CN109269688B - Pressure sensing array and preparation method thereof - Google Patents
Pressure sensing array and preparation method thereof Download PDFInfo
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- CN109269688B CN109269688B CN201811320690.3A CN201811320690A CN109269688B CN 109269688 B CN109269688 B CN 109269688B CN 201811320690 A CN201811320690 A CN 201811320690A CN 109269688 B CN109269688 B CN 109269688B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- 239000010410 layer Substances 0.000 claims abstract description 98
- 239000011229 interlayer Substances 0.000 claims abstract description 4
- 238000004519 manufacturing process Methods 0.000 claims description 96
- 239000000463 material Substances 0.000 claims description 87
- 238000001125 extrusion Methods 0.000 claims description 86
- 239000011344 liquid material Substances 0.000 claims description 47
- 230000007246 mechanism Effects 0.000 claims description 32
- 239000000758 substrate Substances 0.000 claims description 25
- 238000010438 heat treatment Methods 0.000 claims description 17
- 238000001723 curing Methods 0.000 claims description 12
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000013007 heat curing Methods 0.000 claims description 9
- 238000000465 moulding Methods 0.000 claims description 9
- 238000004806 packaging method and process Methods 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 6
- 229910052799 carbon Inorganic materials 0.000 claims description 6
- 229920001940 conductive polymer Polymers 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 4
- 239000007921 spray Substances 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000000499 gel Substances 0.000 claims description 3
- 239000000017 hydrogel Substances 0.000 claims description 3
- 239000002608 ionic liquid Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims description 3
- 239000000243 solution Substances 0.000 claims description 3
- 229920002725 thermoplastic elastomer Polymers 0.000 claims description 3
- 229920005992 thermoplastic resin Polymers 0.000 claims description 3
- 238000011068 loading method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 18
- 230000008569 process Effects 0.000 abstract description 14
- 230000005489 elastic deformation Effects 0.000 abstract description 5
- 239000003990 capacitor Substances 0.000 abstract description 3
- 238000007639 printing Methods 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 229920002379 silicone rubber Polymers 0.000 description 4
- 239000000084 colloidal system Substances 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005266 casting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 230000002572 peristaltic effect Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
- G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/18—Measuring force or stress, in general using properties of piezo-resistive materials, i.e. materials of which the ohmic resistance varies according to changes in magnitude or direction of force applied to the material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/20—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress
- G01L1/22—Measuring force or stress, in general by measuring variations in ohmic resistance of solid materials or of electrically-conductive fluids; by making use of electrokinetic cells, i.e. liquid-containing cells wherein an electrical potential is produced or varied upon the application of stress using resistance strain gauges
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Measuring Fluid Pressure (AREA)
- Measurement Of Levels Of Liquids Or Fluent Solid Materials (AREA)
Abstract
The invention relates to the technical field of flexible electronics, and particularly discloses a pressure sensing array, wherein the pressure sensing array comprises: each layer of cable structure comprises a plurality of parallel elastic cables, one layer of cable structure is transversely arranged, the other side of cable structure is longitudinally arranged, each two elastic cable contact positions of the two layers of cable structures form a sensing node with position information, each elastic cable structure comprises a shell and a conducting wire layer positioned in the shell, the conducting wire layer forms a capacitor electrode, and the shell of the two layers of cable structures and the air interlayer form a capacitor dielectric layer. The invention also discloses a preparation method of the pressure sensing array. The electronic product formed by the pressure sensing array meets the flexibility requirement, has the elastic deformation capability, solves the problems of complex process and high cost in the prior art due to the fact that the electronic product is different from the existing cable structure, and has the advantages of being simple in structure, saving labor, saving time and the like.
Description
Technical Field
The invention relates to the technical field of flexible electronics, in particular to a pressure sensing array and a preparation method of the pressure sensing array.
