CN109315068A - Circuit unit and its manufacturing method - Google Patents
Circuit unit and its manufacturing method Download PDFInfo
- Publication number
- CN109315068A CN109315068A CN201780029301.9A CN201780029301A CN109315068A CN 109315068 A CN109315068 A CN 109315068A CN 201780029301 A CN201780029301 A CN 201780029301A CN 109315068 A CN109315068 A CN 109315068A
- Authority
- CN
- China
- Prior art keywords
- circuit
- metal plate
- expose portion
- circuit unit
- electrically connected
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4084—Through-connections; Vertical interconnect access [VIA] connections by deforming at least one of the conductive layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/091—Locally and permanently deformed areas including dielectric material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Combinations Of Printed Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The present invention relates to a kind of circuit unit (1), including conductive metal sheet (20) and it is electrically connected to the circuits (10) of the metal plate (20), wherein the circuit (10) includes at least one insulating film (12,13) conductive layer (11) and at least partly covered by least one described insulating film (12,13).Furthermore, the circuit (10) includes at least one expose portion (15) in preferred join domain (14) towards the metal plate (20), in the preferred join domain (14), electrical connection between the circuit (10) and the metal plate (20) will be established and the expose portion (15) is at least partly electrically connected to the metal plate (20).In addition, the present invention relates to a kind of methods for manufacturing circuit unit (1).
Description
The present invention relates to a kind of circuit unit and a kind of method for manufacturing this circuit unit, wherein the component is substantially
But the circuit not solely by conductive metal sheet and including conductive layer forms, and wherein metal plate and circuit should be mutually electrical
Connection.
According to current practice, including with circuit, the circuit unit of the electrical connection of preferably flexible circuit is by from two sides
It is directly accessed the conductive layer of the circuit, preferably layers of copper is established, this is also referred to as " backing " structure.Therefore, institute is formed
The material for stating the conductive layer (for example, layers of copper) of circuit is exposed from two sides in the position for establishing electrical contact with conductive metal sheet.
Particularly, flexible circuit is exemplarily used for battery unit interconnection and battery cell management system with being electrically connected for another conductive member
The fields such as system.Therefore, because the miniaturization of circuit, the failure of this electrical connection typically results in the event of the unrepairable of entire product
Barrier.
However, this known manufacturing process and circuit unit have the shortcomings that it is several.Firstly, it leads to the structure of electrical connection
Such as thicker more expensive copper foil of application or any kind of mechanical strain of application is needed to eliminate solution, it is the smallest to realize
It is electrically connected intensity.Secondly, the conductive layer or layers of copper of flexible circuit in exposed at both sides in environment, and need further processing step
Suddenly enough protections are provided with the expose portion for conductive or copper circuit layer.Third uses flexible circuit in terms of providing flexibility,
And the movement of subsequent this flexible electrical conductor may cause the disconnection of electrical connection.Finally, it is desirable to provide simplify and reliable electric
Gas interconnection structure, especially for the circuit unit between the metal plate component and flexible circuit of relative stiffness.
Therefore, root problem of the invention is to provide a kind of improved circuit component configurations and manufacturing process, therefore passes through
Improve the efficiency and reliability of gained circuit unit simultaneously to reduce necessary manufacturing step and reduce manufacturing cost.
The present invention is by providing the circuit unit according to independent claims 1 and the method solution according to independent claims 7
It has determined these problems.The other embodiment of the present invention is described in dependent claims 2 to 6 and 8 to 10.
Circuit unit according to the present invention includes conductive metal sheet and the circuit for being electrically connected to the metal plate.The circuit
Including at least one insulating film and at least partly by the conductive layer of at least one described insulating film covering.In addition, the circuit
Including at least one expose portion towards the metal plate in preferred join domain, in the preferred join domain, institute
Stating the electrical connection between circuit and the metal plate will be established.The expose portion is at least partly electrically connected to the metal
Plate.
For the present invention, the expose portion of circuit be interpreted as circuit conductive layer it is not exhausted by least one insulating film
Edge.Certainly, insulating film is removed from the preferred join domain of circuit, in particular so that the electrical contact with conductive layer is available
, to obtain expose portion.
Advantageously, the conductive layer of the circuit only exposure at Minimum Area, the Minimum Area are intended to be in electrical contact with metal plate.?
Except the expose portion, conductive layer is covered by least one insulating film completely.Therefore, conductive layer is avoided to be unnecessarily exposed to
Environment influences, and the durable connection structure between circuit and the metal plate of circuit unit may be implemented.In addition, by providing electricity
This unilateral connection on road, manufacturing cost also reduce.
