CN109295440A - Electroless plating catalyst and the method for forming copper metal layer in substrate surface using the catalyst - Google Patents
Electroless plating catalyst and the method for forming copper metal layer in substrate surface using the catalyst Download PDFInfo
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- CN109295440A CN109295440A CN201710610269.5A CN201710610269A CN109295440A CN 109295440 A CN109295440 A CN 109295440A CN 201710610269 A CN201710610269 A CN 201710610269A CN 109295440 A CN109295440 A CN 109295440A
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- Prior art keywords
- electroless plating
- mixture
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- plating catalyst
- material powder
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1827—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment only one step pretreatment
- C23C18/1834—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
Abstract
A kind of method that the present invention provides electroless plating catalyst and forms copper metal layer in substrate surface using the catalyst, electroless plating catalyst includes: the carbon material powder with oxygen-containing functional group, and the oxygen-containing functional group includes at least lactone, ester, hydroxyl, epoxy and ketone are therein any；An aspect of of the present present invention includes that electroless plating catalyst is prepared into electroless plating catalyst ink, electroless plating catalyst ink is printed in substrate, copper metal layer is formed on the surface of electroless plating catalyst ink by electroless copper program again, it can be used for producing printed circuit board or antenna, have the advantages that low manufacturing cost, processing procedure are simple and quick.
Description
Technical field
The present invention relates to one kind to be used for electroless plating (Electroless Plating) catalyst and electroless process, especially
A method of it not needing the electroless plating catalyst of sensitization and forms copper metal layer in substrate surface using the catalyst.
Background technique
Electroless plating (Electroless Plating) is also known as chemical plating (chemical plating), chemical plating be
By suitable reducing agent in the case where without impressed current, metal ion is made in plating solution to be reduced into metal by oxygen reduction reaction,
And deposit to a kind of metal deposition technology of the piece surface by activation processing.
Electroless copper is a kind of technology known to printed circuit board (PCB) manufacturing field, it is known that is being printed using electroless copper
The method that the non-metallic substrate surface of printed circuit board forms conducting channel, first with catalyst (catalyst) be also known as catalyst into
The surface treatment of row substrate (substrate), in one layer of active particle of non-metallic substrate adsorption, the step one
As be known as sensitization (sensitization), being sensitized common active particle is Metal Palladium particle (Pd) and silver particles (Ag),
Know that a kind of catalyst containing palladium particle is a kind of containing tin/palladium colloid aqueous solution, wherein tin/palladium colloid includes by tin ion
(II) the palladium metal core that stabilized zone surrounds, but this catalyst has following problem, comprising: tin/palladium colloid stability
It is bad and palladium expensive.A kind of catalysis for chemical plating is proposed in published European patent EP 2559486A1
Agent, this stable catalyst include catalyst metals nanometer (nanometer) particle and cellulose or cellulose derivative, can
Aforementioned the problem of containing tin/palladium colloid aqueous solution as catalyst is used to improve.In addition a report proposed in 2007
In, propose a kind of nonmetallic catalyst-poly-dopamine (polydopamine) of electroless plating processing procedure for being used in copper or silver
[Science 318(2007)426]。
It also discloses in published European patent EP 2712885A1 by there is at least one on amine compounds and aromatic ring
The aromatic compounds of hydroxyl is copolymerized catalyst of the copolymer to be formed as electroless copper.Since polymerization reaction needs 4~24 hours
As long as, one kind, which is proposed, in published United States Patent (USP) US20160168715A1 is directly carried out using poly-dopamine nanoparticle
The technology of electroless copper, but dopamine usually requires 24 hours progress polymerization reactions, time-consuming relatively long unfavorable production capacity at room temperature
Promotion, and the pH range of the auto polymerization of dopamine is relatively narrow (PH6.5~PH9.5), more other than this pH range
Bar amine auto polymerization rate can become very low.