Background
With the continuous progress of science and technology, more and more electronic products are turned to flexibility and personalized customization, such as wearable devices, flexible circuits, antennas, microwave cables, electronic skins and the like, and the electronic products not only require normal operation of electronic elements, but also require that the electronic elements can be elastically deformed along with the needs of users, and the connecting cables in the electronic elements are also required to be elastically deformed, so that the needs clearly pose a great challenge to traditional manufacturing. The related research and manufacture of the existing elastic cable is to embed conductive material into elastic material by casting and package and form. However, the related research and manufacture of the existing elastic cable has the following limitations: (1) The existing elastic cable is manufactured by adopting a traditional casting mould mode, a mould is required to be manufactured in advance, the production cost is high, and if different process adjustment is carried out according to different requirements, the mould is required to be replaced according to the requirements, so that a great deal of waste of manpower, time and cost is caused; (2) Due to the factors, the existing elastic cable is difficult to meet more and more personalized customization requirements of users.
Disclosure of Invention
The invention aims to at least solve one of the technical problems in the prior art, and provides a pressure sensing array and a preparation method of the pressure sensing array so as to solve the problems in the prior art.
As a first aspect of the present invention, there is provided a pressure sensing array, wherein the pressure sensing array includes: each layer of cable structure comprises a plurality of parallel elastic cables, one layer of cable structure is transversely arranged, the other side of cable structure is longitudinally arranged, each two elastic cable contact positions of the two layers of cable structures form a sensing node with position information, and each elastic cable comprises a shell and a conducting wire layer positioned in the shell.
Preferably, the pressure sensing array comprises a capacitive pressure sensing array, the conducting wire layer forms a capacitive electrode, and the shell of the two-layer cable structure and the air interlayer form a capacitive dielectric layer.
Preferably, the pressure sensing array comprises a resistive pressure sensing array, each layer of cable structure forming a resistive sensing unit.
Preferably, the material for manufacturing the wire layer comprises one or more of carbon-based conductive liquid, carbon-based conductive paste, conductive ionic liquid, conductive polymer solution, conductive polymer hydrogel, conductive ionic gel and gallium indium tin alloy, and the conductivity range of the material for manufacturing the wire layer is 10 5 S/m ~10 8 S/m。
Preferably, the housing is made of a material including one or more of thermoset or thermoplastic rubber, thermoset/thermoplastic resin, and nylon.
Preferably, the angle between the transversely arranged cable structures and the longitudinally arranged cable structures is between 10 ° and 90 °.
As a second embodiment of the present invention, there is provided a method of manufacturing a pressure sensing array, wherein the method of manufacturing a pressure sensing array includes:
providing a substrate, a manufacturing material of a shell and a manufacturing material of a wire layer;
providing an extrusion device;
loading the manufacturing material of the shell and the manufacturing material of the wire layer into the extrusion device;
setting extrusion parameters of an extrusion device;
according to the extrusion parameters, the extrusion device simultaneously extrudes the manufacturing materials of the shell and the wire layer onto a substrate, and extrudes the two layers of crisscross grid structures on the substrate;
heating and curing;
and (5) packaging and molding.
Preferably, the extrusion device comprises a first extrusion mechanism, a second extrusion mechanism and a nozzle structure, the nozzle structure comprises an inner core structure and an outer cavity structure, the outer cavity structure surrounds the inner core structure and is arranged in an isolated mode, an inlet of the inner core structure is connected with an outlet of the first extrusion mechanism, an inlet of the outer cavity structure is connected with an outlet of the second extrusion structure, the first extrusion mechanism is used for containing manufacturing materials of the wire layers and capable of extruding the manufacturing materials of the wire layers to the inner core structure, the second extrusion mechanism is used for containing the manufacturing materials of the shells and capable of extruding the manufacturing materials of the shells to the outer cavity structure, and an outlet of the inner core structure and an outlet of the outer cavity structure simultaneously spray the manufacturing materials of the shells and the manufacturing materials of the wire layers onto the substrate.
