CN109273437A - The multi-colored led lamp bead of thermoelectricity separation - Google Patents
The multi-colored led lamp bead of thermoelectricity separation Download PDFInfo
- Publication number
- CN109273437A CN109273437A CN201811475614.XA CN201811475614A CN109273437A CN 109273437 A CN109273437 A CN 109273437A CN 201811475614 A CN201811475614 A CN 201811475614A CN 109273437 A CN109273437 A CN 109273437A
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- China
- Prior art keywords
- pad
- lamp bead
- led lamp
- insulating body
- luminescence chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 239000011324 bead Substances 0.000 title claims abstract description 43
- 230000005619 thermoelectricity Effects 0.000 title claims abstract description 31
- 238000000926 separation method Methods 0.000 title claims abstract description 27
- 238000004020 luminiscence type Methods 0.000 claims abstract description 30
- 208000002925 dental caries Diseases 0.000 claims abstract description 10
- 239000000084 colloidal system Substances 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 claims description 8
- 239000007769 metal material Substances 0.000 claims description 8
- 239000004020 conductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 description 5
- 238000005286 illumination Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 239000003086 colorant Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of multi-colored led lamp beads of thermoelectricity separation, it include: insulating body, at least two cavitys are provided on insulating body, the first pad, the second pad and third pad are sequentially arranged at intervals in each cavity, the bottom of first pad, the second pad and third pad is connected separately with pin, and each pin runs through insulating body；LED luminescence chip, at least provided with a LED luminescence chip in each cavity, LED luminescence chip is set on the second pad, the anode and cathode of LED luminescence chip are connected to the first pad and third pad, realize the effect of LED lamp bead thermoelectricity separation, and have multiple color, improve lamp bead luminous efficiency and service life, simplify manufacture craft, reduce production cost, improves production efficiency.
Description
Technical field
The invention belongs to LED technology fields, more particularly, to a kind of multi-colored led lamp bead of thermoelectricity separation.
Background technique
LED is a kind of solid state semiconductor devices that can convert electrical energy into visible light, it can be directly electrotransformation
For light.The heart of LED is the chip of a semiconductor, and one end of chip is attached on a bracket, and one end is cathode, and the other end connects
The anode for connecing power supply is encapsulated entire chip by epoxy resin.Semiconductor wafer consists of two parts, and a part is p-type
Semiconductor, hole is occupied an leading position inside it, and the other end is N-type semiconductor, is mainly electronics in this side.But both are partly led
When body connects, a P-N junction is just formed between them.When electric current acts on this chip by conducting wire,
Electronics will be pushed to the area P, and in the area P then electronics will issue energy with hole-recombination in the form of photon, here it is
The luminous principle of LED light.As social progress people require higher and higher, simple LED monochromatic light to shine illumination and brightening
The bright demand for being no longer satisfied the mankind to illumination market, the existing market overwhelming majority are monochromatic illumination, one only few
It is divided into bi-chromatic illumination, and is all the LED lamp bead of thermoelectricity one, is unfavorable for lamp bead radiating requirements, reduces lamp bead service life.
Therefore, it is necessary to research and develop a kind of multi-colored led lamp bead of thermoelectricity separation, solve existing LED light luminescent color it is single and
The lower problem of radiating efficiency makes LED lamp bead have multiple color, and improves the radiating efficiency of LED lamp bead entirety, makes LED light
Pearl has more purposes and longer service life.
Summary of the invention
The object of the present invention is to provide a kind of multi-colored led lamp beads of thermoelectricity separation, realize the effect of LED lamp bead thermoelectricity separation
Fruit, and there is multiple color, lamp bead luminous efficiency and service life are improved, manufacture craft is simplified, reduces production cost, is improved
Production efficiency.
To achieve the goals above, the present invention provides a kind of multi-colored led lamp bead of thermoelectricity separation, comprising:
Insulating body is provided at least two cavitys, successively interval setting in each cavity on the insulating body
There are the first pad, the second pad and third pad, the bottom of first pad, the second pad and third pad is connected separately with
Pin, each pin run through the insulating body；
LED luminescence chip, at least provided with a LED luminescence chip, the LED luminescence chip in each cavity
It is set on second pad, the anode and cathode of the LED luminescence chip are connected to first pad and described
Third pad.