Summary of the invention
It is a kind of for electroless catalyst and its using the catalyst technical problem to be solved by the present invention lies in providing
Electroless process, especially it is a kind of do not need sensitization, low manufacturing cost electroless plating catalyst and using the catalyst in substrate surface
The method for forming copper metal layer.Further, the invention proposes a kind of using the catalyst by electroless copper processing procedure in substrate
(substrate) method of surface manufacture printed circuit or antenna.
The present invention includes a kind of for electroless electroless plating catalyst, and the electroless plating catalyst includes: with oxygen-containing official
The carbon material powder of energy group (Oxygen functional groups), the oxygen-containing functional group include at least lactone,
Ester, hydroxyl, epoxy and ketone are therein any, and wherein carbon material powder is selected from graphene, graphite, carbon nanotubes, carbon black and work
The oxide of property charcoal any one of them.
Wherein carbon material powder can further include at least one doped chemical, and the doped chemical includes nitrogen (N), sulphur
(S), boron (B), fluorine (F) and phosphorus (P) it is therein any one.
In one aspect of the invention, a kind of electroless plating catalyst ink is proposed, comprising: by the carbon with oxygen-containing functional group
The mixture of material powder, dispersing agent and solvent composition, the oxygen-containing functional group include at least lactone, ester, hydroxyl, epoxy
Therein any with ketone, the content of the solid component wherein contained in mixture accounts for the 1~60% of the total weight of mixture
(wt%), the content of solvent accounts for 40~99% (wt%) of the total weight of mixture, and the content of dispersing agent, which accounts in mixture, to be contained
Solid component total weight 0.1~40% (wt%).
Preferably, the carbon material powder in the mixture of the electroless plating catalyst is graphene oxide (graphene
Oxide, GO).
Wherein dispersing agent can be ionic dispersant or non-ionic dispersing agent.
Wherein solvent includes that pure water, organic solvent and inorganic solvent are therein any or combinations thereof.
Further, the mixture includes thickener, and the content of thickener accounts for the 1~5% of the total weight of solid component
(wt%).
Another embodiment of the mixture of the electroless plating catalyst ink, wherein carbon material powder include: graphite, nano-sized carbon
Pipe, the mixture of the oxide of carbon black and active carbon any one of them, the electroless plating catalyst also includes adhesive, the bonding
Agent includes that polymer and resin are therein any, and the content of described adhesive accounts for the 0.1~30% of the total weight of solid component
(wt%).Need it is noted that when using graphene platelet or graphene oxide as catalyst filling, electroless plating catalyst
Mixture can not needed using any polymer or resin binder.
An aspect of of the present present invention, which proposes, a kind of forms copper metal layer in substrate surface using above-mentioned electroless plating catalyst
Method, the method includes the following steps:
Electroless plating catalyst ink is prepared, the electroless plating catalyst ink includes: by the carbon material with oxygen-containing functional group
The mixture of powder, dispersing agent and solvent composition；
Electroless plating catalyst ink is printed in the predetermined position for forming circuit pattern or antenna of substrate surface, and by electroless plating
The drying of catalyst ink；And
The substrate for being printed with electroless plating catalyst ink is immersed in electroless plating solution, carries out electroless plating to touch in electroless plating
The surface of matchmaker's ink forms copper metal layer.
Oxygen-containing functional group in carbon material powder in electroless plating ink described in the method for the present invention includes at least lactone,
Ester, hydroxyl, epoxy and ketone are therein any, and the content of the solid component wherein contained in mixture accounts for the total weight of mixture
1~60% (wt%), the content of solvent accounts for 40~99% (wt%) of the total weight of mixture, and the content of dispersing agent accounts for mixing
0.1~40% (wt%) of the total weight of the solid component contained in object.
Further, electroless plating ink described in the method for the present invention includes thickener, and the content of thickener accounts in mixture
1~5% (wt%) of the total weight of the solid component contained.
In an embodiment of the method for the present invention, wherein with the carbon material of oxygen-containing functional group among electroless plating catalyst ink
Powder is graphene oxide.
