CN109300638A - Anti- power frequency arc extinguishing encapsulation piezoresistor and packaging method - Google Patents
Anti- power frequency arc extinguishing encapsulation piezoresistor and packaging method Download PDFInfo
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- CN109300638A CN109300638A CN201811424882.9A CN201811424882A CN109300638A CN 109300638 A CN109300638 A CN 109300638A CN 201811424882 A CN201811424882 A CN 201811424882A CN 109300638 A CN109300638 A CN 109300638A
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- quartz sand
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- outer shell
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/10—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material voltage responsive, i.e. varistors
- H01C7/12—Overvoltage protection resistors
- H01C7/126—Means for protecting against excessive pressure or for disconnecting in case of failure
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/02—Housing; Enclosing; Embedding; Filling the housing or enclosure
- H01C1/032—Housing; Enclosing; Embedding; Filling the housing or enclosure plural layers surrounding the resistive element
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Thermistors And Varistors (AREA)
Abstract
A kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, are to be packaged in chip varistor external application insulated plastic and the mixing of preventing arc material to chip varistor；Or outside chip varistor then the conformal layer of first encapsulating insulation encapsulates insulated plastic and preventing arc mixing material again；Or again in one layer of protective layer that fixes the sand of its outer encapsulating after the completion of above-mentioned encapsulation.Preventing arc material first choice quartz sand or silanised quartz, insulating materials first choice epoxy resin, silicone resin, silicone resin, silicon rubber.The characteristics of being lower than zinc oxide pressure-sensitive device fusing point using quartz sand softening temperature by fixed quartz sand position, the SiO2 melted first in chip varistor deterioration process can be repaired to pressure-sensitive device, be blocked the generation of its deterioration process.Power frequency tolerance, tension arc and the antisurge impact capacity for the pressure-sensitive device that the present invention encapsulates all improve a lot, while manufacturing cost also has certain decline.
Description
Technical field
The present invention relates to technical field of electronic devices, in particular to the structure and envelope of the varistor with high arc extinction performance
Dress method.
Technical background
Varistor is widely used in due to its outstanding surge pulse response time and powerful electric current handling capacity
In the surge protection circuit of various circuits.But he has a fatal weakness, that is, in the effect of continuous power-frequency voltage
Under, it has lasting leakage current and generates, and constantly destroy pressure-sensitive immanent structure, so that leakage current channel impedance gradually becomes
Small, leakage current expands.With the degeneration of pressure-sensitive device performance or the fluctuation of power-frequency voltage, pressure-sensitive crystal part burn through is finally resulted in
Arcing even occurs, electric arc is ionized the media such as the air, moisture, epoxy of surrounding, forms open fire, leads to burning machine even fire
Calamity.The usual outer temperature of arc is 1500~1600 DEG C, and temperature is then up to 2500~3500 DEG C in arc.
The serious is, it is different from metallic short circuit, it is that the formation of this burning does not need too big leakage current, as long as reaching
It may occur to mA grades；So other overcurrent protection circuits, such as fuse, air switch etc. will not generate protection
Movement, therefore more difficult protection, it is extremely dangerous.
When metallic short circuit occurs, for high current by biggish contact resistance, metal molten can be made by forming high temperature.After fusing
Metal can be shrunk to spherical shape under the action of surface tension, make Circuit Interrupt.Although metallic short circuit hazard of catch fire is big,
As long as the validity installed short circuit protection electric appliance by code requirement and it is kept to protect, this short circuit and fire hazard are not difficult to avoid.
But pressure-sensitive power frequency failure can't generate this movement disconnected automatically.
Other two kinds of failure modes of varistor have: bursting under shortwave heavy current impact and climbing electric arcing (also referred to as
Side dodge) caused by short circuit.It bursts under the Short wave impact typically occurred within 50us, when surge energy is much higher by pressure-sensitive suction
When receiving power, it may occur that burst phenomenon.And failure mode of perforating then occurs mainly in the work of electric current of the pulse width greater than 100us
Under.Climb failure caused by power mode then may all occur in both cases.
If applying the voltage for being not more than 300V between conductor, no matter how small the air gap is between conductor, gap is will not
Puncture arcing.If the air gap is 10mm, need the voltage for applying 3kV that could puncture arcing.Maintain the electric arc of this 10mm
Only need the voltage of 20V.The local temperature of electric arc is very high, can ignite near combustible, become the origin of fire.Electric wiring
Short circuit and fire hazard be mostly it is arc resistance short circuit rather than metallic short circuit cause.