As a third real-time manner of the present invention, a method for manufacturing a pressure sensing array is provided, where the method for manufacturing a pressure sensing array includes:
providing a substrate, a liquid material, a manufacturing material of a shell and a manufacturing material of a wire layer, wherein the liquid material is incompatible with the manufacturing material of the wire layer and the manufacturing material of the shell;
providing an extrusion device and an injection device;
charging the manufacturing material of the shell and the liquid material into the extrusion device;
setting extrusion parameters of an extrusion device;
according to the extrusion parameters, the extrusion device extrudes the manufacturing material of the shell and the liquid material on a substrate at the same time, and extrudes two layers of crisscross grid structures on the substrate;
heating and solidifying for the first time to form a structure with a liquid material outer layer as a shell at the center;
removing the liquid material to form a hollow channel;
injecting the manufacturing material of the wire layer into the hollow channel by adopting an injection device;
heating and solidifying for the second time;
and (5) packaging and molding.
Preferably, the liquid material includes a volatile liquid material that volatilizes after the first heat curing and a nonvolatile liquid material that forms a solid shape after the first heat curing.
According to the pressure sensing array provided by the invention, the two layers of cable structures are arranged in a vertically and horizontally alternating manner, and the sensing nodes with position information are formed at the contact positions of the two layers of cable structures, so that the electronic product formed by the structure meets the flexibility requirement, has the elastic deformation capability, solves the problem of complex process and high cost in the prior art due to the fact that the structure is different from the existing cable structure, and has the advantages of being simple in structure, saving labor and time and the like.
Drawings
The accompanying drawings are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification, illustrate the invention and together with the description serve to explain, without limitation, the invention. In the drawings:
fig. 1 is a schematic structural diagram of a pressure sensor array according to the present invention.
FIG. 2 is a flow chart of one embodiment of a method of fabricating a pressure sensing array according to the present invention.
Fig. 3 is a schematic structural view of an extrusion device provided by the invention.
Fig. 4 is a flowchart of another embodiment of a method for manufacturing a pressure sensor array according to the present invention.
Fig. 5 is a schematic diagram of a path planning of a printing process of a pressure sensor array according to the present invention.
Fig. 6 is a schematic structural diagram of a pressure sensor array manufactured by the manufacturing method of the pressure sensor array provided by the invention.
Detailed Description
The following describes specific embodiments of the present invention in detail with reference to the drawings. It should be understood that the detailed description and specific examples, while indicating and illustrating the invention, are not intended to limit the invention.
As a first aspect of the present invention, there is provided a pressure sensing array, wherein, as shown in fig. 1, the pressure sensing array includes: each layer of cable structure 100 comprises a plurality of elastic cable lines 110 arranged in parallel, one layer of cable structure 100 is transversely arranged, the other side of cable structure 100 is longitudinally arranged, each two elastic cable lines 110 of each layer of cable structure 100 are contacted to form a sensing node 120 with position information, and each elastic cable line 110 comprises a shell 111 and a conducting wire layer 112 positioned in the shell.
According to the pressure sensing array provided by the invention, the two layers of cable structures are arranged in a vertically and horizontally alternating manner, and the sensing nodes with position information are formed at the contact positions of the two layers of cable structures, so that the electronic product formed by the structure meets the flexibility requirement, has the elastic deformation capability, solves the problem of complex process and high cost in the prior art due to the fact that the structure is different from the existing cable structure, and has the advantages of being simple in structure, saving labor and time and the like.
As a specific embodiment, the pressure sensing array includes a capacitive pressure sensing array, the conductive wire layer forms a capacitive electrode, and the housing of the two-layer cable structure 100 forms a capacitive dielectric layer with an air interlayer.
As another specific embodiment, the pressure sensing array comprises a resistive pressure sensing array, each layer of cable structure 100 forming a resistive sensing cell.
Specifically, the conductive wire layer 112 is made of one or more materials selected from carbon-based conductive liquid, carbon-based conductive paste, conductive ionic liquid, conductive polymer solution, conductive polymer hydrogel, conductive ionic gel and gallium indium tin alloy.