In an embodiment of the method for the present invention, wherein electroless plating solution is carboxaldehyde radicals chemical copper plating solution.
In an embodiment of the method for the present invention, wherein with the carbon material of oxygen-containing functional group among electroless plating catalyst ink
Powder includes: graphite, carbon nanotubes, the oxide of carbon black and active carbon any one of them, the mixture of the electroless plating catalyst
It also include adhesive, described adhesive includes that polymer and resin are therein any, and the content of described adhesive accounts for mixture
In 0.1~30% (wt%) of the total weight of solid component that contains.
In above-described embodiment of the method for the present invention, including baking step, the nothing on the surface substrate will be printed on
Catalyst ink setting is electroplated, is crosslinked the adhesive.
Preferably, the method for the present invention includes water-washing step, remaining electroless plating solution is removed after completing electroless plating.
The detailed content of other effects and embodiment for the present invention, cooperation schema are described as follows.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The some embodiments recorded in application, for those of ordinary skill in the art, without creative efforts,
It can also be obtained according to these attached drawings other attached drawings.
Fig. 1 is a kind of step flow chart of embodiment of the method for the present invention；
Fig. 2A~Fig. 2 B is that method is illustrated in a kind of construction of implementation steps of substrate surface manufacture circuit according to the present invention
Figure is shown in the surface printing electroless plating catalyst ink of substrate, and forms copper metal layer on the surface of electroless plating catalyst ink
Situation；
Fig. 3 depicts the planar configuration of printed circuit made of electroless plating catalyst and method according to the present invention；
Fig. 4 depicts radio frequency identification label (RFID) made of electroless plating catalyst and method according to the present invention
The planar configuration of antenna.
Symbol description
10 substrates
20 electroless plating catalyst ink
30 copper metal layers
Specific embodiment
It is proposed by the present invention it is a kind of for electroless electroless plating catalyst include: the carbon materials feed powder with oxygen-containing functional group
End, the oxygen-containing functional group include at least lactone (lactol), ester (ester), hydroxyl (hydroxyl), epoxy
(epoxy) and ketone (ketone) is therein any, and wherein the embodiment of carbon material powder includes graphene, graphite, nanometer
Carbon pipe, the oxide of carbon black and active carbon any one of them.
Above-mentioned various carbon material powders are by that can generate various oxygen-containing functional groups, chemical structural formula after oxidation processes
It is expressed as follows:
Cited:Nature Chemistry 1(2009)403.
The oxide of above-mentioned various carbon materials material powder according to the difference in its source and preparation method, can not yet by oxygen content therein
Together, it is however generally that, wherein the oxygen content of active carbon isWeight % (wt%), the oxygen content of natural graphite powder are 0.5 weight
It measures % (wt%), the oxygen content of graphene oxide is about 40 weight % (wt%), and graphene is prepared with various preparation method systems
At the oxygen content of graphene oxide beWeight % (wt%).Preferably, the present invention is above-mentioned to have oxygen-containing function
The oxygen content of the carbon material powder of group accounts for 5% to 50% (wt%) of carbon powder material total weight.
In order to test the feasibility that various carbon material powders are applied to electroless copper, we have selected a variety of carbon materials feed powders
End has carried out the test of the following steps, and various carbon materials powder is directly put into electroless plating solution by us, we select herein
Commercially available common carboxaldehyde radicals chemical copper plating solution sees whether obviously to generate after the electroless plating that 50 DEG C carry out 30 minutes
Copper deposit, the test result of various carbon material powders is as shown in following table one.
| Sample number into spectrum | Carbon powder material | It is obvious to generate copper deposit |
| 1 | Conductive carbon black (conductive carbon black) | It is no |
| 2 | Natural graphite (natural graphite) | It is no |
| 3 | High-quality graphene (high quality graphene) | It is no |
| 4 | Activated carbon (activated carbon) | It is |
| 5 | The natural graphite (oxidized natural graphite) of oxidation | It is |
| 6 | It aoxidizes conductive carbon black (oxidized conductive carbon black) | It is |
| 7 | Graphene oxide (graphene oxide) | It is |
Table one
Pass through above-mentioned test, it was demonstrated that the oxygen-containing functional group on carbon material powder surface can be used as the active sites of catalyst
Point, therefore the catalyst for thering is the carbon material powder of oxygen-containing functional group to can be used as electroless copper.