In SPD lightning protection component, to prevent what chip varistor from bearing long-term power-frequency voltage power frequency leakage current is caused to be gradually increased
Or even the influence of fire occurs, a kind of releasing structure is specially made, chip body is increased to one due to the excessive temperature of leakage current
It when definite value, will thread off automatically, be detached from chip with by protection circuit, cut off the electric current of chip varistor, prevent the generation of disaster.
But there are three defects for this mode；The first, tripping mechanism may not necessarily thread off in time；Two, tripping mechanism is likely to weld in device
Since welding temperature is higher when being connected in PCB version, tripping is just had occurred and that, so that protective effect is lost, to by protection circuit system
Regiment commander carrys out hidden danger.After third, tripping, pressure-sensitive device is ineffective, by protection circuit system be in broken by lightning threat it
Under, SPD just loses protective effect completely.If cannot find in time, endanger very huge.This design is a kind of very helpless
Design.
Therefore, varistor power frequency tolerance is improved, be allowed to fire-retardant and has arc extinguishing ability with regard to extremely important.From above-mentioned
Mechanism is as it can be seen that these abilities are related with pressure-sensitive encapsulation.
There are mainly two types of modes at present for the encapsulation of varistor, first is that epoxy resin enclosed, such as present most of plug-in unit
Varistor.Second is that wrapping up quartz sand outside again outside the pressure-sensitive epoxy resin enclosed layer of electricity to block the formation of electric arc, finally
Quartz sand is wrapped up with a shell again.
The improvement of capsulation material has made the performance of plastic device be greatly improved, but due to the characteristic of some essence, still deposits
In some integrity problems.
First is thermal adaptability problem: capsulation material glass transition temperature is 130~160 DEG C, due to chip, is drawn
The respective coefficient of expansion of line, resin is different, and resin can generate internal stress after being molded into.Under this stress, under packaging or draw
Crackle is also easy to produce between line.
Second is moisture invasion problem: due to the intrinsic hygroscopicity of capsulation material and the adsorptivity of epoxy moulding material,
Plastic part can adsorb steam and some ions, so as to cause largely failure relevant to corrosion.Water is absorbed in capsulation material
It is welded in the case where vapour, because heated suddenly make steam rapid expanding, damage can be caused even to burst to device.Humidity is drawn
The encapsulation damage (such as interior laminate layer and reflow welding cracking) risen will lead to a series of integrity problems.
Third is layering caused by plastic packaging: this is directly related with above-mentioned two factor, shows as moulding material and device is each
Layering between component.And then bonding degeneration, chip and passivation layer cracking is caused metallization step degeneration even occur.
Relatively common has warm variation layer and popcorn effect.Especially the latter easily occurs in device welding process.It is infrared
Reflow Soldering (235~240 DEG C), gas phase Reflow Soldering (215+5DEG C), wave-soldering (260+5DEG C), when temperature is more than the glass of capsulation material
When glass inversion temperature, capsulation material softens, if device inside has more moisture, steam can be inflated, quick-fried in the short time
It splits, puffed rice phenomenon occurs.
Same producer, with batch same specification chip under the processing of different encapsulated layers, show it is widely different.
Epoxy material has excellent electrical insulating property, heat resistance, chemical resistance, and mechanical property and low-hygroscopicity are good,
Easily solidify, good processing is widely used in the encapsulation of electronic component and integrated circuit.Table 1 is common epoxy type.
The common epoxy type of table 1
Humidity-proof ability-stress of the various resin systems of table 2 compares
Improving the heat resistance of epoxy resin and reducing hygroscopicity is a pair of of structural inconsistency.Because improving epoxy packages material
The temperature capability of material will generally improve the degree of cross linking of encapsulating material；But simultaneously therefore the free volume in encapsulating material also increases
Add, is also improved so as to cause hygroscopicity.This just needs to find optimum balance between and epoxy encapsulant is had
There is high-fire resistance that also there is agent of low hygroscopicity, the effect of this certain method is limited.