Preferably, the conductive wire layer 112 is made of a material having a conductivity ranging from 10 5 S/m ~10 8 S/m。
Specifically, the housing 111 is made of one or more materials selected from the group consisting of thermosetting or thermoplastic rubber, thermosetting/thermoplastic resin, and nylon.
Specifically, the angle between the transversely aligned cable structures 100 and the longitudinally aligned cable structures 100 is between 10 ° and 90 °.
Preferably, the wall thickness of the housing is between 10 microns and 1 millimeter.
As a second aspect of the present invention, there is provided a method of manufacturing a pressure sensing array, wherein the method of manufacturing a pressure sensing array, as shown in fig. 2, includes:
s110, providing manufacturing materials of a substrate, a shell and manufacturing materials of a wire layer;
s120, providing an extrusion device;
s130, filling the manufacturing materials of the shell and the wire layer into the extrusion device;
s140, setting extrusion parameters of an extrusion device;
s150, according to the extrusion parameters, the extrusion device extrudes the manufacturing materials of the shell and the manufacturing materials of the wire layer onto a substrate at the same time, and extrudes two layers of criss-cross grid structures on the substrate;
s160, heating and curing;
s170, packaging and molding.
The preparation method of the pressure sensing array provided by the invention adopts the forms of the shell and the wire layer, the pressure sensing array is finally obtained through the processes of extrusion molding by an extrusion device, heating and curing and the like, the traditional complex production process using a die or manual operation is avoided, the requirements of different users on any 3D graph, geometric dimension and the like of cables can be met, and meanwhile, the sensor array produced by the preparation method has the advantages of good molding, high continuous degree, uninterrupted process, mass production and the like, and the manpower, time and production cost are saved.
Specifically, as a specific embodiment of the extrusion device, as shown in fig. 3, the extrusion device comprises a first extrusion mechanism 1, a second extrusion mechanism 2 and a nozzle structure 3, the nozzle structure 3 comprises an inner core structure 31 and an outer cavity structure 32, the outer cavity structure 32 is arranged around the inner core structure 31 in a separated manner, an inlet of the inner core structure 31 is connected with an outlet of the first extrusion mechanism 1, an inlet of the outer cavity structure 32 is connected with an outlet of the second extrusion structure 2, the first extrusion mechanism 1 is used for containing the manufacturing material of the wire layer and capable of extruding the manufacturing material of the wire layer to the inner core structure 31, the second extrusion mechanism 2 is used for containing the manufacturing material of the shell and capable of extruding the manufacturing material of the shell to the outer cavity structure 32, and an outlet of the inner core structure 31 and an outlet of the outer cavity structure 32 are used for simultaneously spraying the manufacturing material of the shell and the manufacturing material of the wire layer onto the substrate.
Specifically, the first extrusion mechanism 1, the second extrusion mechanism 2 and the spray head 3 are arranged at the execution end of the multi-degree-of-freedom motion; the first extrusion mechanism 1 is filled with the manufacturing material of the wire layer, and the second extrusion mechanism 2 is filled with the manufacturing material of the shell; the elastic cable can be extruded on the substrate in the movement process by utilizing the cooperative control of the movement control technology and the extrusion system, self-support is completed by utilizing the characteristic of high storage modulus of the manufacturing material of the shell layer, and meanwhile, the manufacturing material of the wire layer is extruded inside.
Auxiliary curing equipment such as a heat curing heating plate, a heating light source and the like can be selectively configured according to curing conditions of different materials, and the coating material is heated and cured in the printing process so as to obtain a better coating effect.
After the criss-cross grid structure is printed out, the grid structure is placed in a high-temperature environment to be completely solidified. And introducing a connecting electric wire on the obtained capacitive sensing grid structure, contacting with the wire layer, packaging and forming the electric wire layer, and finally obtaining the elastic pressure sensing array.