Preferably, wherein carbon material powder can further include at least one doped chemical, the doped chemical includes nitrogen
(N), sulphur (S), boron (B), fluorine (F) and phosphorus (P) it is therein any one, the content of the doped chemical accounts for carbon powder material total weight
1%~20% (wt%).
An aspect of of the present present invention proposes a kind of electroless plating catalyst ink (ink), a kind of reality of this electroless plating catalyst ink
Example is applied by above-mentioned: the mixture that carbon material powder, dispersing agent and solvent with oxygen-containing functional group form, described is oxygen-containing
Functional group includes at least lactone, and ester, hydroxyl, epoxy and ketone are therein any, the solid component wherein contained in mixture
Content account for mixture total weight 1~60% (wt%), the content of solvent accounts for the 40~99% of the total weight of mixture
(wt%), the content of dispersing agent accounts for 0.1~40% (wt%) of the total weight of the solid component contained in mixture.
Further, the mixture of the electroless plating catalyst ink includes: the content of thickener, thickener accounts in mixture
1~5% (wt%) of the total weight of the solid component contained.
The first embodiment of mixture
Preferably, the carbon material powder in the ink mixture of the electroless plating catalyst is graphene oxide.
Wherein dispersing agent can be ionic dispersant or non-ionic dispersing agent.Wherein solvent includes pure water, You Jirong
Agent and inorganic solvent are therein any or combinations thereof, and in other words, solvent includes one or more carriers, and the carrier includes
Pure water, organic solvent and inorganic solvent it is therein any one.Wherein non-ionic dispersing agent includes P-123, Tween 20,
Xanthan gum, Carboxymethyl Cellulose (CMC), Triton X-100, Polyvinylpyrrolidone
(PVP), any one or more combination therein of Brji 30；Wherein ionic dispersant includes Poly (sodium 4-
Styrenesulfonate) (PSS), 3- [(3-Cholamidopropyl) dimethyl ammonio] -1-
Propanesufonate (CHAPS), Hexadecyltrimethylammonium bromide (HTAB), Sodium
Taurodeoxycholate hydrate (SDS), 1-Pyrenebutyric acid (PBA) it is therein any or it is a kind of with
On combination.Wherein organic solvent includes: N-Methyl-2-pyrrolidone (NMP), IPA (Isopropyl alcohol)
Isopropanol, ethanol, glycerol, ethylene glycol, butanol, propanol, Propylene glycol
Monomethyl ether (PGME), Propylene glycol monomethyl ether acetate (PGMEA) are therein
It is any.
The second embodiment of mixture
Preferably, another embodiment of the mixture of the electroless plating catalyst ink, wherein carbon material powder includes: stone
The mixture of ink, carbon nanotubes, the oxide of carbon black and active carbon any one of them, the electroless plating catalyst ink also includes:
Adhesive, described adhesive include that polymer and resin are therein any, and wherein the content of adhesive, which accounts in mixture, contains
Solid component total weight 0.1~30% (wt%).It need be it is noted that when using graphene platelet or graphene oxide
When as catalyst filling, the mixture of electroless plating catalyst can not needed using any polymer or resin binder.