The main purpose of second of packaged type is that the generation of electric arc is blocked with quartz sand, prevents electric arc from causing fire.But
It is since, with the presence of gap, can there be a small amount of air and water in the inside in quartz sand.Therefore, it is swollen to will lead to gas for localized hyperthermia
It is swollen, and then cause casing rupture or quartz sand is made to blow off, destroy the ability that quartz sand blocks electric arc；In addition, these air and water
Two effects can also be generated by being divided to, first is that oxygen needed for being capable of providing a part of internal-combustion, second is that in fusion piercing arcing and
There are the possibility of ionization when climbing electric arcing, thus its flame retardant effect be have it is insufficient.Therefore, the effect of this packaged type
It is limited.
Requirement of the MOV chip package for encapsulating material is varied, and being substantially summarized as " five high five is low ", list is such as
Under:
One outstanding encapsulation scheme on these basic demands, will also there is self-shield effect.It is namely pressure-sensitive in generation
When performance deteriorates, surface encapsulation layer can play the role of auto-mending defect, prevent deterioration.
Summary of the invention
The purpose of the present invention is designing for the above the deficiencies in the prior art, a kind of structure is simple, can effectively prevent from pressing
The piezoresistor and packaging method of the anti-power frequency arc extinguishing of burning and phenomenon of arc discharge occur inside quick resistance.
The purpose of the present invention can be achieved through the following technical solutions, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor, packet
Chip varistor ontology 1, pin 2 and protection outer shell 3 are included, the protection outer shell 3 is preventing arc material and plastic insulating materials
It mixes.
The anti-power frequency arc extinguishing encapsulates piezoresistor, is equipped with one between chip varistor ontology 1 and protection outer shell 3
Layer insulation conformal coat 4；The preferred material of insulation conformal coat 4 is silicone resin or epoxy resin.
The anti-power frequency arc extinguishing encapsulates piezoresistor, and the outside of protection outer shell 3 is equipped with a protective layer 5.
The piezoresistor of the anti-power frequency arc extinguishing encapsulation, plastic insulating materials are polyimides, epoxy resin, silicon
The mixture of one or more of ketone resin, silicone resin and silicon rubber；The preventing arc material is semimetal and metal oxygen
Compound, metal hydroxides, semimetal and metal nitride, semimetal and metal carbides, metal carbonate, metal sulfate
And the mixture of one or more of mineral ground；Preferred preventing arc material are as follows: quartz sand, silanised quartz sand, nitrogen
SiClx, silicon carbide, aluminum oxide, titanium oxide.
The anti-power frequency arc extinguishing encapsulates piezoresistor, and the softening temperature or fusion temperature of preventing arc material are lower than pressure-sensitive
The fusing point of material.
A kind of packaging method of anti-power frequency arc extinguishing encapsulation piezoresistor, the described method includes:
(1), chip varistor ontology 1 is electrically connected with pin 2；
(2), preventing arc material quartz sand and plastic insulating materials are mixed in the ratio of 3:0.5-2, it is outer becomes protection
The material of shell 3；
(3), the chip varistor ontology 1 for being connected with pin 2 is made to be wrapped in the protection outer shell 3 of mixed preparing in proportion
In material, make its solidification, forms protection outer shell 3.
The packaging method of the anti-power frequency arc extinguishing encapsulation piezoresistor, the described method includes:
(1), chip varistor ontology 1 is electrically connected with pin 2；
(2), the package insulation conformal coat 4 on chip varistor ontology 1；
(3), preventing arc material quartz sand and plastic insulating materials are mixed in the ratio of 3:0.5-2, it is outer becomes protection
The material of shell 3；
(4), make to be connected with pin 2 and be provided with the chip varistor ontology 1 of insulating layer and be wrapped in mixed configuration in proportion
Protection outer shell 3 material in, make its solidification, form protection outer shell 3.
The anti-power frequency arc extinguishing encapsulates piezoresistor, and preventing arc material quartz sand is mixed by different purpose quartz sand numbers
It closes, the weight proportion for the quartz sand that the quartz sand that mesh number is 60-70 is 300-330 with mesh number is that mesh number is 60-
70 quartz sand is 30---70%, remaining quartz sand for being 300-330；Optimum proportioning is the quartz sand that mesh number is 60-70
With mesh number be 300-330 quartz sand according to 1:1 proportional arrangement.
The packaging method of the anti-power frequency arc extinguishing encapsulation piezoresistor, method includes: to protect outside outer shell 3 at it
It is additionally provided with the one layer of protective layer 5 that fixes the sand.