As a third aspect of the present invention, there is provided a method of manufacturing a pressure sensing array, wherein the method of manufacturing a pressure sensing array, as shown in fig. 4, includes:
s210, providing a substrate, a liquid material, a manufacturing material of a shell and a manufacturing material of a wire layer, wherein the liquid material is incompatible with the manufacturing material of the wire layer and the manufacturing material of the shell;
s220, providing an extrusion device and an injection device;
s230, filling the manufacturing material of the shell and the liquid material into the extrusion device;
s240, setting extrusion parameters of an extrusion device;
s250, according to the extrusion parameters, the extrusion device extrudes the manufacturing material of the shell and the liquid material onto a substrate at the same time, and extrudes two layers of criss-cross grid structures on the substrate;
s260, heating and solidifying for the first time to form a structure with a liquid material outer layer as a shell at the center;
s270, removing the liquid material to form a hollow channel;
s280, injecting manufacturing materials of the wire layer into the hollow channel by adopting an injection device;
s290, heating and curing for the second time;
s300, packaging and molding.
The preparation method of the pressure sensing array provided by the invention adopts the form of the shell and the wire layer, firstly, the shell and the liquid material are extruded and molded through the extrusion device, then, the liquid material is removed, then, the manufacturing material of the wire layer is injected, and the pressure sensing array is finally obtained through the processes of heating and curing, etc., thus avoiding the traditional complicated production process of using a die or manual operation, meeting the requirements of different users on any 3D graph, geometric dimension, etc. of the cable, and simultaneously, the sensor array produced by the preparation method has the advantages of good molding, high continuous degree, uninterrupted process, mass production, etc., and saving manpower, time and production cost. In addition, the liquid material is firstly heated and solidified and then removed, and then the manufacturing material of the lead layer is injected, so that the one-time extrusion distance is longer, and the controllable replacement is realized.
It should be noted that, the liquid material is not compatible with the material of the conductive wire layer and the material of the housing, so that the liquid material can be removed after the heat curing.
Specifically, the liquid material includes a volatile liquid material that volatilizes after the first heat curing and a nonvolatile liquid material that forms a solid shape after the first heat curing.
It can be understood that when the liquid material is a volatile liquid material, the material for manufacturing the wire layer can be directly injected by volatilizing after heating and solidifying, and when the liquid material is a nonvolatile liquid material, the liquid material is extruded by an auxiliary injection device such as a peristaltic feeding device while the material for manufacturing the wire layer is injected.
Specifically, the extrusion device may be the extrusion device described above, except that the first extrusion mechanism 1 is configured to hold the liquid material, the liquid material is in the inner core structure 31, and the manufacturing material and the liquid material of the housing are ejected onto the substrate at the same time from the outlet of the inner core structure 31 and the outlet of the outer cavity structure 32.
Specifically, the first extrusion mechanism 1, the second extrusion mechanism 2 and the nozzle structure 3 are arranged at the execution end of the multi-degree-of-freedom motion; the first extrusion mechanism 1 is filled with liquid material, and the second extrusion mechanism 2 is filled with shell manufacturing material; the elastic cable can be extruded on the substrate in the movement process by utilizing the cooperative control of the movement control technology and the extrusion system, self-support is completed by utilizing the characteristic of high storage modulus of the manufacturing material of the shell layer, and meanwhile, the liquid material is extruded inside.
Auxiliary curing equipment such as a heat curing heating plate, a heating light source and the like can be selectively configured according to curing conditions of different materials, and the coating material is heated and cured in the printing process so as to obtain a better coating effect.
After a criss-cross grid structure is printed out, placing the criss-cross grid structure in a high-temperature environment to completely solidify the criss-cross grid structure, and volatilizing internal liquid at high temperature to form an elastic hollow channel if the liquid material is a volatile material; the material of the wire layer is then injected into the hollow channel using an injection device.
And introducing connecting electric wires on the obtained capacitive sensing grid structure, contacting the electric wires with the wire layer, and packaging and forming the electric wires to finally obtain the elastic pressure sensing array.