Referring to Fig. 1, an aspect of of the present present invention is proposed and a kind of is formed using above-mentioned electroless plating catalyst in substrate surface
The method of copper metal layer, the method includes the following steps:
A. electroless plating catalyst ink 20 is prepared, the electroless plating catalyst ink includes: by the carbon with oxygen-containing functional group
The mixture of material powder, dispersing agent and solvent composition；
B. electroless plating catalyst ink 20 is printed in the predetermined position (see Fig. 2A) for forming circuit pattern in 10 surface of substrate, and
Electroless plating catalyst ink 20 is dried；And
C. the substrate 10 for being printed with electroless plating catalyst ink 20 is immersed in electroless plating solution, carries out electroless plating in nothing
The surface that catalyst ink 20 is electroplated forms copper metal layer 30 (see Fig. 2 B).
Wherein substrate 10 is a kind of nonmetallic materials, manufactures substrate, the plastics of printed circuit board (PCB) including being usually used in
Plate, fiberboard and paper are therein any.
Preferably, the method for the present invention further includes water-washing step d, it is molten to remove remaining electroless plating after completing electroless plating
Liquid.
Wherein step a. preparation electroless plating catalyst ink 20 include: by with oxygen-containing functional group carbon material powder,
The mixture of dispersing agent and solvent composition, the oxygen-containing functional group include at least lactone, and ester, hydroxyl, epoxy and ketone are wherein
It is any, the content of the solid component wherein contained in mixture accounts for 1~60% (wt%) of the total weight of mixture, solvent
Content account for mixture total weight 40~99% (wt%), the content of dispersing agent accounts for the solid component contained in mixture
0.1~40% (wt%) of total weight；The mixture of this electroless plating catalyst ink 20 can be directly coated at the table of substrate 10
Face, such as it is coated on by way of printing the predetermined position for forming circuit pattern or antenna in surface of substrate 10.
A kind of embodiment of the method for the present invention, the wherein electroless plating catalyst ink 20 of step a. preparation, if it is using
The first embodiment of aforementioned mixture prepares electroless plating catalyst ink 20, that is, using graphene oxide (comprising graphite
Alkene thin slice or graphene oxide) carbon material powder as oxygen-containing functional group, directly electroless plating catalyst ink 20 can be printed
It brushes in the surface of substrate 10, and electroless plating catalyst ink 20 is dried, then will be printed with the base of electroless plating catalyst ink 20 again
Material 10 immerses electroless plating solution (such as carboxaldehyde radicals chemical copper plating solution) and carries out electroless plating, and one of embodiment is at 50 DEG C
Carry out electroless plating in 30 minutes, so that it may copper metal layer 30 is formed on the surface of electroless plating catalyst ink 20, suitable for manufacture
Printed circuit or antenna.
The another embodiment of the method for the present invention, the wherein electroless plating catalyst ink 20 of step a. preparation, if it is making
Prepare electroless plating catalyst ink 20 with second of embodiment of aforementioned mixture, that is, use graphite, carbon nanotubes, carbon black and
Carbon material powder of the oxide of active carbon any one of them as oxygen-containing functional group, in this electroless plating catalyst ink 20 also
Include above-mentioned adhesive.
Printed circuit and less radio-frequency made of two electroless plating catalyst proposed according to the present invention disclosed below and method
Identify the implementation example of the antenna of label (RFID) as after.
Implement example one
Referring to Fig. 3, wherein depicting printed circuit made of electroless plating catalyst proposed according to the present invention and method
Planar configuration；Implement in example one at this, the composition and each ingredient of electroless plating catalyst ink 20 account for electroless plating catalyst ink
20 total weight percent, comprising: water 88% (wt%)；Graphene (Graphene) 5% (wt%)；Graphene oxide
(Graphene oxide) 5% (wt%)；Non-ionic dispersing agent (Non-ionic dispersant) 1% (wt%)；Polymerization tree
Rouge (polymer resin) 1% (wt%)；The substrate 10 of selection is Kapton (PI Film).
The electroless plating catalyst ink 20 for implementing example one is printed on after the surface of Kapton, is placed in 100 DEG C
It is dry in baking oven.
After the completion of drying, immerses in commercially available carboxaldehyde radicals chemical copper plating solution and carried out electroless copper 30 minutes at 50 DEG C.
