CN109300818A - A kind of processing unit (plant) of epitaxial substrate - Google Patents
A kind of processing unit (plant) of epitaxial substrate Download PDFInfo
- Publication number
- CN109300818A CN109300818A CN201811255887.3A CN201811255887A CN109300818A CN 109300818 A CN109300818 A CN 109300818A CN 201811255887 A CN201811255887 A CN 201811255887A CN 109300818 A CN109300818 A CN 109300818A
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- dust
- support frame
- workbench
- pusher
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 65
- 238000000605 extraction Methods 0.000 claims abstract description 24
- 239000000428 dust Substances 0.000 claims description 29
- 239000000463 material Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000005520 cutting process Methods 0.000 abstract description 14
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000000407 epitaxy Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Abstract
The invention discloses a kind of processing unit (plant)s of epitaxial substrate, its structure includes workbench, support frame is provided on the workbench, placement plate, dust-extraction unit and fixed link, support frame as described above is fixedly connected on the upper surface of the workbench, the placement plate is fixedly connected on the inside of support frame as described above, the dust-extraction unit is fixedly connected on the right side of the workbench bottom, the fixed link is fixedly connected on the right side of the placement plate, the first pusher and the second pusher are provided on support frame as described above, first pusher is fixedly connected on the middle of support frame as described above upper end, second pusher is fixedly connected on the right side of support frame as described above upper end.The stability that invention enhances substrates in cutting process reduces the probability damaged during substrate cut, the accuracy of length when improving substrate cut, and the substrate avoided under cutting collides with workbench, improves the quality of substrate processing environment.
Description
Technical field
The present invention relates to processing unit (plant) technical field, specially a kind of processing unit (plant) of epitaxial substrate.
Background technique
Currently, there is also the places of some shortcomings for the processing unit (plant) of existing epitaxial substrate, such as；Existing epitaxy base
The processing unit (plant) of plate is typically directly placed a substrate on workbench and is cut, and reduces substrate in cutting process
Stability improves the probability damaged during substrate cut, the accuracy of length when reducing substrate cut, and works as substrate
After the completion of cutting, the part under cutting can directly be fallen on workbench, and the substrate and workbench being easy to cause under cutting occur
Collision, the processing unit (plant) of existing epitaxial substrate cannot remove the dust generated during substrate cut, drop in use
The low quality of substrate processing environment.It is solved for this reason, it may be necessary to design new technical solution and give.
Summary of the invention
The purpose of the present invention is to provide a kind of processing unit (plant)s of epitaxial substrate, solve and ask proposed in background technique
Topic.
To achieve the above object, the invention provides the following technical scheme: a kind of processing unit (plant) of epitaxial substrate, including work
Platform, support frame, placement plate, dust-extraction unit and fixed link are provided on the workbench, and support frame as described above is fixedly connected on described
The upper surface of workbench, the placement plate are fixedly connected on the inside of support frame as described above, and the dust-extraction unit is fixedly connected on institute
The right side of workbench bottom is stated, the fixed link is fixedly connected on the right side of the placement plate, and is provided on support frame as described above
One pusher and the second pusher, first pusher are fixedly connected on the middle of support frame as described above upper end, and described second
Pusher is fixedly connected on the right side of support frame as described above upper end, and the first catch bar, institute are provided with below first pusher
The lower end for stating the first catch bar is provided with limit plate, is provided with the second catch bar below second pusher, and described second
Driving motor is provided with below catch bar, the left end of the driving motor is provided with cutter, sets on the right side of the placement plate
Be equipped with graduated scale, the upper end of the fixed link is provided with buffer board, be provided on the dust-extraction unit dust sucting motor, sweep-up pipe,
Delivery pipe and dress dirt room, the dust sucting motor are fixedly connected on the right side inside the dust-extraction unit, and the sweep-up pipe is fixed to be connected
It connects in the upper end of the dust sucting motor, the delivery pipe is fixedly connected on the left end of the dust sucting motor.
As a kind of preferred embodiment of the invention, the limit plate passes through the lower end of screw thread and first catch bar
It is connected, the right end of the right end of the limit plate and the placement plate is in same level.
As a kind of preferred embodiment of the invention, the cutter are connected by rivet with the driving motor,
And there is the gap of 5mm with the right end of the limit plate and placement plate.