If the liquid material is a non-volatile material, the solidified non-volatile liquid material may be extruded to form a hollow channel by using an air pressure, an injection device, a peristaltic feeding device, etc., so as to facilitate the injection of the manufacturing material of the conductive wire layer. In addition, the nonvolatile liquid material after the solidification can be extruded while the material for manufacturing the wire layer is injected.
It should be noted that the temperature at the time of curing is controlled to be between 40 ° and 200 °.
The crossed double-layer grid structure, such as the line width of a single cable, the line distance between adjacent cables, the diameter of the conductive layer inside the cable, and the like, can be respectively adjusted by extrusion parameters, motion parameters and nozzle specifications.
Preferably, the liquid material may be water.
The method for manufacturing the pressure sensing array provided by the invention is specifically described below, and the mode of injecting the manufacturing material of the wire layer is taken as an example.
(1) Water is filled in the first extrusion mechanism 1, and the Dow Corning SE1700 silicon rubber is filled in the second extrusion mechanism 2;
(2) Arranging the first extrusion mechanism 1 and the second extrusion mechanism 2 in parallel with the nozzle structure 3, and communicating the first extrusion mechanism 1 and the second extrusion mechanism 2 with an inner core structure 31 and an outer cavity structure 32 of the nozzle structure 3 respectively through a conduit; the inner diameter of the inner core structure 31 of the spray head structure 3 is specifically 0.21mm, the outer diameter of the inner core structure 31 is 0.4mm, and the inner diameter of the outer cavity structure 32 is 13mm;
(3) Setting the flow rate of the injection pump of the first extrusion mechanism 1 to be 5ul/s and the extrusion air pressure of the second extrusion mechanism 2 to be 70psi, and printing the coaxial line on a printing substrate by the nozzle structure 3 at a printing speed of 8 mm/s; the print paths may be stacked in a grid shape as shown in fig. 5;
(4) Adopting a heating and thermosetting mode at 80 ℃ to enable the pressure sensing array obtained in the step (3) to be cured and molded to obtain a double-layer sensor grid array with the length dimension of 30mm, wherein each coaxial line is about 1.4mm in width, and the diameter of an inner core is about 0.4mm;
(5) And (3) injecting the eutectic alloy Ga75.5-In24.5 gallium indium tin alloy into the grid sensor array from the initial end of the grid array obtained in the step (4) by using an injector.
(6) Cutting off two ends of the sensing grid array obtained in the step (5), inserting copper wires with the diameter of 0.1mm into two ends of each coaxial line (the length of the immersed coaxial line is 3mm-5mm, the embodiment takes 5mm as an example in the drawing), injecting two ends of the coaxial line by using UV light curing glue until the two ends of the coaxial line overflow, and curing and packaging by using UV silica gel.
Finally, a pressure sensor array as shown in fig. 6 was fabricated, and the capacitance of the individual nodes was measured using a Keysight E9480AL LCR table, which has a value of about 1.5pf.
The preparation method of the capacitive sensor array provided by the invention avoids the traditional complicated production process by using a die or manually, can meet the requirements of different users on any 3D graph, geometric dimension and the like of the cable, and meanwhile, the sensor array produced by the preparation method has the advantages of good molding, high continuous degree, uninterrupted process, mass production and the like, and saves manpower, time and production cost.
The invention adopts liquid or colloid conductive material, and can meet the elasticity of the sensor array manufactured by the liquid or colloid conductive material due to the liquidity of the liquid or the good elastic deformation of the colloid. When the coating material is silicon rubber, the silicon rubber has good insulativity and elastic deformation capability, and meanwhile, the silicon rubber is nontoxic and odorless, high-temperature resistant and low-temperature resistant, has good inertness, and ensures that the flexible capacitor has obvious advantages.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present invention, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the invention, and are also considered to be within the scope of the invention.