Preferably, second pad is heat dissipation plate.
Preferably, the colloid of different-colour is separately filled in each cavity.
Preferably, first pad, the second pad and third bond pad surface are covered with silvering.
Preferably, the pin extends to the side and bottom of the insulating body.
Preferably, the anode of the LED luminescence chip and cathode and first pad and the third pad pass through gold
Belong to conducting wire connection.
Preferably, the outer wall of the insulating body is equipped with semi-circular recesses.
Preferably, a side of the insulating body is equipped with notch, and the notch is for identifying direction and polarity.
Preferably, first pad, the second pad and third pad are metal material.
Preferably, the pin is metal material.
The beneficial effects of the present invention are: plurality of LEDs luminescence chip is respectively arranged in multiple cavities, is reduced single
Package carrier needed for the luminous core of LED, simplifies manufacture craft, reduces production cost, improve production efficiency；Using thermoelectricity
Three welded discs are arranged in isolated encapsulation technology in each cavity, and power supply connection is separated with heat dissipation channel, optimizes LED
Lamp bead heat dissipation and electrical problem, reduce LED lamp bead light decay, improve service life；Different-colour is filled in each cavity
Colloid, the light of capable of emitting different colours；Pin extends to insulating body bottom and side, make finished product end patch can side patch,
It can just paste, so that LED lamp bead application form is more extensive.
Other features and advantages of the present invention will then part of the detailed description can be specified.
Detailed description of the invention
Exemplary embodiment of the invention is described in more detail in conjunction with the accompanying drawings, it is of the invention above-mentioned and its
Its purpose, feature and advantage will be apparent, wherein in exemplary embodiment of the invention, identical reference label
Typically represent same parts.
Fig. 1 shows a kind of top view of the multi-colored led lamp bead of thermoelectricity separation according to an embodiment of the invention.
Fig. 2 shows a kind of side views of the multi-colored led lamp bead of thermoelectricity separation according to an embodiment of the invention.
The back side that Fig. 3 shows a kind of multi-colored led lamp bead of thermoelectricity separation according to an embodiment of the invention is three-dimensional
Figure.
Description of symbols
1, insulating body；2, cavity；3, the first pad；4, the second pad；5, third pad；6, LED luminescence chip；7, golden
Belong to conducting wire；8, notch；9, pin；10, semi-circular recesses；
Specific embodiment
The preferred embodiment of the present invention is described in more detail below.Although the following describe preferred implementations of the invention
Mode, however, it is to be appreciated that may be realized in various forms the present invention without that should be limited by the embodiments set forth herein.Phase
Instead, these embodiments are provided so that the present invention is more thorough and complete, and can be by the scope of the present invention completely
It is communicated to those skilled in the art.
The multi-colored led lamp bead of thermoelectricity separation according to the present invention, comprising:
Insulating body is provided at least two cavitys on insulating body, the first weldering is sequentially arranged at intervals in each cavity
Disk, the second pad and third pad, the bottom of the first pad, the second pad and third pad are connected separately with pin, Mei Geyin
Foot runs through insulating body；
LED luminescence chip, at least provided with a LED luminescence chip in each cavity, LED luminescence chip is set to the second weldering
On disk, the anode and cathode of LED luminescence chip are connected to the first pad and third pad.
Specifically, plurality of LEDs luminescence chip is respectively arranged in multiple cavities, reduces single LED and shines needed for core
Package carrier, simplify manufacture craft, reduce production cost, improve production efficiency；The encapsulation skill separated using thermoelectricity
Three welded discs are arranged in art in each cavity, and power supply connection is separated with heat dissipation channel, optimizes LED lamp bead heat dissipation and electricity
Property problem, reduces LED lamp bead light decay, improves service life.
Preferably, the second pad is heat dissipation plate.
Preferably, the colloid of different-colour is separately filled in each cavity.