An advantageous embodiment of the invention includes bonder, which is arranged in the circuit and the metal
Between plate.Therefore, binding force is not only generated by electrical connection itself.Therefore, the combination of the metal plate of circuit and component is also by described
Bonder support.The higher reliability of circuit unit is provided as a result, (such as is sheared because for example preventing by separating force
Power or pulling force) caused by electrically disconnected or its risk at least significantly reduce.
According to another embodiment, the bonder surrounds the expose portion of the circuit.It is thereby achieved that such excellent
Point: circuit is sealed by the bonder of surrounding simultaneously with being electrically connected for metal plate.Thus, for example, air humidity will not influence
Electrical connection, and then its durability increases.
According to one embodiment of present invention, the circuit is flexible circuit.Particularly, flexible circuit and metal plate are provided
Electrical connection, without apply " backing " technology.Therefore, the guarantor of flexible circuit, especially conductive layer is realized through the invention
Shield and sealing, and establish economical and effective and improved circuit unit.In addition, flexible circuit preferably includes copper as conductive
Layer material.But any other advantageous conductive material can be certainly also used to conductive layer.
In of the invention another preferably and in advantageous embodiment, at least one described insulating film includes basement membrane and covering
Film, wherein cover film includes at least one expose portion, and wherein the basement membrane be located at circuit away from the metal plate
Side, especially in conductive layer side.Therefore, the expose portion being made of circuit realized by the interruption in cover film,
At the interruption, insulating layer is removed from conductive layer.Advantageously, even if basement membrane also can establishing with metal plate when being electrically connected
Support function is provided for conductive layer.Therefore, circuit and its conductive layer are adequately sealed and support, with provide circuit and metal plate it
Between the improved durability that is electrically connected.
According to another embodiment, the electrical connection between the circuit and the metal plate is established by welding, especially
Pass through ultrasonic bonding, laser welding, resistance welding, Vibration Welding or friction welding or any other welding technique appropriate.
Particularly, circuit and the metal plate property of can choose and accurate mode are electrically connected.Furthermore it is possible to be each individual circuit unit
Select suitable welding method.It is thereby achieved that effectively, inexpensive and durable electrical connection.
Following steps manufacture can be used in circuit unit as described above.First step is the preferred connection in the circuit
At least one expose portion is set in region, and thus the preferred join domain is towards metal plate.Another step is to make described lead
Electric metal plate and the circuit are aligned on the axis that the length perpendicular to the circuit extends across the expose portion.Cause
This, the circuit, the preferred join domain of the electrical connection between the conductive layer and the metal plate of the especially described circuit
It should be facing with each other in the right way.Therefore, the preferred company of the expose portion of metal plate and circuit, especially metal plate and circuit
It connects region and is preferably parallel to one another positioning.
Another step of manufacturing process be by applying mechanical force to the circuit and the metal plate along the axis, with
At least part of the expose portion establishes surface contact.In particular, surface contact can be by providing and metal plate and electricity
At least one force application apparatus (for example, two anvil blocks) that road is aligned on the same axis is realized.As a result, for example, the first anvil block
Can on the back side of the expose portion away from circuit of metal plate applied force, and the second anvil block can circuit deviate from metal
On the back side of plate, the applied force especially on the basement membrane of flexible circuit.
In addition, at least one of two anvil blocks are preferably moveable, so as to make circuit, metal plate and two
Anvil block is in contact with each other.Hereinafter, using at least one moveable anvil block, the circuit, particularly its at expose portion
Conductive layer and the metal plate can be and being pressed against on another immovable anvil block in preferred join domain
Place carries out surface contact.Certainly, both anvil block or force application apparatus can also be moved relative to each other along alignment axis.
Final step according to the method for manufacture circuit unit is to establish to be electrically connected between the circuit and the metal plate
It connects.In particular, electrical connection should be established as firmly connecting.This means that the electrical connection of the circuit and the metal plate must quilt
It is interpreted as the component being fixed to one another.It thus provides reliable electrical connection, any unnecessary without showing during use
Signs of wear.
For another embodiment of this method, establishing the step of surface contacts and establishes electrical connection is to carry out simultaneously
's.Particularly, it establishes and is electrically connected while force transfering device (for example, two anvil blocks) provide the surface contact of circuit and metal plate
It connects.Therefore, the region of circuit and metal plate is electrically connected to each other in a precise manner, because the electrical connection is arranged in circuit and metal
At the surface area contact of plate.
Therefore, force transfering device (for example, two anvil blocks) be preferably configured to not only applied force with realize surface contact, but also
Also any kind of energy is provided to establish electrical connection between the two parts for circuit and metal plate.Therefore, described two anvils
Seat can be designed as weld anvil.