As a kind of preferred embodiment of the invention, the fixed link is connected by rivet with the workbench, institute
It states buffer board and is connected by screw thread with the upper end of the fixed link, the buffer board is arc-shaped.
As a kind of preferred embodiment of the invention, the sweep-up pipe is made of the material of PVC, the sweep-up pipe
Upper end passes through the inside of the dust-extraction unit, and is located at the right end of the placement plate, and the other end of the sweep-up pipe passes through riveting
Nail is connected with the dust sucting motor.
Compared with prior art, beneficial effects of the present invention are as follows:
1, the present invention is first put substrate in placement plate by the combination of placement plate, limit plate and graduated scale, then root again
The length of substrate cut is determined according to graduated scale, is then again pushed down on limit plate by the first catch bar by the first pusher
It is dynamic, so that substrate is firmly fixed in placement plate, stability of the substrate in cutting process is effectively enhanced, is reduced
The probability damaged during substrate cut, the accuracy of length when improving substrate cut.
2, the present invention is by the increase of buffer board, and after the completion of substrate cut, the part under cutting can be sliding by buffer board
It falls on workbench, the substrate effectively avoided under cutting collides with workbench, complete after improving substrate cut
Property.
3, the increase of the invention by dust-extraction unit, dust sucting motor during substrate cut inside dust-extraction unit are logical
It crosses sweep-up pipe to absorb the dust of generation, then dust is transported to by delivery pipe the inside of dress dirt room again, it can be effective
The dust generated during substrate cut is removed, the quality of substrate processing environment is improved.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is a kind of main view of the processing unit (plant) of epitaxial substrate of the present invention；
Fig. 2 is a kind of dust-extraction unit interior views of the processing unit (plant) of epitaxial substrate of the present invention；
Fig. 3 is a kind of partial view of the processing unit (plant) of epitaxial substrate of the present invention.
In figure: workbench 1, support frame 2, placement plate 3, dust-extraction unit 4, fixed link 5, the first pusher 6, the second pusher
7, the first catch bar 8, limit plate 9, the second catch bar 10, driving motor 11, cutter 12, graduated scale 13, buffer board 14, dust suction
Motor 15, sweep-up pipe 16, delivery pipe 17, dress dirt room 18.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
Fig. 1-3 is please referred to, the present invention provides a kind of technical solution: a kind of processing unit (plant) of epitaxial substrate, including workbench
1, support frame 2, placement plate 3, dust-extraction unit 4 and fixed link 5 are provided on the workbench 1, and support frame as described above 2 is fixedly connected on
The upper surface of the workbench 1, the placement plate 3 are fixedly connected on the inside of support frame as described above 2, and the dust-extraction unit 4 is fixed
It is connected to the right side of 1 bottom of workbench, the fixed link 5 is fixedly connected on the right side of the placement plate 3, support frame as described above
The first pusher 6 and the second pusher 7 are provided on 2, first pusher 6 is fixedly connected on 2 upper end of support frame as described above
Middle, second pusher 7 are fixedly connected on the right side of 2 upper end of support frame as described above, and the lower section of first pusher 6 is set
It is equipped with the first catch bar 8, the lower end of first catch bar 8 is provided with limit plate 9, the lower section setting of second pusher 7
There is the second catch bar 10, the lower section of second catch bar 10 is provided with driving motor 11, and the left end of the driving motor 11 is set
Cutter 12 are equipped with, the right side of the placement plate 3 is provided with graduated scale 13, and the upper end of the fixed link 5 is provided with buffer board 14,
It is solid that dust sucting motor 15, sweep-up pipe 16, delivery pipe 17 and dress dirt room 18, the dust sucting motor 15 are provided on the dust-extraction unit 4
Surely it is connected to the right side inside the dust-extraction unit 4, the sweep-up pipe 16 is fixedly connected on the upper end of the dust sucting motor 15, institute
The left end that delivery pipe 17 is fixedly connected on the dust sucting motor 15 is stated, (as shown in Figure 1, Figure 2 and Figure 3) pass through is put in the present embodiment
The combination of plate 3, limit plate 9 and graduated scale 13 is set, first puts substrate in placement plate 3, then further according to graduated scale 13
It determines the length of substrate cut, is then again pushed down on limit plate 9 by the first catch bar 8 by the first pusher 6, so that
Substrate is firmly fixed in placement plate 3, stability of the substrate in cutting process is effectively enhanced, reduces substrate and cut
The probability damaged during cutting, the accuracy of length works as substrate cut by the increase of buffer board 14 when improving substrate cut
After the completion, the part under cutting can be slipped on workbench 1 by buffer board 14, effectively avoid substrate and work under cutting
Make platform 1 to collide, the integrality after improving substrate cut, through the increase of dust-extraction unit 4, during substrate cut
Dust sucting motor 15 inside dust-extraction unit 4 is absorbed the dust of generation by sweep-up pipe 16, then again will by delivery pipe 17
Dust is transported to the inside of dress dirt room 18, can effectively remove the dust generated during substrate cut, improves substrate processing
The quality of environment.