The packaging method of the described anti-power frequency arc extinguishing encapsulation piezoresistor, chip varistor ontology 1 be wrapped in by than
In the material of the protection outer shell 3 of example mixed configuration, the curing method for forming it into protection outer shell 3 is injection molding packaging or filling
Encapsulation or moulded package.
Technological progress of the invention is, designed anti-power frequency arc extinguishing encapsulation piezoresistor structure is simple, can be effective
Prevent burning and phenomenon of arc discharge occur inside varistor.
Detailed description of the invention
Fig. 1 is the perspective diagram of cylindrical structure of the invention；
Fig. 2 is the perspective diagram of cuboid structure of the invention；
Fig. 3 is the perspective diagram for having the cuboid structure of insulation conformal coat in the present invention；
Fig. 4 is the perspective diagram of the outer cuboid structure for having the layer that fixes the sand of the present invention；
Fig. 5 is common pressure-sensitive power frequency tolerable temperature change curve schematic diagram；
Fig. 6 is present invention encapsulation power frequency tolerable temperature change curve schematic diagram.
Specific embodiment
As shown in Figure 1, Figure 2, Figure 3, Figure 4, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor, including chip varistor ontology 1,
Pin 2 and protection outer shell 3, the protection outer shell 3 are that preventing arc material is mixed with plastic insulating materials.
The preventing arc material is semimetal and metal oxide, metal hydroxides, semimetal and metal nitride, half gold
Belong to and metal carbides, metal carbonate, metal sulfate, the mineral ground.Wherein semimetal and metal oxide are as follows: SiO,
Al2O3.Metal hydroxides are as follows: Mg (OH) 2, Al (OH) 3.Semimetal and metal nitride are as follows: desalination silicon, boron nitride, nitridation
Aluminium.Semimetal and metal carbides are as follows: SiC, boron carbide.Metal carbonate are as follows: CaCO3, dolomite.Metal sulfate are as follows: stone
Cream, barite.The mineral ground are as follows: basic magnesite, talcum, kaolin, mica.
Preferred preventing arc material are as follows: quartz sand, silanised quartz sand, silicon nitride, silicon carbide, aluminum oxide, titanium oxide.
This structure that the present invention provides, by the periphery quartz sand and epoxy resin or silicone resin of chip or silicon rubber
The protection outer shell 3 of mixing material composition is encapsulated, and can thus be squeezed out the interstitial air of quartz sand and moisture, be prevented
Inner air and water power are from the possibility that burning and arcing occurs.Meanwhile after this mixing material use, the position quilt of quartz sand
It is fixed, it, would not be due to the expansion of gas and the gasification of metal and by the high temperature dot that blows off when melting generation.Due to quartz sand
(1500~1720 DEG C) of the softening point fusing points (1975 DEG C) lower than ZnO, so when the temperature is excessively high, quartz sand can melt absorption first
A large amount of heat prevents the generation of fusing and the arcing of chip varistor ontology 1, facilitates the generation for preventing open fire.For climbing electricity
On the one hand phenomenon, quartz sand can also block the generation of arcing.On the one hand, when the temperature is excessively high, the quartz sand on electrical creepage path can be first
It first melts, and then flows and cover on electrical creepage path, make current interruptions.Certainly, due to there is no gas in wrapping layer, so also not
It will appear and cause the phenomenon that bursting since gas superheat expands.It is suitably added other mixture (low temperature as pacified meter Wei Na
Glass powder D250,450 DEG C of melting temperature), its fusing point can be made lower.Another effect of quartz sand is, can after melting
Pressure-sensitive ontology is penetrated into, SiO2 film is generated on its crystal boundary, plays the role of the exposure mask for preventing the diffusion of various impurity, reduces chip
Leakage current greatly improves the stability of its electrical property.
Unlike integrated antenna package, the encapsulation of pressure-sensitive device not only considers weld cracking, more to focus on encapsulating
Fire retardancy.
In the present invention, the alternative condition of insulating layer 4 are as follows:
High-purity ----directly contacted with chip；
Low water absorption；
Low gas permeability；
Good hot property --- good thermal conductivity and thermal expansion coefficient；Suitably use temperature (- 50~150 DEG C)；
High insulativity --- dielectric strength is greater than 250V/mil；
High mechanical strength；
High resistance to chemical corrosion；
Excellent service performance；
Non-toxic, pollution-free, UL certification.