For another embodiment, using bonder the circuit is selectively adhered to the metal plate
On.Therefore, bonder can be applied between circuit and metal plate before or after being electrically connected foundation.Particularly, lead to
It crosses and bonder is provided after adhesion process, can correspondingly seal the electrical connection of foundation.In addition, the company of circuit and metal plate
It connects and is in addition supported by bonder.Therefore, any kind of separating force being applied in electrical connection, such as shearing force or pulling force,
It can be received at least partially through bonding connection.It can thus be avoided or at least substantially reducing since application external force causes
Electrical connection destruction.
According to another embodiment, the circuit for being selectively adhered to by bonder in scheduled join domain
On the metal plate.Therefore, the bonder is applied to the cover film of metal plate or circuit, especially insulator chain, is fitted
For providing the pre-determined bit for being used for alignment circuit and metal plate.Term " predetermined join domain " then means further connecting
The preferred join domain of circuit and metal plate is identified and limited before process.Therefore, realizing that surface connects by force transfering device
Before touching, the process realized surface contact and establish electrical connection can simplify by being aligned in advance.In addition, circuit and metal plate can
To be electrically connected to each other, and it is unrelated with their direction in space.Thus, for example, circuit can be positioned at metal plate top or under
Side or two components can be located adjacent to, such as are aligned along horizontal axis.Then, pass through the choosing of bonder
The bonding of selecting property is conducive to manufacturing process and manufacturing process is divided into single step easy to carry out.In addition, thus reducing
Manufacturing cost and for effort needed for providing the reliable electrical connection of high quality.
Hereinafter, by reference to included attached drawing, the present invention will be described in more detail.However, should not exclude of the invention
Further it is contemplated that example.
Therefore, these schematically illustrate:
Fig. 1 is according to the present invention for manufacturing the cross-sectional view of the device of an example of circuit unit；With
Fig. 2 is the example of the viewgraph of cross-section of circuit unit according to the present invention.
Fig. 1 shows metal plate 20 and circuit 10, especially flexible circuit 10 comprising the conductive layer being preferably made of copper
11.Conductive layer 11 is insulated by cover film 12 on the first side, and is insulated on the second side by basement membrane 13.Flexible circuit 10
So that mode of the cover film 12 in face of the surface of metal plate is arranged.Cover film 12 is interrupted in preferred join domain 14, by
This provides the expose portion 15 of circuit 10, especially its conductive layer 11.Therefore, expose portion 15 faces metal plate 20.With this phase
Instead, basement membrane 13 is the pantostrat of abundant support conductive layer 11, to realize the necessary stability of flexible circuit 10.
In addition, the metal plate 20 and the flexible circuit 10 are aligned with each other along alignment axis X.However, alignment axis
The axis of symmetry of expose portion 15 is not necessarily represented.Particularly, the preferred join domain 24 of metal plate 20 and flexible circuit 10
It is preferred that join domain 14 is facing with each other.Then, the preferred join domain 24 of the expose portion 15 of flexible circuit 10 and metal plate 20
Alignment.However, the expose portion 15 of flexible circuit 10 may include any geometry being contemplated that and appropriate to provide flexibility
Electrical contact between circuit 10 and metal plate 20.
According to Fig. 1, bonder is applied on cover film 12 before adhesion technique, especially to lead in circuit 10
Electrical connection is provided between electric layer 11 and metal plate 20.Therefore, the flexible circuit 10 and the metal plate 20 especially include sudden and violent
Each preferred join domain 14,24 of dew part 15 is pre-positioned relative to each other along alignment axis X.Therefore, the bonding
Device 16 surrounds preferred join domain 14, and the expose portion 15 of especially circuit 10.Then, applied bonder 16
Shape preferably correspond to flexible circuit 10 expose portion 15 geometry.
In addition, the first weld anvil 30 and the second weld anvil 40 are also aligned along axis X.Therefore, two weld anvils 30,
40 represent force transfering device according to the present invention.According to Fig. 1, the first weld anvil 30 is located in above metal plate, the second welding
Anvil block 40 is located in 10 lower section of flexible circuit.It is removable by two weld anvils 30, at least one of 40, it can be in circuit
Applied force on component, to realize at least part and the preferred join domain of metal plate 20 of the expose portion 15 of flexible circuit 10
Surface contact between 24.Certainly, two anvil blocks also can be set into can relatively move along axis X.Therefore, once the second anvil
Seat 40 is contacted with the basement membrane of flexible circuit 10, and deformation force is applied to flexible circuit 10, leads to the conductive layer at expose portion 15
Surface between 11 and metal plate 20 contacts.By preferably providing surface contact and establishing electrical connection, adhesion process example simultaneously
Such as carried out according to any welding procedure.