Claims (7)
1. A pressure sensing array, the pressure sensing array comprising: each layer of cable structure comprises a plurality of elastic cable lines which are arranged in parallel, one layer of cable structure is transversely arranged, the other side of cable structure is longitudinally arranged, each two elastic cable line contact positions of the two layers of cable structures form a sensing node with position information, and each elastic cable line comprises a shell and a conducting wire layer positioned in the shell;
the preparation method of the pressure sensing array comprises the following steps:
providing a substrate, a manufacturing material of a shell and a manufacturing material of a wire layer;
providing an extrusion device;
loading the manufacturing material of the shell and the manufacturing material of the wire layer into the extrusion device; setting extrusion parameters of an extrusion device;
according to the extrusion parameters, the extrusion device simultaneously extrudes the manufacturing materials of the shell and the wire layer onto a substrate, and extrudes the two layers of crisscross grid structures on the substrate;
heating and curing;
packaging and molding;
the extrusion device comprises a first extrusion mechanism, a second extrusion mechanism and a nozzle structure, wherein the nozzle structure comprises an inner core structure and an outer cavity structure, the outer cavity structure is arranged around the inner core structure in an isolated mode, an inlet of the inner core structure is connected with an outlet of the first extrusion mechanism, an inlet of the outer cavity structure is connected with an outlet of the second extrusion structure, the first extrusion mechanism is used for containing manufacturing materials of the wire layers and capable of extruding the manufacturing materials of the wire layers to the inner core structure, the second extrusion mechanism is used for containing the manufacturing materials of the shells and capable of extruding the manufacturing materials of the shells to the outer cavity structure, and the outlet of the inner core structure and the outlet of the outer cavity structure simultaneously spray the manufacturing materials of the shells and the manufacturing materials of the wire layers to the substrate;
the preparation method of the pressure sensing array comprises the following steps:
providing a substrate, a liquid material, a manufacturing material of a shell and a manufacturing material of a wire layer, wherein the liquid material is incompatible with the manufacturing material of the wire layer and the manufacturing material of the shell;
providing an extrusion device and an injection device;
charging the manufacturing material of the shell and the liquid material into the extrusion device;
setting extrusion parameters of an extrusion device;
according to the extrusion parameters, the extrusion device extrudes the manufacturing material of the shell and the liquid material on a substrate at the same time, and extrudes two layers of crisscross grid structures on the substrate;
heating and solidifying for the first time to form a structure with a liquid material outer layer as a shell at the center;
removing the liquid material to form a hollow channel;
injecting the manufacturing material of the wire layer into the hollow channel by adopting an injection device;
heating and solidifying for the second time;
and (5) packaging and molding.
2. The pressure sensing array of claim 1, wherein the pressure sensing array comprises a capacitive pressure sensing array, the conductive wire layer forms a capacitive electrode, and the two-layer cable structured housing forms a capacitive dielectric layer with an air interlayer.
3. The pressure sensing array of claim 1, wherein the pressure sensing array comprises a resistive pressure sensing array, each layer of cable structure forming a resistive sensing element.
4. The pressure sensing array of claim 1, wherein the wire layer is made of a material comprising one or more of a carbon-based conductive liquid, a carbon-based conductive paste, a conductive ionic liquid, a conductive polymer solution, a conductive polymer hydrogel, a conductive ionic gel, and a gallium indium tin alloy, and the wire layer is made of a material having a conductivity ranging from 105S/m to 108S/m.
5. The pressure sensing array of claim 1, wherein the housing is made of a material comprising one or more of thermoset or thermoplastic rubber, thermoset/thermoplastic resin, and nylon.
6. A pressure sensing array according to any one of claims 1 to 5, wherein the angle between the transversely aligned cable structures and the longitudinally aligned cable structures is between 10 ° and 90 °.
7. The method of manufacturing a pressure sensing array of claim 1, wherein the liquid material comprises:
a volatile liquid material that volatilizes after the first heat cure, and a non-volatile liquid material that forms a solid shape after the first heat cure.
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