After the deposition for completing copper metal layer 30, it is washed with water and dries in an oven.
Implement example two
Referring to Fig. 4, wherein depicting the knowledge of less radio-frequency made of electroless plating catalyst proposed according to the present invention and method
The planar configuration of the antenna of other label (RFID)；Implement in example two at this, the composition of electroless plating catalyst ink 20 and each
Ingredient accounts for the total weight percent of electroless plating catalyst ink 20, comprising: isopropanol (Isopropyl alcohol) 65%
(wt%)；Partial oxidation graphite (Partly oxidized graphite) 17% (wt%)；Non-ionic dispersing agent (Non-
Ionic dispersant) 1% (wt%)；Polymer resin (polymer resin) 15% (wt%)；Thickener 2% (wt%)；
The substrate 10 of selection is paper (Paper).
The electroless plating catalyst ink 20 for implementing example two is printed on after paper, is placed in 100 DEG C of baking oven dry.
After the completion of drying, immerses in commercially available carboxaldehyde radicals chemical copper plating solution and carried out electroless copper 20 minutes at 50 DEG C.
After the deposition for completing copper metal layer 30, it is washed with water and dries in an oven.
The antenna for implementing the radio frequency identification label that the manufacture of example two is completed, by test, wireless radio frequency identification mark
Reading range be about 10 meters (m), it was demonstrated that radio frequency identification made of electroless plating catalyst proposed according to the present invention and method
Label antenna has excellent performance and practicability.
Embodiment described above and/or embodiment are only the preferred embodiments to illustrate to realize the technology of the present invention
And/or embodiment, not the embodiment of the technology of the present invention is made any form of restriction, any those skilled in the art
Member changes or is modified to other equivalent when can make a little in the range for not departing from technological means disclosed in the content of present invention
Embodiment, but still should be regarded as and the substantially identical technology or embodiment of the present invention.
Claims (16)
1. a kind of electroless plating catalyst characterized by comprising the carbon material powder with oxygen-containing functional group, the oxygen-containing function
Group includes at least: lactone, ester, hydroxyl, and epoxy and ketone are therein any, and wherein the carbon material powder is selected from graphene, stone
Ink, carbon nanotubes, the oxide of carbon black and active carbon any one of them.
2. electroless plating catalyst as described in claim 1, which is characterized in that the oxygen content of the carbon material powder accounts for the carbon dust material
Expect the 5% to 50% of total weight.
3. electroless plating catalyst as described in claim 1, which is characterized in that the carbon material powder can further include at least one
Doped chemical, the doped chemical include nitrogen, sulphur, boron, fluorine and phosphorus it is therein any one, the content of the doped chemical accounts for the carbon dust
The 1%~20% of material total weight.
4. a kind of electroless plating catalyst ink characterized by comprising by the carbon material powder with oxygen-containing functional group, dispersion
The mixture of agent and solvent composition, the oxygen-containing functional group include at least: lactone, ester, hydroxyl, epoxy and ketone are therein any
Kind, the content of the solid component wherein contained in the mixture accounts for the 1~60% of the total weight of the mixture, the content of the solvent
The 40~99% of the total weight of the mixture are accounted for, the content of the dispersing agent accounts for the gross weight of the solid component contained in the mixture
The 0.1~40% of amount.
5. electroless plating catalyst ink as claimed in claim 4, which is characterized in that the carbon material powder in the mixture is stone
Black olefinic oxide.
6. electroless plating catalyst ink as claimed in claim 4, which is characterized in that the carbon material powder packet in the mixture
Contain: graphite, carbon nanotubes, the oxide of carbon black and active carbon any one of them, the mixture also include adhesive, the adhesive
Therein any comprising polymer and resin, the content of the adhesive accounts for the gross weight of the solid component contained in the mixture
The 0.1~30% of amount.
7. such as electroless plating catalyst ink described in claim 5 or 6, which is characterized in that the dispersing agent can be ionic dispersion
Agent or non-ionic dispersing agent, the solvent include that pure water, organic solvent and inorganic solvent are therein any or combinations thereof.