Specifically, the colloid of different-colour, the light of capable of emitting different colours are filled in each cavity.
Preferably, the first pad, the second pad and third bond pad surface are covered with silvering.
Specifically, silvering has good Dao electricity ﹑ Yan Zhan ﹑ thermal conductivity and high reflectance and easily welds.
Preferably, pin extends to the side and bottom of insulating body.
Specifically, pin extends to insulating body bottom and side, make finished product end patch can side patch, can also just paste, make
It is more extensive to obtain LED lamp bead application form.
Preferably, the anode of LED luminescence chip and cathode and the first pad and third pad pass through plain conductor
Connection.
Preferably, the outer wall of insulating body is equipped with semi-circular recesses, easy to remove and lifting.
Preferably, a side of insulating body is equipped with notch, and notch is for identifying direction and polarity.
Preferably, the first pad, the second pad and third pad are metal material.
Preferably, pin is metal material.
Embodiment
Fig. 1 shows the top view of the multi-colored led lamp bead according to a kind of separation of thermoelectricity of the present embodiment；Fig. 2 shows roots
According to the side view for the multi-colored led lamp bead that a kind of thermoelectricity of the present embodiment separates；Fig. 3 shows a kind of thermoelectricity according to the present embodiment
The rear isometric view of the multi-colored led lamp bead of separation.
As shown in Figure 1 to Figure 3, the multi-colored led lamp bead of thermoelectricity separation, comprising:
The outer wall of insulating body 1 is equipped with semi-circular recesses 10, and side is equipped with for identifying direction and polar notch
8, on insulating body 1 setting there are two cavity 2, be sequentially arranged at intervals in each cavity 2 metal material the first pad 3, the
Two pads 4 and third pad 5, the first pad 3, the second pad 4 and 5 surface of third pad are covered with silvering, the first pad 3,
The bottom of second pad 4 and third pad 5 is connected separately with the pin 9 of metal material, and each pin 9 extends to insulating body 1
Side and bottom；A LED luminescence chip 6 is equipped in each cavity 2, LED luminescence chip 6 is set on the second pad 4, will
Second pad 4 is used as heat dissipation plate, and the anode and cathode of LED luminescence chip 6 pass through plain conductor 7 respectively and be connected to the first pad 3
With third pad 5, the colloid of different-colour is separately filled in two cavitys 2.
Its packaging technology comprises the following steps:
1, the notch 8 of two cavitys 2 and a mark direction is opened on insulating body 1, in each cavity 2 respectively successively
Each pad is connected a pin 9, each pin 9 is prolonged by interval setting 3 the second pad of ﹑ 4 of the first pad and third pad 5
Extend to the bottom and side of insulating body 1.
2, selection have lead well electricity ﹑ prolong exhibition property ﹑ lead hot property ﹑ high reflectance and easily weld silver to bond pad surface into
Row plating.
3, LED luminescence chip 6 is welded on the second pad 4 in cavity 2,6 positive and negative anodes of LED luminescence chip pass through respectively
Two plain conductors 7 are connected with the first pad 3 and third pad 5.
4, the colloid of different-colour is filled in two cavitys 2 that LED luminescence chip 6 is welded respectively.
By shining with two cavitys 2 of setting on insulating body 1, and respectively in two cavitys 2, one LED of each installation
6 positive and negative anodes of LED luminescence chip are connected with the first pad 3 and third pad 5 by plain conductor 7, are then existed respectively by chip 6
The colloid of filling different-colour, realizes the effect of single lamp multi color temperature in two cavitys 2, simplifies packaging technology, and LED shines
Chip 6 is set on the second pad 4, and 6 positive and negative anodes of LED luminescence chip are individually connected with other two pad, realizes LED lamp bead
The effect of thermoelectricity separation, improves lamp bead luminous efficiency and service life；In addition, pin 9 extends to 1 bottom of insulating body and side
Face, finished product end patch can side patch can also just paste so that LED lamp bead application form is more extensive.
Various embodiments of the present invention are described above, above description is exemplary, and non-exclusive, and
It is not limited to disclosed each embodiment.Without departing from the scope and spirit of illustrated each embodiment, for this skill
Many modifications and changes are obvious for the those of ordinary skill in art field.