In fig. 2 it is shown that circuit unit 1, is generated by the manufacturing process that reference Fig. 1 is described.Metal plate 20 and flexibility
Circuit 10 is electrically connected to each other by adhesion technique.Particularly, the conductive layer 11 and metal at the expose portion 15 of flexible circuit 10
The deformation that electrical connection between the preferred join domain 24 of plate 20 has passed through flexible circuit 10 is realized, especially by conductive layer
11 and basement membrane 13 deformation and subsequent welding procedure formed.Therefore, basement membrane 13 is that the conductive layer 11 being preferably made of copper mentions
For mechanical support.
In addition, Fig. 2 shows electrical connections to be present at least part of initial expose portion 15 of circuit 10.Therefore, all
The bonder 16 enclosed represents the sealing for electrical connection, influences to avoid on any environment of electrical connection.Therefore, according to this hair
The shown example of bright circuit unit 1 can be potential to solve the problems, such as by providing improved structure, which can be in letter
Change and reduce and realized in the manufacturing process of cost, and at the same time improving the efficiency and reliability of gained circuit.
Reference signs list
X alignment axis
1 circuit unit
10 (flexibility) circuits
11 conductive layers
12 cover films
13 basement membranes
14 ((flexibility) circuit) preferred join domains
15 expose portions
16 bonders
20 metal plates
24 (metal plate) preferred join domains
30 first weld anvils
40 second weld anvils
Claims (10)
1. a kind of circuit unit (1), comprising:
Conductive metal sheet (20), and
It is electrically connected to the circuit (10) of the metal plate (20),
Wherein the circuit (10) includes at least one insulating film (12,13) and at least partly by least one described insulating film
(12,13) conductive layer (11) covered,
Wherein the circuit (10) includes at least one exposure in preferred join domain (14) towards the metal plate (20)
Partially (15), in the preferred join domain (14), described between the circuit (10) and the metal plate (20) is electrically connected
Connecing will be established,
And wherein the expose portion (15) is at least partly electrically connected to the metal plate (20).
2. circuit unit (1) according to claim 1, wherein being mentioned between the circuit (10) and the metal plate (20)
For bonder (16).
3. circuit unit (1) according to claim 2, wherein the bonder (16) surrounds the institute of the circuit (10)
State expose portion (15).
4. the circuit unit according to one of preceding claims (1), wherein the circuit (10) is flexible circuit.
5. the circuit unit according to one of preceding claims (1), wherein at least one described insulating film (12,13) includes
Basement membrane (13) and cover film (12), wherein the cover film (12) includes at least one described expose portion (15), and wherein
The basement membrane (13) is located at the side away from the metal plate (20) of circuit (10).
6. the circuit unit according to one of preceding claims (1), wherein the circuit (10) and the metal plate (20)
Between the electrical connection by welding establish, especially by ultrasonic bonding, laser welding, resistance welding, Vibration Welding
Or friction welding.
7. the method for manufacturing circuit unit according to any one of claim 1 to 6 (1), comprising the following steps:
At least one described expose portion (15) is set in the preferred join domain (14) of the circuit (10), it is thus described
It is preferred that join domain (14) is towards the metal plate (20)；
The conductive metal sheet (20) and the circuit (10) is set to extend across institute in the length perpendicular to the circuit (10)
It states and is aligned on the axis (X) of expose portion (15)；
By applying mechanical force to the circuit (10) and the metal plate (20) along the axis (X), with the expose portion
(15) at least part establishes surface contact；With
Electrical connection is established between the circuit (10) and the metal plate (20).
8. according to the method described in claim 7, wherein described establish surface contact and establish the step of being electrically connected while carrying out.
9. method according to claim 7 or 8, wherein the bonder (16) being applied to choose property by the electricity
Road (10) is adhered on the metal plate (20).