8. electroless plating catalyst ink as claimed in claim 7, which is characterized in that the mixture includes thickener, the thickener
Content account for the solid component contained in the mixture total weight 1~5%.
9. a kind of method for forming copper metal layer in substrate surface characterized by comprising
Prepare electroless plating catalyst ink, which includes: by with oxygen-containing functional group carbon material powder, point
The mixture of powder and solvent composition；
Electroless plating catalyst ink printing is made a reservation for be formed in the substrate surface the position of circuit pattern or antenna, and by this without electricity
Plate the drying of catalyst ink；And
The substrate for being printed with the electroless plating catalyst ink is immersed in electroless plating solution, carries out electroless plating in the electroless plating
The surface of catalyst ink forms copper metal layer.
10. method as claimed in claim 9, which is characterized in that it is total that the oxygen content of the carbon material powder accounts for the carbon powder material
The 5% to 50% of weight.
11. method as claimed in claim 10, which is characterized in that the carbon material powder can further include at least one doping
Element, the doped chemical include nitrogen, sulphur, boron, fluorine and phosphorus it is therein any one, the content of the doped chemical accounts for the carbon powder material
The 1%~20% of total weight.
12. method as claimed in claim 9, which is characterized in that the carbon material powder in the mixture is graphene oxidation
Object.
13. method as claimed in claim 9, which is characterized in that the carbon material powder in the mixture includes: graphite is received
Rice carbon pipe, the oxide of carbon black and active carbon any one of them, which also includes adhesive, which includes polymer
It is therein any with resin, the content of the adhesive account for the total weight of the solid component contained in the mixture 0.1~
30%.
14. method as described in claim 12 or 13, which is characterized in that the dispersing agent can be ionic dispersant or it is non-from
Subtype dispersing agent, the solvent include that pure water, organic solvent and inorganic solvent are therein any or combinations thereof.
15. method as claimed in claim 14, which is characterized in that the mixture includes thickener, and the content of the thickener accounts for
The 1~5% of the total weight of the solid component contained in the mixture.
16. method as claimed in claim 9, which is characterized in that the electroless plating solution is carboxaldehyde radicals chemical copper plating solution.
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| CN201710610269.5A CN109295440A (en) | 2017-07-25 | 2017-07-25 | Electroless plating catalyst and the method for forming copper metal layer in substrate surface using the catalyst |
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| CN201710610269.5A CN109295440A (en) | 2017-07-25 | 2017-07-25 | Electroless plating catalyst and the method for forming copper metal layer in substrate surface using the catalyst |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3699321A1 (en) * | 2019-02-19 | 2020-08-26 | BGT Materials Limited | Method of forming copper metal layer on non-metallic material |
| CN112063998A (en) * | 2020-08-28 | 2020-12-11 | 南昌大学 | Preparation method of ultrathin copper/graphene composite foil |
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|---|---|---|---|---|
| US20100009094A1 (en) * | 2007-01-19 | 2010-01-14 | Basf Se Patents, Trademarks And Licenses | Method for the producing structured electrically conductive surfaces |
| US20100151120A1 (en) * | 2008-12-12 | 2010-06-17 | Tsinghua University | Method for making conductive wires |
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2017
- 2017-07-25 CN CN201710610269.5A patent/CN109295440A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100009094A1 (en) * | 2007-01-19 | 2010-01-14 | Basf Se Patents, Trademarks And Licenses | Method for the producing structured electrically conductive surfaces |
| US20100151120A1 (en) * | 2008-12-12 | 2010-06-17 | Tsinghua University | Method for making conductive wires |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3699321A1 (en) * | 2019-02-19 | 2020-08-26 | BGT Materials Limited | Method of forming copper metal layer on non-metallic material |
| CN112063998A (en) * | 2020-08-28 | 2020-12-11 | 南昌大学 | Preparation method of ultrathin copper/graphene composite foil |
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