CN109285935A - 一种通体发光led灯珠及灯串 - Google Patents

一种通体发光led灯珠及灯串 Download PDF

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CN109285935A
CN109285935A CN201811321535.3A CN201811321535A CN109285935A CN 109285935 A CN109285935 A CN 109285935A CN 201811321535 A CN201811321535 A CN 201811321535A CN 109285935 A CN109285935 A CN 109285935A
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support
led lamp
lamp pearl
epoxy resin
surface luminescent
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卢军
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Dongguan City Yi Jing Source Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017
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Dongguan City Yi Jing Source Electro-Optical Technology Inc (us) 62 Martin Road Concord Massachusetts 017
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Priority to CN201811321535.3A priority Critical patent/CN109285935A/zh
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Priority to US16/396,750 priority patent/US20200144452A1/en
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/36Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/20Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
    • H01L33/24Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate of the light emitting region, e.g. non-planar junction
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/02Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
    • H01L33/26Materials of the light emitting region
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52Encapsulations
    • H01L33/54Encapsulations having a particular shape
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)

Abstract

本发明公开了一种通体发光LED灯珠及灯串,所述通体发光LED灯珠包括LED芯片和金属支架,该金属支架包括呈平面型的第一支架和第二支架;所述LED芯片固定在第二支架上,LED芯片的两极分别与第一支架和第二支架之间通过导线连接;第一支架和第二支架上设置有环氧树脂层,该环氧树脂层将第一支架和第二支架之间的区域填充。本发明提供的通体发光LED灯珠点亮后各个方向上都能观察到发光,从而提高LED灯珠的了发光效果。

Description

一种通体发光LED灯珠及灯串
技术领域
本发明涉及LED技术领域,特别涉及一种通体发光LED灯珠及灯串。
背景技术
LED灯带或灯串应用广泛,但是用于灯串(或称“灯带”)的贴片式LED灯珠的底板设置有BT板,点亮后只能在正面的180度发光,而受到LED灯珠的基板影响,LED灯珠的另一面底部存在较大阴影,影响LED灯带的整体发光效果。因此,有必要提出一种LED灯珠,其正反两面以及侧面都能实现发光,发光角度整体上达到360度,而应用了这种LED灯珠的灯带的发光效果也能相应地得到提高。
可见,现有技术还有待改进和提高。
发明内容
鉴于上述现有技术的不足之处,本发明的目的在于提供一种通体发光LED灯珠及灯串,旨在解决现有技术中贴片式LED灯珠只能在180度内发光的技术问题。
为了达到上述目的,本发明采取了以下技术方案:
一种通体发光LED灯珠,包括LED芯片和金属支架,该金属支架包括呈平面型的第一支架和第二支架;所述LED芯片固定在第二支架上,LED芯片的两极分别与第一支架和第二支架之间通过导线连接;第一支架和第二支架上设置有环氧树脂层,该环氧树脂层将第一支架和第二支架之间的区域填充。
所述的通体发光LED灯珠中,所述第一支架上开设有第一通孔,第二支架上开设有第二通孔;环氧树脂层将第一通孔和第二通孔填充。
所述的通体发光LED灯珠中,所述第一支架和第二支架的厚度相等,第一支架和第二支架的宽度相等。
所述的通体发光LED灯珠中,所述金属支架的长度为1.4~2mm,金属支架的宽度为0.7~1.2mm,金属支架的厚度为0.1~0.25mm。
所述的通体发光LED灯珠中,所述环氧树脂层的上表面为平面或弧面。
所述的通体发光LED灯珠中,所述环氧树脂层的厚度为0.4~0.8mm。
所述的通体发光LED灯珠中,第一支架和第二支架分别为一体地冲压成型。
本发明相应地提供一种灯串,包括电源线,与现有技术不同的是,还包上述的通体发光LED灯珠,每个通体发光LED灯珠分别与电源线连接。
有益效果:本发明提供了一种通体发光LED灯珠及灯串,相比现有技术,本发明提供的通体发光LED灯珠的金属支架具有透光区域,金属支架底部无基板衔接,灯珠点亮后其背面也能够发光;灯珠在各个方向上都能观察到发光,提高灯珠的了发光效果。
附图说明
图1为本发明提供的通体发光LED灯珠的俯视图。
图2为本发明提供的通体发光LED灯珠的仰视图。
图3为图1中A-A剖视图。
具体实施方式
本发明提供一种通体发光LED灯珠及灯串,为使本发明的目的、技术方案及效果更加清楚、明确,以下参照附图并举实施例对本发明进一步详细说明。应当理解,此处所描述的具体实施例仅用以解释本发明,并不用于限定本发明。
请参阅图1至图3,本发明提供一种通体发光LED灯珠。图1中直线501和502表示透明胶层两端的边界。为了便于与透明胶层区分,图2中用黑色填充表示金属支架。图2和图3中未画出导线41。
一种通体发光LED灯珠,包括LED芯3片和金属支架,该金属支架包括呈平面型的第一支架1和第二支架2,;所述LED芯片3固定在第二支架2上,LED芯片的两极分别与第一支架1和第二支架2之间通过导线(包括导线41和导线42)连接;第一支架和第二支架上设置有环氧树脂层5,该环氧树脂层5将第一支架1和第二支架2之间的区域填充。上述“平面型”指第一支架和第二支架的上表面和下表面均为平面。上述导线可以是金线、合金线或者铜线,此处不作限定;上述金属支架通常为铜或者铝制成。
需要说明的是,实际使用时,所述通体发光LED灯珠设置有荧光粉(图中未画出)以实现灯珠发出某种颜色,由于本发明不在于发光的具体颜色,因此不对荧光粉作出限定。第一支架和第二支架的形状可以优选为图1和图2所示那样,即,第一支架上的第一焊盘11和第二支架上的第二焊盘21相对设置但不接触,导线41连接LED芯片和第一焊盘;导线42连接LED芯片和第二焊盘;第一焊盘以及第二焊盘的宽度W2比金属支架的整体宽度W小,这样可以使得第一支架和第二支架之间具有更大的透光区域。
优选地,所述第一支架1上开设有第一通孔101,第二支架2上开设有第二通孔201;环氧树脂层将第一通孔和第二通孔填充。通过设置第一通孔和第二通孔,进一步增加了透光的区域,提高了反面的透光效果。
优选地,为了便于加工,所述第一支架1和第二支架2的厚度相等,第一支架和第二支架的宽度相等,即,都为金属支架的整体宽度W。
优选地,所述金属支架的长度L为1.4~2mm,金属支架的宽度W为0.7~1.2mm,金属支架的厚度H为0.1~0.25mm。
优选地,所述环氧树脂层5的上表面为平面或弧面。图3中画出的环氧树脂层的上表面为平面,但不限定于此。
优选地,所述环氧树脂层的厚度H2为0.4~0.8mm。
如附图所示,优选地,环氧树脂层的长度L2小于金属支架的长度L1,即,金属支架的两端从环氧树脂层的两端露出,便于形成引脚。环氧树脂层的下表面和金属支架的下表面平齐。
优选地,第一支架1和第二支架2分别为一体地冲压成型。
本发明还提供一种灯串,包括电源线(图中未画出),与现有技术不同的是,还包括若干个如权利要求1-7任一项所述的通体发光LED灯珠,每个通体发光LED灯珠分别与电源线连接。
以下简述通体透光远离:实际使用时,第一支架和第二支架用作灯珠的阳极和阴极与外部输入线路(图中未画出)连接。由于包裹有环氧树脂层,对第一支架和第二支架起到固定作用,不用如现有技术那样设置BT板。由图2和图3可以观察到,金属支架形成了A(第一通孔)、B(第一支架和第二支架之间的的区域)、C(第二通孔)三个透光区域,这三个区域均填充了透明胶层,且具有透光的作用,当LED灯珠点亮后,不仅正面和侧面可以发光,光线经环氧树脂层的反射有也可以贯穿上述三个透光区域使得灯珠的背面也实现发光,即,光线整体上可以从各个方向射出,实现通体发光,提高了LED灯珠的发光效果。而使用这样的LED灯珠制成的灯串,两面都可以发光,提高了整体的发光效果。
通过上述分析可知,相比现有技术中的贴片式LED灯珠,本发明提供的通体发光LED灯珠的金属支架具有透光区域,金属支架底部无基板衔接,灯珠点亮后其背面也能够发光;灯珠在各个方向上都能观察到发光,提高灯珠的了发光效果。所述通体发光LED灯珠能够广泛地应用于灯串、舞台、玩具、装饰品等方场合。
可以理解的是,对本领域普通技术人员来说,可以根据本发明的技术方案及其发明构思加以等同替换或改变,而所有这些改变或替换都应属于本发明的保护范围。