In general, optional following a few class materials are as insulation conformal coat 4:
Silicone resin gathers to two methylene benzene (Parylene), silicon nitride, acrylic acid, polyurethane, asphalt mixtures modified by epoxy resin
Rouge.
Insulation conformal coat 4 require safety, easily use, it is pollution-free, will not be generated on component big contraction and stress,
It can prevent moisture and chemical contamination, enough dielectric strengths, not cracked under desired temperature.Seldom there is a kind of material to meet
It states and is required, for this purpose, interior insulation conformal coat can also be realized using multilayered structure.It can be with electronics device in conformal coat
The first choice that part is in close contact is silicone resin.Require 4 layers of the conformal painting of insulation close with chip varistor 1 and its pin 2 in the present invention
Contact, and guarantee directly to connect with 1,2 without other materials.
SiO2 is used in the present invention to play filling, preventing arc, fusing heat absorption, passivation, exposure mask, along with SiO2 is good
Good thermal conductivity (thermal conductivity: 10W/m.K), can function well as cooling, arc extinguishing, fire-retardant effect.
As shown in figure 5, common epoxy packages varistor 14D681 is starting boosting 8 in power frequency tolerance comparative experiments
Temperature starts rapid increase after minute, and after 4 minutes, body temperature reaches 646 DEG C, burns, and pin temperature reaches 51~
54℃.And the varistor that the present invention encapsulates, as shown in fig. 6, temperature just starts rapid increase after starting boosting 11 minutes, then
After 3 minutes, body temperature only reaches 363 DEG C, and temperature rising curve is more gentle, without rapidly jumping, smolders non-ignitable, pin
Temperature reaches 45 DEG C；Power frequency tolerance is remarkably reinforced.Temperature rise rate in highest experiment, commonly encapsulates pressure-sensitive than of the invention
Pressure-sensitive fast 74 times of integrative packaging；As it can be seen that encapsulating material prevents the ability orientation of pressure-sensitive ontology deterioration very your writing in the present invention
With.
8/20us, 5KA, prestore 4.2KV impact tolerance comparative experiments in, common epoxy packages 14D681K it is pressure-sensitive
After impact 9 times, ontology is burst；And the pressure-sensitive of integrative packaging of the present invention is used, after impact 16 times, only under pressure sensitive voltage
Drop about 10%, appearance is normal.It can be seen that (table 4) is also remarkably reinforced in its antisurge impact capacity.
The common epoxy of table 4 is pressure-sensitive with the pressure-sensitive shock resistance comparative experiments of integrative packaging
In glowing filament experiment, sample tolerable temperature of the present invention reaches 900 DEG C or more, and the pressure-sensitive tolerable temperature of normal tape shell
At 750 DEG C or so, and burn.In view of capacity of equipment, present invention encapsulation is pressure-sensitive to fail to continue heating test.Experiment is completed
Afterwards, it commonly encapsulates pressure-sensitive shell to have burnt, the present invention encapsulates pressure-sensitive appearance and only has to burn a scar, and cigarette does not all emit.
Due to the characteristic of mixing material, it can be with one effective packaging body of self-contained, so this encapsulation does not need specially
Shell, the difficulty of packaging cost and packaging technology can be reduced.
The filler material (such as: cryogenic glass powder) for suitably selecting plastic insulation heat resistant material, can also enhance mixing material
Ductility reduces thermal stress to keep combining closely for encapsulated layer and chip body, prevents the cracking of encapsulating.
The softening temperature of the optimal preventing arc material of the present invention requires the fusing point for being lower than pressure sensitive, can wear in pressure-sensitive melt
Starting repairing before, the effect for blocking deterioration.Optimal selection of the invention is quartz sand.
Preventing arc material of the invention selects the particulate material of two or more different meshes to match by a certain percentage.Bulky grain material
Help to increase the capacity of heat transmission of material and reduce cost, small-particulate materials help to improve the mobility and preventing arc material of potting compound
The compactness of material.Its preventing arc material quartz sand can be mixed by the quartz sand of different meshes in the present invention, and mesh number is 60-
The weight proportion for the quartz sand that 70 quartz sand is 300-330 with mesh number is that the quartz sand that mesh number is 60-70 is 30---
70%, remaining quartz sand for being 300-330；Optimum proportioning is that the quartz sand that mesh number is 60-70 and mesh number are 300-330
Quartz sand according to 1:1 proportional arrangement.