(Fig. 1 is please referred to) in the present embodiment, and the limit plate 9 is connected by screw thread with the lower end of first catch bar 8
It connects, for the right end of the right end of the limit plate 9 and the placement plate 3 in same level, its role is to can effectively enhance
Stability during substrate cut.
(Fig. 1 is please referred to) in the present embodiment, the cutter 12 are connected by rivet with the driving motor 11, and
There is the gap of 5mm with the right end of the limit plate 9 and placement plate 3, its role is to when can effectively raise substrate cut
Accuracy.
(Fig. 3 is please referred to) in the present embodiment, and the fixed link 5 is connected by rivet with the workbench 1, the buffering
Plate 14 is connected by screw thread with the upper end of the fixed link 5, and the buffer board 14 is arc-shaped, and its role is to can effectively mention
The high protective effect to substrate.
(please refer to Fig. 2) in the present embodiment, the sweep-up pipe 16 is made of the material of PVC, the sweep-up pipe 16 it is upper
End is located at the right end of the placement plate 3 across the inside of the dust-extraction unit 4, and the other end of the sweep-up pipe 16 passes through
Rivet is connected with the dust sucting motor 15, and its role is to can effectively remove the dust generated during substrate cut.
When the processing unit (plant) of epitaxial substrate uses, substrate is put in placement plate 3 first, then further according to quarter
Ruler 13 is spent to determine the length of substrate cut, is then again pushed down on limit plate 9 by the first catch bar 8 by the first pusher 6
It is dynamic, so that substrate is firmly fixed in placement plate 3, then will be driven by the second pusher 7 by the second catch bar 10 again
Dynamic motor 11 pushes down on, and then drives cutter 12 to be rotated by driving motor 11 again, so that substrate is cut,
After the completion of substrate cut, the part under cutting can be slipped on workbench 1 by buffer board 14, during substrate cut
Dust sucting motor 15 inside dust-extraction unit 4 is absorbed the dust of generation by sweep-up pipe 16, then again will by delivery pipe 17
Dust is transported to the inside of dress dirt room 18.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, for this field skill
For art personnel, it is clear that invention is not limited to the details of the above exemplary embodiments, and without departing substantially from spirit of the invention or
In the case where essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action
Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that including all changes that fall within the meaning and scope of the equivalent elements of the claims in the present invention
It is interior.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (5)
1. a kind of processing unit (plant) of epitaxial substrate, including workbench (1), it is characterised in that: be provided with branch on the workbench (1)
Support (2), placement plate (3), dust-extraction unit (4) and fixed link (5), support frame as described above (2) are fixedly connected on the workbench (1)
Upper surface, the placement plate (3) is fixedly connected on the inside of support frame as described above (2), and the dust-extraction unit (4) is fixedly connected on
The right side of workbench (1) bottom, the fixed link (5) are fixedly connected on the right side of the placement plate (3), support frame as described above
(2) the first pusher (6) and the second pusher (7) are provided on, first pusher (6) is fixedly connected on support frame as described above
(2) middle of upper end, second pusher (7) are fixedly connected on the right side of support frame as described above (2) upper end, and described first pushes away
It is provided with the first catch bar (8) below dynamic device (6), the lower end of first catch bar (8) is provided with limit plate (9), described
It is provided with below second pusher (7) the second catch bar (10), driving electricity is provided with below second catch bar (10)
The left end of machine (11), the driving motor (11) is provided with cutter (12), is provided with graduated scale on the right side of the placement plate (3)
(13), the upper end of the fixed link (5) is provided with buffer board (14), be provided on the dust-extraction unit (4) dust sucting motor (15),
Sweep-up pipe (16), delivery pipe (17) and dress dirt room (18), the dust sucting motor (15) are fixedly connected in the dust-extraction unit (4)
The right side in portion, the sweep-up pipe (16) are fixedly connected on the upper end of the dust sucting motor (15), and the delivery pipe (17) is fixed to be connected
Connect the left end in the dust sucting motor (15).