Claims (10)
1. a kind of multi-colored led lamp bead of thermoelectricity separation characterized by comprising
Insulating body is provided at least two cavitys on the insulating body, is sequentially arranged at intervals in each cavity
One pad, the second pad and third pad, the bottom of first pad, the second pad and third pad, which is connected separately with, draws
Foot, each pin run through the insulating body；
LED luminescence chip, at least provided with a LED luminescence chip, the LED luminescence chip setting in each cavity
In on second pad, the anode and cathode of the LED luminescence chip are connected to first pad and the third
Pad.
2. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that second pad is heat dissipation
Disk.
3. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that in each cavity respectively
Colloid filled with different-colour.
4. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that first pad, the second weldering
Disk and third bond pad surface are covered with silvering.
5. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that the pin extends to described
The side and bottom of insulating body.
6. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that the LED luminescence chip is just
Pole and cathode are connect with first pad and the third pad by plain conductor.
7. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that the outer wall of the insulating body
It is equipped with semi-circular recesses.
8. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that one of the insulating body
Side is equipped with notch, and the notch is for identifying direction and polarity.
9. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that first pad, the second weldering
Disk and third pad are metal material.
10. the multi-colored led lamp bead of thermoelectricity separation according to claim 1, which is characterized in that the pin is metal material
Matter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811475614.XA CN109273437A (en) | 2018-12-04 | 2018-12-04 | The multi-colored led lamp bead of thermoelectricity separation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811475614.XA CN109273437A (en) | 2018-12-04 | 2018-12-04 | The multi-colored led lamp bead of thermoelectricity separation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109273437A true CN109273437A (en) | 2019-01-25 |
Family
ID=65186290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811475614.XA Pending CN109273437A (en) | 2018-12-04 | 2018-12-04 | The multi-colored led lamp bead of thermoelectricity separation |
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| Country | Link |
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| CN (1) | CN109273437A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117594737A (en) * | 2024-01-17 | 2024-02-23 | 深圳市天成照明有限公司 | Lamp bead |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925182A (en) * | 2005-09-01 | 2007-03-07 | E.I.内穆尔杜邦公司 | Low temperature co-fired ceramic tape compositions, light emitting diode modules, lighting devices and method of forming thereof |
| JP3156197U (en) * | 2009-10-07 | 2009-12-17 | 柏友照明科技股▲フン▼有限公司 | Light-emitting diode sealing structure that can be lit separately |
| CN104637930A (en) * | 2014-12-30 | 2015-05-20 | 木林森股份有限公司 | Double color LED (Light Emitting Diode) lamp bead, lamp strip based on lamp bead and packaging process for lamp bead |
| CN208938967U (en) * | 2018-12-04 | 2019-06-04 | 深圳市天成照明有限公司 | The multi-colored led lamp bead of thermoelectricity separation |
-
2018
- 2018-12-04 CN CN201811475614.XA patent/CN109273437A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1925182A (en) * | 2005-09-01 | 2007-03-07 | E.I.内穆尔杜邦公司 | Low temperature co-fired ceramic tape compositions, light emitting diode modules, lighting devices and method of forming thereof |
| JP3156197U (en) * | 2009-10-07 | 2009-12-17 | 柏友照明科技股▲フン▼有限公司 | Light-emitting diode sealing structure that can be lit separately |
| CN104637930A (en) * | 2014-12-30 | 2015-05-20 | 木林森股份有限公司 | Double color LED (Light Emitting Diode) lamp bead, lamp strip based on lamp bead and packaging process for lamp bead |
| CN208938967U (en) * | 2018-12-04 | 2019-06-04 | 深圳市天成照明有限公司 | The multi-colored led lamp bead of thermoelectricity separation |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117594737A (en) * | 2024-01-17 | 2024-02-23 | 深圳市天成照明有限公司 | Lamp bead |
| CN117594737B (en) * | 2024-01-17 | 2024-04-16 | 深圳市天成照明有限公司 | Lamp bead |
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