotropic; neglecting the reaction between the brazing filler metal/the substrate in the laser heating process; the brazing filler metal does not flow in the welding process, and the volume does not change (neglecting volume force);
(4) calculating physical property parameters of the solder alloy along with temperature change by using JMatPro material performance simulation software, introducing the physical property parameters into material attributes of the built model, adding heat source items, and sequentially setting boundary conditions; in the numerical model, setting physical parameters such as density, heat capacity, heat conductivity coefficient and the like of the materials of the PCB substrate, the Cu bonding pad and the gold-plating layer with low temperature change as constants (looking up from a material database carried by COMSOL software), wherein specific numerical values are shown in a table 1, while setting physical parameters of the brazing filler metal directly acted by laser as variables (obtained by calculating JMatPro material performance simulation software) changing along with temperature, wherein the specific numerical values are shown in the table 1 and are introduced into the material attributes of the correction model by an interpolation function; in order to make the model more consistent with the experimental result, a semi-ellipsoid heat source model is selected as a laser heat source (same as example 1), and parameters of laser output power (18W), brazing time (0.8s), spot radius (0.4mm) and laser absorption rate (0.05) of brazing filler metal are introduced into a heat source phase, as shown in fig. 4 (a); boundary conditions of heat radiation and heat convection are set on the surface of the solder having a higher temperature and the upper surface of the substrate, in which the radiation rates of the solder and the substrate to the environment are 0.5 and 0.9, respectively, and the type of convection heat transfer is set to natural convection, and the side surface and the lower surface of the substrate having a lower temperature are approximately thermally insulated, as shown in fig. 4 (b). In order to accurately simulate and calculate the temperature distribution of the laser brazing process, the activation energy is set to 65KJ/mol by considering the phase change latent heat (solid-liquid phase change) of the brazing filler metal under the action of laser.
The experimental result of this example shows that the microstructure of the solder joint is a relatively coarse dendritic β -Sn phase, as shown in fig. 12(a), which illustrates that the temperature generated by the laser solder process parameters of this example is relatively high; the simulation result shows that the maximum temperature of the welding spot is 287 ℃, which is consistent with the actually measured welding temperature, and the simulation temperature field after the calculation is finished is shown in fig. 12 (b); the simulation results show that the thermal stress is mainly concentrated on the Cu pad, the maximum value is 497MPa, and the simulated thermal stress field after the calculation is completed is shown in fig. 12 (c). The above experimental results and numerical simulation results show that the welding temperature generated under the laser brazing process parameters of the embodiment is higher, which results in larger beta-Sn phase growth and smaller micro-hardness of the welding spot.
In the invention, the figure 5 also shows the microstructure of the welding spot under different laser brazing process parameters, when the laser output power is 16W and the welding time is 0.8s, the beta-Sn phase is fine and uniform, as shown in figure 5 (b); FIG. 6 shows the micro-hardness of the welding spot under different laser brazing process parameters, and it can be seen from the figure that the micro-hardness of the welding spot is increased and then decreased along with the increase of the laser output power or the extension of the welding time, and the micro-hardness of the welding spot reaches the maximum value when the welding time is 0.8s when the laser output power is 16W; FIG. 7 is a temperature field diagram under different laser welding process parameters calculated by simulation, and it can be seen from the diagram that when the laser output power is 16W and the welding time is 0.8s, the temperature of a welding spot is 251-256 ℃, and the temperature range is very suitable for good welding of Sn3.0Ag0.5Cu brazing filler metal; fig. 8 is a stress-strain field diagram under different laser welding process parameters calculated by simulation, and it can be seen from the diagram that the thermal stress strain is concentrated on the Cu pad for the welded sample regardless of the welding process parameters, and the maximum thermal stress of the welded sample is 430MPa when the welding time is 0.8s at the laser output power of 16W.
It is apparent that the above embodiments are only examples for clearly illustrating and do not limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications are therefore intended to be included within the scope of the invention as claimed.
Claims (5)
1. A method for exploring laser brazing process parameters by combining experimental characterization and numerical simulation is characterized by comprising the following steps:
(1) adjusting process parameters: welding the brazing filler metal/the substrate by the output power of the laser, the welding time and the spot radius; the adjustment range of the process parameters is as follows: the output power of the laser is 10-20W, the brazing time is 0.3-1.0 s, and the radius of a light spot is 0.2-0.6 mm;
(2) cutting, grinding, polishing and corroding the welded sample, and then characterizing and testing the sample to obtain a welding quality result; the welding quality includes: appearance observation of welding spots, welding temperature, microstructure and microhardness;
(3) the geometric model of the temperature field and stress-strain field coupling was established using Comsol Multiphysics finite element software, according to the dimensions of the welded samples, with the following assumptions made in the numerical model: the solder material is isotropic; ignoring solder/substrate heating by laserBoardA reaction between them; the brazing filler metal does not flow in the welding process, and the volume is not changed;
(4) optimizing the model: calculating physical property parameters of the solder alloy along with temperature change by using JMatPro material performance simulation software, and introducing the physical property parameters into the material properties of the geometric model established in the step (3); simultaneously, selecting a semi-ellipsoid heat source model as a laser heat source, and introducing the output power of a laser, the welding time, the spot radius and the laser absorption rate parameters of the brazing filler metal in a heat source phase; setting boundary conditions in sequence to obtain a correction model of temperature field and stress strain field coupling;
(5) and (3) verifying the accuracy of the correction model obtained in the step (4) by using the welding quality result obtained in the step (2) and the actually measured welding temperature, and further guiding the selection of the laser brazing process parameters by using the correction model.
2. The method of claim 1, wherein the solder in step (1) is Sn3.0Ag0.5Cu lead-free solder, and the substrate is a PCB substrate.
3. The method of claim 1, wherein in the material properties of step (4), the density, heat capacity and thermal conductivity of the material of the PCB substrate, the Cu pads and the gold-plated layer, which have low temperature variation, are set to be constant.
4. The method of claim 1, wherein the set boundary conditions comprise: setting thermal radiation and thermal convection boundary conditions on the surface of the brazing filler metal with higher temperature and the upper surface of the substrate, wherein the radiation rates of the brazing filler metal and the substrate to the environment are 0.2-0.5 and 0.8-0.95 respectively, setting the type of convection heat transfer into natural convection, and setting the side surface and the lower surface of the substrate with lower temperature into thermal insulation.
5. The method according to claim 1, wherein in the correction model, the activation energy is set to 55-65 KJ/mol in consideration of the latent heat of phase change of the brazing filler metal by the laser.
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