2. a kind of processing unit (plant) of epitaxial substrate according to claim 1, it is characterised in that: the limit plate (9) passes through
Screw thread is connected with the lower end of first catch bar (8), the right end of the limit plate (9) and the right end of the placement plate (3)
In same level.
3. a kind of processing unit (plant) of epitaxial substrate according to claim 1, it is characterised in that: the cutter (12) pass through
Rivet is connected with the driving motor (11), and has the gap of 5mm with the right end of the limit plate (9) and placement plate (3).
4. a kind of processing unit (plant) of epitaxial substrate according to claim 1, it is characterised in that: the fixed link (5) passes through
Rivet is connected with the workbench (1), and the buffer board (14) is connected by screw thread with the upper end of the fixed link (5),
The buffer board (14) is arc-shaped.
5. a kind of processing unit (plant) of epitaxial substrate according to claim 1, it is characterised in that: the sweep-up pipe (16) uses
The material of PVC makes, and the upper end of the sweep-up pipe (16) passes through the inside of the dust-extraction unit (4), and is located at the placement
The other end of the right end of plate (3), the sweep-up pipe (16) is connected by rivet with the dust sucting motor (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811255887.3A CN109300818A (en) | 2018-10-26 | 2018-10-26 | A kind of processing unit (plant) of epitaxial substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811255887.3A CN109300818A (en) | 2018-10-26 | 2018-10-26 | A kind of processing unit (plant) of epitaxial substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109300818A true CN109300818A (en) | 2019-02-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811255887.3A Pending CN109300818A (en) | 2018-10-26 | 2018-10-26 | A kind of processing unit (plant) of epitaxial substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109300818A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010056549A (en) * | 2008-08-26 | 2010-03-11 | Rin Tenzai | Method of cutting led, and product thereof |
| CN105261782A (en) * | 2015-11-12 | 2016-01-20 | 武汉海王新能源工程技术有限公司 | Automatic plate wrapping machine for storage battery |
| CN106695517A (en) * | 2017-03-16 | 2017-05-24 | 贾爱忠 | Cutting device for solar panel for environment-friendly power station |
| CN107717099A (en) * | 2017-10-30 | 2018-02-23 | 无锡威伟矿冶设备制造有限公司 | A kind of laminator cutter device |
| CN108206224A (en) * | 2017-12-29 | 2018-06-26 | 浙江紫微新材料有限公司 | A kind of solar energy back plate protective film rewinding cutting means easy to use |
| CN108608475A (en) * | 2018-04-25 | 2018-10-02 | 佛山聚晨知识产权运营有限公司 | A kind of thermal insulation board smart-cut manufacturing machine |
| CN208970487U (en) * | 2018-10-26 | 2019-06-11 | 张婷 | A kind of processing unit (plant) of epitaxial substrate |
-
2018
- 2018-10-26 CN CN201811255887.3A patent/CN109300818A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010056549A (en) * | 2008-08-26 | 2010-03-11 | Rin Tenzai | Method of cutting led, and product thereof |
| CN105261782A (en) * | 2015-11-12 | 2016-01-20 | 武汉海王新能源工程技术有限公司 | Automatic plate wrapping machine for storage battery |
| CN106695517A (en) * | 2017-03-16 | 2017-05-24 | 贾爱忠 | Cutting device for solar panel for environment-friendly power station |
| CN107717099A (en) * | 2017-10-30 | 2018-02-23 | 无锡威伟矿冶设备制造有限公司 | A kind of laminator cutter device |
| CN108206224A (en) * | 2017-12-29 | 2018-06-26 | 浙江紫微新材料有限公司 | A kind of solar energy back plate protective film rewinding cutting means easy to use |
| CN108608475A (en) * | 2018-04-25 | 2018-10-02 | 佛山聚晨知识产权运营有限公司 | A kind of thermal insulation board smart-cut manufacturing machine |
| CN208970487U (en) * | 2018-10-26 | 2019-06-11 | 张婷 | A kind of processing unit (plant) of epitaxial substrate |
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Application publication date: 20190201 |