Importance of the invention is, in SPD pressure-sensitive device, since thermal conductivity improves, the heat resistance of SPD is mentioned
It is high；It is pressure-sensitive with the present invention encapsulation under the action of power-frequency overvoltage, even if larger power frequency leakage current occurs, can also repair automatically
It fills a vacancy sunken；Even if defect mending effect is limited, it can also endure biggish power frequency leakage current and radiate as soon as possible；Even if power frequency is leaked electricity
Stream causes to generate heat, and will not cause burning and arcing.
Embodiment 1, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, structure are chip varistor ontologies 1
The component ratio of the protection outer shell 3 of outer package is: quartz sand: epoxy resin 3:1.
Embodiment 2, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, structure are chip varistor ontologies 1
The component ratio of the protection outer shell 3 of outer package is: quartz sand: silicone resin 3:0.5.
Embodiment 3, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, structure are chip varistor ontologies 1
The ingredient ratio of the protection outer shell 3 of outer package is: quartz sand: silicon rubber 3:1.5.
Embodiment 4, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, structure are chip varistor ontologies 1
It is wrapped with protection outer shell 3, outside protection outer shell 3, being enclosed with the one layer of protective layer 5 that fixes the sand is waterglass, prevents sand grains
It falls off.
Embodiment 5, as shown in figure 3, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, structure are pressure-sensitive
It is silicone resin that chip sheet 1, which is externally provided with a layer insulating 4,；There is the protection shell of quartz sand and epoxy resin mixing outside insulating layer
Layer 3.
Embodiment 6, as shown in figure 4, a kind of anti-power frequency arc extinguishing encapsulation piezoresistor and packaging method, structure are pressure-sensitive
It is epoxy resin, the protection shell for having quartz sand and epoxy to mix outside insulating layer that chip sheet 1, which is externally provided with a layer insulating 4,
The ratio of layer 3, quartz sand and epoxy is 3:1.Varnish is externally provided in protection outer shell 3 to fix the sand protective layer 5.
Claims (10)
1. a kind of anti-power frequency arc extinguishing encapsulates piezoresistor, including chip varistor ontology (1), pin (2) and protection outer shell
(3), which is characterized in that the protection outer shell (3) is that preventing arc material is mixed with plastic insulating materials.
2. anti-power frequency arc extinguishing according to claim 1 encapsulates piezoresistor, which is characterized in that in the chip varistor sheet
One layer of insulation conformal coat (4) is equipped between body (1) and protection outer shell (3)；The preferred material of insulation conformal coat (4) is silicon
Ketone resin or epoxy resin.
3. anti-power frequency arc extinguishing according to claim 1 or 2 encapsulates piezoresistor, which is characterized in that in protected shell
The outside of layer (3) is equipped with a protective layer (5).
4. the piezoresistor of anti-power frequency arc extinguishing encapsulation according to claim 1 or 2, which is characterized in that described plastic exhausted
Edge material is the mixture of one or more of polyimides, epoxy resin, silicone resin, silicone resin and silicon rubber；
The preventing arc material is semimetal and metal oxide, metal hydroxides, semimetal and metal nitride, semimetal and metal
The mixture of one or more of carbide, metal carbonate, metal sulfate and the mineral that grind；Preferred preventing arc material
Material are as follows: quartz sand, silanised quartz sand, silicon nitride, silicon carbide, aluminum oxide, titanium oxide.
5. anti-power frequency arc extinguishing according to claim 1 encapsulates piezoresistor, which is characterized in that the preventing arc material it is soft
Change temperature or fusion temperature is lower than the fusing point of pressure sensitive.
6. a kind of packaging method of anti-power frequency arc extinguishing encapsulation piezoresistor, which is characterized in that the described method includes:
(1), chip varistor ontology (1) is electrically connected with pin (2)；
(2), preventing arc material quartz sand and plastic insulating materials are mixed in the ratio of 3:0.5-2, becomes protection outer shell
(3) material；
(3), the chip varistor ontology 1 for being connected with pin (2) is made to be wrapped in the protection outer shell (3) of mixed preparing in proportion
In material, make its solidification, forms protection outer shell (3).