10. method according to claim 7 or 8, wherein the bonder (16) is by application in scheduled bonding pad
Selectively the circuit (10) is adhered on the metal plate (20) in domain.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/152,218 US9844146B2 (en) | 2016-05-11 | 2016-05-11 | Electrical circuitry assembly and method for manufacturing the same |
| DE202016102522.2U DE202016102522U1 (en) | 2016-05-11 | 2016-05-11 | Electrical conductor assembly |
| US15/152,218 | 2016-05-11 | ||
| DE202016102522.2 | 2016-05-11 | ||
| PCT/EP2017/061210 WO2017194618A1 (en) | 2016-05-11 | 2017-05-10 | Electrical circuitry assembly and method for manufacturing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109315068A true CN109315068A (en) | 2019-02-05 |
Family
ID=58699135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780029301.9A Pending CN109315068A (en) | 2016-05-11 | 2017-05-10 | Circuit unit and its manufacturing method |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP3456161A1 (en) |
| CN (1) | CN109315068A (en) |
| MX (1) | MX2018013731A (en) |
| WO (1) | WO2017194618A1 (en) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5526563A (en) * | 1994-03-10 | 1996-06-18 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing an electronic component |
| CN1225790A (en) * | 1997-03-12 | 1999-08-11 | 精工爱普生株式会社 | Electronic parts module and electric equipment |
| WO1999049708A1 (en) * | 1998-03-27 | 1999-09-30 | Minnesota Mining And Manufacturing Company | Method for making electrical connections between conductors separated by a dielectric |
| TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
| CN1527657A (en) * | 2003-02-27 | 2004-09-08 | 株式会社山武 | Electric circuit base board assembling body |
| CN1898764A (en) * | 2003-12-26 | 2007-01-17 | 索尼化学株式会社 | Connecting structure and connecting method of circuit |
| DE102005035102A1 (en) * | 2005-07-27 | 2007-02-01 | Robert Bosch Gmbh | Electrically conductive connection and method for producing such |
| CN1918583A (en) * | 2004-02-06 | 2007-02-21 | 日立化成工业株式会社 | Electronic device |
| CN101406112A (en) * | 2006-03-20 | 2009-04-08 | 住友电木株式会社 | Circuit board and connection substrate |
| CN101448359A (en) * | 2007-11-29 | 2009-06-03 | 三星电子株式会社 | Printed circuit board assembly and manufacturing method for the same |
| CN102065645A (en) * | 2009-11-17 | 2011-05-18 | 王定锋 | Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof |
| CN202496133U (en) * | 2012-02-28 | 2012-10-17 | 比亚迪股份有限公司 | Integrated flexible printed circuit board |
-
2017
- 2017-05-10 MX MX2018013731A patent/MX2018013731A/en unknown
- 2017-05-10 WO PCT/EP2017/061210 patent/WO2017194618A1/en unknown
- 2017-05-10 CN CN201780029301.9A patent/CN109315068A/en active Pending
- 2017-05-10 EP EP17722769.1A patent/EP3456161A1/en not_active Withdrawn
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5526563A (en) * | 1994-03-10 | 1996-06-18 | Matsushita Electric Industrial Co., Ltd. | Method for manufacturing an electronic component |
| CN1225790A (en) * | 1997-03-12 | 1999-08-11 | 精工爱普生株式会社 | Electronic parts module and electric equipment |
| WO1999049708A1 (en) * | 1998-03-27 | 1999-09-30 | Minnesota Mining And Manufacturing Company | Method for making electrical connections between conductors separated by a dielectric |
| TW486721B (en) * | 2000-08-30 | 2002-05-11 | Acer Display Tech Inc | Plasma display having auxiliary bonding pad |
| CN1527657A (en) * | 2003-02-27 | 2004-09-08 | 株式会社山武 | Electric circuit base board assembling body |
| CN1898764A (en) * | 2003-12-26 | 2007-01-17 | 索尼化学株式会社 | Connecting structure and connecting method of circuit |
| CN1918583A (en) * | 2004-02-06 | 2007-02-21 | 日立化成工业株式会社 | Electronic device |
| DE102005035102A1 (en) * | 2005-07-27 | 2007-02-01 | Robert Bosch Gmbh | Electrically conductive connection and method for producing such |
| CN101406112A (en) * | 2006-03-20 | 2009-04-08 | 住友电木株式会社 | Circuit board and connection substrate |
| CN101448359A (en) * | 2007-11-29 | 2009-06-03 | 三星电子株式会社 | Printed circuit board assembly and manufacturing method for the same |
| CN102065645A (en) * | 2009-11-17 | 2011-05-18 | 王定锋 | Double-sided printed circuit board (PCB) with elements and mutual conductance method thereof |
| CN202496133U (en) * | 2012-02-28 | 2012-10-17 | 比亚迪股份有限公司 | Integrated flexible printed circuit board |
Non-Patent Citations (1)
| Title |
|---|
| 于宏彦等: "《机械制造技术与生产模式实务全书》", 31 July 2003 * |
Also Published As
| Publication number | Publication date |
|---|---|
| EP3456161A1 (en) | 2019-03-20 |
| MX2018013731A (en) | 2019-08-01 |
| WO2017194618A1 (en) | 2017-11-16 |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190205 |