Claims (8)

1.一种通体发光LED灯珠,包括LED芯片和金属支架,其特征在于,该金属支架包括呈平面型的第一支架和第二支架;所述LED芯片固定在第二支架上,LED芯片的两极分别与第一支架和第二支架之间通过导线连接;第一支架和第二支架上设置有环氧树脂层,该环氧树脂层将第一支架和第二支架之间的区域填充。
2.根据权利要求1所述的通体发光LED灯珠,其特征在于,所述第一支架上开设有第一通孔,第二支架上开设有第二通孔;环氧树脂层将第一通孔和第二通孔填充。
3.根据权利要求2所述的通体发光LED灯珠,其特征在于,所述第一支架和第二支架的厚度相等,第一支架和第二支架的宽度相等。
4.根据权利要求3所述的通体发光LED灯珠,其特征在于,所述金属支架的长度为1.4~2mm,金属支架的宽度为0.7~1.2mm,金属支架的厚度为0.1~0.25mm。
5.根据权利要求3所述的通体发光LED灯珠,其特征在于,所述环氧树脂层的上表面为平面或弧面。
6.根据权利要求5所述的通体发光LED灯珠,其特征在于,所述环氧树脂层的厚度为0.4~0.8mm。
7.根据权利要求1所述的通体发光LED灯珠,其特征在于,第一支架和第二支架分别为一体地冲压成型。
8.一种灯串,包括电源线,其特征在于,还包括若干个如权利要求1-7任一项所述的通体发光LED灯珠,每个通体发光LED灯珠分别与电源线连接。
CN201811321535.3A 2018-11-07 2018-11-07 一种通体发光led灯珠及灯串 Pending CN109285935A (zh)

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US16/396,750 US20200144452A1 (en) 2018-11-07 2019-04-28 Surface light-emitting led

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CN111584533A (zh) * 2019-02-19 2020-08-25 启端光电股份有限公司 微发光二极管显示器及其形成方法

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CN111584533B (zh) * 2019-02-19 2023-06-13 启端光电股份有限公司 微发光二极管显示器及其形成方法

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