7. the packaging method of anti-power frequency arc extinguishing encapsulation piezoresistor according to claim 6, which is characterized in that the side
Method includes:
(1), chip varistor ontology (1) is electrically connected with pin (2)；
(2), package insulation conformal coat (4) on chip varistor ontology (1)；
(3), preventing arc material quartz sand and plastic insulating materials are mixed in the ratio of 3:0.5-2, becomes protection outer shell
(3 material；
(4), make to be connected with pin 2 and be provided with the chip varistor ontology (1) of insulating layer and be wrapped in mixed configuration in proportion
In the material for protecting outer shell (3), make its solidification, forms protection outer shell (3).
8. anti-power frequency arc extinguishing according to claim 6 or 7 encapsulates piezoresistor, which is characterized in that the preventing arc material
Quartz sand is mixed by different purpose quartz sand numbers, the quartz sand that mesh number is 60-70 and the stone that mesh number is 300-330
The weight proportion of sand is that the quartz sand that mesh number is 60-70 is 30---70%, remaining quartz sand for being 300-330；Most preferably
Proportion is, the quartz sand that mesh number is 60-70 and the quartz sand that mesh number is 300-330 according to 1:1 proportional arrangement.
9. the packaging method of anti-power frequency arc extinguishing encapsulation piezoresistor according to claim 6 or 7, which is characterized in that institute
The method of stating includes: to protect to be additionally provided with one layer of protective layer that fixes the sand (5) outside outer shell (3) at it.
10. the packaging method of anti-power frequency arc extinguishing encapsulation piezoresistor according to claim 6 or 7, which is characterized in that institute
It states chip varistor ontology 1 to be wrapped in the material of protection outer shell (3) of mixed configuration in proportion, forms it into protection shell
The curing method of layer (3) is injection molding packaging or filling encapsulation or moulded package.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112927876A (en) * | 2020-12-28 | 2021-06-08 | 广西新未来信息产业股份有限公司 | High-performance surge protector valve plate and manufacturing method thereof |
| CN115410784A (en) * | 2022-09-30 | 2022-11-29 | 深圳市辰驹电子科技有限公司 | Integrated packaging method for polymer composite material of electronic component |
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| CN201788778U (en) * | 2010-05-06 | 2011-04-06 | 深圳市辰驹电子科技有限公司 | Horizontal voltage dependent resistor |
| CN103013153A (en) * | 2012-12-13 | 2013-04-03 | 深圳市辰驹电子科技有限公司 | Packaging material for piezoresistor and low voltage arrester and manufacture method of packaging material |
| CN105895284A (en) * | 2016-06-12 | 2016-08-24 | 兴勤（常州）电子有限公司 | Thermal protection-type varistor |
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| DE2037896A1 (en) * | 1970-07-27 | 1972-02-03 | Matsushita Electric Ind Co Ltd | Carbon resistance - with carbon contg resin core and resin cover both contg silicon dioxide powder |
| JPH0897008A (en) * | 1994-02-21 | 1996-04-12 | Matsushita Electric Ind Co Ltd | Manufacture of varistor |
| CN1933040A (en) * | 2006-09-27 | 2007-03-21 | 成都铁达电子有限责任公司 | Easy-to-produce antiexplosive voltage-dependent resister |
| CN201788778U (en) * | 2010-05-06 | 2011-04-06 | 深圳市辰驹电子科技有限公司 | Horizontal voltage dependent resistor |
| CN103013153A (en) * | 2012-12-13 | 2013-04-03 | 深圳市辰驹电子科技有限公司 | Packaging material for piezoresistor and low voltage arrester and manufacture method of packaging material |
| CN105895284A (en) * | 2016-06-12 | 2016-08-24 | 兴勤（常州）电子有限公司 | Thermal protection-type varistor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112927876A (en) * | 2020-12-28 | 2021-06-08 | 广西新未来信息产业股份有限公司 | High-performance surge protector valve plate and manufacturing method thereof |
| CN115410784A (en) * | 2022-09-30 | 2022-11-29 | 深圳市辰驹电子科技有限公司 | Integrated packaging method for polymer composite material of electronic component |
| CN115410784B (en) * | 2022-09-30 | 2023-09-01 | 深圳市辰驹电子科技有限公司 | Polymer composite material integrated packaging method for electronic components |
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